RA05H8693M

RA05H8693M MITSUBISHI | Alldatasheet

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MITSUBISHI RF MOSFET MODULE RA05H8693M RoHS Compliance,866-928MHz 5W 14V, 3 Stage Amp. RA05H8693M MITSUBISHI ELECTRIC 2nd Mar 2007 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS

1 RF Input (Pin)

2 Gate Voltage (VGG), Power Control

3 Drain Voltage (VDD), Battery

4 RF Output (Pout)

5 RF Ground (Case)

PACKAGE CODE: H11S BLOCK DIAGRAM DESCRIPTION The RA05H8693M is a 5watt RF MOSFET Amplifier Module that operate in the 866 to 928MHz range. The battery can be connected directly to the drain of the enhancement-mode MOSFET transistors. The output power and drain current increase as the gate voltage increases. With a gate voltage around 3.5V (minimum), output power and drain current increases substantially. The nominal output power becomes available at 3.8V (typical) and 4V (maximum). At VGG=5V, the typical gate current is 1 mA.

FEATURES

• Enhancement-Mode MOSFET Transistors (IDD≅0 @ VDD=14V, VGG=0V)
• Pout>5W, IT<1.4A @ VDD=14V, VGG=5V, Pin=1mW
• IT<1.4A @ VDD=14V, Pout=3W(VGG control), Pin=1mW
• Broadband Frequency Range: 866-928MHz
• Low-Power Control Current IGG=1mA (typ) at VGG=5V
• Module Size: 60.5 x 14 x 6.4 mm RoHS COMPLIANCE
• RA05H8693M-101 is a RoHS compliant products.
• RoHS compliance is indicate by the letter “G” after the Lot Marking.
• This product include the lead in the Glass of electronic parts and the lead in electronic Ceramic parts. How ever,it applicable to the following exceptions of RoHS Directions. 1.Lead in the Glass of a cathode-ray tube, electronic parts, and fluorescent tubes. 2.Lead in electronic Ceramic parts. ORDERING INFORMATION: ORDER NUMBER SUPPLY FORM RA05H8693M-101 Antistatic tray, 20 modules/tray

MITSUBISHI RF POWER MODULE RoHS COMPLIANCE RA05H8693M RA05H8693M MITSUBISHI ELECTRIC 2nd Mar 2007 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS MAXIMUM RATINGS (Tcase=+25°C, unless otherwise specified) SYMBOL PARAMETER CONDITIONS RATING UNIT VDD Drain Voltage VGG<5V 17 V VGG Gate Voltage VDD<14V, Pin=0mW 6 V Pin Input Power 4 mW Pout Output Power f=866-928MHz, VGG<5V ZG=ZL=50Ω 7 W Tcase(OP) Operation Case Temperature Range ditto -30 to +110 °C Tstg Storage Temperature Range -40 to +110 °C The above parameters are independently guaranteed. ELECTRICAL CHARACTERISTICS (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT f Frequency Range 866 928 MHz Pout Output Power VDD=14V, VGG=5V, Pin=1mW 5 W IT Total Current 1.4 A 2fo 2nd Harmonic -25 dBc ρin Input VSWR 3:1 — IGG Gate Current VDD=14V, Pout=3W(VGG control) Pin=1mW 1 mA — Stability VDD=10.0-15.2V, Pin=0.5-2mW, Pout<5W (VGG control), Load VSWR=3:1 No parasitic oscillation — — Load VSWR Tolerance VDD=15.2V, Pin=1mW, Pout=5W (VGG control), Load VSWR=20:1 No degradation or destroy — All parameters, conditions, ratings, and limits are subject to change without notice.

MITSUBISHI RF POWER MODULE RoHS COMPLIANCE RA05H8693M RA05H8693M MITSUBISHI ELECTRIC 2nd Mar 2007 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS TYPICAL PERFORMANCE (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified) OUTPUT POWER, TOTAL EFFICIENCY, 2nd, 3rd HARMONICS versus FREQUENCY and INPUT VSWR versus FREQUENCY OUTPUT POWER, POWER GAIN and OUTPUT POWER, POWER GAIN and DRAIN CURRENT versus INPUT POWER DRAIN CURRENT versus INPUT POWER 850 870 890 910 930 950 970 FREQUENCY f(MHz) OUTPUT POWER Pout(W) INPUT VSWR ρin (-) 100 120 TOTAL EFFICIENCY ηT(%) VDD=14V Pout=3W(VGG adj.) Pin=1mW Pout ηT ρin -20 -15 -10 -5 0 5 INPUT POWER Pin(dBm) OUTPUT POWER Pout(dBm) POWER GAIN Gp(dB) DRAIN CURRENT IDD(A) f=866MHz, VDD=14V, VGG=5V Pout IDD Gp -20 -15 -10 -5 0 5 INPUT POWER Pin(dBm) OUTPUT POWER Pout(dBm) POWER GAIN Gp(dB) DRAIN CURRENT IDD(A) f=896MHz, VDD=14V, VGG=5V Pout Gp IDD -70 -60 -50 -40 -30 -20 850 870 890 910 930 950 970 FREQUENCY f(MHz) HARMONICS (dBc) VDD=14V Pout=3W(VGG adj.) Pin=1mW 2nd 3rd OUTPUT POWER, POWER GAIN and OUTPUT POWER, POWER GAIN and DRAIN CURRENT versus INPUT POWER DRAIN CURRENT versus INPUT POWER OUTPUT POWER and DRAIN CURRENT OUTPUT POWER and DRAIN CURRENT versus DRAIN VOLTAGE versus DRAIN VOLTAGE 3 5 7 9 11 13 15 DRAIN VOLTAGE VDD(V) OUTPUT POWER Pout(W) DRAIN CURRENT IDD(A) Pout f=866MHz, VGG=5V, Pin=1mW IDD -20 -15 -10 -5 0 5 INPUT POWER Pin(dBm) OUTPUT POWER Pout(dBm) POWER GAIN Gp(dB) DRAIN CURRENT IDD(A) f=926MHz, VDD=14V, VGG=5V Pout Gp IDD 35 79 11 13 15 DRAIN VOLTAGE VDD(V) OUTPUT POWER Pout(W) DRAIN CURRENT IDD(A)Pout f=896MHz, VGG=5V, Pin=1mW IDD -20 -15 -10 -5 0 5 INPUT POWER Pin(dBm) OUTPUT POWER Pout(dBm) POWER GAIN Gp(dB) DRAIN CURRENT IDD(A) f=956MHz, VDD=14V, VGG=5V Pout Gp IDD

MITSUBISHI RF POWER MODULE RoHS COMPLIANCE RA05H8693M RA05H8693M MITSUBISHI ELECTRIC 2nd Mar 2007 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS TYPICAL PERFORMANCE (Tcase=+25°C, ZG=ZL=50Ω, unless otherwise specified) OUTPUT POWER and DRAIN CURRENT OUTPUT POWER and DRAIN CURRENT versus DRAIN VOLTAGE versus DRAIN VOLTAGE OUTPUT POWER and DRAIN CURRENT OUTPUT POWER and DRAIN CURRENT versus GATE VOLTAGE versus GATE VOLTAGE OUTPUT POWER and DRAIN CURRENT OUTPUT POWER and DRAIN CURRENT versus GATE VOLTAGE versus GATE VOLTAGE 33 .5 44 .5 55 .5 GATE VOLTAGE VGG(V) OUTPUT POWER Pout(W) DRAIN CURRENT IDD(A) Pout f=866MHz, VDD=14V, Pin=1mW IDD 3579 11 13 15 DRAIN VOLTAGE VDD(V) OUTPUT POWER Pout(W) DRAIN CURRENT IDD(A) Pout f=926MHz, VGG=5V, Pin=1mW IDD 3 3.5 4 4.5 5 5.5 GATE VOLTAGE VGG(V) OUTPUT POWER Pout(W) DRAIN CURRENT IDD(A)Pout f=896MHz, VDD=14V, Pin=1mW IDD 33 .5 44 .5 55 .5 GATE VOLTAGE VGG(V) OUTPUT POWER Pout(W) DRAIN CURRENT IDD(A) Pout f=926MHz, VDD=14V, Pin=1mW IDD 35 79 11 13 15 DRAIN VOLTAGE VDD(V) OUTPUT POWER Pout(W) DRAIN CURRENT IDD(A) Pout f=956MHz, VGG=5V, Pin=1mW IDD 33 .5 44 .5 55 .5 GATE VOLTAGE VGG(V) OUTPUT POWER Pout(W) DRAIN CURRENT IDD(A) Pout f=956MHz, VDD=14V, Pin=1mW IDD

MITSUBISHI RF POWER MODULE RoHS COMPLIANCE RA05H8693M RA05H8693M MITSUBISHI ELECTRIC 2nd Mar 2007 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS 2-R1.6±0.2 51.3±1 43.3±1 0.45 Area [A] 0.09±0.02 21.3±1 8.3±1 Expansion figure of area [A] 2.3±0.3 (6.4) 6±1 11±0.5 1 2 3 4 5 (49.5) 0.09±0.02 50.4±1 57.5±0.5 60.5±1 OUTLINE DRAWING (mm)

2 Gate Voltage (VGG)

3 Drain Voltage (VDD)

MITSUBISHI RF POWER MODULE RoHS COMPLIANCE RA05H8693M RA05H8693M MITSUBISHI ELECTRIC 2nd Mar 2007 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS TEST BLOCK DIAGRAM C1, C2: 4700pF, 22uF in parallel Signal Generator Attenuator Pre- amplifier Attenuator Power Meter Directional Coupler ZG=50Ω - + DC Power Supply VGG ZL=50Ω + - DC Power Supply VDD C1 C2 21 3 4 DUT 5 Spectrum Analyzer Power MeterAttenuatorDirectional Coupler EQUIVALENT CIRCUIT EQUIVALENT CIRCUIT

MITSUBISHI RF POWER MODULE RoHS COMPLIANCE RA05H8693M RA05H8693M MITSUBISHI ELECTRIC 2nd Mar 2007 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS PRECAUTIONS, RECOMMENDATIONS, and APPLICATION INFORMATION: Construction: This module consists of an alumina substrate soldered onto a copper flange. For mechanical protection, a plastic cap is attached with silicone. The MOSFET transistor chips are die bonded onto metal, wire bonded to the substrate, and coated with resin. Lines on the substrate (eventually inductors), chip capacitors, and resistors form the bias and matching circuits. Wire leads soldered onto the alumina substrate provide the DC and RF connection. Following conditions must be avoided: a) Bending forces on the alumina substrate (for example, by driving screws or from fast thermal changes) b) Mechanical stress on the wire leads (for example, by first soldering then driving screws or by thermal expansion) c) Defluxing solvents reacting with the resin coating on the MOSFET chips (for example, Trichloroethylene) d) Frequent on/off switching that causes thermal expansion of the resin e) ESD, surge, overvoltage in combination with load VSWR, and oscillation ESD: This MOSFET module is sensitive to ESD voltages down to 1000V. Appropriate ESD precautions are required. Mounting: Heat sink flatness must be less than 50 µm (a heat sink that is not flat or particles between module and heat sink may cause the ceramic substrate in the module to crack by bending forces, either immediately when driving screws or later when thermal expansion forces are added). A thermal compound between module and heat sink is recommended for low thermal contact resistance and to reduce the bending stress on the ceramic substrate caused by the temperature difference to the heat sink. The module must first be screwed to the heat sink, then the leads can be soldered to the printed circuit board. M3 screws are recommended with a tightening torque of 0.4 to 0.6 Nm. Soldering and Defluxing: This module is designed for manual soldering. The leads must be soldered after the module is screwed onto the heat sink. The temperature of the lead (terminal) soldering should be lower than 350°C and shorter than 3 second. Ethyl Alcohol is recommend for removing flux. Trichloroethylene solvents must not be used (they may cause bubbles in the coating of the transistor chips which can lift off the bond wires). Thermal Design of the Heat Sink: At Pout=3W, VDD=14V and Pin=1mW each stage transistor operating conditions are: Stage Pin (W) Pout (W) Rth(ch-case) (°C/W) IDD @ IT=1.4A (A) VDD (V) 1st 0.001 0.03 29.0 0.02 2nd 0.030 0.70 4.5 0.30 3rd 0.700 3.00 3.0 1.07 The channel temperatures of each stage transistor Tch = Tcase + (VDD x IDD - Pout + Pin) x Rth(ch-case) are: For long-term reliability, it is best to keep the module case temperature (Tcase) below 90°C. For an ambient temperature Tair=60°C and Pout=3W, the required thermal resistance Rth (case-air) = ( Tcase - Tair) / ( (Pout / ηT ) - Pout + Pin ) of the heat sink, including the contact resistance, is: Rth(case-air) = (90°C - 60°C) / (3W/15% – 3W + 0.001W) = 1.76 °C/W When mounting the module with the thermal resistance of 1.76 °C/W, the channel temperature of each stage transistor is: Tch1 = Tair + 37.3 °C Tch2 = Tair + 45.9 °C Tch3 = Tair + 68.0 °C The 175°C maximum rating for the channel temperature ensures application under derated conditions.

MITSUBISHI RF POWER MODULE RoHS COMPLIANCE RA05H8693M RA05H8693M MITSUBISHI ELECTRIC 2nd Mar 2007 ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS Output Power Control: Depending on linearity, the following two methods are recommended to control the output power: a) FM modulation: By the gate voltage (VGG). b) Linear modulation: By RF input power Pin. The gate voltage is used to set the drain’s quiescent current for the required linearity. Oscillation: To test RF characteristics, this module is put on a fixture with two bias decoupling capacitors each on gate and drain, a 4.700 pF chip capacitor, located close to the module, and a 22 µF (or more) electrolytic capacitor. When an amplifier circuit around this module shows oscillation, the following may be checked: a) Do the bias decoupling capacitors have a low inductance pass to the case of the module? b) Is the load impedance ZL=50Ω? c) Is the source impedance ZG=50Ω? Frequent on/off switching: In base stations, frequent on/off switching can cause thermal expansion of the resin that coats the transistor chips and can result in reduced or no output power. The bond wires in the resin will break after long-term thermally induced mechanical stress. Quality: Mitsubishi Electric is not liable for failures resulting from base station operation time or operating conditions exceeding those of mobile radios. This module technology results from more than 20 years of experience, field proven in tens of millions of mobile radios. Currently, most returned modules show failures such as ESD, substrate crack, and transistor burnout, which are caused by improper handling or exceeding recommended operating conditions. Few degradation failures are found. Keep safety first in your circuit designs! Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble ma y occur. Trouble with semiconductors may lead to personal injury , fire or propert y damage. Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of non-flammable material, or (iii) prevention against any malfunction or mishap.