A28B-W2SS4712-C7 REFOND | Alldatasheet
Document overview
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Technical content
Datasheet sections
- 1.1 General Description
- 1.2 Features
- 1.3 Application
- 1.4 Package Dimension
- 1.5 Product Parameters
- 1.6 Bin Range Of Luminous Flux and The Chromaticity Diagram (IF=1300mA)
- 1.7 Typical optical characteristics curves
- 2.1 Packaging Specification
- 2.1.1 Suction box Dimension
- 2.1.2 Label Form Specification
- 2.2 Moisture Resistant Packing
- 2.3 Cardboard Box
- 2.4 Reliability Test Items And Conditions
- 2.5 Criteria For Judging Damage
- 4.1 Handling Precautions
REFOND:WI-E-045 A/ 3 REV:E/1 Tel: +86-755-66839118 Fax:+86-755-66839300 E -mail:sales@refond.com Web: www.refond.com PAGE:1 TG-201803280905EP SPECIFICATION Mass Product RF-P**MI32DS-BF-N-Y REFOND P/N A28B-W*SS4712-C7
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1.1 General Description
The white light of this light emitting diode is formed by mixing light from a blue light chip Size： 28mmX28mmX1.0mm。
1.2 Features
► COB Package. ► High power density. ► Integrated packaging module,no SMT . ► Aluminum substrate package，low thermal resistance，high electrical insulation strength . ► RoHS compliant.
1.3 Application
► Commercial lighting. ► Indoor lighting. ► Supermarket lighting. ► General use.
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1.4 Package Dimension
Fig.1-1 Top view Fig.1-2 Side view Fig.1-3 Polarity Notes 1. All dimensions units are millimeters. 2. All dimensions tolerances are 0.5mm unless otherwise noted. 12S11P （Tc measurement point） Cathode RF-A2828 1.4 1.4 φ 24.5 0.6
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1.5 Product Parameters
Table 1-1 Electrical / Optical Characteristics at Tc=25° C Table 1-2 Absolute Maximum Ratings at Tc=25° C Item Symbol Test Condition Value Unit Min. Typ Max. Forward Voltage VF IF=1300mA 32 36 42 V Reverse Current IR VR=60V --- --- 60 uA A28B-W2SS4712-C7 Φ IF=1300mA 6340 6760 7180 lm A28B-W3SS4712-C7 Φ IF=1300mA 6550 6970 7390 lm A28B-W4SS4712-C7 Φ IF=1300mA 6760 7180 7600 lm A28B-W5SS4712-C7 Φ IF=1300mA 6970 7390 7840 lm A28B-W6KS4712-C7 Φ IF=1300mA 6970 7390 7840 lm A28B-W7SS4712-C7 Φ IF=1300mA 6970 7390 7840 lm Viewing Angle 2θ1/2 IF=1300mA --- 120 --- deg Color Rendering Index CRI IF=1300mA 70 73 --- / Parameter Symbol Rating Units Power Dissipation PD 70 W Forward Current IF 2000 mA Peak Forward Current IFP 2500 mA Reverse Voltage VR 60 V Electrostatic Discharge (HBM) ESD 1000 V Case Temperature Tc 90 ℃ Storage Temperature TOPR -40 ~ +85 ℃ Junction Temperature TJ 125 ℃
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1.6 Bin Range Of Luminous Flux and The Chromaticity Diagram (IF=1300mA)
(IF=1300mA) Table 1-3 VF（V） Φ（lm） SDCM A28B-W2SS4712-C7 32-42 6340-6760-7180 2S-3，2S-5 A28B-W3SS4712-C7 6550-6970-7390 3S-3，3S-5 A28B-W4SS4712-C7 6760-7180-7600 4S-3，4S-5 A28B-W5SS4712-C7 6970-7390-7840 5S-3，5S-5 A28B-W6KS4712-C7 6970-7390-7840 6K-3，6K-5 A28B-W7SS4712-C7 6970-7390-7840 7S-3，7S-5 Fig 1-4 The C.I.E Chromaticity Diagram CIE X 0.35 0.37 0.39 0.41 0.43 Y 0.45 0.29 0.31 0.33 2S-3 2S-5 3S-3 3S-5 4S-3 4S-5 5S-3 5S-5 6K-3 6K-5 7S-3 7S-5
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1.7 Typical optical characteristics curves
Fig 1-5 Forward Voltage Vs. Forward Current. Fig 1-6 Forward Current Vs. Relative Intensity. 0.4 0.8 1.2 1.6 300 800 1300 1800 2300 Relative Intensity(%) Forward Current (mA) 500 1000 1500 2000 33 34 35 36 37 Forward Current (mA) Forward Voltage (v)
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2.1 Packaging Specification
Package:20pcs/box. 20pcs
2.1.1 Suction box Dimension
Fig.2-1 Suction box Dimension Notes The tolerances unless mentioned ± 0.1mm. Unit : mm 注：未注公差为± 0.1毫米 尺寸单位：毫米
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2.1.2 Label Form Specification
2.2 Moisture Resistant Packing
Fig.2-3 Moisture Resistant Packing PART NO. Part Number SPEC NO. Spec Number LOT NO. Lot Number BIN CODE Bin Code Ф Luminous flux XY Chromaticity Bin VF Forward Voltage WLD Wavelength QTY Packing Quantity DATE Made Date Label 标签 Suction box 吸塑盒 Moisture Barrier Bag 防潮袋 ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES Label 标签
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2.3 Cardboard Box
Fig.2-4 Cardboard Box
2.4 Reliability Test Items And Conditions
Table 2-3 Reliability Test Items And Conditions Test Items Ref.Standard Test Condition Time Quantity Ac/Re Thermal Shock JESD22-A106 -40 15min ↑↓10sec 100 15min 100 cycle 10pcs. 0/1 High Temperature Storage JESD22-A103 Temp:100 1000hrs. 10pcs. 0/1 Low Temperature Storage JESD22-A119 Temp:-40 1000hrs. 10pcs. 0/1 Life Test JESD22-A108 Tc=65 Ta=25 IF=1300mA 1000hrs. 10pcs. 0/1 深圳市瑞丰光电子股份有限公司 SHENZHEN REFOND OPTOELECTRONICS CO.LTO.
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2.5 Criteria For Judging Damage
Table 2-4 Criteria For Judging Damage Test Items Symbol Test Condition Criteria For Judgement Min. Max. Forward Voltage VF IF=1300mA - U.S.L*)x1.1 High Temperature High Humidity Life Test / IF=1300mA No open circuit, shortcircuit or Flicke Luminous Flux Ф IF=1300mA L.S.L*)x0.7 - Notes 1.U.S.L: Upper standard level L.S.L: Lower standard level 2. The above reliability tests is based on the verification of a single/strip LED of Refond's existing experimental platform, the reliability experiment was taken under good heat dissipation conditions. when customers applies the LED to the series and parallel circuit, should take consideration of all the factors such as the current,
REFOND:WI-E-045 A/ 3 REV:E/1 Tel: +86-755-66839118 Fax:+86-755-66839300 E -mail:sales@refond.com Web: www.refond.com PAGE:18 TG-201803280905EP voltage distribution, heat dissipation and others. 3.The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. 3. Soldering Instructions 300 ° C 350 °C (1) The hand solder should be done only one time (2) When soldering , do not put stress on the COBs’silicone (3) When soldering , put COB on the Surface of a poor conductor of heat (4) Don’t remove the protective film on the silicone until soldering end Soldering Iron (1) When hand soldering, keep the temperature of iron below less 3 50℃ less than 5 seconds. The tip of the iron tip is the blade Repairing Repair should not be done after the COBs have been soldered. When repairing is unavoidable,a double-head soldering iron should be used (as below figure). It should be confirmed in advance whether the characteristics of COBs will or will not be damaged by repairing. When COBs are repairing ,don’t use soldering iron scrape pad of COBs.
REFOND:WI-E-045 A/ 3 REV:E/1 Tel: +86-755-66839118 Fax:+86-755-66839300 E -mail:sales@refond.com Web: www.refond.com PAGE:19 TG-201803280905EP Cautions (1) The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on the top of package. The pressure to the top surface will be influence to the reliability of the LEDs. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when use the picking up nozzle, the pressure on the silicone resin should be proper. LED (2) Components should not be mounted on warped (non coplanar) portion of PCB. After soldering, do not warp the circuit board.LED (3) Do not apply mechanical force or excess vibration du ring the cooling process to normal temperature after soldering. Do not rapidly cool device after soldering. 4. Handling Precautions
4.1 Handling Precautions
(1) LED operating environment and sulfur element composition cannot be over 100PPM in the LED mating usage material. This is provided for informational purposes only and is not a warranty or endorsement.LED (2) In order to prevent ex-ternal material from getting into the inside of LED, which may cause the malfunction of LED, the single content of Bromine element is required to be less than 900PPM,the single content of Chlorine elementis required to be less than 900PPM,the total content of Bromine element and Chlorine element in the external materials of the application products is required to be less than 1500PPM . This is provided for informational purposes only and is not a warranty or endorsement.
REFOND:WI-E-045 A/ 3 REV:E/1 Tel: +86-755-66839118 Fax:+86-755-66839300 E -mail:sales@refond.com Web: www.refond.com PAGE:20 TG-201803280905EP (3) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat an d photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. Refond advises against the use of any chemicals or materials that have been found or are suspected to have an adverse affect on device performance or reliability. To verify compatibility, Refond recommends that all chemicals and materials be tested in the specific application and environment for which they are intended to be used. Attaching LEDs, do not use adhesives that outgas organic vapor. (4) Handle the component along the side surface by using forceps or appropriate tools; do not directly touch or Handle the silicone lens surface, it may damage the internal circuitry. (5) In designing a circuit, the current through each LED can not be exceed the absolute maximum rating specified for each LED. In the mean while, resistors for protection should be applied, otherwise slight voltage shift will cause big current change, burn out may happen. The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage.
REFOND:WI-E-045 A/ 3 REV:E/1 Tel: +86-755-66839118 Fax:+86-755-66839300 E -mail:sales@refond.com Web: www.refond.com PAGE:21 TG-201803280905EP (6) Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color change and so on. Please consider the heat generation of the LEDs when making the system design.LED (7) Compared to standard encapsulants, silicone is generally softer, and the surface is more li kely to attract dust，requiring special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. Refond suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (8) To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50% (9)Similar to most Solid state devices; LEDs are sensitive to Electro -Static Discharge (ESD) and Electrical Over Stress (EOS). (10) Other points for attention, please refer to our relevant information.
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