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Thick Film Chip Resistors (RC General) Thi k FilGl Chi R i tThick Film General Chip Resistors 3225(1210), 5025(2010), 6432(2512) ■ Features

  • Small, thin and lightweight
  • High reliability
  • Applicable Both flow and reflow soldering
  • Applicable Both flow and reflow soldering.
  • Suitable size and package for surface mount assembly
  • RoHS Compliant. ■ Part Number System■ Part Number System RC Type General purpose chip 7320 Resistance Value 3 di i di S CS Packing Type 7” reelCS F Tolerance ±1%F 1005 Size : mm (inch) 10 0 5 (0402)1005General purpose chip resistorRC -3-digit coding System (E-24 series) -4-digit coding System (E-96 series) -Jumper : ‘000’ 7” reelCS 10” reelES 13” reelAS ±1%F ±2%G * Jumper : ‘J’ ±5%J 1.0×0.5mm (0402)1005 1.6×0.8mm (0603)1608 2012 3216 2.0×1.2mm (0805) 3.2×1.6mm (1206) ex)7320 : 732Ω3225 5025 6432 3.2×2.5mm (1210) 5.0×2.5mm (2010) 6.4×3.2mm (2512) Ver. 2012.11

Thick Film Chip Resistors (RC General) < Top View > < Side View > ■ Structure and Dimensions L W T ( Unit : mm ) TYPE (Inch) L W T l 1 l2 Unit Weight Ver. 2012.11

Thick Film Chip Resistors (RC General) ■ Applications and Ratings TYPE Power Rating at 70℃ (W) Max Working Voltage (V) Max Overload Voltage (W) Resistance Range (Ω) T.C.R (ppm/℃) Working Temperature (℃) 1005 (0402) 1/16 50 100 1 ~ 10M 1~99 Ω: +300 -200 -55 ~ 155 1608 (0603) 1/10 50 100 1 ~ 10M -55 ~ 155 2012 (0805) 1/8 150 300 1 ~ 10M -55 ~ 155 1~9.9Ω :+300,-200 10Ω ~ 1㏁ : ±100 1.1㏁~10㏁ : ±300 3216 (1206) 1/4 200 400 1 ~ 10M -55 ~ 155 3225 (1210) 1/3 200 400 1 ~ 10M -55 ~ 155 5025 (2010) 2/3 200 400 1 ~ 10M -55 ~ 155 6432 (2512) 1 200 400 1 ~ 10M -55 ~ 155 ■ Power Derating Curve ■ Jumper Ratings Type Rated Current (A) Max Overload Current (A) 1005, 1608 1 2 2012, 3216, 3225, 2 4

100 Power

■ Rated Voltage 5025, 6432 2 4 %R a t e d E = E : Rated Voltage (V) P:R a t e dP o w e r( W ) R : Resistance Value (Ω) ‐60 ‐40 ‐20 0 20 40 60 80 100 120 140 150 160 ‐55 Ambient Temperature( ℃) 15570 Ver. 2012.11

Thick Film Chip Resistors (RC General) ■ Recommended land pattern■ Recommended land pattern : Land Pattern : Chip Resistor AA B C [ Unit : mm ] TYPE (Inch) Reflow Soldering Flow Soldering D i m e n s i o nA B2 A + BC A B2 A + BC Ver. 2012.11

Thick Film Chip Resistors (RC General) ■ Performance Characteristics■ Performance Characteristics ITEM Requirements Specification Test Conditions (JIS C 5201-1) Within the specifiedResistance Within the specified tolerance JIS C 5201-1 4.5 Temperature Characteristic Within the specified T.C.R JIS C 5201-1 4.8 Sh iShort time Overload ΔR < ±1%+0.1Ω JIS C 5201-1 4.13 Rated Voltage×2.5, 5sec Solderability Immersed over 95% JIS C 5201-1 4.17 Rosin Ethanol (25%WT) Resistance to Solder Heat ΔR < ±1%+0.05Ω JIS C 5201-1 4.18 260±5℃, 10±1 sec Temperature ΔR< ±1%+0 1Ω JIS C 5201-1 4.19 Cycle Moisture Resistance ΔR < ±3%+0.1Ω JIS C 5201-1 4.24 JIS C 5201-142 5 Load Life ΔR < ±3%+0.1Ω JIS C 5201 1 4.25 Rated Voltage, 70±2℃, 1,000+48hours 90mins ON, 30mins OFF High Temp. Exposure ΔR < ±3%+0.1Ω JIS C 5201-1 4.25.3 155±2℃, 1,000+48hoursExposure , , ※ NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications. Ver. 2012.11