RP602K330G-TR

RP602X NISSHINBO | Alldatasheet

Document overview

• PDF pages: 29

Technical content

1.5 A PWM/VFM Buck-Boost DC/DC Converter with Synchronous Rectifier

No. EA-353-190507 The RP602x is a 6.5 V (Max. rating) buck-boost DC/DC converter with synchronous rectifier. This device is ideally suited for industrial or OA equipment that require constant voltage even when low-input voltage (Min. 2.3 V). Since operating with switching frequency of 2.6 MHz, this device can realize a high-speed response with a small coil and maintain a high-efficiency at low input voltage.

• Realize a high-efficiency at low input voltage.
• Input Voltage Range:2.3 V to 5.5 V
• Output Voltage Range:2.7 V to 4.2 V (0.1V step)
• Output Voltage Accuracy :±1.5%
• Line Regulation: Typ. 0.5%, PWM mode
• L oad Regulation: Typ. 0.1%, (IOUT = 0 to 500 mA, PWM mode)
• Maximum Output Current: Typ. 1.5 A, (PVIN = 3 V, VOUT = 3.3 V)
• Maximum Burst Current: Typ. 2.7 A, (PVIN=3 V, VOUT=3.3 V, Duty=10%, t=2.0 ms)
• Overcurrent Limit Protection: Typ. 4.2 A
• Oscillator Frequency: Typ. 2.6 MHz
• Built-in Driver ON Resistance: Typ. Pch. 80 mΩ, Nch. 80 mΩ
• Operating Quiescent Current: Typ. 27.5 µA, (VFM mode, Non-switching)
• UVLO Detector Threshold: Typ. 2.0 V
• Soft-start Time: Typ. 1.0 ms
• Thermal Shutdown Temperature:Typ.150°C
• Protection Feature: Overvoltage, Overcurrent Efficiency Characterisitcs (RP602Z330x, MODE = H) RP602Z RP602K The following functions are user-selectable options. Code Auto-discharge Function Latch Protection Reset Protection A/E Yes Yes No B/F No Yes No C/G Yes No Yes D/H No No Yes WLCSP-20-P1 2.305 mm x 1.700 mm DFN(PLP)2730-12 2.7mm×3.0mm
• Power source for portable equipment such as laptops, PDAs, DSCs, cellular phones, and smartphones
• Power source for Li-ion battery-used equipment PACKAGE OPTIONAL FUNCTION Control MODE Control CE GND BULX BOLX L RP602x VFB PVIN CIN COUT AVIN LoadVOUT PGND TYPICAL APPLICATION OVERVIEW KEY BENEFITS KEYSPECIFICATIONS TYPICAL CHARACTERISTICS

APPLICATIONS

No. JA-353-190507 SELECTION GUIDE Selection Guide Product Name Package Quantity per Reel Pb Free Halogen Free RP602Zxxx$-E2-F WLCSP-20-P1 5,000 pcs Yes Yes RP602Kxxx#-TR DFN(PLP)2730-12 5,000 pcs Yes Yes xxx: Specify the set output voltage (VSET) within the range of 2.7 V to 4.2 V in 0.1 V (1) steps. $: Specify the combination of the auto-discharge option and the protection function option. Symbol Auto-discharge Function Latch-type Protection Reset-type Protection Short-circuit Protection A Yes Yes No Yes B No Yes No Yes C Yes No Yes Yes D No No Yes Yes #: Specify the combination of the auto-discharge option and the protection function option. Symbol Auto-discharge Function Latch-type Protection Reset-type Protection Short-circuit Protection E Yes Yes No Yes F No Yes No Yes G Yes No Yes Yes H No No Yes Yes (1) 0.05 V step is also available as a custom code.

No. JA-353-190507 BLOCK DIAGRAM RP602x Block Diagram

No. JA-353-190507 PIN DESCRIPTION RP602Z Pin Description Top Vie w Bottom View A B C D DC B A WLCSP-20-P1 Pin Configuration Pin No. Symbol Pin Description A5, B5, C5 VOUT (1) Output Voltage Pin A4, B4, C4 BOLX (1) Boost Switching Output Pin A3, B3, C3 PGND (2) P o w e r G N D P i n A2, B2, C2 BULX (1) Buck Switching Output Pin A1, B1, C1 PVIN (1) Power Input Voltage Pin D1 AVIN (1) Analog Power Input Voltage Pin D2 CE Chip Enable Pin, Active-high D3 MODE Mode Control Pin, Forced PWM Control: L, PWM/VFM Auto Switching Control: H D4 AGND (2) Analog GND Pin D5 VFB Output Voltage Feedback Pin Pin Truth Table CE Pin MODE Pin (3) Operation L - OFF H H PWM/ VFM Auto Switching Control Mode L Forced PWM Control Mode (1) The pin numbers sharing the same pin symbol must be connected together: A4, B4, and C4 of the BOLX pin, A2, B2, and C2 of the BULX pin, A5, B5, and C5 of the VOUT pin. D1 of the AVIN pin and A1, B1, and C1 of the PVIN pin must be connected together. (2) D4 of the AGND pin and A3, B3, and C3 of the PGND pin must be connected to the ground. (3) The logic to the MODE pin should not be changed while CE = “H”.

No. JA-353-190507 RP602K Pin Description Top View Bottom View DFN(PLP)2730-12 Pin Configuration Pin No. Symbol Pin Description

1 AVIN (1) Analog Power Input Voltage Pin

2 CE Chip Enable Pin, Active-high

3 MODE Mode Control Pin,

Forced PWM Control: L, PWM/VFM Auto Switching Control: H

4 NC No Connection

5 AGND (2) Analog GND Pin

6 VFB Output Voltage Feedback Pin

7 VOUT Output Voltage Pin

8 BOLX Boost Switching Output Pin

9,10 PGND (2) P o w e r G N D P i n

11 BULX Buck Switching Output Pin

12 PVIN (1) Power Input Voltage Pin

 The tab on the bottom of the pac kage must be connected to the g round plane on the board to enhance thermal performance. Pin Truth Table CE Pin MODE Pin (3) Operation L - OFF H H PWM/ VFM Auto Switching Control Mode L Forced PWM Control Mode (1) The AVIN pin and the PVIN pin must be connected together. (2) The AGND pin and the PGND pin must be connected to the ground. (3) The logic to the MODE pin should not be changed while CE = “H”.

No. JA-353-190507 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings ( A G N D = P G N D = 0 V) Symbol Item Rating Unit VIN AVIN/ PVIN Pin Voltage −0.3 to 6.5 V VBULX BULX Pin Voltage −0.3 to VIN + 0.3 V VBOLX BOLX Pin Voltage −0.3 to VOUT + 0.3 V VCE CE Pin Voltage −0.3 to 6.5 V VMODE MODE Pin Voltage −0.3 to 6.5 V VOUT VOUT Pin Voltage −0.3 to 6.5 V VFB VFB Pin Voltage −0.3 to 6.5 V ILX BULX/ BOLX Pin Output Current 4.2 A PD Power Dissipation (1) WLCSP-20-P1 (JEDEC STD.51-9 ) 1400 mW DFN(PLP)2730-12 (JEDEC STD.51-7 ) 3100 Tj Junction Temperature Range −40 to 125 °C Tstg Storage Temperature Range −55 to 125 °C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings are not assured. RECOMMENDED OPERATING CONDITIONS Symbol Item Rating Unit VIN Input Voltage 2.3 to 5.5 V Ta Operating Temperature Range −40 to 85 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment shou ld be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices can not operate normally over the recommended operating conditions, even if they are used over such ratings b y momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Refer to POWER DISSIPATION for detailed information.

No. JA-353-190507

ELECTRICAL CHARACTERISTICS

Open-loop Measurement GND = 0 V, unless otherwise noted. RP602Z E l e c t r i c a l C h a r a c t e r i s t i c s (Ta = 25°C) Symbol Item Conditions Min. Typ. Max. Unit IDD Power Current VIN = 5.5 V, VOUT = 4.2 V VMODE = 5.5V 27.5 60 µA VMODE = 0 V 1000 1400 ISTANDBY Standby Current VIN = 5.5 V, VCE = 0 V 0.1 5.0 µA VOUT Output Voltage VIN = 3.6 V x0.985 x1.015 V  VOUT /Ta Output Voltage Temperature Coefficient −40°C ≤ Ta ≤ 85°C ±50 ppm/ VOVP OVP Detection Voltage VIN = 3.6 V , Rising 4.5 5.0 5.5 V OVP Release Voltage VIN = 3.6 V , Falling 4.3 4.8 5.3 V fOSC Switching Frequency VIN = 3.6 V 2.4 2.6 2.9 MHz ILIMHS BULX Current Limit (1) V IN = 3.6 V 3.7 4.2 A RON High & Low Switch On-resistance V IN = 3.6 V 80 mΩ RDIS On-resistance of Discharge Tr. (RP602ZxxxA/C) V IN = 3.6 V, VCE = 0 V 80 Ω IFBH V FB Input Current, High VIN = 5.5 V, VCE = 0 V VFB = 5.5V 1 µ A IFBL V FB Input Current, Low VIN = 5.5 V, VCE = 0 V VFB = 0V 1 µ A VH CE / MODE Pins Input Voltage, High V IN = 5.5 V 1.0 V VL CE / MODE Pins Input Voltage, Low V IN = 2.3 V 0.4 V IH CE / MODE Pins Input Current, High V IN = VCE = 5.5 V −1 0 1 µA IL CE / MODE Pins Input Current, Low V IN = 5.5 V, VCE = 0 V −1 0 1 µA VUVLO1 UVLO Detection Voltage VIN = Falling 1.83 2.00 V VUVLO2 UVLO Release Voltage VIN = Rising 2.05 2.25 V TTSD Thermal Shutdown Threshold Temperature Tj, Rising 150 °C TTSR Tj, Falling 110 °C tSTART Soft-start Time VIN = 3.6 V 1 ms tPROT Protection Delay Time (RP602ZxxxA/B/C/D) V IN = 3.6 V 1.6 ms tRST Reset Protection Delay Time (RP602ZxxxC/D) V IN = 3.6 V 12 ms All test items listed under ELECTRICAL CHARACTERISTICS are done under the pulse load condition (Tj ≈ Ta = 25°C). (1) BULX Current Limit vary according to the switching duty ratio.

No. JA-353-190507 Open-loop Measurement GND = 0 V, unless otherwise noted. RP602K E l e c t r i c a l C h a r a c t e r i s t i c s (Ta = 25°C) Symbol Item Conditions Min. Typ. Max. Unit IDD Power Current VIN = 5.5 V, VOUT = 4.2 V, VMODE = 5.5 V 27.5 60 µA VMODE = 0 V 1000 1400 ISTANDBY Standby Current VIN = 5.5 V, VCE = 0 V 0.1 5.0 µA VOUT Output Voltage VIN = 3.6 V x0.985 x1.015 V  VOUT /Ta Output Voltage Temperature Coefficient −40°C ≤ Ta ≤ 85°C ±50 ppm/ VOVP OVP Detection Voltage VIN = 3.6 V , Rising 4.5 5.0 5.5 V OVP release Voltage VIN = 3.6 V , Falling 4.3 4.8 5.3 V fOSC Switching Frequency VIN = 3.6 V 2.4 2.6 2.9 MHz ILIMHS BULX Current Limit (1) V IN = 3.6 V 3.7 4.2 A RON High & Low Switch On-resistance V IN = 3.6 V 120 mΩ RDIS On-resistance of Discharge Tr. (RP602KxxxE/G) V IN = 3.6 V, VCE = 0 V 80 Ω IFBH V FB Input Current, High VIN = 5.5 V, VCE = 0 V VFB = 5.5V 1 µ A IFBL V FB Input Current, Low VIN = 5.5 V, VCE = 0 V VFB = 0V 1 µ A VH CE / MODE Pins Input Voltage, High VIN = 5.5 V 1.0 V VL CE / MODE Pins Input Voltage, Low VIN = 2.3 V 0.4 V IH CE / MODE Pins Input Current, High VIN = VCE = 5.5 V −1 0 1 µA IL CE / MODE Pins Input Current, Low VIN = 5.5 V, VCE = 0 V −1 0 1 µA VUVLO1 UVLO Detection Voltage V IN = Falling 1.83 2.00 V VUVLO2 UVLO Release Voltage VIN = Rising 2.05 2.25 V TTSD Thermal Shutdown Threshold Temperature Tj, Rising 150 °C TTSR Tj, Falling 110 °C tSTART Soft-start Time VIN = 3.6 V 1 ms tPROT Protection Delay Time (RP602KxxxE/F/G/H) V IN = 3.6 V 1.6 ms tRST Reset Protection Delay Time (RP602KxxxG/H) V IN = 3.6 V 12 ms All test items listed under ELECTRICAL CHARACTERISTICS are done under the pulse load condition (Tj ≈ Ta = 25°C). (1) BULX Current Limit vary according to the switching duty ratio.

No. JA-353-190507 Product-specific Electrical Characteristics (Ta = 25°C) Product Name VOUT (V) Min. Typ. Max. RP602x270x 2.660 2.700 2.740 RP602x280x 2.758 2.800 2.842 RP602x290x 2.857 2.900 2.943 RP602x300x 2.955 3.000 3.045 RP602x310x 3.054 3.100 3.146 RP602x320x 3.152 3.200 3.248 RP602x330x 3.251 3.300 3.349 RP602x340x 3.349 3.400 3.451 RP602x350x 3.448 3.500 3.552 RP602x360x 3.546 3.600 3.654 RP602x370x 3.645 3.700 3.755 RP602x380x 3.743 3.800 3.857 RP602x390x 3.842 3.900 3.958 RP602x400x 3.940 4.000 4.060 RP602x410x 4.039 4.100 4.161 RP602x420x 4.137 4.200 4.263

No. JA-353-190507 THEORY OF OPERATION Soft-start Time Starting-up with CE Pin The IC starts to operate when the CE pin voltage (V CE) exceeds the threshold voltage. The threshold voltage is preset between CE “High” input voltage (V CEH) and CE “Low” input voltage (V CEL). After the start-up of the IC, soft-start circuit starts to operate. Then, after a certain period of time, the reference voltage (VREF) in the IC gradually increases up to the specified value. Soft-start time (tSTART) starts when soft-start circuit is activated, and ends when the reference voltage reaches the specified voltage. Soft start time is not always equal to the turn-on speed of the DC/DC conver ter. Note that the turn-on spe ed could be affected by the power supply capacity, the output current, the inductance value and the COUT value. VCEH Soft-start Time IC Internal Reference Voltage VCEL Threshold Level Lx Voltage (VCE) (VREF) Soft-start Circuit operation starts. (VLX) Depending on Power Supply, Load Current, External Components (VOUT) Output Voltage CE Pin Input Voltage IC operates with PWM mode during Soft-start time. Timing Chart: Starting-up with CE Pin Starting-up with Power Supply After the power-on, when VIN exceeds the UVLO release voltage (VUVLO2), the IC starts to operate. Then, soft- start circuit starts to operate and after a certain period of t ime, VREF gradually increases up to the specified value. Soft-start time starts when soft-start circuit is activa ted, and ends when V REF reaches the specified voltage. Note that the turn-on speed of VOUT could be affected by the power supply capacity, the output current, the inductance value, the COUT value and the turn-on speed of VIN determined by CIN. Output Voltage (VOUT) Input Voltage (VIN) VUVLO2 IC Internal Reference Voltage (VREF) VUVLO1 Lx Voltage (VLX) VSET VSET Depending on Power Supply, Load Current, External Components Soft-start Time IC operates with PWM mode during Soft-start time. Timing Chart: Starting-up with Power Supply

No. JA-353-190507 Undervoltage Lockout (UVLO) Circuit If the VIN becomes lower than the UVLO detection voltage (V UVLO1), the UVLO circuit s tarts to operate, V REF stops, and P-channel and N-channel built-in switch transistors turn “OFF”. As a result, V OUT drops according to the COUT capacitance value and the load. To restart the operation, VIN needs to be higher than VUVLO2. Overvoltage Protection (OVP) Circuit If the VOUT becomes higher than the OVP detection voltage (VOVP), the OVP circuit starts to operate, P-channel and N-channel built-in switch transistors turn “OFF”. As a result, VOUT drops according to the COUT capacitance value and the load. Overcurrent Protection Circuit Overcurrent protection circuit supervises the inductor peak cur rent (the peak current flowing through Pch Tr (SW1) in each switching cycle, and if the current exceeds the B ULX current limit (I LXLIM), it turns off Pch Tr (SW1). ILXLIM of the RP602x is set to Typ.4200 mA. Simplified Diagram of Output Switches Short Protection Circuit If the VOUT becomes lower than a certain threshold, the BULX current limit is reduced. BULX Current Limit (ILXLIM) BULX Current Pch Tr Current BULX Voltage Over Current Protection Output Current (IOUT) Output Voltage (VOUT) Short Protection Detector Threshold BULX Current Limit (ILXLIM) Short Protection Detected Timing Chart: Overcurrent Protection Circuit & Short Protection Circuit

No. JA-353-190507 Latch Type Protection Circuit: RP602xxxxA/B/E/F The latch type protection circuit latches the built-in drivers o f S W 1 , S W 2 , S W 3 a n d S W 4 o f f t o s t o p t h e operation of the device if the overcurrent state continues more than the protection delay time (tPROT). To release the latch-type protection, reset the device by switching the CE pin from High to Low or making the input voltage (VIN) lower than the UVLO detection voltage (VUVLO1). BULX Limit Current (ILXLIM) BULX Current Pch Tr Current BULX Voltage Protection Delay time (tprot) Output Current (IOUT) Output Voltage (VOUT) Timing Chart: RP602xxxxA/B/E/F Latch Protection Circuit

No. JA-353-190507 Reset Type Protection Circuit: RP602xxxxC/D/G/H When the overcurrent state continues more than the protection delay time (tPROT), the reset type protection circuit operates and switching stops. The built-in drivers of SW1, SW2, SW3 and SW4 turn off and restarts after the reset protection delay time (t RST). When the overcurrent state is released, the operation is automatically released and returns to normal operation. BULX Limit Current (ILXLIM) BULX Current Pch Tr Current BULX Voltage Protection Delay time (tprot) Output Current (IOUT) Output Voltage (VOUT) Delay time for Reset Protection (trst) BULX Limit Current (ILXLIM) Short Protection Detected Short Protection Detector Threshold ( t r s t ) (tprot) restart restart Timing Chart: RP602xxxxC/D/G/H Reset Protection Circuit

No. JA-353-190507

APPLICATION INFORMATION

RP602x Typical Application Circuit Recommended External Components Symbol Description CIN (1) 10 µF, Ceramic, GRM188R60J106ME47, Murata COUT (2) 22 µF x 2, Ceramic, GRM188R60J226MEA0, Murata L 1.0 µH, Inductor, DFE201610P- 1R0M, TOKO 1.0 µH, Inductor, XAL4020- 102ME, Coilcraft Technical Notes on External Components Selection

• Use ceramic capacitors having a low equivalent series resistance (ESR). C OUT should be paralleled with another COUT. When selecting the capacitors, consider the bias characteristics and input/ output voltage.
• When the built-in switches are turned off, the inductor may generate a spike-shaped high voltage. Use the high-breakdown voltage capacitor (C OUT) which output voltage is 1.5 times or more than the set output voltage.
• Use an inductor that has a low DC resistance, has an enough tolerable current and is less likely to cause magnetic saturation. If the inductance value is extremely small, the peak current of LX may increase. When the peak current of LX reaches to the LX limit current (I LXLIM), overcurrent protection circuit starts to operate. When selecting the inductor, consider the peak current of LX pi n (ILXMAX). Refer to Calculation Method of Peak Current of LX Pin (ILXMAX) in Continuous Mode for details. (1) Place CIN as close as possible to the PVIN pin. (2) Place COUT as close as possible to the VOUT pin.

No. JA-353-190507 Calculation Method of Peak Current of LX Pin (ILXMAX) in Continuous Mode The peak current of LX pin (ILXMAX) can be calculated as follows, in the case of an ideal buck converter operating in steady conditions, using the components listed in Recommended External Components of APPLICATION INFORMATION. Ripple Current P-P value is described as IRP, ON resistance of Pch. Tr. is described as RONP, ON resistance of Nch. Tr. is described as RONN, and DC resistor of the inductor is described as RL. First, when Pch. Tr. is “ON”, the following equation is satisfied. L  I Put Equation 2 into Equation 1 to solve ON duty of Pch. Tr. (DON = tON / (tOFF + tON)): D Ripple Current is described as follows: I Peak current that flows through L, and LX Tr. is described as follows: I

No. JA-353-190507 The peak current of LX pin (I LXMAX) can be calculated as follows, in the case of an ideal boost c onverter operating in steady conditions, using the components listed in Recommended External Components o f APPLICATION INFORMATION. Ripple Current P-P value is described as I RP, Average inductor current is described as I LX, ON resistance of Pch. Tr. and ON resistance of Nch. Tr. is described as R ONP and R ONN respectively, and DC resistor of the inductor is described as RL. First, when Nch. Tr. is “ON”, the following equation is satisfied. Put Equation 7 into Equation 6 to solve ON duty of Nch. Tr. (D ON = tON / (tOFF + t tON)): Ripple Current is described as follows: Peak current that flows through L (ILMAX), and LX Tr. is described as follows: Also, the average peak current (I OUT and DON) in the boost circuit is described as follows:

No. JA-353-190507 TECHNICAL NOTES The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a rated power. When designing a peripheral circuit, please be fully aware of the following points.

• Place the bypass capacitor (C IIN) between the PVIN pin and the GND pin with shortest-distance wiring.
• Place the output capacitor (C OUT) between the V OUT pin and the GND pin with shortest-distance wiring. Connect GND of COUT to the GND pin with shortest-distance wiring.
• Make the GND plane wide.
• Ensure the PVIN and GND lines are firmly connected. A large s witching current flows through the PVIN, GND, inductor, BOLX, BULX and V OUT lines. If their impedance is too high, noise pickup or unstable operation may result.
• Connect the BOLX pin and the i nductor and the BULX pin with shortest-distance wiring.

No. JA-353-190507 PCB LAYOUT Top Layer Bottom Layer RP602x [PKG: WLCSP-20-P1] PCB Layout Top Layer Bottom Layer RP602x [PKG: DFN(PLP)2730-12] PCB Layer

No. JA-353-190507 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Input Voltage vs. Output Voltage RP602Z330x, MODE = H RP602Z330x, MODE = L 2) Output Current vs. Efficiency (for Different Input Voltages) RP602Z330x, MODE = H RP602Z330x, MODE = L 3) Output Current vs. Output Voltage RP602Z330x, MODE = H RP602Z330x, MODE = L

No. JA-353-190507 4) Temperature vs. Output Voltage 5) Temperature vs. Standby Cu rrent RP602Z330x RP602Z330x, V IN = 5.5 V 6) Input Voltage vs. Output Current 7) Temperature vs. Soft-start Time RP602Z330x, MODE = L RP602Z330x 8) CE Start-up Waveform RP602Z330x, VIN = 3.6 V, MODE = H RP602Z330x, VIN = 5.5 V, MODE = H IOUT = 0 mA IOUT = 0 mA

No. JA-353-190507 RP602Z330x, VIN = 3.6 V, MODE = L RP602Z330x, VIN = 5.5 V, MODE = L IOUT = 0 mA IOUT = 0 mA 9) VOUT Waveform RP602Z270x, VIN = 3.6 V, MODE = H RP602Z270x, VIN = 3.6 V, MODE = L IOUT = 10 mA IOUT = 0 mA RP602Z330x, VIN = 3.6 V, MODE = H RP602Z330x, VIN = 3.6 V, MODE = L IOUT = 10 mA IOUT = 0 mA

No. JA-353-190507 RP602Z420x, VIN = 3.6 V, MODE = H RP602Z420x, VIN = 3.6 V, MODE = L IOUT = 10 mA IOUT = 0 mA 10) Load Transient Response Waveform RP602Z330x, VIN = 3.6 V, MODE = H RP602Z330x, VIN = 3.6 V, MODE = L IOUT = 1 mA ←→ 5 0 0 m A IOUT = 1 mA ←→ 5 0 0 m A RP602Z330x, VIN = 3.6 V, MODE = H RP602Z330x, VIN = 3.6 V, MODE = L IOUT = 50 mA ←→ 900 mA I OUT = 50 mA ←→ 9 0 0 m A

No. JA-353-190507 RP602Z330x, VIN = 3.6 V, MODE = H RP602Z330x, VIN = 3.6 V, MODE = L IOUT = 1000 mA ←→ 1500 mA I OUT = 1000 mA ←→ 1500 mA 11) CE Turn off Waveform RP602Z330x, VIN = 3.6 V, MODE = H RP602Z330x, VIN = 3.6 V, MODE = L IOUT = 0 mA IOUT = 0 mA 12) Input Transient Response Waveform RP602Z330x, MODE = H RP602Z330x, MODE = L IOUT = 500 mA, VIN = 2.5 V ←→ 4.5 V I OUT = 500 mA, VIN = 2.5 V ←→ 4.5 V

POWER DISSIPATION WLCSP-20-P1 Ver. B i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-9. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 101.5 mm x 114.5 mm x 1.6 mm Copper Ratio Outer Layers (First and Fourth Layers): 60% Inner Layers (Second and Third Layers): 100% Measurement Result ( T a = 2 5 ° C , T j m a x = 125°C) Item Measurement Result Power Dissipation 1400 mW Thermal Resistance (ja) θja = (125 − 25°C) / 1.4W = 71 °C/W ja: Junction-to-Ambient Thermal Resistance Power Dissipation vs. Ambient Temperature Measurement Board Pattern 200 400 600 800 1000 1200 1400 1600 0 25 50 75 100 125 150 Power Dissipation (mW) Ambient Temperature (°C) 1400 114.5 101.5

PACKAGE DIMENSIONS WLCSP-20-P1 Ver. A i

POWER DISSIPATION DFN(PLP)2730-12 Ver. A i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes  0.3 mm × 23 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 3100 mW Thermal Resistance (ja) ja = 32°C/W Thermal Characterization Parameter (ψjt) ψjt = 8°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern

PACKAGE DIMENSIONS DFN(PLP)2730-12 Ver. A i DFN(PLP)2730-12 Package Dimensions (Unit: mm) 2.700.05 3.000.05 A B INDEX 0.575±0.025 S 0.05 S 0.250.05 0.50

0.05 M AB

1.700.05 6 1  0.50.05 2.700.05 C 0.05 Bottom View

1.5IFQSPEVDUTBOEUIFQSPEVDUTQFDJpDBUJPOTEFTDSJCFEJOUIJTEPDVNFOUBSFTVCKFDUUPDIBOHFPSEJTDPOUJOVBUJPOPG QSPEVDUJPOXJUIPVUOPUJDFGPSSFBTPOTTVDIBTJNQSPWFNFOU5IFSFGPSF,CFGPSFEFDJEJOHUPVTFUIFQSPEVDUT QMFBTFSFGFS UPourTBMFTSFQSFTFOUBUJWFTGPSUIFMBUFTUJOGPSNBUJPOUIFSFPO. 2.5IFNBUFSJBMTJOUIJTEPDVNFOUNBZOPUCFDPQJFEPSPUIFSXJTFSFQSPEVDFEJOXIPMFPSJOQBSUXJUIPVUQSJPSXSJUUFO DPOTFOUPGour company. 3.1MFBTFCFTVSFUPUBLFBOZOFDFTTBSZ GPSNBMJUJFTVOEFSSFMFWBOUMBXTPSSFHVMBUJPOTCFGPSFFYQPSUJOHPSPUIFSXJTF UBLJOHPVUPGZPVSDPVOUSZUIFQSPEVDUTPSUIFUFDIOJDBMJOGPSNBUJPOEFTDSJCFEIFSFJO 4.5IFUFDIOJDBMJOGPSNBUJPOEFTDSJCFEJOUIJTEPDVNFOUTIPXTUZQJDBMDIBSBDUFSJTUJDTPGBOEFYBNQMFBQQMJDBUJPODJSDVJUT GPSUIFQSPEVDUT5IFSFMFBTFPGTVDIJOGPSNBUJPOJTOPUUPCFDPOTUSVFEBTBXBSSBOUZPGPSBHSBOUPGMJDFOTFVOEFS our company's PSBOZUIJSEQBSUZTJOUFMMFDUVBMQSPQFSUZSJHIUTPSBOZPUIFSSJHIUT. 5.5IFQSPEVDUTMJTUFEJOUIJTEPDVNFOUBSFJOUFOEFEBOEEFTJHOFEGPSVTFBTHFOFSBMFMFDUSPOJDDPNQPOFOUTJOTUBOEBSE BQQMJDBUJPOT P⒏DFFRVJQNFOU UFMFDPNNVOJDBUJPOFRVJQNFOU NFBTVSJOHJOTUSVNFOUT DPOTVNFSFMFDUSPOJDQSPEVDUT BNVTFNFOUFRVJQNFOUFUD 5IPTFDVTUPNFSTJOUFOEJOHUPVTFBQSPEVDUJOBOBQQMJDBUJPOSFRVJSJOHFYUSFNFRVBMJUZBOE SFMJBCJMJUZ GPSFYBNQMF JOBIJHIMZTQFDJpDBQQMJDBUJPOXIFSFUIFGBJMVSFPSNJTPQFSBUJPOPGUIFQSPEVDUDPVMESFTVMUJO IVNBOJOKVSZPSEFBUI BJSDSBGU TQBDFWFIJDMF OVDMFBSSFBDUPSDPOUSPMTZTUFN USB⒏DDPOUSPMTZTUFN BVUPNPUJWFBOE USBOTQPSUBUJPOFRVJQNFOU DPNCVTUJPOFRVJQNFOU TBGFUZEFWJDFT MJGFTVQQPSUTZTUFNFUD TIPVMEpSTUDPOUBDUVT. 6.8FBSFNBLJOHPVSDPOUJOVPVTF⒎PSUUPJNQSPWFUIFRVBMJUZBOESFMJBCJMJUZPGPVSQSPEVDUT CVUTFNJDPOEVDUPSQSPEVDUT BSFMJLFMZUPGBJMXJUIDFSUBJOQSPCBCJMJUZ*OPSEFSUPQSFWFOUBOZJOKVSZUPQFSTPOTPSEBNBHFTUPQSPQFSUZSFTVMUJOHGSPN TVDIGBJMVSF DVTUPNFSTTIPVMECFDBSFGVMFOPVHIUPJODPSQPSBUFTBGFUZNFBTVSFTJOUIFJSEFTJHO TVDIBTSFEVOEBODZ GFBUVSF pSFDPOUBJONFOUGFBUVSFBOEGBJMTBGFGFBUVSF8FEPOPUBTTVNFBOZMJBCJMJUZPSSFTQPOTJCJMJUZGPSBOZMPTTPS EBNBHFBSJTJOHGSPNNJTVTFPSJOBQQSPQSJBUFVTFPGUIFQSPEVDUT. 7."OUJSBEJBUJPOEFTJHOJTOPUJNQMFNFOUFEJOUIFQSPEVDUTEFTDSJCFEJOUIJTEPDVNFOU 8.5IF9SBZFYQPTVSFDBOJOqVFODFGVODUJPOTBOEDIBSBDUFSJTUJDTPGUIFQSPEVDUT$POpSNUIFQSPEVDUGVODUJPOTBOE DIBSBDUFSJTUJDTJOUIFFWBMVBUJPOTUBHF. 9.8-$41QSPEVDUTTIPVMECFVTFEJOMJHIUTIJFMEFEFOWJSPONFOUT5IFMJHIUFYQPTVSFDBOJOqVFODFGVODUJPOTBOE DIBSBDUFSJTUJDTPGUIFQSPEVDUTVOEFSPQFSBUJPOPSTUPSBHF. 10.5IFSFDBOCFWBSJBUJPOJOUIFNBSLJOHXIFOEJ⒎FSFOU"0* "VUPNBUFE0QUJDBM*OTQFDUJPO FRVJQNFOUJTVTFE*OUIFDBTF PGSFDPHOJ[JOHUIFNBSLJOHDIBSBDUFSJTUJDXJUI"0*,QMFBTFDPOUBDUourTBMFTPSPVSEJTUSJCVUPSCFGPSFBUUFNQUJOHUPVTF "0*. 11.1MFBTFDPOUBDUourTBMFTSFQSFTFOUBUJWFTTIPVMEZPVIBWFBOZRVFTUJPOTPSDPNNFOUTDPODFSOJOHUIFQSPEVDUTPS UIFUFDIOJDBMJOGPSNBUJPO. Official website https://www.nisshinbo-microdevices.co.jp/en/ Purchase information https://www.nisshinbo-microdevices.co.jp/en/buy/