RF1001

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Technical content

Features

 Ceramic Package for Surface Mounted Technology (SMT)  RoHS compatible  Package size 7.00x5.00x1.60mm 3  Package Code QCC12C  Electrostatic Sensitive Device(ESD) Package Dimensions (Unit: mm) Pin Configuration Marking Description Pin No. Description

9 Input

4 Output

1,2,3,5,6,7,8,10 Ground R Manufacturer F SAW Filter

1001 Part Number

• Pin 1 YYWW Year Code & Week Code
• YYWW *Fig：If the products produced in 06th week of 2012, The year code & week code is 1206. RF1001

R E Y C O N N S S A W F i l t e r R F 1 0 0 1 REYCONNS CHINA LIMITED www.reyconns.com ‐ 2 ‐ Test Circuit Performance Maximum Rating Item Value Unit DC Voltage VDC 3 V Operation Temperature T -40 ~ +85 ℃ Storage Temperature Tstg -55 ~ +125 ℃ RF Power Dissipation P 10 dBm Electronic Characteristics Test Temperature: 25 ℃±2℃ Terminating source impedance: 50 Ω Terminating load impedance: 50 Ω Item Minimum Typical Maximum Unit Center Frequency fc 168.68 MHz Insertion Loss(min) IL 3.8 4.5 dB Insertion Loss 168.65 - 168.71MHz IL 4.4 5.0 dB αrel ≤ 1 dB BW1 60.0 80.0 kHz Pass bandwidth αrel ≤ 3 dB BW3 90.0 110.0 kHz Amplitude Ripple (p-p) 168.65 - 168.71MHz △ɑ 0.5 1.0 dB Group Delay Ripple 168.65 - 168.71MHz GDR 1.5 2.0 us Absolute Attenuation ɑ DC - 130.00MHz 50.0 55.0 dB 130.00 - 163.68MHz 40.0 45.0 dB 163.68 MHz 35.0 45.0 dB 166.68 MHz 30.0 40.0 dB 170.68 MHz 30.0 40.0 dB

R E Y C O N N S S A W F i l t e r R F 1 0 0 1 REYCONNS CHINA LIMITED www.reyconns.com ‐ 3 ‐ 173.68 MHz 35.0 45.0 dB 173.68 - 250.00MHz 40.0 45.0 dB 250.00 - 800.00MHz 50.0 55.0 dB Input VSWR 168.65 - 168.71MHz 2.5:1 3.0:1 / Output VSWR 168.65 - 168.71MHz 2.5:1 3.0:1 / Frequency Characteristics F r e q u e n c y R e s p o n s e F r e q u e n c y R e s p o n s e（wideband） Delay Ripple & S11 VSWR Phase Linearity & S22 VSWR

R E Y C O N N S S A W F i l t e r R F 1 0 0 1 REYCONNS CHINA LIMITED www.reyconns.com ‐ 4 ‐ S 1 1 S m i t h C h a r t S 2 2 S m i t h C h a r t

R E Y C O N N S S A W F i l t e r R F 1 0 0 1 REYCONNS CHINA LIMITED www.reyconns.com ‐ 5 ‐ Reliability （The SAW components shall remain electrical performance after tests） No. Test item Test condition

1 Temperature

(1) Temperature: 85 ±2 , Duration: 250h , Recovery time: 2h±0.5h℃℃ (2) Temperature: –55 ±3 , Duration: 250h ,Recovery time: 2h±0.5h℃℃

2 Humidity Test Conditions: 60 ±2 , 90~95% RH Duration: 250h℃℃

3 Thermal Shock

Heat cycle conditions: TA=-55 ±3 , TB=85 ±2 , t1=t2=30min, Switch ℃℃ ℃℃ time: ≤3min, Cycle time: 100 times, Recovery time: 2h±0.5h.

4 Vibration Fatigue

Frequency of vibration: 10~55Hz Amplitude:1.5mm Directions: X,Y and Z Duration: 2h 5 Drop Test Cycle time: 10 times Height: 1.0m

6 Solder Ability Test

Temperature: 245 ±5 Duration: 3.0s℃℃ --5.0s Depth: DIP--2/3 , SMD--1/5

7 Resistance to

(1)Thickness of PCB:1mm , Solder condition: 260 ±5 , Duration: 10±1s℃℃ (2)Temperature of Soldering Iron: 350 ±10 , Duration: 3~4s ,℃℃ Recover y time : 2 ± 0.5h Recommended Reflow Soldering Diagram

R E Y C O N N S S A W F i l t e r R F 1 0 0 1 REYCONNS CHINA LIMITED www.reyconns.com ‐ 6 ‐ Notes 1. As a result of the particularity of inner structure of SAW products, it easy to be breakdown by electrostatic, so we should pay attention to ESD protect in the test. 2. Static voltage between signal load and ground may cause deterioration and destruction of the component. Please avoid static voltage. 3. Ultrasonic cleaning may cause deterioration and destruction of the component. Please avoid ultrasonic cleaning. 4. Only leads of component may be soldered. Please avoid soldering another part of component. 5. There is a close relationship between the device's performance and matching network. The specifications of this device are based on the test circuit shown above. L and C values may change depending on board layout. Values shown are intended as a guide only.