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Features
Ceramic Package for Surface Mounted Technology (SMT) RoHS compatible Package size 3.00x3.00x1.25mm 3 Package Code DCC6C Electrostatic Sensitive Device(ESD) Package Dimensions (Unit: mm) Pin Configuration Marking Description Test Circuit（Bottom View） S.S.G. 0dBm Rg Ri Vi Rg=Ri=50Ω Pin No. Description
2 Input
5 Output
1,3,4,6 Case Ground SF SF Trademark F SAW Filter
9668 Part Number
- Pin 1 YYWW Year Code & Week Code
- YYWW RF9668 *Fig：If the products produced in 06th week of 2015, The year code & week code is 1506.
R E Y C O N N S S A W F i l t e r R F 9 6 6 8 REYCONNS CHINA LIMITED www.reyconns.com ‐ 2 ‐ Performance Maximum Rating Item Value Unit DC Voltage VDC 5 V Operation Temperature T -40 ~ +125 ℃ Storage Temperature Tstg -40 ~ +125 ℃ RF Power Dissipation P 10 dBm Electronic Characteristics Test Temperature: 25 ℃±2℃ Terminating source impedance: 50 Ω Terminating load impedance: 50 Ω Item Minimum Typical Maximum Unit Center Frequency fc 1847.50 MHz Insertion Loss(min) IL 2.5 3.0 dB Insertion Loss 1815.00 - 1880.00 MHz IL 3.8 5.0 dB Amplitude Ripple (p-p) 1815.00 - 1880.00 MHz △ɑ 1.3 2.5 dB Group Delay Ripple 1815.00 - 1880.00 MHz GDR 25.0 80.0 ns Absolute Attenuation ɑ DC - 1500.00 MHz 35.0 40.0 dB 1500.00 -1795.00 MHz 26.0* 30.0 dB 1920.00 -2100.00 MHz 30.0 35.0 dB 2100.00 -3000.00 MHz 25.0 30.0 dB Input VSWR 1815.00 - 1880.00 MHz 1.5:1 2.0:1 / Output VSWR 1815.00 - 1880.00 MHz 1.5:1 2.0:1 / * : +25℃
R E Y C O N N S S A W F i l t e r R F 9 6 6 8 REYCONNS CHINA LIMITED www.reyconns.com ‐ 3 ‐ Frequency Characteristics Frequency Response Frequency Response （wideband） Delay Ripple & S11 VSWR Phase Linearity & S22 VSWR S 1 1 S m i t h C h a r t S 2 2 S m i t h C h a r t
R E Y C O N N S S A W F i l t e r R F 9 6 6 8 REYCONNS CHINA LIMITED www.reyconns.com ‐ 4 ‐ Reliability （The SAW components shall remain electrical performance after tests） No. Test item Test condition
1 Temperature
(1) Temperature: 85 ±2 , Duration: 250h , Recovery time: 2h±0.5h℃℃ (2) Temperature: –55 ±3 , Duration: 250h ,Recovery time: 2h±0℃℃ .5h
2 Humidity Test Conditions: 60 ±2 , 90~95% RH Duration: 250h℃℃
3 Thermal Shock
Heat cycle conditions: TA=-55 ±3 , TB=85 ±2 , t1=t2=30min, Switch ℃℃ ℃℃ time: ≤3min, Cycle time: 100 times, Recovery time: 2h±0.5h.
4 Vibration Fatigue
Frequency of vibration: 10~55Hz Amplitude:1.5mm Directions: X,Y and Z Duration: 2h 5 Drop Test Cycle time: 10 times Height: 1.0m
6 Solder Ability Test
Temperature: 245 ±5 Duration: 3.0s℃℃ --5.0s Depth: DIP--2/3 , SMD--1/5
7 Resistance to
(1)Thickness of PCB:1mm , Solder condition: 260 ±5 , Duration: 10±1s℃℃ (2)Temperature of Soldering Iron: 350 ±10 , Duration: 3~4s ,℃℃ Recovery time : 2 ± 0.5h Recommended Reflow Soldering Diagram
R E Y C O N N S S A W F i l t e r R F 9 6 6 8 REYCONNS CHINA LIMITED www.reyconns.com ‐ 5 ‐ Packing Information Carrier Tape * B0: 5.35 for QCC8C; 4.15 for DCC6/QCC8B; 3.35 for DCC6C/QCC8D Reel Dimensions Outer Packing Type Quantity Dimension Description Weight Internal box 1000 190×188×42 carton box 2 reel / internal box 5 boxes / external box 0.18 External box 10000 235×205×210 1.80 Unit: mm Unit: kg Notes 1. As a result of the particularity of inner structure of SAW products, it easy to be breakdown by electrostatic, so we should pay attention to ESD protect in the test. 2. Static voltage between signal load and ground may cause deterioration and destruction of the component. Please avoid static voltage. 3. Ultrasonic cleaning may cause deterioration and destruction of the component. Please avoid ultrasonic cleaning. 4. Only leads of component may be soldered. Please avoid soldering another part of component. 5. There is a close relationship be tween the device's performance and matching network. The specifications of this device are based on the test circuit shown above. L and C values may change depending on board layout. Values shown are intended as a guide only.