S1A GE | Alldatasheet
Document overview
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Technical content
Reverse Voltage -50 to 1000 Volts Forward Current -1.0 Ampere
FEATURES
♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0 ♦ For surface mounted applications ♦ Low profile package ♦ Built-in strain relief, ideal for automated placement ♦ Glass passivated chip junction ♦ High temperature soldering: 250°C/10 seconds at terminals MECHANICAL DATA Case: JEDEC DO-214AC molded plastic over passivated chip Terminals:Solder plated, solderable per MIL-STD-750, Method 2026 Polarity:Color band denotes cathode end Weight:0.002 ounce, 0.064 gram MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Ratings at 25°C ambient temperature unless otherwise specified. SYMBOLS S1A S1B S1D S1G S1J S!K S1M UNITS Device marking code SA SB SD SG SJ SK SM Maximum recurrent peak reverse voltage V RRM 50 100 200 400 600 800 1000 Volts Maximum RMS voltage V RMS 35 70 140 280 420 560 700 Volts Maximum DC blocking voltage VDC 50 100 200 400 600 800 1000 Volts Maximum average forward rectified current See Figure 1 I (AV) 1.0 Amp Peak forward surge current 8.3ms single half sine-wave superimposed on I FSM 40.0 30.0 Amps rated load (JEDEC Method) TL=110°C Maximum instantaneous forward voltage at 1.0A V F 1.10 Volts Maximum DC reverse current T A=25°C 1.0 5.0 at Rated DC blocking voltage T A=125°C IR 50.0 µA Typical reverse recovery time (NOTE 1) trr 1.8 µs Typical junction capacitance(NOTE 2) C J 12.0 pF Typical thermal resistance(NOTE 3) R Θ JA 75.0 85.0 R Θ JL 27.0 30.0 °C/W Operating junction and storage temperature range TJ, TSTG -55 to +150 °C NOTES: (1) Reverse recovery test conditions: IF=0.5A, IR =1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead mounted on 0.2 x 0.2” (5.0 x 5.0mm) copper pad areas DO-214A C 0.157 (3.99) 0.177 (4.50) 0.006 (0.152) 0.012 (0.305) 0.030 (0.76) 0.060 (1.52) 0.008 (0.203) MAX. 0.194 (4.93) 0.208 (5.28) 0.100 (2.54) 0.110 (2.79) 0.078 (1.98) 0.090 (2.29) 0.049 (1.25) 0.065 (1.65) Dimensions are in inches and (millimeters)
0 20 40 60 80 100 120 140 1600 0.2 0.4 0.6 0.8 1.0 1.2 1 10 100 100 0.01 0.1 100 0.01 0.1 1 10 100 100 0.01 0.1 1 10 100 100 1,000 0 20 40 60 80 100 0.001 0.01 0.1 100 RATING AND CHARACTERISTIC CURVES S1A THRU S1M FIG. 1 - FORWARD CURRENT DERATING CURVE LEAD TEMPERATURE, °C AVERAGE FORWARD CURRENT, AMPERES FIG. 2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT NUMBER OF CYCLES AT 60 H Z PEAK FORWARD SURGE CURRENT, AMPERES FIG. 3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG. 4 - TYPICAL REVERSE CHARACTERISTICS INSTANTANEOUS FORWARD CURRENT, AMPERES INSTANTANEOUS REVERSE CURRENT, MICROAMPERES INSTANTANEOUS FORWARD VOLTAGE, VOLTS FIG. 5 - TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE, pF REVERSE VOLTAGE, VOLTS TL=110°C 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) TJ=25°C TJ=25°C S1(K,M) S1(A-J) PULSE WIDTH=300 µs 1% DUTY CYCLE TJ=25°C f=1.0 MHZ Vsig=50mVp-p TJ=125°C THICK COPPER PAD AREAS RESISTIVE OR INDUCTIVE LOAD PERCENT OF RATED PEAK REVERSE VOLTAGE, % TJ=75°C FIG. 6 - TRANSIENT THERMAL IMPEDANCE TRANSIENT THERMAL IMPEDANCE, °C/W t, PULSE DURATION, UNITS MOUNTED on INCHES (0.013mm) THICK COPPER LAND AREAS S1(K,M) S1(A-J) S1(K,M) S1(A-J)