DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 4

Technical content

20.08.2012 RLT-BNP1000-02 1 of 4

FEATURES: Growth Technique: MOCVD Substrate: Sapphire(0001) Structure: InGaN MQW Chip size: 1000um×1000um ABSOLUTE MAXIMUM RATINGS (at TA=25℃) : Parameter Symbol Min. Max. Unit Forward Current IF 500 mA Pulse Forward Current IFP* 1500 mA Reverse Voltage VR 5 V Operating Temperature Topr. -30 +85 °C Storage Temperature Tstg. -40 +85 °C Power Dissipation PD 1200 mW *Pulse width:Max.10ms, Duty ratio: Max 1/10 Electrical/Optical Characteristics (at TA=25℃) : Parameter Condition Min. Typ. Max. Unit Forward Voltage VF IF=350mA 3.0 3.4 3.6 V Reverse Current IR VR=5V 10 μA Wavelength IF=350mA 465 470 475 nm Luminous Flux IF=350mA 8 11 16 lm

20.08.2012 RLT-BNP1000-02 2 of 4

Package Dimensions : Optical Characteristic Curves Of this Series: Relative Intensity vs. Wavelength Relative Intensity (%) Wavelength (nm) 20.00mm 3.00mm φ5.00mm 5.30mm 1.00mm 4.00mm 2.10mm 1.22mm φ3.00mm 4.50m m

20.08.2012 RLT-BNP1000-02 3 of 4

*1 Criteria For Judging the Damage Measuring items Symbol Measuring conditions Judgement criteria for failure Forward Voltage VF IF=350mA Over U×1.1 Reverse current IR VR=5V Over U×2 Luminous intensity IV IF=350mA Below S×0.7 U means the upper limit of specified characteristics. S means initial value. APPLICATION NOTES： 1. Static Electricity： Products are sensitive to static electricity and a high standard of care must be taken when handling products. Particularly if an over -voltage which exceeds the Absolute Maximum Rating of Products is applied, the overflow in energy may cause damage to, or possibly result in destruction of the products. To touch the lead directly must be avoided. Customer shall take absolutely secure countermeasures against static electricity and surge when handling products. 2. Soldering：

  • Manual soldering by soldering iron： The use of a soldering iron of less than 25W is recommended and the temperature of the iron must be kept at no higher than 260℃.
  • Reflow soldering： a. The temperature profile as shown in Fig.3 is recommended for soldering SMD LED by the reflow furance. b. Care must be taken that the products be handled after their temperature has dropped down to the normal room temperature after soldering.  Recommended Reflow Soldering Profile.

20.08.2012 RLT-BNP1000-02 4 of 4

  • Post solder cleaning ： When cleaning after soldering is needed, the following conditions must be adhered to. a. Cleaning solvents：Freon TF or equivalent or alcohol. b. Temperature：50℃ Max.for 30 seconds or 30℃Max.for 3 minutes c. Ultrasonic：300W Max.
  • OTHERS ： a. Care must be taken not to cause stress to the epoxy resin portion of POWER LEDs while it is exposed to the high temperature. b. Care must be taken not to the rub the epoxy resin portion of POWER LEDs with a hard or sharp edged article such as the sand blast and the metal hook as the epoxy resin is rather soft and liable to be damaged.