RP511X NISSHINBO | Alldatasheet

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0.3 µA IQ Ultra-low Quiescent Current 100 mA Buck DC/DC Converter No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. RP511x is a DC/DC converter featuring 0.3 μA ultra-low operating quiescent current. It is suitable for use in wearable and IoT devices that require miniaturization and long-lifetime of battery.

  • VFM (fSW up to 1 MHz) control achieves 0.3 μA ultra-low operating quiescent current.
  • The wide range of VIN from 2.0 V to 5.5 V allows operation from coin cell to USB port.
  • Total mount area including CIN, COUT, and inductor is 8.0 mm2.
  • Selectable packages including WLCSP, DFN, and SOT. 0.4 mm-thickness WLCSP package adaptable to IC cards.
  • Output Current: 100 mA
  • Output Voltage Range: 1.0 V to 4.0 V (Settable in 0.1 V step)
  • Output Voltage Accuracy: ±1.5% (VSET ≥ 1.2 V), ±18 mV (VSET < 1.2 V)
  • Built-in Driver On-resistance (VIN = 3.6 V): Typ. PMOS 0.15 Ω, NMOS 0.15 Ω (RP511Z)
  • Standby Current: 0.01 µA VOUT = 1.8 V VIN CE LX VOUT GND VIN CIN COUT VOUT L RP511x xx: Set output voltage (VSET) Fixed Output Voltage Type: 1.0 V (10) to 4.0 V (40) in 0.1 V step. $: Version Product Name Package Q’ty per Reel RP511Zxx1$-TR-F WLCSP-8-P1 5,000 pcs RP511Zxx1$-TR-T WLCSP-8-P1 5,000 pcs RP511Kxx1$-TR DFN(PL)2527-10 5,000 pcs RP511Hxx1$-T1-FE SOT-89-5 1,000 pcs Version Auto-discharge Function VSET A No 1.0 V to 4.0 V B Yes L: 2.2 µH, COUT: 22 µF WLCSP-8-P1 1.45 mm x 1.48 mm, t=0.4mm (max.) DFN(PL)2527-10 2.7mm x 2.5 mm, t=0.6mm (max.) SOT-89-5 4.5mm x 4.35mm, t=1.6mm (max.)
  • Wearable equipment such as SmartWatch, SmartBand, and health monitoring
  • Li-ion battery-used equipment, Coin cell-used equipment
  • Low power RF such as Bluetooth® Low Energy, Zigbee, WiSun, and ANT
  • Low power CPU, memory, sensor devices, and energy harvesting 100 0.001 0.01 0.1 1 10 100 Efficiency [% ] IOUT [mA] Vin=2.3V Vin=3.6V Vin=5.5V KEY BENEFITS KEY SPECIFICATIONS TYPICAL CHARACTERISTICS TYPICAL APPLICATIONS SELECTION GUIDE

APPLICATIONS

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. SELECTION GUIDE The set output voltage, the output voltage type, the auto-discharge function(1), and the package for the ICs are user-selectable options. Selection Guide Product Name Package Quantity per Reel Pb Free Halogen Free RP511Zxx1$-TR-F WLCSP−8−P1 5,000 pcs Yes Yes RP511Zxx1$-TR-T WLCSP−8−P1 5,000 pcs Yes Yes RP511Kxx1$-TR DFN(PL)2527-10 5,000 pcs Yes Yes RP511Hxx1$-T1-FE SOT-89-5 1,000 pcs Yes Yes xx: Designation of the set output voltage (VSET) For Fixed Output Voltage Type(2): 1.0 V (10) to 4.0 V (40) in 0.1 V step $: Designation of Version Version Auto-discharge Function VSET A Disable 1.0 V to 4.0 V B Auto-discharge (1) Auto-discharge function quickly lowers the output voltage to 0 V, when the chip enable signal is switched from the active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor. (2) The customization of specifying in 0.05 V step is available.

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. BLOCK DIAGRAM RP511xxx1A Block Diagram RP511xxx1B Block Diagram Switching Control VOUT GND Low Side Current Detector Enable Control Soft Start High Side Current Detector CE LX VIN Vref UVLO Switching Control VOUT GND Low Side Current Detector Enable Control Soft Start High Side Current Detector CE LX VIN Vref UVLO

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. PIN DESCRIPTION Top View Bottom View RP511Z (WLCSP-8-P1) Pin Configuration Top View Bottom View 1 3 5 4 RP511K [DFN(PL)2527-10] Pin Configuration RP511H (SOT-89-5) Pin Configuration RP511Z Pin Description Pin No. Symbol Description A1 VIN Input Pin B1 VIN Input Pin C1 LX Switching Pin A2 VOUT Output voltage Pin C2 GND Ground Pin A3 CE Chip Enable Pin (Active-high) B3 GND Ground Pin C3 GND Ground Pin (1) The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. C B A C B A 1 2 3 4 5 6 7 8 9 10 5 4 3 2 1 10 9 8 7 6 (1)

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. RP511K Pin Description Pin No. Symbol Description

1 VOUT Output Pin

2 GND Ground Pin

3 GND Ground Pin

4 LX Switching Pin

5 LX Switching Pin

6 VIN Input Pin

7 VIN Input Pin

8 NC No connection

9 CE Chip Enable Pin (Active-high)

10 NC No connection

Pin No. Symbol Description

3 LX Switching Pin

4 VIN Input Pin

5 CE Chip Enable Pin (Active-high)

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings (GND = 0 V) Symbol Parameter Rating Unit VIN Input Voltage −0.3 to 6.5 V VLX LX Pin Voltage −0.3 to VIN + 0.3 V VCE CE Pin Voltage −0.3 to 6.5 V VMODE MODE Pin Voltage −0.3 to 6.5 V VOUT VOUT Pin Voltage −0.3 to 6.5 V ILX LX Pin Output Current 650 mA PD Power Dissipation(1) WLCSP-8-P1, JEDEC STD. 51-9 1140 mW DFN(PL)2527-10, JEDEC STD. 51-7 2500 mW SOT-89-5, JEDEC STD. 51-7 2600 mW Tj Junction Temperature Range −40 to 125 C Tstg Storage Temperature Range −55 to 125 C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Parameter Rating Unit VIN Input Voltage 2.0 to 5.5 V Ta Operating Temperature Range −40 to 85 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used ov er such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Refer to POWER DISSIPATION for detailed information.

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product.

ELECTRICAL CHARACTERISTICS

The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C. RP511x Electrical Characteristics (Ta = 25°C) Symbol Parameter Condition Min. Typ. Max. Unit VOUT Output Voltage VIN = VCE = 3.6 V (VSET ≤ 2.6 V), VIN = VCE = VSET +1 V (VSET > 2.6 V) VSET ≥ 1.2 V x 0.985 x 1.015 V VSET < 1.2 V −0.018 +0.018 IQ Operating Quiescent Current VIN = VCE = VOUT = 3.6 V, VSET = 1.8 V, device not switching 0.3 A ISTANDBY Standby Current VIN = 5.5 V, VCE = 0 V 0.01 0.5 A ICEH CE Pin Input Current, high VIN = VCE = 5.5 V −0.025 0 0.025 A ICEL CE Pin Input Current, low VIN = 5.5 V, VCE = 0 V −0.025 0 0.025 A IVOUTH VOUT "High" Input Current VIN = VOUT = 5.5 V, VCE = 0 V −0.025 0 0.025 A IVOUTL VOUT "Low" Input Current VIN = 5.5 V, VCE = VOUT = 0 V −0.025 0 0.025 A RDISN Auto-discharge NMOS On- state Resistance(1) VIN = 3.6 V, VCE = 0 V 60 Ω VCEH CE Pin Input Voltage, high VIN = 5.5 V 1.0 V VCEL CE Pin Input Voltage, low VIN = 2.0 V 0.4 V RONP PMOS On-state Resistance RP511Z VIN = 3.6 V, ILX = −100 mA 0.15 Ω RP511K VIN = 3.6 V, ILX = −100 mA 0.19 Ω RP511H VIN = 3.6 V, ILX = −100 mA 0.19 Ω RONN NMOS On-state Resistance RP511Z VIN = 3.6 V, ILX = −100 mA 0.15 Ω RP511K VIN = 3.6 V, ILX = −100 mA 0.19 Ω RP511H VIN = 3.6 V, ILX = −100 mA 0.19 Ω tSTART Soft-start Time VIN = VCE = 3.6 V (VSET ≤ 2.6 V), VIN = VCE = VSET + 1 V (VSET > 2.6 V) 10 ms ILXLIM LX Current Limit VIN = VCE = 3.6 V (VSET ≤ 2.6 V), VIN = VCE = VSET + 1 V (VSET > 2.6 V) 210 430 mA VUVLOF Undervoltage Lockout (UVLO) Threshold VIN = VCE, Falling 1.40 1.50 1.65 V VUVLOR VIN = VCE, Rising 1.55 1.65 1.80 V All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C). Test circuit is operated with “Open Loop Control” (GND = 0 V), unless otherwise specified. (1) RP511xxx1B only

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. Product-specific Electrical Characteristics RP511xxx1x (Ta = 25°C) Product Name VOUT Min. Typ. Max. RP511x101x 0.9820 1.00 1.0180 RP511x111x 1.0820 1.10 1.1180 RP511x121x 1.1820 1.20 1.2180 RP511x131x 1.2805 1.30 1.3195 RP511x141x 1.3790 1.40 1.4210 RP511x151x 1.4775 1.50 1.5225 RP511x161x 1.5760 1.60 1.6240 RP511x171x 1.6745 1.70 1.7255 RP511x181x 1.7730 1.80 1.8270 RP511x191x 1.8715 1.90 1.9285 RP511x201x 1.9700 2.00 2.0300 RP511x211x 2.0685 2.10 2.1315 RP511x221x 2.1670 2.20 2.2330 RP511x231x 2.2655 2.30 2.3345 RP511x241x 2.3640 2.40 2.4360 RP511x251x 2.4625 2.50 2.5375 RP511x261x 2.5610 2.60 2.6390 RP511x271x 2.6595 2.70 2.7405 RP511x281x 2.7580 2.80 2.8420 RP511x291x 2.8565 2.90 2.9435 RP511x301x 2.9550 3.00 3.0450 RP511x311x 3.0535 3.10 3.1465 RP511x321x 3.1520 3.20 3.2480 RP511x331x 3.2505 3.30 3.3495 RP511x341x 3.3490 3.40 3.4510 RP511x351x 3.4475 3.50 3.5525 RP511x361x 3.5460 3.60 3.6540 RP511x371x 3.6445 3.70 3.7555 RP511x381x 3.7430 3.80 3.8570 RP511x391x 3.8415 3.90 3.9585 RP511x401x 3.9400 4.00 4.0600

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. THEORY OF OPERATION Soft-start Time Starting-up with CE Pin The IC starts to operate when the CE pin voltage (VCE) exceeds the threshold voltage. The threshold voltage is preset between CE “H” input voltage (VCEH) and CE “Low” input voltage (VCEL). After the start-of the start-up of the IC, soft-start circuit starts to operate. Then, after a certain period of time, the reference voltage (VREF) in the IC gradually increases up to the specified value. Notes: Soft start time (tSTART)(1) is not always equal to the turn -on speed of the step-down DC/DC converter. Please note that the turn-on speed could be affected by the power supply capacity, the output current, the inductance value and the COUT value. VCEH tSTART VCEL Threshold Level VCE VREF Soft-start Circuit operation starts VLX Depending on Power Supply, Load Current, External Components VOUT Timing Chart when Starting-up with CE Pin Starting-up with Power Supply After the power-on, when VIN exceeds the UVLO released voltage (VUVLO2), the IC starts to operate. Then, soft- start circuit starts to operate and after a certain period of time, V REF gradually increases up to the specified value. Note: Please note that the turn-on speed of VOUT could be affected by the power supply capacity, the output current, the inductance value, the COUT value and the turn-on speed of VIN determined by CIN. VOUT VIN VUVLO2 VREF VLX VSET Depending on Power Supply, Load Current, External Components tSTART Timing Chart when Starting-up with Power Supply (1) Soft-start time (tSTART) indicates the duration until the reference voltage (VREF) reaches the specified voltage after soft- start circuit’s activation.

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. Undervoltage Lockout (UVLO) Circuit If VIN becomes lower than VSET, the step-down DC/DC converter stops the switching operation and ON duty becomes 100%, and then VOUT gradually drops according to V IN. If the V IN drops more and becomes lower than the UVLO detector threshold (V UVLO1), the UVLO circuit starts to operate, V REF stops, and PMOS and NMOS built-in switch transistors turn “OFF”. As a result, VOUT drops according to the COUT capacitance value and IOUT. As for RP511xxx1B, the discharge transistor for COUT discharges after it turns on. To restart the operation, VIN needs to be higher than VUVLO2. The timing chart below shows the voltage shifts of VREF, VLX and VOUT when VIN value is varied. Note: Falling edge (operating) and rising edge (releasing) waveforms of V OUT could be affected by the initial voltage of COUT and the output current of VOUT. VOUT VIN VUVLO2 VREF VUVLO1 VLX VSET VOUT Depending on Power Supply, Load Current, External Components tSTART Timing Chart with Variations in Input Voltage (VIN)

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. Operation of Step-down DC/DC Converter and Output Current The step-down DC/DC converter charges energy in the inductor when LX transistor turns “ON”, and discharges the energy from the inductor when LX transistor turns “OFF” and controls with less energy loss, so that a lower output voltage (VOUT) than the input voltage (VIN) can be obtained. The operation of the step -down DC/DC converter is explained in the following figures. PMOS Tr. L NMOS Tr. VIN VOUT CL GND tON tOFF tOPEN ILMIN ILMAX IL i1 i2 Basic Circuit Inductor Current (IL) flowing through Inductor (L) Step1. PMOS transistor turns “ON” and IL (i1) flows, L is charged with energy. At this moment, i1 increases from the minimum inductor current (ILMIN), which is 0 A, and reaches the maximum inductor current (ILMAX) in proportion to the on-time period (tON) of PMOS Transistor. Step2. When PMOS transistor turns “OFF”, L tries to maintain IL at ILMAX, so L turns NMOS transistor “ON” and IL (i2) flows into L. Step3. i2 decreases gradually and reaches ILMIN after the open-time period (tOPEN) of NMOS transistor, and then NMOS transistor turns “OFF”. This is called discontinuous current mode. As the output current (IOUT) increases, the off-time period (tOFF) of PMOS transistor runs out before IL reaches ILMIN. The next cycle starts, and PMOS transistor turns “ON” and NMOS transistor turns “OFF”, which means IL starts increasing from ILMIN. This is called continuous current mode. When the step -down DC/DC operation is constant, I LMIN and ILMAX during ton of PMOS transistor would be same as during tOFF of PMOS transistor. The current differential between ILMAX and ILMIN is described as I, as the following equation 1.

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. VFM Mode A switching method is a VFM (Variable Frequency Modulation) mode to achieve a high efficiency during light load conditions. A switching frequency varies depending on values of input voltage (VIN), output voltage (VOUT), and output current (IOUT). Check the actual characteristics for concerns regarding the switching noise. A switching starts when VOUT drops below the lower-limit reference voltage (VREFL). When VOUT exceeds the upper-limit reference voltage ( VREFH), a constant voltage outputs by a hysteresis control which stops the switching. In order not to exceed the rated current of inductor or to avoid using the deteriorated band frequency of DC superimposed characteristics, the operation shifts to off-cycle once when the inductor current (IL) exceeds LX current limit (ILXLIM), and then it shifts back to on-cycle again when IL becomes 0 A. No Load Light Load Medium Load Heavy Load VOUT IL VREFH VREFL ILXLIM VOUT IL VREFH VREFL ILXLIM VOUT IL VREFH VREFL ILXLIM VOUT IL VREFH VREFL ILXLIM

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product.

APPLICATION INFORMATION

RP511x Typical Application Recommended External Components Symbol Descriptions CIN 10 µF, GRM155R60J106ME44D, MURATA COUT 22 µF, JMK107BBJ226MA-T, TAIYO L 2.2 µH, MBKK1608T2R2M, TAIYO 2.2 µH, MLP2012H2R2MT0S1, TDK ⚫ Precautions for Selecting External Components ・Using ceramic capacitors with low ESR (Equivalent Series Resistance) are recommended. Select capacitors with considerations of bias characteristics and input/output voltages. ・When a built-in Lx switch is turned off, a spike-like high voltage may be generated due to an action of an inductor. Using 1.5 times or more of a set output voltage is recommended for the withstanding voltage of COUT. ・Select an inductor that has small DC resistance, has sufficient allowable current and is hard to cause magnetic saturation.

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. TECHNICAL NOTES The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a rated power. When designing a peripheral circuit, please be fully aware of the following points. Refer to PCB Layout below. ・External components must be connected as close as possible to the ICs and make wiring as short as possible. Especially, the capacitor connected in between VIN pin and GND pin must be wiring the shortest. ・If the impedance of power supply lines and GND lines is high, the internal voltage of the IC may shift by the switching current, and the operating may be unstable. Make the power supply and GND lines sufficient. ・A sufficient consideration is required due to a large switching current flows through power supply lines, GND lines, an inductor, Lx, and VOUT line. ・The wiring between VOUT pin and inductor should be separated from the wiring connected to the load. ・When an intermediate voltage other than VIN or GND is input to the CE pin, a supply current may be increased with a through current of a logic circuit in the IC. The CE pin is neither pulled up nor pulled down, therefore an operation is not stable at open.

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. PCB Layout RP511Zxx1x (WLCSP-8-P1) Top Layer Bottom Layer RP511Kxx1x [DFN(PL)2527-10] Top Layer Bottom Layer

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. RP511Hxx1x (SOT-89-5) Top Layer Bottom Layer

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. TYPICAL CHARACTERISTICS Typical Characteristics are intended to be used as reference data; they are not guaranteed. As for the inductor, MLP2012H2R2MT0S1 (TDK) is used. 1) Quiescent Current vs. Temperature 2) Standby Current vs. Temperature 3) Output Voltage vs. Temperature RP511x181x, VIN = 3.6 V 4) Efficiency vs. Output Current RP511x121x, Ta = 25°C RP511x181x, Ta = 25°C 0.00 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 -50 -25 0 25 50 75 100 QuiescentCurrent IQ[uA] Temperature Ta[℃] Vin=3.6V Vin=5.5V 0.00 0.01 0.02 0.03 0.04 0.05 0.06 0.07 0.08 0.09 0.10 -50 -25 0 25 50 75 100 StandbyCurrent ISTANDBY[uA] Temperature Ta[℃] Vin=3.6V Vin=5.5V - 10.0 - 8.0 - 6.0 - 4.0 - 2.0 0.0 2.0 4.0 6.0 8.0 10.0 1.620 1.656 1.692 1.728 1.764 1.800 1.836 1.872 1.908 1.944 1.980 - 50 - 25 0 25 50 75 100 Vout_ % OutputVoltage V OUT [V] Temperature Ta[ ℃] 100 0.001 0.01 0.1 1 10 100 Efficiency [% ] OutputCurrent I OUT [mA] Vin=2.0V Vin=3.6V Vin=4.2V Vin=5.0V 100 0.001 0.01 0.1 1 10 100 Efficiency [% ] OutputCurrent I OUT [mA] Vin=2.0V Vin=2.3V Vin=3.6V Vin=4.2V Vin=5.0V

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. RP511x331x, Ta = 25°C 5) Output Voltage vs. Output Current RP511x121x, Ta = 25°C RP511x181x, Ta = 25°C RP511x331x, Ta = 25°C 100 0.001 0.01 0.1 1 10 100 Efficiency [% ] OutputCurrent I OUT [mA] Vin=3.6V Vin=4.2V Vin=5.0V - 5.0 - 3.0 - 1.0 1.0 3.0 5.0 1.140 1.152 1.164 1.176 1.188 1.200 1.212 1.224 1.236 1.248 1.260 0 20 40 60 80 100 OutputVoltage_ % [ ％] OutputVoltage V OUT [V] OutputCurrent I OUT [mA] Vin=2.0V Vin=3.6V Vin=4.2V Vin=5.0V - 5.0 - 3.0 - 1.0 1.0 3.0 5.0 1.710 1.728 1.746 1.764 1.782 1.800 1.818 1.836 1.854 1.872 1.890 0 20 40 60 80 100 OutputVoltage_ % [ ％] OutputVoltage V OUT [V] OutputCurrent I OUT [mA] Vin=2.0V Vin=2.3V Vin=3.6V Vin=4.2V Vin=5.0V - 5.0 - 3.0 - 1.0 1.0 3.0 5.0 3.135 3.168 3.201 3.234 3.267 3.300 3.333 3.366 3.399 3.432 3.465 0 20 40 60 80 100 OutputVoltage_ % [ ％] OutputVoltage V OUT [V] OutputCurrent I OUT [mA] Vin=3.6V Vin=4.2V Vin=5.0V

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. 6) Ripple Voltage vs. Output Current RP511x121x, Ta = 25°C RP511x181x, Ta = 25°C RP511x331x, Ta = 25°C 7) Switching Frequency vs. Output Current RP511x121x, Ta = 25°C RP511x181x, Ta = 25°C 108 120 0 20 40 60 80 100 RippleVoltage [% ] OutputVoltage Vripple [mV] OutputCurrent I OUT [mA] Vin=2.0V Vin=3.6V Vin=4.2V Vin=5.0V 108 126 144 162 180 0 20 40 60 80 100 RippleVoltage [% ] OutputVoltage Vripple [mV] OutputCurrent I OUT [mA] Vin=2.0V Vin=2.3V Vin=3.6V Vin=4.2V Vin=5.0V 132 165 198 231 264 297 330 0 20 40 60 80 100 RippleVoltage [% ] OutputVoltage Vripple [mV] OutputCurrent I OUT [mA] Vin=3.6V Vin=4.2V Vin=5.0V 100 150 200 250 300 350 400 0 20 40 60 80 100 Vout Frequency [kHz] OutputCurrent I OUT [mA] Vin=2.0V Vin=3.6V Vin=4.2V Vin=5.0V 100 150 200 250 300 350 400 0 20 40 60 80 100 Vout Frequency [kHz] OutputCurrent I OUT [mA] Vin=2.0V Vin=2.3V Vin=3.6V Vin=4.2V Vin=5.0V

No. EA-502-251006 RP511Zxx1x-TR-F is discontinued product. RP511x331x, Ta = 25°C 8) Load Transient Response RP511x181x, Ta = 25°C, VIN = 3.6 V IOUT = 0.01 mA -> 50 mA IOUT = 50 mA -> 0.01 mA 9) Soft Start Time RP511x181x, Ta = 25°C VIN = VCE = 0 V -> 3.6 V, ⊿t = 10 µs VIN = 3.6 V, VCE = 0 V -> 3.6 V, ⊿t = 10 µs 100 150 200 250 300 350 400 0 20 40 60 80 100 Vout Frequency [kHz] OutputCurrent I OUT [mA] Vin=3.6V Vin=4.2V Vin=5.0V 350 300 250 200 150 100 100 150 1.70 1.72 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 1.90 0 80 160 240 320 400 OutputCurrent I OUT [mA] OutputVoltage V OUT [V] Time [us] Vout Iout 350 300 250 200 150 100 100 150 1.70 1.72 1.74 1.76 1.78 1.80 1.82 1.84 1.86 1.88 1.90 OutputCurrent I OUT [mA] OutputVoltage V OUT [V] Time [ms] Vout Iout - 0.2 0.0 0.2 0.4 0.6 - 4.0 - 3.0 - 2.0 - 1.0 0.0 1.0 2.0 3.0 4.0 5.0 -8 -4 0 4 8 12 16 20 24 28 32 InputCurrent I IN [A] CE/ OutputVoltage VCE / VOUT [V] Time [ms] Vout CE Iin - 0.2 0.0 0.2 0.4 0.6 - 4.0 - 3.0 - 2.0 - 1.0 0.0 1.0 2.0 3.0 4.0 5.0 -8 -4 0 4 8 12 16 20 24 28 32 InputCurrent I IN [A] CE/ OutputVoltage VCE / VOUT [V] Time [ms] Vout CE Iin

POWER DISSIPATION WLCSP-8-P1 Ver. B i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-9. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 101.5 mm x 114.5 mm x 1.6 mm Copper Ratio Outer Layers (First and Fourth Layers): 60% Inner Layers (Second and Third Layers): 100% Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 1140 mW Thermal Resistance (θja) θja = 87°C/W θja: Junction-to-Ambient Thermal Resistance Power Dissipation vs. Ambient Temperature Measurement Board Pattern 250 500 750 1000 1250 1500 0 25 50 75 100 125 Power Dissipation (mW) Ambient Temperature (°C) 1140 114.5 101.5

PACKAGE DIMENSIONS WLCSP-8-P1 Ver. A i

i : Product Code … Refer to Part Marking List : Lot Number … Alphanumeric Serial Number WLCSP-8-P1 Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI. RP511Zxx1A/RP511Zxx1B Part Marking List Product Name   Product Name   RP511Z181A 1L RP5 11Z 181B 3L RP511Z201A 1P RP5 11Z 201B 3P

Visual Inspection Criteria WLCSP VI-160823 i No. Inspection Items Inspection Criteria Figure 1 Package chipping A≥0.2mm is rejected B≥0.2mm is rejected C≥0.2mm is rejected And, Package chipping to Si surface and to bump is rejected. 2 Si surface chipping A≥0.2mm is rejected B≥0.2mm is rejected C≥0.2mm is rejected But, even if A≥0.2mm, B≤0.1mm is acceptable. 3 No bump No bump is rejected.

4 Marking miss To reject incorrect marking, such as

another product name marking or another lot No. marking. 5 No marking To reject no marking on the package.

6 Reverse direction of

To reject reverse direction of marking character. 7 Defective marking To reject unreadable marking. (Microscope: X15/ White LED/ Viewed from vertical direction)

8 Scratch To reject unreadable marking

character by scratch. (Microscope: X15/ White LED/ Viewed from vertical direction)

9 Stain and Foreign

To reject unreadable marking character by stain and foreign material. (Microscope: X15/ White LED/ Viewed from vertical direction)

POWER DISSIPATION DFN(PL)2527-10 Ver. A i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes  0.3 mm × 30 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 2500 mW Thermal Resistance (ja) ja = 39°C/W Thermal Characterization Parameter (ψjt) ψjt = 11°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern 500 1000 1500 2000 2500 3000 0 25 50 75 100 125 Power Dissipation (mW) Ambient Temperature (°C) 2500

PACKAGE DIMENSIONS DFN(PL)2527-10 Ver. A i DFN(PL)2527-10 Package Dimensions ∗ The tab on the bottom of the package is substrate level (GND). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. 2.50 2.70 A B 0.05 INDEX 0.6max. 0.05min. S 0.05 S 6 10 5 1 0.25±0.1 0.25±0.1 0.10nom. 0.30±0.1 1.5±0.1 0.50 0.20±0.1 0.05 M AB 2.3±0.1 φ 0.5±0.05

i : Product Code … Refer to Part Marking List : Lot Number … Alphanumeric Serial Number RP511K [DFN(PL)2527-10] Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI.

RP511Kxx1A / RP511Kxx1B Part Marking List Product Name ①②③④ Product Name ①②③④ RP511K101A FT1 0 RP511K101B FU1 0 RP511K111A FT1 1 RP511K111B FU1 1 RP511K121A FT1 2 RP511K121B FU1 2 RP511K131A FT1 3 RP511K131B FU1 3 RP511K141A FT1 4 RP511K141B FU1 4 RP511K151A FT1 5 RP511K151B FU1 5 RP511K161A FT1 6 RP511K161B FU1 6 RP511K171A FT1 7 RP511K171B FU1 7 RP511K181A FT1 8 RP511K181B FU1 8 RP511K191A FT1 9 RP511K191B FU1 9 RP511K201A FT2 0 RP511K201B FU2 0 RP511K211A FT2 1 RP511K211B FU2 1 RP511K221A FT2 2 RP511K221B FU2 2 RP511K231A FT2 3 RP511K231B FU2 3 RP511K241A FT2 4 RP511K241B FU2 4 RP511K251A FT2 5 RP511K251B FU2 5 RP511K261A FT2 6 RP511K261B FU2 6 RP511K271A FT2 7 RP511K271B FU2 7 RP511K281A FT2 8 RP511K281B FU2 8 RP511K291A FT2 9 RP511K291B FU2 9 RP511K301A FT3 0 RP511K301B FU3 0 RP511K311A FT3 1 RP511K311B FU3 1 RP511K321A FT3 2 RP511K321B FU3 2 RP511K331A FT3 3 RP511K331B FU3 3 RP511K341A FT3 4 RP511K341B FU3 4 RP511K351A FT3 5 RP511K351B FU3 5 RP511K361A FT3 6 RP511K361B FU3 6 RP511K371A FT3 7 RP511K371B FU3 7 RP511K381A FT3 8 RP511K381B FU3 8 RP511K391A FT3 9 RP511K391B FU3 9 RP511K401A FT4 0 RP511K401B FU4 0

POWER DISSIPATION SOT-89-5 Ver. A i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes  0.3 mm × 13 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 2600 mW Thermal Resistance (ja) ja = 38°C/W Thermal Characterization Parameter (ψjt) ψjt = 13°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern 500 1000 1500 2000 2500 3000 0 25 50 75 100 125 Power Dissipation PD (mW) Ambient Temperature (°C) 2600

PACKAGE DIMENSIONS SOT-89-5 Ver. A i 1.5±0.1 1.5±0.1 0.47±0.1 0.42±0.1 0.42±0.1 1.5±0.1 0.4±0.1 0.4±0.1 0.1 S S 0.3±0.2 0.3±0.2 4 5 3 3 2 1 0.42±0.1 4.5±0.1 1.6±0.2 4.35±0.1 2.5±0.1 0.4±0.3 5 4 1 2 3 φ1.0 1.00±0.2

i : Product Code … Refer to Part Marking List : Lot Number … Alphanumeric Serial Number RP511H (SOT-89-5) Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI.

RP511Hxx1A / RP511Hxx1B Part Marking List Product Name ①②③④ Product Name ①②③④ RP511H101A L10A RP511H101B L10B RP511H111A L11A RP511H111B L11B RP511H121A L12A RP511H121B L12B RP511H131A L13A RP511H131B L13B RP511H141A L14A RP511H141B L14B RP511H151A L15A RP511H151B L15B RP511H161A L16A RP511H161B L16B RP511H171A L17A RP511H171B L17B RP511H181A L18A RP511H181B L18B RP511H191A L19A RP511H191B L19B RP511H201A L20A RP511H201B L20B RP511H211A L21A RP511H211B L21B RP511H221A L22A RP511H221B L22B RP511H231A L23A RP511H231B L23B RP511H241A L24A RP511H241B L24B RP511H251A L25A RP511H251B L25B RP511H261A L26A RP511H261B L26B RP511H271A L27A RP511H271B L27B RP511H281A L28A RP511H281B L28B RP511H291A L29A RP511H291B L29B RP511H301A L30A RP511H301B L30B RP511H311A L31A RP511H311B L31B RP511H321A L32A RP511H321B L32B RP511H331A L33A RP511H331B L33B RP511H341A L34A RP511H341B L34B RP511H351A L35A RP511H351B L35B RP511H361A L36A RP511H361B L36B RP511H371A L37A RP511H371B L37B RP511H381A L38A RP511H381B L38B RP511H391A L39A RP511H391B L39B RP511H401A L40A RP511H401B L40B

  1. T he products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us. 3. This product and any technical information relating thereto are subject to complementary export controls (so- called KNOW controls) under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade Control Law and its related regulations with respect to the complementary export controls. 4. The technical information described in this document shows typical characteristics and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death should first contact us.
  • Aerospace Equipment
  • Equipment Used in the Deep Sea
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  • Life Maintenance Medical Equipment
  • Fire Alarms / Intruder Detectors
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  • Various Safety Devices
  • Traffic control system
  • Combustion equipment In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases where operation requirements such as application conditions are confirmed by our company in writing after consultation with your company. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead to deterioration, destruction or failure of the products. We shall not be responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of the products. 8. Quality Warranty 8-1. Quality Warranty Period In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement, quality assurance agreement, delivery specifications, etc., it shall be followed. 8-2. Quality Warranty Remedies When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute for the defective product or refund the purchase price of the defective product. Note that such delivery or refund is sole and exclusive remedies to your company for the defective product. 8-3. Remedies after Quality Warranty Period With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company. 9. Anti-radiation design is not implemented in the products described in this document. 10. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 11. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 12. Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with general industrial waste or household waste. 13. Please contact our sales representatives should you have any questions or comments concerning the products or the technical information. Official website https://www.nisshinbo-microdevices.co.jp/en/ Purchase information https://www.nisshinbo-microdevices.co.jp/en/buy/