RB140BN3 CYSTEKEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 6
Technical content
Features
For surface mounted applications. For use in low voltage, high frequency inverters, free wheeling, and polarity protection applications Plastic material used carries Underwriters Laboratory Flammability Classification 94V-0 Low leakage current High surge capability High temperature soldering: 250C/10 seconds at terminals Exceeds environmental standards of MIL-S-19500/228 Pb-free lead plating package Equivalent Circuit Outline
Applications
DC-DC converters. Strobes. Mobile phones. Charging circuits. Motor control. SOT-23 RB140BN3 1：Anode 2：Not Connected 3：Cathode Anode Cathode 1 2 Not Connected
CYStech Electronics Corp. Spec. No. : C062N3 Issued Date : 2016.07.01 Revised Date : Page No. : 2/6 RB140N3 CYStek Product Specification Absolute Maximum Ratings (Rating at 25C ambient temperature unless otherwise specified.) Parameter Symbol Limits Units Repetitive peak reverse voltage VRRM 40 V Maximum RMS voltage VRMS 28 V Maximum DC blocking voltage VR 40 V Average forward rectified current IO 1.2 A Peak forward surge current @8.3ms single half sine wave superimposed on rated load (JEDEC method) IFSM 20 A Power Dissipation (Note) PD 625 mW Maximum thermal resistance, Junction to ambient (Note) Rth,JA 250 ℃/W Operating Junction and Storage Temperature range TJ ; Tstg -50 ~ +150 ℃ Note : For a device mounted on 25mm×25mm FR-4 PCB with high coverage of single sided 1oz copper, in still air condition. Characteristics (TA=25C) Characteristic Symbol Condition Min. Typ Max. Unit Reverse Breakdown V oltage V(BR)R IR=80μA 40 - - V Forward V oltage VF 1 IF=50mA - 280 340 mV VF 2 IF=100mA - 300 360 VF 3 IF=250mA - 340 410 VF 4 IF=400mA - 380 460 VF 5 IF=750mA - 410 500 VF 6 IF=1000mA - 440 550 VF7 IF=1500mA - - 630 Reverse Leakage Current IR 1 VR=30V - 8 20 μA IR 3 VR=30V, TA=75C - 180 - μA Capacitance Between Terminals CT VR=30V , f=1MHz - 18 - pF
Ordering Information
(Pb-free lead plating and halogen-free package) 3000 pcs / Tape & Reel Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs/ tape & reel in 7” reel Product rank, zero for no rank products Product name
CYStech Electronics Corp. Spec. No. : C062N3 Issued Date : 2016.07.01 Revised Date : Page No. : 3/6 RB140N3 CYStek Product Specification Typical Characteristics
CYStech Electronics Corp. Spec. No. : C062N3 Issued Date : 2016.07.01 Revised Date : Page No. : 4/6 RB140N3 CYStek Product Specification Reel Dimension Carrier Tape Dimension
CYStech Electronics Corp. Spec. No. : C062N3 Issued Date : 2016.07.01 Revised Date : Page No. : 5/6 RB140N3 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/ -5 C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3C/second max. 3C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100C 150C 60-120 seconds 150C 200C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183C 60-150 seconds 217C 60-150 seconds Peak Temperature(TP) 240 +0/-5 C 260 +0/ -5 C Time within 5C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6C/second max. 6C/second max. Time 25 C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.
CYStech Electronics Corp. Spec. No. : C062N3 Issued Date : 2016.07.01 Revised Date : Page No. : 6/6 RB140N3 CYStek Product Specification SOT-23 Dimension DIM Inches Millimeters DIM Inches Millimeters H 0.0005 0.0040 0.013 0.10 Notes: 1Controlling dimension: millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material: Lead: Pure tin plated. Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek. CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. H JKD A L GV C B S Style: Pin 1.Anode 2.Not Connected 3.Cathode Marking: TE 3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3