RS7300 ORISTER | Alldatasheet
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Page No. : 1/11 DS‐RS7300‐14 September, 2009 www.Orister.com RS7300 600mA Adjustable & Fixed Voltage LDO Linear Regulator General Description The RS7300 series is a low‐dropout linear regulator that operates in the input voltage range from +2.4V to +7.0V and delivers 600mA output current. The RS7300 is available in two types, fixed output voltage type and adjustable output voltage type. The fixed output 1.25V to 5V. The RS7300 (ADJ type) consists of a 1.25V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features include short‐circuit protection and thermal shutdown protection. The RS7300 (Fixed type) consists of a 0.95V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features include short‐circuit protection and thermal shutdown protection. The RS7300 series devices are available in SOT‐ 223, SOT‐89 and SOT‐23 packages. Features Applications ◎ Operating Voltage Range：+2.4V to +7.0V ◎ Output Voltages：+1.0V to +5.0V (0.1V Step) (Fixed), +1.25V to +5.0V (ADJ Type) ◎ Dropout Voltage：500mV@600mA (Fixed) ◎ Fast Response in Power‐on (Fixed Voltage Only) ◎ Low Current Consumption：60μA (Typ.) ◎ ±2% Output Voltage Accuracy (special ±1% highly accurate), VOUT≧1.8V ◎ Low ESR Capacitor Compatible ◎ High Ripple Rejection：55dB (Typ.) ◎ Output Current Limit Protection：1.0A (Typ.) ◎ Short Circuit Protection：200mA (Typ.) ◎ Thermal Overload Shutdown Protection ◎ SOT‐223, SOT‐89 and SOT‐23 Packages ◎ RoHS Compliant and 100% Lead (Pb)‐Free and Green (Halogen Free with Commercial Standard) ◎ Battery‐Powered Equipments ◎ Graphic Card, Peripheral Card ◎ PCMCIA & New Card ◎ Mini PCI & PCI‐Express Cards ◎ Digital Still Camera ◎ CDMA/GSM Cellular Handsets ◎ Laptop, Palmtops, Notebook Computers ◎ Portable Information Application Application Circuits
Page No. : 2/11 DS‐RS7300‐14 September, 2009 www.Orister.com This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Pin Assignments SOT‐23 SOT‐89 SOT‐223 PACKAGE PIN SYMBOL DESCRIPTION
1 VIN Regulator Input Pin
2 VOUT Regulator Output Pin SOT‐23
3 GND/ADJ Ground Pin or ADJ Pin
PACKAGE PIN SYMBOL DESCRIPTION
1 GND/ADJ Ground Pin or ADJ Pin
2 VIN Regulator Input Pin SOT‐89
3 VOUT Regulator Output Pin
PACKAGE PIN SYMBOL DESCRIPTION
1 VOUT Regulator Output Pin
2 GND/ADJ Ground Pin or ADJ Pin SOT‐223
3 VIN Regulator Input Pin
Ordering Information
RS7300‐XX YY Z XX is nominal output voltage (for example, AD=ADJ, 15 = 1.5V, 33 = 3.3V, 285 = 2.85V). YY is package designator : N : SOT‐23 M : SOT‐89 SJ : SOT‐223 Z is Lead Free designator : P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package G: Green (Halogen Free with Commercial Standard)
Page No. : 3/11 DS‐RS7300‐14 September, 2009 www.Orister.com Block Diagram Absolute Maximum Ratings Parameter Symbol Ratings Units Input Voltage VIN to GND VIN 9.0 V Output Current Limit, I(LIMIT) ILIMIT 1.0 A Junction Temperature TJ +155 oC SOT‐89 180 SOT‐223 155 Thermal Resistance SOT‐23 θJA 260 oC/W SOT‐89 550 SOT‐223 900 Power Dissipation SOT‐23 PD 400 mW Operating Ambient Temperature TOPR ‐ 40 ~ +85 oC Storage Temperature TSTG ‐ 55~+150 oC Lead Temperature (soldering, 10sec) ‐ +260 oC NOTES： 1 The power dissipation values are based on the condition that junction temperature TJ and ambient temperature TA difference is 100°C. 2 Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute‐maximum –rated conditions for extended periods may affect device reliability.
Page No. : 4/11 DS‐RS7300‐14 September, 2009 www.Orister.com Electrical Characteristics (TA=25°C, VIN=5.0V unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit VIN Input Voltage ‐ 2.4 ‐ 7.0 V VIN=VOUT+1.0V, IOUT=1mA, VOUT≧1.8V ‐2% +2% V Fixed Type VIN=VOUT+1.0V, IOUT=1mA, VOUT＜1.8V, VIN＞2.4V ‐35 +35 mV VIN=VOUT+1.2V, IOUT=1mA, VOUT≧1.8V ‐2% +2% V VOUT Output Voltage ADJ Type VIN=VOUT+1.2V, IOUT=1mA, VOUT＜1.8V, VIN＞2.4V ‐50 VOUT +50 mV IMAX Output Current (see NOTE) VOUT+1.0V≦VIN≦7.0V, VOUT≧2.4V 600 ‐ ‐ mA IOUT=100mA, VOUT>3.0V ‐ 100 ‐ Dropout Voltage (Fixed Type) IOUT=600mA, VOUT>3.0V ‐ 500 ‐ VDROP Dropout Voltage (ADJ Type) IOUT=600mA, VOUT>3.0V ‐ 900 ‐ mV ΔVLOAD Load Regulation VIN=VOUT+1V, 1mA≦IOUT≦600mA ‐ 0.01 0.02 %/mA IQ Ground Pin Current ILOAD=0mA to 600mA, VIN=VOUT+1.0V ‐ 60 ‐ uA IADJ ADJ Pin Current ILOAD=0mA to 600mA, VIN=VOUT+1.0V ‐ 60 ‐ uA PSRR Ripple Rejection IOUT=30mA, F=1KHz, COUT=3.3uF ‐ 55 ‐ dB eN Output Noise IOUT=100mA , F=1KHz, COUT=3.3uF ‐ 40 ‐ uV(rms) TSD Thermal Shutdown Temperature ‐ ‐ 150 ‐ oC THYS Thermal Shutdown Hysteresis ‐ ‐ 20 ‐ oC NOTE：Measured using a double sided board with 1” x 2” square inches of copper area connected to the GND pins for “heat spreading”.
Page No. : 5/11 DS‐RS7300‐14 September, 2009 www.Orister.com Detail Description The RS7300 is a low‐dropout linear regulator. The device provides preset 1.8V, 2.5V and 3.3V output voltages for output current up to 600mA. Adjustable output voltage and other mask options for special output voltages are also available. As illustrated in function block diagram, it consists of a 1.25V bandgap (Fixed voltage type is 0.95V) reference, an error amplifier, a P‐channel pass transistor and an internal feedback voltage divider. The bandgap reference for adjustable voltage type is connected to the error amplifier, which compares this reference with the feedback voltage and amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the pass transistor gate is pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is too high, the pass transistor gate is pulled up to decrease the output voltage. The output voltage is feed back through an internal resistive divider (or external resistive divider for adjustable output voltage type) connected to VOUT pin. Additional blocks include an output current limiter, thermal sensor, and shutdown logic. Internal P‐channel Pass Transistor The RS7300 features a P‐channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P‐channel MOSFETs require no base drive, which reduces quiescent current. PNP‐based regulators also waste considerable current in dropout when the pass transistor saturates, and use high base‐drive currents under large loads. The RS7300 does not suffer from these problems and consumes only 60μA (Typ.) of current consumption under heavy loads as well as in dropout conditions. Output Voltage Selection For fixed voltage type of RS7300, the output voltage is preset at an internally trimmed voltage. The first two digits of part number suffix identify the output voltage (see Ordering Information). For example, the RS7300‐33 has a preset 3.3V output voltage. For adjustable voltage type of RS7300, the output voltage is set by comparing the feedback voltage at adjust terminal to the internal bandgap reference voltage. The reference voltage VREF is 1.25V. The output voltage is given by the equation: VOUT=VREF x (1+R2/R1)+IADJ x R2 Current Limit The RS7300 also includes a fold back current limiter. It monitors and controls the pass transistor’s gate voltage, estimates the output current, and limits the output current within 1.0A. Thermal Overload Protection Thermal overload protection limits total power dissipation in the RS7300. When the junction temperature exceeds TJ=+150°C, a thermal sensor turns off the pass transistor, allowing the IC to cool down. The thermal sensor turns the pass transistor on again after the junction temperature cools down by 20°C, resulting in a pulsed output during continuous thermal overload conditions. Thermal overload protection is designed to protect the RS7300 in the event of fault conditions. For continuous operation, the absolute maximum operating junction temperature rating of TJ=+125°C should not be exceeded. Operating Region and Power Dissipation Maximum power dissipation of the RS7300 depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is P = IOUT x (VIN‐VOUT). The resulting maximum power dissipation is: JA AJ CAJC AJ MAX TTTTP θθθ )()( −=+ Where (TJ‐TA) is the temperature difference between the RS7300 die junction and the surrounding air, θJC is the thermal resistance of the package chosen, and θCA is the thermal resistance through the printed circuit board, copper traces and other materials to the surrounding air. For better heat‐sinking, the copper area should be equally shared between the VIN, VOUT, and GND pins.
Page No. : 6/11 DS‐RS7300‐14 September, 2009 www.Orister.com If the RS7300 uses a SOT‐89 package and this package is mounted on a double sided printed circuit board with two square inches of copper allocated for “heat spreading”, the resulting θJA is 155°C/W. Based on the maximum operating junction temperature 125°C with an ambient of 25°C, the maximum power dissipation will be: W650155 25125TTP CAJC AJ MAX .)()( =−=+ −= θθ Thermal characteristics were measured using a double sided board with 1”x2” square inches of copper area connected to the GND pin for “heat spreading”. Dropout Voltage A regulator’s minimum input‐output voltage differential, or dropout voltage, determines the lowest usable supply voltage. In battery‐powered systems, this will determine the useful end‐of‐life battery voltage. The RS7300 use a P‐channel MOSFET pass transistor, its dropout voltage is a function of drain‐to‐source on‐resistance RDS(ON) multiplied by the load current. OUTONDSOUTINDROPOUT IRVVV ×=−= )(
Page No. : 7/11 DS‐RS7300‐14 September, 2009 www.Orister.com SOT‐23 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
Page No. : 8/11 DS‐RS7300‐14 September, 2009 www.Orister.com SOT‐89 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. The center lead is in electrical contact with the tab. D. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. E. Thermal pad contour optional within these dimensions. F. Falls within JEDEC TO‐243 variation AA, except minimum lead length, pin 2 minimum lead width, minimum tab width.
Page No. : 9/11 DS‐RS7300‐14 September, 2009 www.Orister.com SOT‐223 Dimension NOTES: A. All linear dimensions are in millimeters (inches). B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. Falls within JEDEC TO‐261 variation AA.
Page No. : 10/11 DS‐RS7300‐14 September, 2009 www.Orister.com Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface‐mount devices Profile Feature Sn‐Pb Eutectic Assembly Pb‐Free Assembly Average ramp‐up rate (TL to TP) <3oC/sec <3oC/sec Preheat ‐ Temperature Min (Tsmin) ‐ Temperature Max (Tsmax) ‐ Time (min to max) (ts) 100oC 150oC 60~120 sec 150oC 200oC 60~180 sec Tsmax to TL ‐ Ramp‐up Rate <3oC/sec <3oC/sec Time maintained above: ‐ Temperature (TL) ‐ Time (tL) 183oC 60~150 sec 217oC 60~150 sec Peak Temperature (TP) 240oC +0/‐5oC 260oC +0/‐5oC Time within 5oC of actual Peak Temperature (tP) 10~30 sec 20~40 sec Ramp‐down Rate <6oC/sec <6oC/sec Time 25oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245oC ±5oC 5sec ±1sec Pb‐Free devices. 260oC +0/‐5oC 5sec ±1sec Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP t 25oC to Peak Time Temperature
Page No. : 11/11 DS‐RS7300‐14 September, 2009 www.Orister.com Important Notice: © Orister Corporation Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product. No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied. Orister reserves the right to make changes to their products or specifications or to discontinue any product or service without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed. Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders.