RS7100

RS7100 ORISTER | Alldatasheet

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Page No. : 1/12 DS‐RS7100‐14 April, 2010 www.Orister.com RS7100 Low Power 300mA CMOS LDO General Description The RS7100 is a low‐dropout linear regulator that operations in the input voltage range from +2.5V to +9.0V and delivers 300mA output current. The high‐accuracy output voltage is preset at an internally trimmed voltage 2.5V or 3.3V. Other output voltages can be mask‐optioned from 1.5V to 5.0V with 100mV increment. The RS7100 consists of a 1.25V bandgap reference, an error amplifier, and a P‐channel pass transistor. Other features include short‐circuit protection and thermal shutdown protection. The RS7100 devices are available in SOT‐23 and SOT‐89 packages. Features Applications

• Operating Voltages Range: +2.5V to +9.0V
• Output Voltages Range: +1.5V to +5.0V with 100mV Increment
• Maximum Output Current: 300mA
• Low Dropout: 120mV@100mA (VOUT≥2.0V)
• ±2% Output Voltage Accuracy
• High Ripple Rejection: 70dB
• Output Current Limit Protection (600mA)
• Short Circuit Protection (300mA)
• Thermal Overload Shutdown Protection
• Low ESR Capacitor Compatible
• RoHS Compliant and 100% Lead (Pb)‐Free and Green (Halogen Free with Commercial Standard)
• Battery‐powered equipment
• Voltage regulator for microprocessor
• Voltage regulator for LAN cards
• Wireless Communication equipment
• Audio/Video equipment
• Post Regulator for Switching Power Application Circuits This integrated circuit can be damaged by ESD. Orister Corporation recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

Page No. : 2/12 DS‐RS7100‐14 April, 2010 www.Orister.com Pin Assignments SOT‐23 SOT‐89 PACKAGE PIN SYMBOL DESCRIPTION

1 GND Ground Pin

2 VOUT Regulator Output Pin SOT‐23

3 VIN Regulator Input Pin

PACKAGE PIN SYMBOL DESCRIPTION

2 VOUT Regulator Output Pin SOT‐89

Ordering Information

RS7100‐XX Y Z XX is nominal output voltage (for example, 15 = 1.5V, 33 = 3.3V, 285 = 2.85V). Y is package designator : N: SOT‐23 M: SOT‐89 Z is Lead Free designator : P: Commercial Standard, Lead (Pb) Free and Phosphorous (P) Free Package G: Green (Halogen Free with Commercial Standard) Block Diagram

Page No. : 3/12 DS‐RS7100‐14 April, 2010 www.Orister.com Absolute Maximum Ratings Parameter Symbol Ratings Units Input Voltage VIN to GND VIN 10 V Output Current Limit, I(LIMIT) ILIMIT 600 mA Junction Temperature TJ +155 oC SOT‐23 280 Thermal Resistance SOT‐89 θJA 180 oC/W SOT‐23 350 Power Dissipation SOT‐89 PD 550 mW Operating Ambient Temperature TOPR ‐ 40 ~ +85 oC Storage Temperature TSTG ‐ 55~+150 oC Lead Temperature (soldering, 10sec) ‐ +260 oC NOTE: Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and function operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute‐maximum–rated conditions for extended periods may affect device reliability. Electrical Characteristics (TA=25°C, unless otherwise specified) Symbol Parameter Conditions Min. Typ. Max. Unit VIN Input Voltage ‐ 2.5 ‐ 9.0 V IMAX Output Current ‐ 300 ‐ ‐ mA ILIMIT Current Limit ‐ ‐ 0.6 ‐ A ISC Short Circuit Current VOUT=0V, VIN=5V 300 350 mA IQ Ground Pin Current ILOAD=0mA to 300mA, VIN=5.0V ‐ 30 50 uA IOUT=100mA ‐ 120 145 VDROP Dropout Voltage IOUT=300mA ‐ 400 480 mV ΔVLINE Line Regulation VOUT+0.48V<VIN<9.0V, ILOAD=1mA ‐ 0.2 0.3 %/V ΔVLOAD Load Regulation IOUT=0mA to 300mA ‐ 0.01 0.02 %/mA eN Output Noise F=1Hz to 10KHz, COUT=1uF ‐ 70 ‐ uV(rms) PSRR Ripple Rejection F=1KHz, COUT=1uF ‐ 70 ‐ dB TSD Thermal Shutdown Temperature ‐ ‐ 160 ‐ oC THYS Thermal Shutdown Hysteresis ‐ ‐ 10 ‐ oC

Page No. : 4/12 DS‐RS7100‐14 April, 2010 www.Orister.com Typical Operating Characteristics (CIN=1μF, COUT=3.3μF, TA=+25 oC, unless otherwise noted.)

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Page No. : 7/12 DS‐RS7100‐14 April, 2010 www.Orister.com Detail Description The RS7100 is a low‐dropout linear regulator. The device provides preset 2.5V and 3.3V output voltages for output current up to 300mA. Other mask options for special output voltages from 1.5V to 5.0V with 100mV increment are also available. As illustrated in function block diagram, it consists of a 1.25V reference, error amplifier, a P‐channel pass transistor, and an internal feedback voltage divider. The 1.25V bandgap reference is connected to the error amplifier, which compares this reference with the feedback voltage and amplifies the voltage difference. If the feedback voltage is lower than the reference voltage, the pass‐transistor gate is pulled lower, which allows more current to pass to the output pin and increases the output voltage. If the feedback voltage is too high, the pass‐transistor gate is pulled up to decrease the output voltage. The output voltage is feedback through an internal resistive divider connected to VOUT pin. Additional blocks include with output current limiter and shutdown logic. Internal P‐channel Pass Transistor The RS7100 features a P‐channel MOSFET pass transistor. Unlike similar designs using PNP pass transistors, P‐channel MOSFETs require no base drive, which reduces quiescent current. PNP–based regulators also waste considerable current in dropout conditions when the pass transistor saturates, and use high base‐drive currents under large loads. The RS7100 does not suffer from these problems and consumes only 65μA (Typical) of ground pin current under heavy loads as well as in dropout conditions. Output Voltage Selection The RS7100 output voltage is preset at an internally trimmed voltage 2.5V or 3.3V or can be mask optioned from 1.5V to 5.0V with 100mV increment The first two digits of part number suffix identify the output voltage (see Ordering Information). For example, RS7100‐33 has a preset 3.3V output voltage. Current Limit The RS7100 also includes a fold back current limiter. It monitors and controls the pass‐transistor’s gate voltage, estimates the output current, and limits the output current within 600mA. Thermal Overload Protection Thermal overload protection limits total power dissipation in the RS7100. When the junction temperature exceeds TJ=+155°C, a thermal sensor turns off the pass transistor, allowing the IC to cool down. The thermal sensor turns the pass transistor active again after the junction temperature cools down by 20°C resulting in a pulsed output during continuous thermal overload conditions. Thermal overload protection is designed to protect the RS7100 in the event of fault conditions. For continuous operation, the maximum operating junction temperature rating of TJ=+125°C should not be exceeded. Operating Region and Power Dissipation Maximum power dissipation of the RS7100 depends on the thermal resistance of the case and circuit board, the temperature difference between the die junction and ambient air, and the rate of airflow. The power dissipation across the devices is P = IOUT x (VIN‐VOUT). The resulting maximum power dissipation is: JA AJ CAJC AJ MAX )TT()TT(P θ −=θ+θ Where (TJ‐TA) is the temperature difference between the RS7100 die junction and the surrounding air, θJC is the thermal resistance of the package chosen, and θCA is the thermal resistance through the printed circuit board, copper traces and other materials to the surrounding air. For better heat‐sinking, the copper area should be equally shared between the VIN, VOUT, and GND pins. If the RS7100 uses a SOT‐89 package and this package is mounted on a double sided printed circuit board with two square inches of copper allocated for “heat spreading”, the resulting θJA is 180°C/W.

Page No. : 8/12 DS‐RS7100‐14 April, 2010 www.Orister.com Based on a maximum operating junction temperature 125°C with an ambient of 25°C, the maximum power dissipation will be: W555.0180 )25125()TT(P CAJC AJ MAX =−=θ+θ Thermal characteristics were measured using a double‐side board with 1”x 2” square inches of copper area connected to the GND pin for “heat spreading”. Dropout Voltage A regulator’s minimum input‐output voltage differential, or dropout voltage, determines the lowest usable supply voltage. In battery‐powered systems, this will determine the useful end‐of‐life battery voltage. The RS7100 uses a P‐channel MOSFET pass transistor, its dropout voltage is a function of drain‐to‐source on‐resistance (RDS(ON)) multiplied by the load current. OUT)ON(DSOUTINDROPOUT IRVVV ×=−=

Page No. : 9/12 DS‐RS7100‐14 April, 2010 www.Orister.com SOT‐23 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.

Page No. : 10/12 DS‐RS7100‐14 April, 2010 www.Orister.com SOT‐89 Dimension NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. The center lead is in electrical contact with the tab. D. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side. E. Thermal pad contour optional within these dimensions. F. Falls within JEDEC TO‐243 variation AA, except minimum lead length, pin 2 minimum lead width, minimum tab width.

Page No. : 11/12 DS‐RS7100‐14 April, 2010 www.Orister.com Soldering Methods for Orister’s Products 1. Storage environment: Temperature=10oC~35oC Humidity=65%±15% 2. Reflow soldering of surface‐mount devices Profile Feature Sn‐Pb Eutectic Assembly Pb‐Free Assembly Average ramp‐up rate (TL to TP) <3oC/sec <3oC/sec Preheat ‐ Temperature Min (Tsmin) ‐ Temperature Max (Tsmax) ‐ Time (min to max) (ts) 100oC 150oC 60~120 sec 150oC 200oC 60~180 sec Tsmax to TL ‐ Ramp‐up Rate <3oC/sec <3oC/sec Time maintained above: ‐ Temperature (TL) ‐ Time (tL) 183oC 60~150 sec 217oC 60~150 sec Peak Temperature (TP) 240oC +0/‐5oC 260oC +0/‐5oC Time within 5oC of actual Peak Temperature (tP) 10~30 sec 20~40 sec Ramp‐down Rate <6oC/sec <6oC/sec Time 25oC to Peak Temperature <6 minutes <8 minutes 3. Flow (wave) soldering (solder dipping) Products Peak temperature Dipping time Pb devices. 245oC ±5oC 5sec ±1sec Pb‐Free devices. 260oC +0/‐5oC 5sec ±1sec Figure 1: Temperature profile tP tL Ramp-down Ramp-up Tsmax Tsmin Critical Zone TL to TP tS Preheat TL TP t 25oC to Peak Time Temperature

Page No. : 12/12 DS‐RS7100‐14 April, 2010 www.Orister.com Important Notice: © Orister Corporation Orister cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in an Orister product. No circuit patent licenses, copyrights, mask work rights, or other intellectual property rights are implied. Orister reserves the right to make changes to their products or specifications or to discontinue any product or service without notice. Except as provided in Orister’s terms and conditions of sale, Orister assumes no liability whatsoever, and Orister disclaims any express or implied warranty relating to the sale and/or use of Orister products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards. Testing and other quality control techniques are utilized to the extent Orister deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed. Orister and the Orister logo are trademarks of Orister Corporation. All other brand and product names appearing in this document are registered trademarks or trademarks of their respective holders.