RF2167

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Technical content

Features

 Ceramic Package for Surface Mounted Technology (SMT)  RoHS compatible  Package size 13.30x6.50x1.80mm 3  Package Code QCC12  Electrostatic Sensitive Device(ESD) Package Dimensions (Unit: mm) Pin Configuration Marking Description Test Circuit（Bottom View） Pin No. Description

11 Input

5 Output

1,2,3,4,7,8,9,10 Case Ground 6,12 To be Grounded R Manufacturer RF F SAW Filter

2167 Part Number

• Pin 1 YYWW Year Code & Week Code RF2167
• YYWW *Fig：If the products produced in 06th week of 2015, The year code & week code is 1506.

R E Y C O N N S S A W F i l t e r R F 2 1 6 7 REYCONNS CHINA LIMITED www.reyconns.com Performance Maximum Rating Item Value Unit DC Voltage VDC 3 V Operation Temperature T -40 ~ +85 ℃ Storage Temperature Tstg -55 ~ +125 ℃ RF Power Dissipation P 15 dBm Electronic Characteristics Test Temperature: 25 ℃±2℃ Terminating source impedance: 50 Ω Terminating load impedance: 50 Ω Item Minimum Typical Maximum Unit Center Frequency fc 235.00 MHz Insertion Loss(min) IL 12.5 13.0 dB Insertion Loss 215.00-255.00MHz IL 12.8 13.5 dB Amplitude Ripple (p-p) 215.00-255.00MHz △ɑ 0.5 1.0 dB 1 dB Bandwidth BW 1dB 40.0 43.5 MHz 40 dB Bandwidth BW 40dB 57.0 60.0 MHz Group Delay Ripple 215.00-255.00MHz GDR 30.0 60.0 ns Absolute Attenuation ɑ DC -200.00 MHz 40.0 45.0 dB 280.00-415.00 MHz 40.0 42.0 dB Input VSWR Output VSWR

R E Y C O N N S S A W F i l t e r R F 2 1 6 7 REYCONNS CHINA LIMITED www.reyconns.com Frequency Characteristics F r e q u e n c y R e s p o n s e F r e q u e n c y R e s p o n s e（wideband） Delay Ripple & S11 VSWR Phase Linearity & S22 VSWR S 1 1 S m i t h C h a r t S 2 2 S m i t h C h a r t

R E Y C O N N S S A W F i l t e r R F 2 1 6 7 REYCONNS CHINA LIMITED www.reyconns.com Reliability （The SAW components shall remain electrical performance after tests） No. Test item Test condition

1 Temperature

(1) Temperature: 85 ±2 , Duration: 250h , Recovery time: 2h±0.5h℃℃ (2) Temperature: –55 ±3 , Duration: 250h ,Recovery time: 2h±0.5h℃℃

2 Humidity Test Conditions: 60 ±2 , 90~95% RH Duration: 250h℃℃

3 Thermal Shock

Heat cycle conditions: TA=-55 ±3 , TB=85 ±2 , t1=t2=30min, Switch ℃℃ ℃℃ time: ≤3min, Cycle time: 100 times, Recovery time: 2h±0.5h.

4 Vibration Fatigue

Frequency of vibration: 10~55Hz Amplitude:1.5mm Directions: X,Y and Z Duration: 2h 5 Drop Test Cycle time: 10 times Height: 1.0m

6 Solder Ability Test

Temperature: 245 ±5 Duration: 3.0s℃℃ --5.0s Depth: DIP--2/3 , SMD--1/5

7 Resistance to

(1)Thickness of PCB:1mm , Solder condition: 260 ±5 , Duration: 10±1s℃℃ (2)Temperature of Soldering Iron: 350 ±10 , Duration: 3~4s ,℃℃ Recover y time : 2 ± 0.5h Recommended Reflow Soldering Diagram

R E Y C O N N S S A W F i l t e r R F 2 1 6 7 REYCONNS CHINA LIMITED www.reyconns.com Notes 1. As a result of the particularity of inner structure of SAW products, it easy to be breakdown by electrostatic, so we should pay attention to ESD protect in the test. 2. Static voltage between signal load and ground may cause deterioration and destruction of the component. Please avoid static voltage. 3. Ultrasonic cleaning may cause deterioration and destruction of the component. Please avoid ultrasonic cleaning. 4. Only leads of component may be soldered. Please avoid soldering another part of component. 5. There is a close relationship between the device's performance and matching network. The specifications of this device are based on the test circuit shown above. L and C values may change depending on board layout. Values shown are intended as a guide only.