RSD200N05FRA

RSD200N05FRA ROHM | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 9

Technical content

www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. 4V Drive Nch MOSFET RSD200N05 /g122/g122Structure /g122Dimensions (Unit : mm) Silicon N-channel MOSFET /g122Features 1) Low on-resistance. 2) Fast switching speed. 3) Drive circuits can be simple. 4) Parallel use is easy. /g122Application Switching /g122Packaging specifications /g122Inner circuit Package Taping Code TL Basic ordering unit (pieces) 2500 RSD200N05 /g123 /g122Absolute maximum ratings (Ta = 25/g113C) Symbol Limi ts Uni t Drain-source voltage VDSS 45 V Gate-source voltage VGSS /g11420 V Continuous I D /g11420 A PulsedI DP /g11440 A Continuous I S 16 A PulsedI SP 40 A Power dissipation P D 20 W Channel temperature Tch 150 /g113C Range of storage temperature Tstg /g1655/g3to/g3/g14150 /g113C *1 Pw/g1727210/g80s, Duty cycle/g172721% *2 Tc=25/g113C /g122Thermal resistance Symbol Limi ts Uni t Channel to Case Rth (ch-c) 6.25 /g113C / W * Tc=25/g113C Parameter Type Source current (Body Diode) Drain current Parameter CPT3 (SC-63) <SOT-428> ýõü ùõúïùð ïúð ÷õýü ÷õĀ ïøð ÷õþü ùõú÷õĀ üõø øõüüõü ùõú ÷õü øõ÷ ÷õü Āõü ùõü÷õÿĔİĵõ øõü (1) Gate (2) Drain (3) Source /g131 ESD PROTECTION DIODE /g132 BODY DIODE (1) (2) (3) 1/6 2011.08 - Rev.A AEC-Q101 Qualified FRA FRA 2016.06

www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Data SheetRSD200N05 /g18103 /g122/g122Electrical characteristics (Ta = 25°C) Symbol Min. Typ. Max. Unit Gate-source leakage I GSS -- /g11410 /g80AV GS=/g11420V, VDS=0V Drain-source breakdown voltage V (BR)DSS 45 - - V I D=1mA, VGS=0V Zero gate voltage drain current I DSS -- 1 /g80AV DS=45V, VGS=0V Gate threshold voltage V GS (th) 1.0 - 2.5 V V DS=10V, ID=1mA -2 0 2 8 I D=20A, VGS=10V -2 5 3 5 I D=20A, VGS=4.5V -2 8 4 0 I D=20A, VGS=4.0V Forward transfer admittance l Y fs l1 0 - - S I D=20A, VDS=10V Input capacitance C iss - 950 - pF V DS=10V Output capacitance C oss - 250 - pF V GS=0V Reverse transfer capacitance C rss - 120 - pF f=1MHz Turn-on delay time t d(on) - 10 - ns I D=10A, VDD 25V Rise time t r - 20 - ns V GS=10V Turn-off delay time t d(off) - 50 - ns R L=2.5/g58 Fall time t f - 20 - ns R G=10/g58 Total gate charge Q g - 12 - nC V DD 25V Gate-source charge Q gs - 3.5 - nC I D=20A, Gate-drain charge Q gd - 4.0 - nC V GS=5V *Pulsed /g122Body diode characteristics (Source-Drain) (Ta = 25/g113C) Symbol Min. Typ. Max. Unit Forward Voltage V SD - - 1.2 V I s=20A, VGS=0V *Pulsed Conditions Conditions m/g58 Parameter Parameter Static drain-source on-state resistance RDS (on) 2/6 2011.08 - Rev.A FRA 2016.06

www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Data SheetRSD200N05 䚷 /g122Electrical characteristic curves (Ta=25/g113C) 0 0.2 0.4 0.6 0.8 1 Drain Current : ID [A] Drain-Source Voltage : VDS [V] Fig.1 Typical Output Characteristics (Ϩ) VGS=2.5V VGS=10.0V VGS=4.0V VGS=4.5V VGS=2.8V VGS=3.0V VGS=2.6V VGS=3.5V Ta=25rC pulsed 02468 1 0 Drain Current : ID [A] Drain-Source Voltage : VDS [V] Fig.2 Typical Output Characteristics (ϩ) VGS=10.0V VGS=2.8V VGS=2.6V VGS=4.5V VGS=4.0V Ta=25rC pulsed 100 0.01 0.1 1 10 100 Static Drain-Source On-State Resistance RDS(on) [mΩ] Drain Current : ID [A] Fig.3 Static Drain-Source On-State Resistance vs. Drain Current VGS=4.5V VGS=4.0V VGS=10V Ta=25rC pulsed 100 0.01 0.1 1 10 100 Static Drain-Source On-State Resistance RDS(on) [m/g58] Drain Current : ID [A] Fig.4 Static Drain-Source On-State Resistance vs. Drain Current VGS=10V pulsed Ta=125rC㻌 Ta=75rC㻌 Ta=25rC㻌 Ta=/g1625rC 100 0.01 0.1 1 10 100 Static Drain-Source On-State Resistance RDS(on) [m/g58] Drain Current : ID [A] Fig.5 Static Drain-Source On-State Resistance vs. Drain Current VGS=4.5V pulsed Ta=125rC㻌 Ta=75rC㻌 Ta=25rC㻌 Ta=/g1625rC 100 0.01 0.1 1 10 100 Static Drain-Source On-State Resistance RDS(on) [m/g58] Drain Current : ID [A] Fig.6 Static Drain-Source On-State Resistance vs. Drain Current VGS=4V pulsed Ta=125rC㻌 Ta=75rC㻌 Ta=25rC㻌 Ta=/g1625rC 3/6 2011.08 - Rev.A FRA 2016.06

www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Data SheetRSD200N05 䚷 0.01 0.1 100 0.01 0.1 1 10 100 Forward Transfer Admittance |Yfs| [S] Drain Current : ID [A] Fig.7 Forward Transfer Admittance vs. Drain Current VDS=10V pulsed Ta=125rC㻌 Ta=75rC㻌 Ta=25rC㻌 Ta=/g1625rC 0.001 0.01 0.1 100 Drain Current : ID [A] Gate-Source Voltage : VGS [V] Fig.8 Typical Transfer Characteristics VDS=10V pulsed Ta=125rC㻌 Ta=75rC㻌 Ta=25rC㻌 Ta=/g1625rC 0.01 0.1 100 0.0 0.5 1.0 1.5 Source Current : IS [A] Source-Drain Voltage : VSD [V] Fig.9 Source Current vs. Source-Drain Voltage VGS=0V pulsed Ta=125rC㻌 Ta=75rC㻌 Ta=25rC㻌 Ta=/g1625rC 120 150 02468 1 0 1 2 1 4 1 6 1 8 2 0 Static Drain-Source On-State Resistance RDS(on) [mΩ] Gate-Source Voltage : VGS [V] Fig.10 Static Drain-Source On-State Resistance vs. Gate-Source Voltage ID=20A ID=10A Ta=25rC pulsed 100 1000 10000 0.01 0.1 1 10 100 Switching Time : t [ns] Drain Current : ID [A] Fig.11 Switching Characteristics td(on) tr td(off) tf VDDҸ25V VGS=10V RG=10Ω Ta=25rC Pulsed 0 2 4 6 8 1 01 21 41 61 82 02 2 Gate-Source Voltage : VGS [V] Total Gate Charge : Qg [nC] Fig.12 Dynamic Input Characteristics Ta=25rC VDD=25V ID=20A Pulsed 4/6 2011.08 - Rev.A FRA 2016.06

www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Data SheetRSD200N05 䚷 100 1000 10000 100000 0.01 0.1 1 10 100 Capacitance : C [pF] Drain-Source Voltage : VDS [V] Fig.13 Typical Capacitance vs. Drain-Source Voltage Ta=25rC f=1MHz VGS=0V Ciss Coss Crss 0.01 0.1 100 0.1 1 10 100 Drain㻌 Current : ID [ A ] Drain-Source Voltage : VDS [ V ] Fig.14 Maximum Safe Operating Area Tc=25rC Single Pulse Operation in this area is limited by RDS(on) (VGS = 10V) PW = 100μs PW = 1ms PW = 10ms 0.01 0.1 0.0001 0.001 0.01 0.1 1 10 100 1000 Normalized Transient Thermal Resistance :㻌 r䠄t䠅 Pulse width : Pw (s) Fig.15 Normalized Transient Thermal Resistance v.s. Pulse Width TC=25rC Single Pulse Rth(ch-c)=6.25rC/W Rth(ch-a)(t)=r(t)™Rth(ch-a) 5/6 2011.08 - Rev.A FRA 2016.06

www.rohm.com © 2011 ROHM Co., Ltd. All rights reserved. Data SheetRSD200N05 /g18103 /g122/g122Measurement circuits Fig.1-1 Switching Time Measurement Circuit VGS RG VDS D.U.T. ID RL VDD Fig.1-2 Switching Waveforms 90% 90% 90% 10% 10% 50% 10% 50% VGS Pulse width VDS ton toff trtd(on) tftd(off) Fig.2-1 Gate Charge Measurement Circuit VGS IG(Const.) VDS D.U.T. ID RL VDD Fig.2-2 Gate Charge Waveform VG VGS Charge Qg Qgs Qgd 6/6 2011.08 - Rev.A FRA 2016.06

Notice-PAA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Notice Precaution on using ROHM Products 1. If you intend to use our Products in devices requiring extremely high reliability ( such as medical equipment (Note 1), aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life , bodily injury or serious damage to property ( “Specific Applications ”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a cert ain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail -safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below . Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions . If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no -clean type fluxes, cle aning residue of flux is recommended); or Washing our Products by using water or water -soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on -board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady -state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation d epending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under de viant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface -mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface -mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification

Notice-PAA-E Rev.003 © 2015 ROHM Co., Ltd. All rights reserved. Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use . Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive pr oduct, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and stor age so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condi tion (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rig hts or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties.

Minimum Package Quantity 2500 Packing Type Taping Constitution Materials List inquiry RoHS Yes RSD200N05FRA - Web Page