RA32A1-BNU-FR REFOND | Alldatasheet
Document overview
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Technical content
Datasheet sections
- 1.1 General Description
- 1.2 Features
- 1.3 Application
- 1.4 Package Dimension
- 1.5 Product Parameters
- 1.6 Typical optical characteristics curves
- 2.1 Packaging Specification
- 2.1.1 Carrier Tape Dimension
- 2.1.2 Reel Dimension
- 2.1.3 Label Form Specification
- 2.2 Moisture Resistant Packing
- 2.3 Cardboard Box
- 2.4 Reliability Test Items And Conditions
- 2.5 Criteria For Judging Damage
- 3.1 SMT Reflow Soldering Instructions SMT
- 3.1.1 Soldering Iron
- 3.1.2 Repairing
- 3.1.3 Cautions
- 4.1 Handling Precautions
Tel: +86-755-66839118 Fax:+86-755-66839300 E -mail:uvsales@refond.com Web: www.refonduv.com PAGE:1 REFOND:WI-E-045 A/3 REV:E/ 3 TG-201709070732NP SPECIFICATION Mass Product RF-P**MI32DS-BF-N-Y REFOND P/N RA32A1-BNU-FR
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1.1 General Description
This production use the PLCC-2 package，outline size 2.8*3.5*0.65mm 2.8*3.5*0.65mm
1.2 Features
► PLCC package. ► Viewing angle:120°. ► Suitable for all SMT assembly and solder process . ► Available on tape and reel. ► Moisture sensitivity level: Level 3. ► RoHS compliant.
1.3 Application
► Flower production. ► Tissue culture. ► Plant factory. ► Refreshment. ► General use.
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1.4 Package Dimension
3,2 3,5 2,8 2,9 1,7 2,48 2,27 0,65 Fig.1-1 Top view Fig.1-2 Side view 3,5 1,9 2,1 0,96 2,08 Fig.1-3 Bottom view Fig.1-4 Polarity 2,1 1 2,1 0,4 Fig.1-5 Soldering patterns Notes All dimensions units are millimeters. All dimensions tolerances are 0.2mm unless otherwise noted.
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1.5 Product Parameters
Table 1-1 Electrical / Optical Characteristics at Ts=25° C Table 1-2 Absolute Maximum Ratings at Ts=25° C Item Symbol Test Condition Value Unit Min. Typ Max. Forward Voltage VF IF=100mA 2.8 3.4 3.6 V Reverse Current IR VR=5V --- --- 10 uA Total radiant flux Φe IF=100mA 140 180 224 mW Peak wavelength λp IF=100mA 440 450 455 nm Viewing Angle 2θ1/2 IF=100mA --- 120 --- deg Thermal Resistance. RTHJ-S IF=100mA --- 15 --- ℃/W Parameter Symbol Rating Units Power Dissipation PD 0.3 W Forward Current IF 100 mA Peak Forward Current IFP 150 mA Reverse Voltage VR 5 V Electrostatic Discharge (HBM) ESD 2000 V Operating Temperature TOPR -40 ~ +85 ℃ Storage Temperature TOPR -40 ~ +100 ℃ Junction Temperature TJ 115 ℃
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1.6 Typical optical characteristics curves
Fig.1- Forward Voltage Vs. Forward Current Fig.2- Forward Current Vs. Relative Power 120 150 Forward Current(mA) Forward Voltage(V) 20% 40% 60% 80% 100% 0 20 40 60 80 100 Relative Intensity(%) Forward Current(mA)
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2.1 Packaging Specification
Package:4000pcs/reel. 4000pcs
2.1.1 Carrier Tape Dimension
Fig.2-1 Carrier Tape Dimension
2.1.2 Reel Dimension
Fig.2-2 Reel Dimension Notes The tolerances unless mentioned ± 0.1mm. Unit : mm A 12 0.1mm B 178 1mm C 60 1mm D 13.0 0.5mm Label 标签 D C A B
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2.1.3 Label Form Specification
Fig. 2-3 Label Form Specification
2.2 Moisture Resistant Packing
Fig.2-4 Moisture Resistant Packing Process PART NO. Part Number SPEC NO. Spec Number LOT NO. Lot Number BIN CODE Bin Code Фe Radiation flux VF Forward Voltage WLP Wavelength QTY Packing Quantity DATE Made Date Label 标签 Reel 卷盘 Moisture Barrier Bag 防潮袋 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Label 标签 PART NO. SPEC NO. LOT NO. BIN CODE ： Фe ： WLP ： VF ： QTY: DATE:
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2.3 Cardboard Box
Fig.2-5 Cardboard Box
2.4 Reliability Test Items And Conditions
Table 2-3 Reliability Test Items And Conditions Test Items Ref.Standard Test Condition Time Quantity Ac/Re Reflow JESD22-B106 Temp:260℃max T=10 sec 3times. 10Pcs. 0/1 Temperature Cycle JESD22-A104 100℃ 30 min. ↑↓5 min -40℃ 30 min. 300 Cycles 10Pcs. 0/1 Thermal Shock JESD22-A106 -40℃ 15min ↑↓10s 100℃ 15min 300 Cycles 10Pcs. 0/1 High Temperature Storage JESD22-A103 Temp:100℃ 1000Hrs. 10Pcs. 0/1 Low Temperature Storage JESD22-A119 Temp:-40℃ 1000Hrs. 10Pcs. 0/1 Life Test JESD22-A108 Ta=25℃ IF=100mA 1000Hrs. 10Pcs. 0/1 深圳市瑞丰光电子股份有限公司 SHENZHEN REFOND OPTOELECTRONICS CO.LTO.
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2.5 Criteria For Judging Damage
Table 2-4 Criteria For Judging Damage Test Items Symbol Test Condition Criteria For Judgement Min. Max. Forward Voltage VF IF=100mA - U.S.L*)x1.1 Reverse Current IR VR = 5V - U.S.L*)x2.0 Total radiant flux Фe IF=100mA L.S.L*)x0.7 - Notes 1.U.S.L: Upper standard level L.S.L: Lower standard level 2. The above reliability tests is based on the verification of a single/strip LED of Refond's existing experimental platform, the reliability experiment was taken under good heat dissipation conditions. when customers applies the LED to the series and parallel circuit, should take consideration of all the factors such as the current, voltage distribution, heat dissipation and others. 3.The technical information shown in the data sheets is limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license.
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3.1 SMT Reflow Soldering Instructions SMT
Fig.3-1 SMT Reflow Soldering Instructions Table 3-1 SMT Reflow Soldering Instructions Average temperature rise speed Tsmax TP Max 3 ° C/ s 3 ° C/ Preheating: minimum temperature (Tsmin) 150 ° C Preheating: Max temperature (Tsmax) 200 ° C Preheating: Time Tsmin Tsmax 60s-120s 60 - 120 Time limited to maintain high temperature: the temperature (TL) 217 ° C Time limited to maintain high temperature: The Time (tL) Max 60s Peak /Classification of temperature: (TP) 260 ° C Time limit classification of peak temperature time tp Max 10s Hold time within 5 C with the actual peak temperature (TP) (TP) 5 ° C Max 30s Cooling speed Max 6 ° C/ s 6 ° C/ Needed time from 25 ° C to Tp 25 ° C Max 8 minutes tp t ts L Preheat TS min TS max TP TL Ramp-up Critical Zone T to TL P Ramp-down t 25℃ to Peak Temperature Time
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3.1.1 Soldering Iron
(1) When do soldering by hand, keep the temperature of iron below less 300℃ less than 3 seconds. (2) Soldering by hand should be done only one time.
3.1.2 Repairing
Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable,a double - head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of LEDs will or not be damaged by repairing. LED
3.1.3 Cautions
(1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be impacted on the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when usethe picking up nozzle, the pressure on the silicone resin should be proper. LED (2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp the circuit board.LED (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. Do not rapidly cool device after soldering.
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4.1 Handling Precautions
(1) LED operating environment and sulfur element composition cannot be over 100PPM in the LEDmating usage material. This is provided for informational purposes only and is not a warranty or endorsement.LED (2) In order to prevent ex-ternal material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM,the single content of Chlorine elementis required to be less than 900PPM, the total content of Bromine element and Chlorine element in the external materials of the application products is required to be less than 1500PPM . This is provided for informational purposes only and is not a warranty or endorsement. (3) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. Refond advises against theuse of any chemicals or materials that have been found or are suspected to have an adverse affect on device performance or reliability. To verifycompatibility, Refond recommends that all chemicals and materials be tested in the specific application and environment for which they are intended tobe used. Attaching LEDs, do not use adhesives that outgas organic vapor. (4) Handle the component along the side surface by using forceps or appropriate tools; Do not directlytouch or Handle the silicone lens surface, it may damage the internal circuitry.
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Tel: +86-755-66839118 Fax:+86-755-66839300 E -mail:uvsales@refond.com Web: www.refonduv.com PAGE:18 REFOND:WI-E-045 A/3 REV:E/ 3 TG-201709070732NP Table 4-1Storage Conditions Temperature Humidity Time Storage Before Opening Aluminum Bag 75% Within 1 Year From Date After Opening Aluminum Bag 60% 24hours Baking 24hours (8) If the moisture absorbent material（silica gel）has faded away or the LEDs have exceeded the storage time, baking treatment should be performed after unpacking and based on the following condition（65±5）℃ for above 24 hours. If the package is flatulence or damaged, please notify the sales staff to assist. (9)Similar to most Solid state devices; LEDs are sensitive to Electro -Static Discharge (ESD) and Electrical Over Stress (EOS). (10) Other points for attention, please refer to our relevant information.
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