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Features
Ceramic Package for Surface Mounted Technology (SMT) RoHS compatible Package size 3.80x3.80x1.50mm 3 Package Code DCC6 Electrostatic Sensitive Device(ESD) Package Dimensions (Unit: mm) Pin Configuration Marking Description Test Circuit（Bottom View） S.S.G. 0dBm Rg Ri Vi Rg=Ri=50Ω Pin No. Description
2 Input
5 Output
1,3,4,6 Case Ground R Manufacturer RF F SAW Filter
2002 Part Number
- Pin 1 YYWW Year Code & Week Code
- YYWW RF2002 *Fig：If the products produced in 06th week of 2015, The year code & week code is 1506.
R E Y C O N N S S A W F i l t e r R F 2 0 0 2 REYCONNS CHINA LIMITED www.reyconns.com Performance Maximum Rating Item Value Unit DC Voltage VDC 3 V Operation Temperature T -40 ~ +85 ℃ Storage Temperature Tstg -55 ~ +125 ℃ RF Power Dissipation P 15 dBm Electronic Characteristics Test Temperature: 25 ℃±2℃ Terminating source impedance: 50 Ω Terminating load impedance: 50 Ω Item Minimum Typical Maximum Unit Center Frequency fc 235.00 MHz Insertion Loss(min) IL 1.0 1.5 dB Insertion Loss 233.00 - 237.00 MHz IL 1.5 2.5 dB Amplitude Ripple (p-p) 233.00 - 237.00 MHz △ɑ 0.8 1.2 dB Group Delay Ripple 233.00 - 237.00 MHz GDR 80.0 160.0 ns 3 dB Bandwidth BW 3dB 6.0 7.0 MHz Absolute Attenuation ɑ DC - 220.00 MHz 50.0 55.0 dB 250.00 -450.00 MHz 50.0 55.0 dB 450.00 -1000.00 MHz 50.0 53.0 dB 1000.00 -1500.00 MHz 30.0 33.0 dB Input VSWR 233.00 - 237.00 MHz 1.6:1 2.0:1 / Output VSWR 233.00 - 237.00 MHz 1.6:1 2.0:1 /
R E Y C O N N S S A W F i l t e r R F 2 0 0 2 REYCONNS CHINA LIMITED www.reyconns.com Frequency Characteristics F r e q u e n c y R e s p o n s e F r e q u e n c y R e s p o n s e（wideband） Delay Ripple & S11 VSWR Phase Linearity & S22 VSWR S 1 1 S m i t h C h a r t S 2 2 S m i t h C h a r t
R E Y C O N N S S A W F i l t e r R F 2 0 0 2 REYCONNS CHINA LIMITED www.reyconns.com Reliability （The SAW components shall remain electrical performance after tests） No. Test item Test condition
1 Temperature
(1) Temperature: 85 ±2 , Duration: 250h , Recovery time: 2h±0.5h℃℃ (2) Temperature: –55 ±3 , Duration: 250h ,Recove℃℃ ry time: 2h±0.5h
2 Humidity Test Conditions: 60 ±2 , 90~95% RH Duration: 250h℃℃
3 Thermal Shock
Heat cycle conditions: TA=-55 ±3 , TB=85 ±2 , t1=t2=30min, Switch ℃℃ ℃℃ time: ≤3min, Cycle time: 100 times, Recovery time: 2h±0.5h.
4 Vibration Fatigue
Frequency of vibration: 10~55Hz Amplitude:1.5mm Directions: X,Y and Z Duration: 2h 5 Drop Test Cycle time: 10 times Height: 1.0m
6 Solder Ability Test
Temperature: 245 ±5 Duration: 3.0s℃℃ --5.0s Depth: DIP--2/3 , SMD--1/5
7 Resistance to
(1)Thickness of PCB:1mm , Solder condition: 260 ±5 , Duration: 10±1s℃℃ (2)Temperature of Soldering Iron: 350 ±10 , Duration: 3~4s℃℃ Recovery time : 2 ± 0.5h Recommended Reflow Soldering Diagram
R E Y C O N N S S A W F i l t e r R F 2 0 0 2 REYCONNS CHINA LIMITED www.reyconns.com Packing Information Carrier Tape * B0: 5.35 for QCC8C; 4.15 for DCC6/QCC8B; 3.35 for DCC6C/QCC8D Reel Dimensions Outer Packing Type Quantity Dimension Description Weight Internal box 1000 190×188×42 0.18 External box 10000 235×205×210 carton box 2 reel / internal box 5 boxes / external box 1.80 Unit: mm Unit: kg Notes 1. As a result of the particularity of inner structure of SAW products, it easy to be breakdown by electrostatic, so we should pay attention to ESD protect in the test. 2. Static voltage between signal load and ground may cause deterioration and destruction of the component. Please avoid static voltage. 3. Ultrasonic cleaning may cause deterioration and destruction of the component. Please avoid ultrasonic cleaning. 4. Only leads of component may be soldered. Please avoid soldering another part of component. 5. There is a close relationship between the device's performance and matching network. The specifications of this device are based on the test circuit shown above. L and C values may change depending on board layout. Values shown are intended as a guide only.