RP130X-Y NISSHINBO | Alldatasheet

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Technical content

Low Noise 150mA LDO Regulator for Industrial Applications NO.EA-336-230725 OUTLINE The RP130x is a CMOS-based positive voltage regulator IC with high ripple rejection, low dropout voltage, high output voltage accuracy and extremely low supply current. The RP130x consists of a voltage reference unit, an error amplifier, a resistor network for voltage setting, a short current limit circuit, and a chip enable circuit. The RP130x has low supply current characteristics in the CMOS process. In addition, the RP130x can supply a low dropout voltage, which becomes the smallest difference between the input voltage and output voltage by having a low on-resistance and also can achieve the battery's long life by a chip enable function. When compared with the conventional products of high- speed type, the RP130x achieves low consumption current of 38µA (Typ.) while improving the input transient response, the load transient response, and the ripple rejection. The RP130x supports two package types: DFN(PL)1010-4 and SOT-23-5. By the adoption of the ultra-compact DFN(PL)1010-4, the RP130x can achieve a higher density mounting than ever. This is a high-reliability semiconductor device for industrial applications (-Y) that has passed both the screening at high temperature and the reliability test with extended hours.

FEATURES

Contact our sales representatives for other voltages.  Temperature-Drift Coefficient of Output Voltage ···· Typ. ±20 ppm / °C (BW = 10Hz to 100kHz, IOUT = 30mA)

APPLICATIONS

 Industrial equipments such as FAs and smart meters  Equipments used under high-temperature conditions such as surveillance camera and vending machine  Equipments accompanied by self-heating such as motor and lighting

NO.EA-336-230725 BLOCK DIAGRAMS RP130xxx1B VDD GND VOUT CE Vref Current Limit RP130xxx1D VDD GND VOUT CE Vref Current Limit SELECTION GUIDE The output voltage , chip-enable polarity, auto-discharge function, and package type for this device can be selected at the user’s request. Product Name Package Quantity per Reel Pb Free Halogen Free RP130Kxx1∗-TR-Y DFN(PL)1010-4 10,000pcs Yes Yes RP130Nxx1∗-TR-YE SOT-23-5 3,000pcs Yes Yes xx : Specify the set output voltage (VSET) Note: Contact our sales representatives for other voltages. ∗ : Specify the desired functions for chip-enable polarity and auto-discharge B: "H" active / No auto-discharge function D: "H" active / Auto-discharge function Auto-Discharge function quickly lowers the output voltage to 0V by releasing the electrical charge in the external capacitor when the chip enable signal is switched from the active mode to the standby mode.

NO.EA-336-230725 PIN DESCRIPTION

  • DFN(PL)1010-4 • SOT-23-5 Top View 2 1 3 4 Bottom View 1 2 4 3 4 5 2 3 (mark side) DFN(PL)1010-4 Pin No. Symbol Description

1 VOUT Output Pin

2 GND Ground Pin

3 CE Chip Enable Pin ("H" Active)

4 VDD Input Pin

*1 The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. SOT-23-5 Pin No. Symbol Description

1 VDD Input Pin

4 NC No Connection

5 VOUT Output Pin

NO.EA-336-230725 ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit VIN Input Voltage - 0.3 to 7.0 V VCE Input Voltage (CE Pin) - 0.3 to 7.0 V VOUT Output Voltage - 0.3 to VIN+0.3 V IOUT Output Current 200 mA PD Power Dissipation Refer to “PACKAGE INFORMATION” Tj Junction Temperature - 40 to 125 °C Tstg Strong Temperature Range - 55 to 125 °C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum rating is not assured. RECOMMENDED OPERATING CONDITIONS Symbol Item Rating Unit VIN Input Voltage 1.7 to 6.5 V Ta Operating Temperature Range - 40 to 105 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.

NO.EA-336-230725

ELECTRICAL CHARACTERISTICS

The specifications surrounded by are guaranteed by design engineering at - 40ºC ≤ Ta ≤ 105ºC. RP130xxx1B/D (Ta = 25°C) Symbol Item Conditions Min. Typ. Max. Unit VOUT Output Voltage Ta = 25°C VSET > 2.0V ×0.99 ×1.01 V VSET ≤ 2.0V - 20 20 mV VSET > 2.0V ×0.985 ×1.015 V VSET ≤ 2.0V - 30 30 mV IOUT Output Current 150 mA ∆VOUT /∆IOUT Load Regulation 1mA ≤ IOUT ≤ 150mA 10 30 mV VDIF Dropout Voltage IOUT = 150mA 1.2V ≤ VSET < 1.5V 0.67 1.03 V 1.5V ≤ VSET < 1.7V 0.54 0.84 1.7V ≤ VSET < 2.0V 0.46 0.75 2.0V ≤ VSET < 2.5V 0.41 0.63 2.5V ≤ VSET < 4.0V 0.32 0.51 4.0V ≤ VSET ≤ 4.2V 0.24 0.39 VSET = 5V 0.24 0.31 ISS Supply Current IOUT = 0mA 38 58 µA Istandby Supply Current (at Standby） VCE = 0 0.1 1.0 µA ∆VOUT /∆VIN Line Regulation VSET + 0.5V ≤ VIN ≤ 6.5V 0.02 0.10 %/V ISC Short Current Limit VOUT = 0V 40 mA IPD CE Pull-down Current 0.4 µA VCEH CE Input Voltage "H" 1.0 V VCEL CE Input Voltage "L" 0.36 V RLOW Nch ON Resistance for Auto Discharge (D Version Only) VIN = 4.0V, VCE = 0V 30 Ω All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C)

NO.EA-336-230725 Product-specific Electrical Characteristics The specifications surrounded by are guaranteed by design engineering at - 40ºC ≤ Ta ≤ 105ºC. (Ta = 25°C) Product Name VOUT [V] (Ta = 25°C) VOUT [V] (Ta = − 40 to 105°C) VDIF [V] 0.32 0.51

NO.EA-336-230725 TYPICAL APPLICATION C1 RP130x VDD VOUT CE GND VOUT CE Control External Components： Symbol Description C2 0.47µF (Ceramic) TECHNICAL NOTES Phase Compensation In the ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor C2 with 0.47µF or more. If a tantalum capacitor is used, and its ESR (Equivalent Series Resistance) of C2 is large, the loop oscillation may result. Because of this, select C2 carefully considering its frequency characteristics. PCB Layout Make VDD and GND lines sufficient. If their impedance is too high, noise pickup or unstable operation may result. Connect 0.47µF or more of the capacitor C1 between the VDD and GND, and as close as possible to the pins. In addition, connect the capacitor C2 between VOUT and GND, and as close as possible to the pins.

NO.EA-336-230725 TYPICAL APPLICATION FOR IC CHIP BREAKDOWN PREVENTION C1 RP130x VDD VOUT CE GND VOUT CE Control When a sudden surge of electrical current travels along the V OUT pin and GND due to a short-circuit, electrical resonance of a circuit involving an output capacitor (C2) and a short circuit inductor generates a negative voltage and may damage the device or the load devi ces. Connecting a schottky diode (D1) between the V OUT pin and GND has the effect of preventing damage to them.

NO.EA-336-230725

PACKAGE INFORMATION

Power Dissipation (DFN(PL)1010-4) PD -DFN(PL)1010-4-(105125)-JE-B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2mm × 114.3mm × 0.8mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50mm Square Outer Layer (Fourth Layer): Approx. 100% of 50mm Square Through-holes φ 0.2mm × 21pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 800mW Thermal Resistance (θja) θja = 125°C/W Thermal Characterization Parameter (ψjt) ψjt = 58°C/W θja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern 100 200 300 400 500 600 700 800 900 1000 0 25 50 75 100 125 Power Dissipation (mW) Ambient Temperature (°C) 105 800

NO.EA-336-230725 Package Dimensions (DFN(PL)1010-4) DM -DFN(PL)1010-4-JE-C DFN(PL)1010-4 Package Dimensions UNIT : mm

NO.EA-336-230725

  • Mark Specifications (DFN(PL)1010-4) MK -RP130K-JYEY-A : Product Code … Refer to “RP130K Mark Specification Table” : Lot Number …Alphanumeric Serial Number DFN(PL)1010-4 Mark Specifications RP130K Mark Specification Table (DFN(PL)1010-4) RP130Kxx1B RP130Kxx1D Product Name   VSET Product   VSET RP130K121B T A 1.2 V RP130K121D V A 1.2 V RP130K151B T D 1.5 V RP130K151D V D 1.5 V RP130K181B T G 1.8 V RP130K181D V G 1.8 V RP130K251B T Q 2.5 V RP130K251D V Q 2.5 V RP130K281B T T 2.8 V RP130K281D V T 2.8 V RP130K291B T V 2.9 V RP130K291D V V 2.9 V RP130K301B T W 3.0 V RP130K301D V W 3.0 V RP130K331B T Z 3.3 V RP130K331D V Z 3.3 V RP130K341B U A 3.4 V RP130K341D W A 3.4 V RP130K361B U C 3.6 V RP130K361D W C 3.6 V RP130K421B U J 4.2 V RP130K421D W J 4.2 V RP130K501B U S 5.0 V RP130K501D W S 5.0 V

NO.EA-336-230725 Power Dissipation (SOT-23-5) PD -SOT-23-5-(105125)-JE-B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2mm × 114.3mm × 0.8mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50mm Square Outer Layer (Fourth Layer): Approx. 100% of 50mm Square Through-holes φ 0.3 mm × 7 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 660mW Thermal Resistance (θja) θja = 150°C/W Thermal Characterization Parameter (ψjt) ψjt = 51°C/W θja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern 100 200 300 400 500 600 700 800 0 25 50 75 100 125 Power Dissipation PD (mW) Ambient Temperature (°C) 660 105

NO.EA-336-230725 Package Dimensions (SOT-23-5) DM -SOT-23-5-JE-A 2.9±0.2 1.9±0.2 (0.95) (0.95) 5 4 1 2 3 1.6-0.1 +0.2 2.8±0.3 0.4±0.1 0.8±0.1 1.1±0.1 0～0.1 0.15-0.05 +0.1 Unit : mm 0.2min.

NO.EA-336-230725 Mark Specifications (SOT-23-5) MK -RP130N-JYEY-A : Product Code … Refer to “RP130N Mark Specification Table” : Lot Number …Alphanumeric Serial Number 5 4 1 2 3 SOT-23-5 Mark Specifications RP130N Mark Specification Table (SOT-23-5) RP130Nxx1B RP130Nxx1D Product Name  VSET Product Name  VSET RP130N121B H 1 A 1.2 V RP130N121D H 2 A 1.2 V RP130N151B H 1 D 1.5 V RP130N151D H 2 D 1.5 V RP130N181B H 1 G 1.8 V RP130N181D H 2 G 1.8 V RP130N251B H 1 Q 2.5 V RP130N251D H 2 Q 2.5 V RP130N281B H 1 T 2.8 V RP130N281D H 2 T 2.8 V RP130N291B H 1 V 2.9 V RP130N291D H 2 V 2.9 V RP130N301B H 1 W 3.0 V RP130N301D H 2 W 3.0 V RP130N331B H 1 Z 3.3 V RP130N331D H 2 Z 3.3 V RP130N341B J 1 A 3.4 V RP130N341D J 2 A 3.4 V RP130N361B J 1 C 3.6 V RP130N361D J 2 C 3.6 V RP130N421B J 1 J 4.2 V RP130N421D J 2 J 4.2 V RP130N501B J 1 S 5.0 V RP130N501D J 2 S 5.0 V

NO.EA-336-230725 TEST CIRCUITS C1 RP130x VDD VOUT CE GND V C2 VOUT ↓ IOUT C1 = Ceramic 0.47µF C2 = Ceramic 0.47µF Standard Test Circuit VDD VOUT CE GND C2 A ISS VOUT RP130x C1 = Ceramic 0.47µF C2 = Ceramic 0.47µF Supply Current Test Circuit RP130x VDD VOUT CE GND Pulse Generator ↓ IOUT C2 = Ceramic 0.47µF P. G. Ripple Rejection, Line Transient Response Test Circuit IOUTa IOUTb C1 RP130x VDD VOUT CE GND ↓ ↓ VOUT C1 = Ceramic 0.47µF C2 = Ceramic 0.47µF Load Transient Response Test Circuit

NO.EA-336-230725 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Output Current (C1 = C2 = 0.47µF, Ta = 25°C) RP130x121x RP130x281x RP130x501x 2) Output Voltage vs. Input Voltage (C1 = C2 = 0.47µF, Ta = 25°C) RP130x121x RP130x281x

NO.EA-336-230725 RP130x501x 3) Supply Current vs. Input Voltage (C1 = C2 = 0.47µF, Ta = 25°C) RP130x121x RP130x281x RP130x501x

NO.EA-336-230725 4) Output Voltage vs. Temperature (IOUT = 1mA, C1 = C2 = 0.47µF) RP130x121x RP130x281x RP130x501x 5) Supply Current vs. Temperature (IOUT = 0mA, C1 = C2 = 0.47µF) RP130x121x RP130x281x -40 -25 0 25 50 75 100 1.15 1.16 1.17 1.19 1.20 1.21 1.22 1.23 1.24 1.25 Temperature Ta (℃) Output Voltage VOUT (V) 105 VIN=2.2V -40 -25 0 25 50 75 100 2.75 2.76 2.77 2.79 2.80 2.81 2.82 2.83 2.84 2.85 Temperature Ta (℃) Output Voltage VOUT (V) 105 VIN=3.8V -40 -25 0 25 50 75 100 4.95 4.96 4.97 4.99 5.00 5.01 5.02 5.03 5.04 5.05 Temperature Ta (℃) Output Voltage VOUT (V) 105 VIN=6.0V -40 -25 0 25 50 75 100 Temperature Ta (℃) Supply Current Iss (μA) 105 VIN=2.2V -40 -25 0 25 50 75 100 Temperature Ta (℃) Supply Current Iss (μA) 105 VIN=3.8V

NO.EA-336-230725 RP130x501x 6) Dropout Voltage vs. Output Current (C1 = C2 = 0.47µF) RP130x121x RP130x281x RP130x501x -40 -25 0 25 50 75 100 Temperature Ta (℃) Supply Current Iss (μA) 105 VIN=6.0V

NO.EA-336-230725 7) Dropout Voltage vs. Set Output Voltage (C1 = C2 = 0.47µF) 8) Ripple Rejection vs. Input Bias Voltage (C1 = none, C2 = 0.47µF, Ripple = 0.2Vp-p, Ta = 25°C) RP130x281x RP130x281x 9) Ripple Rejection vs. Frequency (C1 = none, C2 = 0.47µF, Ripple = 0.2Vp-p, Ta = 25°C) RP130x121x RP130x281x

NO.EA-336-230725 RP130x501x 10) Input Transient Response (IOUT = 30mA, tr = tf = 5µs, C1 = none, C2 = 0.47µF, Ta = 25°C) RP130x121x RP130x281x RP130x501x

NO.EA-336-230725 11) Load Transient Response (tr = tf = 0.5µs, C1 = C2 = 0.47µF, IOUT = 50mA 100mA, Ta = 25°C) RP130x121x RP130x281x RP130x501x 12) Load Transient Response (tr = tf = 0.5µs, C1 = C2 = 0.47µF, IOUT = 1mA  150mA, Ta = 25°C) RP130x121x RP130x281x

NO.EA-336-230725 RP130x501x 13) Rise Time with CE Pin (C1 = C2 = 0.47µF, Ta = 25°C) RP130x121x RP130x121x RP130x121x RP130x281x

NO.EA-336-230725 RP130x281x RP130x281x RP130x501x RP130x501x RP130x501x

NO.EA-336-230725 14) Fall Time with CE Pin in D-Version (C1 = C2 = 0.47µF, Ta = 25°C) RP130x121D RP130x121D RP130x121D RP130x281D RP130x281D RP130x281D

NO.EA-336-230725 RP130x501D RP130x501D RP130x501D 15) Minimum Operating Voltage (C1 = C2 = 0.47µF) Hatched area is available for 1.2V output.

NO.EA-336-230725 ESR vs. Output Current The RP130x is recommended to use a ceramic type capacitor, but the RP130x can be used other capacitors of the lower ESR type. The relation between the output current (I OUT) and the ESR of output capacitor is shown below. Measurement conditions Frequency Band: 10Hz to 3MHz Measurement Temperature: − 40°C to 85°C Hatched area: Noise level is 40μV (average) or below Ceramic Capacitor: C1 = Ceramic 0.47μF, C2 = 0.47μF RP130x121x RP130x281x RP130x501x 0.01 0.1 100 0 25 50 75 100 125 150 Output Current IOUT ( mA ) ESR (Ω) VIN=1.4V to 6.5V Ta=-40℃ Ta=85℃ 0.01 0.1 100 0 25 50 75 100 125 150 Output Current lOUT ( mA ) ESR (Ω) Ta=-40℃ Ta=85℃ VIN=3.0V to 6.5V 0.01 0.1 100 0 25 50 75 100 125 150 Output Current lOUT ( mA ) ESR (Ω) Ta=-40℃ Ta=85℃ VIN=5.2V to 6.5V

  1. T he products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us. 3. This product and any technical information relating thereto are subject to complementary export controls (so- called KNOW controls) under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade Control Law and its related regulations with respect to the complementary export controls. 4. The technical information described in this document shows typical characteristics and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death should first contact us.
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