R8360S NISSHINBO | Alldatasheet
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36V System Power Supply with Watchdog Timer for Automotive Applications NO.EC-337-181101 OUTLINE R8360S is the system power supply and supervisor IC based on the high-voltage CMOS process technology, and has high accuracy and ultra low supply current voltage. R8360S consists of a voltage regulator (VR), a voltage detector (VD), and a normal / window type of watchdog timer (WDT) in a chip, and can provide three functions of the system power supply, the supply voltage supervisor, and the supervision of system’s misoperation. Voltage Regulator allows the output current of 500mA. And, VR h as the inrush current protection circuit for rising pulse (Typ.400mA or less). Voltage Detector outputs a reset signal when a reduction of supply voltage (SENSE / VOUT) is detected, and the reset signal is used as system reset. The detection voltage is internally fixed in an IC. And, the delay time is adjustable with an external capacitor because VD has the built-in release delay circuit (the power-on reset circuit). When the supply voltage is higher than the release output voltage, VD maintains the reset state during the delay time. The output type of RESETB and D OUT are Nch open-drain. In addition, R8360Sxx2C and R8360Sxx2D (Detector with SENSE pin) have a manual reset (MR) pin. Watchdog Timer detects the microprocessor output pulse. In addition to the normal type of WDT (R8360Sxx1A / R8360Sxx2C) that outputs a reset signal when the detected pulse period is longer than normal, R8360S supports the window type of WDT (R8360Sxx1B / R8360Sxx2D) that outputs a reset signal when the detected pulse period is shorter or longer. RESETB outputs the reset signal when using R8360Sxx1A / R8360Sxx1B, and the WDO pin outputs “L” as the reset signal when using R8360Sxx2C / R8360Sx x2D. The output type of WDO is Nch open- drain. In addition, R8360Sxx2C and R8360Sxx2D have an inhibitin g (INH) pin to stop the watchdog timer’s monitoring function. The time out period of Watchdog Timer is also adjustable with an external capacitor. R8360S supports the packages of HSOP-8E and HSOP-18.
FEATURES
- Operating Voltage Range (Maximum Rating) ········ 3.5V to 36.0V (50.0V) <Voltage Regulator (VR)>
NO.EC-337-181101 <Voltage Detector (VD)> Delay Time is adjustable with an external capacitor. <Watchdog Timer (WDT)> Each time is adjustable with an external capacitor.
APPLICATIONS
- Voltage monitoring for electronic control units such as EV inverter and battery charge control unit.
NO.EC-337-181101 BLOCK DIAGRAMS R8360Sxx1A / R8360Sxx1B TW VDD SCK RESETB CLOCK DETECTOR CD VOUT CE GND ON/OFF Circuit Thermal shut down Current Limit Internal Supply Voltage WATCHDOG TIMER (R8360xx1A) WINDOW WATCHDOG TIMER (R8360xx1B) VOUT R8360Sxx2C / R8360Sxx2D TW VDD SCK DOUT CLOCK DETECTOR INH CD VOUT CE SENSE GND WDO ON/OFF Circuit Thermal shut down Current Limit Internal Supply Voltage WATCHDOG TIMER (R8360Sxx2C) WINDOW WATCHDOG TIMER (R8360Sxx2D) MR
NO.EC-337-181101 SELECTION GUIDE R8360S user selectable options (Watchdog Timer type, Detector type, and additional functions with using MR / INH / WDO pins) are as follows: Product Name Package Quantity per Reel Pb Free Halogen Free R8360Sxx1-E2-#E HSOP-8E 1,000 pcs Yes Yes R8360Sxx2-E2-#E HSOP-18 1,000 pcs Yes Yes xx: Specify the set output voltage (V SET) and the set detector threshold (-VSET) by using serial numbers starting from 001. Refer to “Mark Specification Table” for details. Detector Monitoring Voltage Package Watchdog Timer Type MR / INH / WDO pins RESETB/ DOUT pins A VOUT HSOP-8E Normal − RESETB B V OUT HSOP-8E Window − RESETB C SENSE HSOP-18 Normal Yes D OUT D SENSE HSOP-18 Window Yes D OUT Quality Class: Operating Temp. Range Test Temperature AEC-Q100 R8 -40°C to 125°C Low, 25°C, High Grade 1
NO.EC-337-181101 PIN DESCRIPTION HSOP-8E HSOP-18 T o p V i e w B o t t o m V i e w Top View Bottom View HSOP-8E (R8360Sxx1A / R8360Sxx1B) Pin No. Symbol Description
1 V DD Supply Voltage pin
2 CE Chip Enable pin (Active "H")
3 GND GND pin
4 C D VD Release Delay Time Set pin
5 TW WDT Monitoring Time Set pin
6 SCK WDT Pulse Input pin
7 RESETB *2 Reset Output pin (Active "L"), Nch Open Drain Output type
8 V OUT VR Output pin
*1The tab on the bottom of the package enhances thermal performan ce and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left open. *2 RESETB pin is required to pull up to a suitable voltage with an external capacitor. 8 7 6 5 1 2 3 4 5 6 7 8 4 3 2 1 18 17 … … 11 10 …8 91 2 …
NO.EC-337-181101 HSOP-18 (R8360Sxx2C / R8360Sxx2D) Pin No. Symbol Description
3 NC No Connection
4 NC No Connection
5 GND GND pin
6 NC No Connection
7 NC No Connection
8 C D VD Release Delay Time Set pin
9 MR Manual Reset pin (Active "L")
10 TW WDT Monitoring Time Set pin
11 INH Inhibition pin (Active "L")
12 SCK WDT Pulse Input pin
13 WDO *2 WDT Output pin, Nch O pen Drain Output type
14 D OUT*3 Reset Output pin (Active "L" ), Nch Open Drain Output type
15 SENSE VD Voltage SENSE pin
16 NC No Connection
17 NC No Connection
18 V OUT VR Output pin
*1The tab on the bottom of the package enhances thermal performan ce and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left open. *2 WDO pin is required to pull up to a suitable voltage with an external capacitor. *3 DOUT pin is required to pull up to a suitable voltage with an external capacitor.
NO.EC-337-181101 PIN EQUIVALENT CIRCUIT DIAGRAMS <VOUT pin> <CE pin> VOUT Driver CE <CD pin> <RESETB / DOUT pin> CD Internal Supply Voltage Driver RESETB Driver <SENSE pin> ( R8360Sxx2C / R8360Sxx2D) <MR pin> ( R8360Sxx2C / R8360Sxx2D) SENSE MR Internal Supply Voltage <SCK pin> <TW pin> SCK Internal SupplyVoltage TW Internal Supply Voltage Driver <INH pin> ( R8360Sxx2C / R8360Sxx2D) <WDO pin> ( R8360Sxx2C / R8360Sxx2D) INH Internal Supply Voltage WDO Driver
NO.EC-337-181101 ABSOLUTE MAXIMUM RATINGS Symbol Item Ratings Unit VDD Supply Voltage −0.3 to 50 V Peak Voltage*1 6 0 V VCE C E Pin Input Voltage −0.3 to 50 V VOUT Output Voltage −0.3 to VIN +0.3 ≤ 50 V VCD Output Voltage CD Pin Output Voltage -0.3 to 7.0 V VTW TW Pin Output Voltage -0.3 to 7.0 V VRESETB RESETB Pin Output Voltage -0.3 to 7.0 V VDOUT D OUT Pin Output Voltage -0.3 to 7.0 V VWDO WDO Pin Output Voltage -0.3 to 7.0 V VSCK Input Voltage SCK Pin Input Voltage -0.3 to 7.0 V VINH INH Pin Input Voltage -0.3 to 7.0 V VMR MR Pin Input Voltage -0.3 to 7.0 V VSENSE SENSE Pin Input Voltage -0.3 to 7.0 V PD Power Dissipation (HSOP-8E) *2 Ultra High Wattage Land Pattern 3600 mW Power Dissipation (HSOP-18) JEDEC STD.51-7 Test Land Pattern 3125 Tj Junction Temperature −40 to 150 C Tstg Storage Temperature −55 to 150 C *1 Within application time of 200ms *2 Refer to the section of Package Information for details. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings are not assured. RECOMMENDED OPERATING RATINGS Symbol Item Operating Ratings Unit VDD Input Voltage 3.5 to 36.0 V VCE C E Pin Input Voltage 0 to 36.0 V VSCK SCKINH Pin Input Voltage 0 to 5.5 V VINH INH Pin Input Voltage 0 to 5.5 V VMR MR Pin Input Voltage 0 to 5.5 V VSENSE SENSE Pin Input Voltage 0 to 5.5 V Ta Operating Temperature Range −40 to 125 °C RECOMMENDED OPERATING RATINGS All of electronic equipment shou ld be designed that the mounted semiconductor devices operate within the recommended operating ratings. The semiconductor devices cannot operate normally over the recommended operating ratings, even if when they are used over such ratings by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating ratings.
NO.EC-337-181101
ELECTRICAL CHARACTERISTICS
CIN =COUT =0.1µF, VIN = 14V, unless otherwise noted. R8360Sxxxx-FE (−40°C ≤ Ta ≤ 125°C) Symbol Item Conditions Min. Typ. Max. Unit ISS Supply Current IOUT =0mA 2 5 3 8 µ A Istandby Power Consumption (on standby) VIN = 36V,VCE =0V 0.2 4.0 µA IPD CE Pull-down Constant Current VCE = 5V 0.2 0.6 µA VCE = 36V 0.5 1.3 µA VCEH CE Input Voltage "H" 2.2 36 V VCEL CE Input Voltage "L" 1.0 V VR Part (−40°C ≤ Ta ≤ 125°C) Symbol Item Conditions Min. Typ. Max. Unit VOUT Output Voltage IOUT =1mA 0.985 1.015 V VOUT/IOUT Load Regulation VIN =VSET + 2.0V 1mA ≤ IOUT ≤ 500mA -20 0 30 mV VDIF Dropout Voltage IOUT = 500mA VSET = 1.8 1.70 1.90 V VSET = 2.5 1.00 1.55 V VSET = 3.3 0.60 1.20 V VSET = 5.0 0.50 0.95 V VOUT/VIN Line Regulation 3.5V ≤ VSET + 0.5V ≤ VIN ≤ 36V IOUT =1mA 0.01 0.02 %/V ILIM Output Current Limit VIN =VSET + 3.0V 500 750 1000 mA ISC Short current Limit VIN = 5V,VOUT = 0V 35 80 135 mA TTSD Thermal Shutdown Temperature Junction Temperature 150 165 °C TTSR Thermal Shutdown Release Temperature Junction Temperature 125 140 °C RLOW VOUT Low Output Nch Tr.ON Resistance VCE = 0V, VOUT = 0.1V 3.2 7.0 kΩ
NO.EC-337-181101 VD Part (−40°C ≤ Ta ≤ 125°C) Symbol Item Conditions Min. Typ. Max. Unit -VDET Detector Threshold VOUT Set Detector Threshold: 1.6V to 5.5V x0.982 x1.018 V VHYS Detector Threshold Hysteresis (-VDET) x0.01 (-VDET) x0.02 (-VDET) x0.03 V tdelay Release Output Delay Time (Power-On Reset) CD = 0.22µF 194 242 290 ms VRESETB RESETB Pull-up Voltage R8360Sxx1A / R8360Sxx1B 5.5 V VDOUT D OUT Pull-up Voltage R8360Sxx2C / R8360Sxx2D 5.5 V IOUTNRSTB Output Current (RESETB Output Pin) R8360Sxx1A / R8360Sxx1B Nch, V DD = 3.5V, VDS = 0.1V 0.7 1.5 mA ILEAKRSTB Nch Leakage Current (RESETB Output Pin) R8360Sxx1A / R8360Sxx1B V RESETB = 5.5V 0.3 µA IOUTDOUT Output Current (DOUT Output Pin) R8360Sxx2C / R8360Sxx2D Nch, V DD = 3.5V, VDS = 0.1V 0.7 1.5 mA ILEAKDOUT Nch Leakage Current (DOUT Output Pin) R8360Sxx2C / R8360Sxx2D V DOUT = 5.5V 0.3 µA VMRH MR Input “H” 1.5 5.5 V VMRL MR Input “L” 0 0.6 V MRW MR Input Pulse Width 2 µs RMR MR Pull-up Resistance 50 110 160 kΩ RLCD CD Pin Discharge Nch Tr.ON Resistance VCE =0V, VCD = 0.1V 7 . 5 2 0 k Ω
NO.EC-337-181101 WDT Part (−40°C ≤ Ta ≤ 125°C) Symbol Item Conditions Min. Typ. Max. Unit tOW Open Window Time R8360Sxx1B/ R8360Sxx2D CTW = 10nF 14.4 18.0 21.6 ms tCW Closed Window Time 14.4 18.0 21.6 ms tOWL Long Open Window Time 36.0 72.0 108.0 ms tIGN Ignoring Time CTW = 10nF 14.4 18.0 21.6 ms tWD Monitoring Time R8360Sxx1A/ R8360Sxx2C CTW = 10nF 14.4 18.0 21.6 ms tWR Reset Time CTW = 10nF 7.6 9.5 11.4 ms VSCKH SCK Input “H” 1.5 5.5 V VSCKL SCK Input “L” 0 0.65 V VINHH INH Input “H” 1.5 5.5 V VINHL INH Input “L” 0 0.6 V RINH INH Pull-up Resistance 50 110 160 kΩ tSCKWH SCK Minimum Input Pulse Width “H” VSCKL =0.5, VSCKH =1.6 500 ns tSCKWL SCK Minimum Input Pulse Width “L” VSCKL =0.5, VSCKH =1.6 1500 ns VWDO WDO Pull-up Voltage 5.5 V IOUTNWDO Output Current (WDO Output Pin) R8360Sxx2C / R8360Sxx2D V DD = 3.5V, VDS = 0.1V 0.7 1.5 mA ILEAKWDO Nch Leakage Current (WDO Output Pin) R8360Sxx2C / R8360Sxx2D V WDO = 5.5V 0.3 µA RLTW CTW Discharge Nch Tr.ON Resistance VCE = 0V, VCTW = 0.1V 7.5 20 kΩ
NO.EC-337-181101 Product-specific Electrical Characteristics VR Part (−40°C ≤ Ta ≤ 125°C) Product Name VOUT [V] VDIF [V] VD Part (−40°C ≤ Ta ≤ 125°C) Product Name -VDET [V] VHYS [V]
NO.EC-337-181101 TYPICAL APPLICATION CIRCUITS R8360Sxx1A/B VDD SCK VOUT CE GND CD CD RESETB TW CTW VCC I/O Microprocessor RESET VIN CE Control R8360Sxx1A/B Typical Application R8360Sxx2C/D VDD SCK VOUT CE GND CD CD SENSE MR DOUT WDO INH TW CTW VCC I/O Microprocessor RESET VIN CE Control R8360Sxx2C/D Typical Application
NO.EC-337-181101 External Components Symbol Description C1 (CIN) 0.1µF, Ceramic Capacitor C2 (COUT) 0.1µF, Ceramic Capacitor CTW A capacitor corresponding to time setting for Watchdog Timer is required. Refer to “Time Setting for WDT” in Application Information for details. CD A capacitor corresponding to se tting for Release Output Delay T ime is required. Refer to “ Delay Operation and Release Output Delay Time (tdelay)” in Application Information.” R1 A resistor is required to set with consideration of the output current and the leakage current. Refer to “Electrical Characteristic” for details. TECHNICAL NOTES Phase Compensation In the ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor C2 with 01 µF or more. If a tantalum capacitor is used, and its ESR (Equivalent Series Resistance) of C2 is large, the loop oscillation may result. Because of this, select C2 carefully considering its frequency characteristics. PCB Layout Make VDD and GND lines sufficient. If their impedance is too high, noise pickup or unstable operation may result. Connect 0.1 µF or more of the capacitor C1 between the VDD and GND, and as close as possible to the pins. In addition, connect the capacitor C2 between VOUT and GND, and as close as possible to the pins.
NO.EC-337-181101 Prohibited Area for Fluctuations in Power Supply Voltage Please take note that miss-detection or miss-release might be invited when changing an input voltage abruptly in the following prohibited area. Prohibited Area of Fluctuation at falling of VIN Prohibited Area of Fluctuation at rising of VIN 0.0 5.0 10.0 15.0 0.01 0.1 1 10 100 1000 Input Voltage Falling Time tf (μs) Input Voltage peak Vp-p (V) Prohibited Area tf GND VIN Vp-p 0.01 0.1 1 10 100 1000 Input Voltage Rising Time tr (μs) Input Voltage peak Vp-p (V) Prohibited Area tr GND VIN Vp-p
NO.EC-337-181101 TYPICAL APPLICATION FOR IC CHIP BREAKDOWN PREVENTION R8360Sxx1A/B VDD SCK VOUT CE GND CD CD RESETB TW CTW VCC I/O Microprocessor RESET VIN C1 = Ceramic 0.1μF C2 = Ceramic 0.1μF CE Control R8360Sxxxx Typical Application When a sudden surge of electrical current travels along the VOUT pin and GND due to a short-circuit, electrical resonance of a circuit involving an output capacitor (C2) and a short circuit inductor generates a negative voltage and may damage the device or the load devices. Connecting a sch ottky diode (D1) between the V OUT pin and GND has the effect of preventing damage to them.
NO.EC-337-181101 TIMING CHART R8360Sxx1A / R8360Sxx1B Voltage Detector (2) (1) (3) (4) (3) VIN VOUT VCD VRESETB +VDET -VDET tdelay tdelay VTCD VDDL Undef ined Undef ined R8360Sxx1A / R8360Sxx1B VD Timing Chart (1) When the V OUT pin voltage (VOUT) becomes more than the release voltage (+VDET), the RESETB pin voltage (VRESETB) becomes “H” after the release output delay time (tdelay). (2) When the detect output delay time is less than 30 µs (Typ.) even if VOUT becomes lower than the detector threshold (-VDET), the voltage detector (VD) does not go into the detecting state. (3) When V OUT becomes lower than -V DET, VRESETB becomes "L" after the detect output delay time (Typ.30µs) and the VD goes into the detecting state. (4) When V OUT becomes more than +V DET. VRESETB becomes "H" after the release output delay time. (V TCD = Typ.1V)
NO.EC-337-181101 R8360Sxx2C / R8360Sxx2D Voltage Detector (2) VIN VSENSE VCD VDOUT VMR +VDET -VDET VTCD tdelay tdelay tdelay R8360Sxx2C / R8360Sxx2D VD Timing Chart (1) When the SENSE pin voltage (VSENSE) becomes more than the release voltage (+VDET), the DOUT pin voltage (VDOUT) becomes “H” after the release output delay time (tdelay). (2) When the detect output delay time is 30µs (Typ.) or less ev en if V SENSE becomes lower than the detector threshold (-VDET), the voltage detector (VD) does not go into the detecting state. (3) When VSENSE becomes lower than -VDET, VDOUT becomes "L" after the detect output delay time (Typ. 30µs) and the VD goes into the detecting state. (4) When VSENSE becomes more than +VDET, VDOUT becomes “H” after the release output delay time. (VTCD = Typ.1V) (5) When the MR pin voltage (V MR) becomes “L”, VDOUT is fixed to "L" after the detect output delay time (Typ. 30µs). (6) When V MR becomes “L” to “H”, VDOUT becomes “H” after the release output delay time.
NO.EC-337-181101 R8360Sxx1A Watchdog Timer (Normal Type) R8360Sxx1A WDT Timing Chart (1) When the V OUT pin voltage (VOUT) becomes more than the release voltage (+VDET), the RESETB pin voltage (VRESETB) becomes “H” after the releas e output delay time (tdelay) and the watchdog timer (WDT) starts monitoring a pulse. After that, the TW pin voltage (V TW) repeats charge and discharge. As a result, a sawtooth wave is generated. The WDT has three states: Ignoring, Reset, and Monitoring. In each state, the TW pin is charged from 0 V or TWFREFL (Typ.0.08V). (2) After the WDT starts, the WDT is in an ignoring state until VTW is charged up to TWVREFH (Typ.2V). So, a pulse to the SCK pin is ignored during the ignoring state. (3) When charging V TW up to TWVREFH has completed, the TW pin starts discharging and the WDT goes into a monitoring state. (4) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during the monitoring state, the TW pin starts discharging and the WDT goes into a reset state. During the reset state, VRESETB becomes “L. (5) When V TW is charged up to TWVREFH during the reset state, the TW pin st arts discharging and the WDT goes into the ignoring state. (6) When a pulse is sent to the SCK pin before V TW reaches TWVREFH during the monitoring state, the TW pin start discharging and the WDT goes into the next open window state. I G N W DR S T I G NW D W DR S T I G NW D (1) (3) (4) (5) (2) (6) VOUT +VDET VIN -VDET tIGN tWD tWR <tWD TWVREFH VSCK tIGN tWD tWR tIGNtdelay VTW TWVREFL VRESETB Undefined -VDET VDDL Undefined
NO.EC-337-181101 R8360Sxx1B Watchdog Timer (Window Type) IGN LOW CW RST IGN LOW CW OW RST IGN LOW (2) (4) (5) VOUT VRESETB VSCK +VDET VIN -VDET TWVREFH tIGN <tOWL <tCW tWR tCW tOWtdelay tWRtIGN <tOWL tIGN VTW TWVREFL Undefined VDDL Undefined R8360Sxx1B WDT Timing Chart (1) When the VOUT pin voltage (VOUT) becomes more than the release voltage (+VDET), the RESETB pin voltage (VRESETB) becomes “H” after the release output delay time (tdelaly) and the watchdog timer (WDT) starts monitoring a pulse. After that, the TW pin voltage (VTW) repeats charge and discharge. As a result, a sawtooth wave is generated. The WDT has four states: Ignoring, Reset, Open Window, and Closed Window. In each state, the TW pin is charged from 0 V or TWVREFL (Typ.0.08V). (2) After WDT starts, the WDT is in an ignoring state until VTW is charged up to TWVREFH (Typ.2V). So, a pulse to the SCK pin is ignored during the ignoring state. (3) When VTW is charged up to TWVREFH during the ignoring state, the TW pin starts discharging and the WDT goes into an open window state. This open window state is four times longer than the normal open window state. (4) When a pulse is sent to the SCK pin before V TW reaches TWVREFH during the open window state, the TW pin starts discharging and the WDT goes into a closed window state. (5) When a pulse is sent to the SCK pin before VTW reaches TWVREF during the closed window state, the TW pin starts discharging and the WDT goes into a reset state. During the reset state, VRESETB becomes “L”. (6) When VTW reaches TWVREFH during the reset state, the TW pin starts discharging and the WDT goes into the ignoring state.
NO.EC-337-181101 (7) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during the closed window state, the TW pin starts discharging and the WDT goes into the open window state. (8) When a pulse is not sent to the SCK pin before V TW reaches TWVREFH during the open window state, the TW pin starts discharging and the WDT goes into the reset state. R8360Sxx2C Watchdog Timer (Normal Type) I G N W DR S T I G NW D W DR S T I G NW D (2) (6) tIGN tWD tWR <tWD VIN VSENSE VWDO TWVREFH VINH VSCK VDOUT tIGNtdelay tWD tIGN +VDET -VDET VTW TWVREFL R8360Sxx2C WDT Timing Chart
NO.EC-337-181101 (1) When the SENSE pin voltage (VSENSE) becomes more than the release voltage (+VDET), the DOUT pin voltage (VDOUT) becomes “H” after the releas e output delay time (tdelay) and the watchdog timer (WDT) starts monitoring a pulse. After that, the TW pin voltage (VTW) repeats charge and discharge. As a result, a sawtooth wave is generated. The WDT has three states: Ignoring, Reset, and Monitoring. In each state, the TW pin is charged from 0 V or TWVREFL (Typ.0.08V). (2) After the WDT starts, the WDT is in an ignoring state until VTW is charged up to TWVREFH. So, a pulse to the SCK pin is ignored during the ignoring state. (3) When VTW is charged up to TWVREFH during the ignoring state, the TW pin starts discharging and the WDT goes into a monitoring state. (4) When a pulse is not sent to the SCK pin before VTW reaches TWVREFH during the monitoring state, the TW pin starts discharging and the WDT goes into a reset state. Dur ing the reset state, the WDO pin voltage (VWDO) becomes “L”. (5) When VTW reaches TWVREFH during the reset state, the TW pin starts discharging and the WDT goes into an ignoring state. (6) When a pulse is sent to the SCK pin before VTW reaches TWVREFH during the monitoring, the TW pin starts discharging and the WDT goes into the next monitoring state. (7) The WDT stops monitoring by setting the INH pin voltage (VINH) to “L”. Then, VWDO is fixed to “H” and VTW is fixed to “L”. (8) When changed VINH from “L” to “H”, the WDT goes into the ignoring state and restarts monitoring.
NO.EC-337-181101 R8360Sxx2D Watchdog Timer (Window Type) IGN LOW CW RST IGN LOW CW OW RST IGN LOW (2) (4) (5) VSENSE VWDO VTW VSCK TWVREFH +VDET VIN -VDET tIGN <tOWL <tCW tWR tCW tOWtdelay VINH tIGN <tOWL tIGN VDOUT TWVREFL R8360Sxx2D WDT Timing Chart (1) When the VOUT pin voltage (VOUT) becomes more than the release voltage (+VDET), the DOUT pin voltage (VDOUT) becomes “H” after the release output delay time (tdelay) and the watchdog timer (WDT) starts monitoring a pulse. After that, the TW pin voltage (V TW) repeats charge and discharge. As a result, a sawtooth wave is generated. The WDT has four states: Ignoring, Reset, Open Window, and Closed Window. In each state, the TW pin is charged from 0 V or TWVREFL (Typ.0.08V). (2) After WDT starts, the WDT is in an ignoring state until V TW is charged up to TWVREFH. So, a pulse to the SCK pin is ignored during the ignoring state.
NO.EC-337-181101 (3) When VTW is charged up to TWVREFH during the ignoring state, the TW pin starts discharging and the WDT goes into an open window state. This open window state is four times longer than the normal open window state. (4) When a pulse is sent to the SCK pin before VTW reaches TWVREFH during the open window state, the TW pin starts discharging and the WDT goes into a closed window state. (5) When a pulse is sent to the SCK pin before VTW reaches TWVREFH during the close window state, the TW pin starts discharging and the WDT goes into a reset state. During the reset state, VDOUT becomes “L”. (6) When VTW reaches TWVREFH during the reset state, the TW pin starts discharging and the WDT goes into an ignoring state. (7) When a pulse is not sent to the SCK pin before V TW reaches TWVREFH during a closed window state, the TW pin starts discharging and the WDT goes into an open window state. (8) When a pulse is not sent to the SCK pin before V TW reaches TWVREFH during the open window state, the TW pin starts discharging and the WDT goes into a reset state. (9) The WDT stops monitoring by setting the INH pin voltage (VINH) to “L”. Then, VWDO is fixed to “H” and VTW is fixed to “L”. (10) When changed VINH from “L” to “H”. the WDT goes into the ignoring state and restarts monitoring.
NO.EC-337-181101
APPLICATION INFORMATION
Delay Operation and Released Output Delay Time (tdelay) CD Pin Threshold Voltage ( VTCD) Released Voltage (+VDET) GND GND Detector Voltage (-VDET) Detect Output Delay Time (tPHL)Release Output Delay Time (tdelay) VOUT / SENSE Pin CD Pin Voltage RESETB / DOUT Pin Released Output Delay Timing Diagram When the operating voltage higher than the released voltage is applied to VOUT pin (R8360Sxx1A/R8360Sxx1B) or SENSE pin (R8360Sxx2C/R8360Sxx2D), charge to an external cap acitor starts, then C D pin voltage (V CD) increases. RESETB pin (R8360Sxx1A/R8360Sxx1B) or D OUT pin (R8360Sxx2C/R8360Sxx2D) maintains the released output until VCD reaches the threshold voltage of the release output delay pin (VTCD). And when VCD is over VTCD, RESETB pin or D OUT pin is inverted from “L” to “H”. That is, the charged external capacitor starts discharging. When the operating voltage lower than the detector threshold is applied to VDD pin, the detect output delay time, which is the time until the output voltage is inverted from “H” to “L”, remains constant independent of the external capacitor. -VDET2.0V 1.5V VOUT / SENSE GND 5.0V 2.5V GND RESETB / D OUT tdelaytPHL Released Output Delay Time Released Output Delay Time (tdelay ) indicates the time between the instance when V OUT pin (R8360Sxx1A / R8360Sxx1B) or SENSE pin (R8360Sxx2C / R8360Sxx2D) shifts from “1.5 V” to “−VDET + 2.0 V” by the application of a pulse voltage and the instance when the output voltage rea ches 2.5 V after pulled up RESETB pin (R8360Sxx1A / R8360Sxx1B) or DOUT pin (R8360Sxx2C/ R8360Sxx2D) to 5.0 V with a resistor of 100 kΩ. This is given by the expression tdelay (s) 1.1 CD (F) / (1.010-6), where CD (F) represents capacitance of the external capacitor. If VOUT / SENSE pin goes up at a mild pace of 0.1V/s or less, connect a capacitor of 20 pF or more to CD pin.
NO.EC-337-181101 WDT State Transition Diagram (1)R8360S xxxA/C (2)R 8360SxxxB/D VOUT＜Detector Threshold(R8360Sxx1A) SENSE＜Detector Threshold(R8360Sxx2C) or INH=Low(R8360Sxx2C) VOUT＜Detector Threshold(R8360Sxx1B) SENSE＜Detector Threshold(R8360Sxx2D) or INH=Low(R8360Sxx2D) Ignoring Ignoring Reset Monitoring Long Open Window Open Window Closed Window Reset INH=High or OPEN and VOUT＞Released Output Voltage(R8360Sxx1A) SENSE＞Released Output Voltage(R8360Sxx2C) Input Clock Time Out INH=High or OPEN and VOUT＞Released Output Voltage(R8360Sxx1B) SENSE＞Released Output Voltage(R8360Sxx2D) Time Setting for Watchdog Timer The following time of WDT is dependent on a capacitor connectin g to the TW pin. Relationship between the value of capacitor and time can be expressed by the following equations.
NO.EC-337-181101 Inrush Current Prevention at Rising Characteristics R8360S has the inrush current preventing circuit to control the inrush current within about 400mA limited. This circuit works during the rising periods. Therefore, the load current must be increased after rising up the output voltage (at typ.100us after being out of the inrush current lim ited condition) by the sequence control. When the load current is increased during the rising periods, the inrush current must be controlled within 250mA. VOUT IRUSH 100us (TYP) VSET 400mA (TYP) IOUT＜250mA 250mA ＜IOUT IOUT Likewise, on the thermal shutdown and the foldback characteristic, the inrush current preventing circuit works when the output voltage re-rises after the output voltage fall down to a guideline (VSET x 0.4) or less. VOUT IOUT VSET×0.4
NO.EC-337-181101 Standby Function When CE turns to low, the R8360S goes into the standby mode. Du ring this mode, the voltage regulator (VR) stops the output, the watchdog timer (WDT) stops the pulse moni toring, and the voltage detector (VD) stops the voltage monitoring. Even if VIN < 3.5 V (Minimum Operating Voltage VMOV), VR stops the output, WDT stops the pulse monitoring, and VD stops the voltage monitoring. When CE = low or VIN < 3.5 V (Minimum Operating Voltage), the output of WDT and VD become as follows regardless of SENSE voltage. R8360Sxx1A/ R8360Sxx1B: The RESETB output is fixed to “L”. R8360Sxx2C/ R8360Sxx2D: The DOUT is fixed to “L”, and WDO output is fixed to the pull-up voltage. When VIN is under 1.52 V, values of RESETB output (R8360Sxx1A/ R8360Sxx1B) and DOUT output (R8360Sxx2C/ R8360Sxx2D) become indefinite, 0.1 V or more (pull-up voltage 5 V, pull-up resistance 100 kΩ). Voltage Setting in R8360Sxx1A / R8360Sxx1B In R8360Sxx1A / R8360Sxx1B, VD detects the drop of the VR outpu t voltage (V OUT). When the VD release voltage (+VDET) is set to a voltage above the VR output voltage, the reset signal of VD is not released even if VD monitors the VR output voltage returns to the normal value after detecting the drop of VR. To prevent this issue, the following condition is required between VOUT and +VDET. (VR Set Output Voltage) x 0.985 - 30mV > (VD Set Detector Threshold) x 1.018 x 1.030 When using a device with the above conditions of V OUT and +VDET, careful consideration must be given to the system operation before use. RESETB (DOUT) WDO CE Voltage Voltage CE standby VOUT (or SENSE) > -VDET VMOV Max. 1.52V VOUT VDIF VIN undefined RESETB (DOUT) WDO Voltage Voltage VOUT (or SENSE) > -VDET at VMOV
NO.EC-337-181101 Manual Reset (MR) Function (R8360Sxx2C, R8360Sxx2D) Setting the MR pin to “L” forcefully sets D OUT to “L”. The maximum value of the delay time (t MR), which is until DOUT outputs “L”, is 1µs as an index of the performance. The MR pin is pulled-up by an internal resistor (Typ.110kΩ). Current is passed to the MR pin when the voltage of MR > VDD. But, this current has no effect to the operation because the current is limited with a pull-up resistor. When setting the MR pin from “L” to “H”, D OUT is changed from “L” to “H” afte r the released output delay tim e and the WDT starts from the ignoring state. When the MR pin is “L”, the WDO pin outputs “H”. SENSE Function (R8360Sxx2C, R8360Sxx2D) In R8360Sxx2C / R8360Sxx2D, the internal voltage detector monit ors the input voltage to the SENSE pin. To measure the proper detector threshold, setting of VDD ≥ 3.5V is required. Inhibition (INH) Function (R8360Sxx2C, R8360Sxx2D) In R8360Sxx2C / R8360Sxx2D, setting the INH pin to “L” stops the WDT pulse monitoring function and the WDO pin is fixed to “H”. The INH pin is pulled up with an internal resistor (Typ.110kΩ).
NO.EC-337-181101
PACKAGE INFORMATION
Power Dissipation (HSOP-8E) Power Dissipation (P D) depends on conditions of mounti ng on board. This specification is based on the measurement at the condition below: Measurement conditions Ultra High Wattage Land Pattern Environment Mounting on board (Wind velocity 0m/s) Board Material Glass cloth epoxy plastic (4 layers) Board Dimensions 76.2mm x 114.3mm x 0.8mm Copper Ratio Top side, Back side : 50mm square, Approx.95% 2nd, 3rd Layer: 50mm square, Approx. 100% Through - hole 0.4mm x 21pcs Measurement Results (Ta = 25C, Tjmax = 150C) Ultra High Wattage land pattern Power Dissipation 3600mW Thermal Resistance jc = 10C/W 76.2 114.3 Measurent Board Pattern IC Mount Area Unit : mm Power Dissipation PD (W) 0 25 5 0 7 5 100 125 150 Ambient Temperature (℃ Power Dissipation 4.0 3.0 2.0 3.6 On Board (Ultra High Wattage Land Pattern)
NO.EC-337-181101 Package Dimension (HSOP-8E) (Unit : mm) 0.10 S 1.50±0.1 S 0.40±0.2 0～10 +0.1 0.15-0.05 D E T A I L A 0.40±0.1 1.27 2.90±0.05 (0.30) 2.70±0.05 0.12 M (0.30) 8 5 1 4 4.40±0.2 6.20±0.3 5.20±0.3 0.695TYP DETAIL A 0.08±0.05 0.05±0.05 ＊) The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. Mark Specification (HSOP-8E) ①②③④⑤⑥: Product Code ･･･ Refer to “ Mark Specification Table” ⑦⑧: Lot Number … Alphanumeric Serial Number ⑨: Lot Sub Number … Alphanumeric Serial Number HSOP-8E Markings ⑦⑧ ⑨ ①②③④⑤⑥ 8 5 1 4
NO.EC-337-181101 R8360S Mark Specification Table (HSOP-8E) R8360Sxx1A/B VR VD R8360S011A R S 0 1 0 A R8360S011B R S 0 1 0 N 5.0V 4.6V R8360S021A R S 0 1 0 B R8360S021B R S 0 1 0 P 1.8V 1.6V R8360S031A R S 0 1 0 C R8360S031B R S 0 1 0 R 5.0V 4.5V R8360S041A R S 0 1 0 D R8360S041B R S 0 1 0 S 5.0V 4.4V R 8 3 6 0 S 0 5 1 A RS010E R 8 3 6 0 S 0 5 1 B RS010T 5.0V 4.3V R8360S061A R S 0 1 0 F R8360S061B R S 0 1 0 U 5.0V 4.2V R 8 3 6 0 S 0 7 1 A RS010G R 8 3 6 0 S 0 7 1 B RS010V 5.0V 3.7V R 8 3 6 0 S 0 8 1 A RS010H R 8 3 6 0 S 0 8 1 B RS010W 3.3V 3.0V R 8 3 6 0 S 0 9 1 A RS010J R 8 3 6 0 S 0 9 1 B RS010X 3.3V 2.9V R8360S101A R S 0 1 0 K R8360S101B R S 0 1 0 Y 3.3V 2.8V R 8 3 6 0 S 1 1 1 A RS010L R 8 3 6 0 S 1 1 1 B RS010Z 3.3V 2.7V R 8 3 6 0 S 1 2 1 A RS010M R 8 3 6 0 S 1 2 1 B RS011A 5.0V 4.1V
NO.EC-337-181101 Power Dissipation (HSOP-18) Power Dissipation (P D) depends on conditions of mounting on board. This specificatio n is based on the measurement at the condition below: Measurement Conditions JEDEC STD.51-7 Test Land Pattern Environment Mounting on Board (Wind velocity=0m/s) Board Material Glass cloth epoxy plastic (4 layers) Board Dimensions 76.2 mm × 114.3 mm × 1.6 mm Copper Ratio Top side, Back side : 60mm square, Approx.10% 2nd, 3rd Layer: 74.2mm square, Approx. 100% Through-holes 0.85mm x 44pcs Measurement Result: (Ta = 25C, Tjmax = 150C) JEDEC STD.51-7 Test Land Pattern Power Dissipation 3125 mW Thermal Resistance Θjc = 9C/W 基板レイアウト IC 実装位置(単位: mm) 76.2 114.3 Ambient Temperature (C) On Board Power Dissipation PD ( m W ) Power Dissipation 3500 3000 2500 2000 1500 1000 500 0 25 3125 50 75 100 125 150 Measurement Board Pattern IC Mount Area (Unit : mm) (JEDEC STD.51-7 Test Land Pattern)
NO.EC-337-181101 PACKAGE DIMENSIONS (HSOP-18) MARK SPECIFICATION (HSOP-18) ①②③④⑤⑥：Product Code … Refer to “Mark Specification Table” ⑦⑧：Lot Number … Alphanumeric Serial Number ⑨：Lot Sub Number … Alphanumeric Serial Number (Unit : mm) 0.10 S 1.50±0.1 S 0.40±0.2 0～10 +0.1 0.15-0. 05 DETAIL A 0.20±0.1 0.50 2.90±0.05 (0.30) 2.70±0.05 0.12 M (0.30) 18 10 1 9 4.40±0.2 6. 20±0.3 5.20±0.3 0.60TYP DETAIL A 0.08±0.05 0.05±0.05 ＊) The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. HSOP-18 Markings ①②③④⑤⑥ ⑦⑧ ⑨ 18 10 1 9
NO.EC-337-181101 R8360S Mark Specification Table (HSOP-18) R8360Sxx2C/D VR VD R8360S012C R S 1 0 5 A R8360S012D R S 1 0 5 N 5.0V 4.6V R8360S022C R S 1 0 5 B R8360S022D R S 1 0 5 P 1.8V 1.6V R8360S032C R S 1 0 5 C R8360S032D R S 1 0 5 R 5.0V 4.5V R8360S042C R S 1 0 5 D R8360S042D R S 1 0 5 S 5.0V 4.4V R 8 3 6 0 S 0 5 2 C RS105E R 8 3 6 0 S 0 5 2 D RS105T 5.0V 4.3V R 8 3 6 0 S 0 6 2 C RS105F R 8 3 6 0 S 0 6 2 D RS105U 5.0V 4.2V R8360S072C R S 1 0 5 G R8360S072D R S 1 0 5 V 5.0V 3.7V R 8 3 6 0 S 0 8 2 C RS105H R 8 3 6 0 S 0 8 2 D RS105W 3.3V 3.0V R8360S092C R S 1 0 5 J R8360S092D R S 1 0 5 X 3.3V 2.9V R8360S102C R S 1 0 5 K R8360S102D R S 1 0 5 Y 3.3V 2.8V R 8 3 6 0 S 1 1 2 C RS105L R 8 3 6 0 S 1 1 2 D RS105Z 3.3V 2.7V R8360S122C R S 1 0 5 M R8360S122D R S 1 0 6 A 5.0V 4.1V
NO.EC-337-181101 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Power Consumption vs. Input Voltage (Ta = 25°C) VR=1.8V VR=3.3V VR=5.0V 2) CE Pin Current vs. CE Pin Voltage (Ta = 25°C, VIN=14V) VR=5.0V 0 6 12 18 24 30 36 Input Voltage V IN (V) Supply Current IIN (μA) 0 6 12 18 24 30 36 Input Voltage V IN (V) Supply Current IIN (μA) 0 6 12 18 24 30 36 Input Voltage V IN (V) Supply Current IIN (μA) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 0 6 12 18 24 30 36 CE Input Voltage V CE (V) CE Crrent ICE (μA)
NO.EC-337-181101 3) GND Pin Current vs. Output Current (Ta = 25°C) 4) Output Voltage vs. Output Current (Ta = 25°C) VR=1.8V VR=3.3V VR=5.0V 100 120 140 0 50 100 150 200 250 300 350 400 450 500 IGND (μA) Output Current IOUT (mA) 0.0 0.5 1.0 1.5 2.0 2.5 0 200 400 600 800 1000 Output Current I OUT (mA) Output Voltage VOUT (V) VIN=3.5V VIN=4.8V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0 200 400 600 800 1000 Output Current I OUT (mA) Output Voltage VOUT (V) VIN=3.8V VIN=4.3V VIN=6.3V 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0 200 400 600 800 1000 Output Current I OUT (mA) Output Voltage VOUT (V) VIN=5.5V VIN=6.0V VIN=8.0V
NO.EC-337-181101 5) Output Voltage vs. Input Voltage (Ta = 25°C) VR=1.8V VR=3.3V VR=5.0V 6) Output Voltage vs. Temperature (VIN=14V, IOUT=1mA) VR=1.8V VR=3.3V 0.0 0.5 1.0 1.5 2.0 2.5 0123456 Input Voltage V IN (V) Output Voltage VOUT (V) Iout=1mA Iout=30mA Iout=150mA 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 0123456 Input Voltage V IN (V) Output Voltage VOUT (V) Iout=1mA Iout=30mA Iout=150mA 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0123456 Input Voltage V IN (V) Output Voltage VOUT (V) Iout=1mA Iout=30mA Iout=150mA 1.764 1.782 1.800 1.818 1.836 -40 -20 0 20 40 60 80 100 120 Ta (℃) Output Voltage VOUT (V) 3.234 3.267 3.300 3.333 3.366 -40 -20 0 20 40 60 80 100 120 Ta (℃) Output Voltage VOUT (V)
NO.EC-337-181101 VR=5.0V 7) Dropout Voltage vs. Output Current VR=1.8V VR=3.3V VR=5.0V 4.900 4.950 5.000 5.050 5.100 -40 -20 0 20 40 60 80 100 120 Ta (℃) Output Voltage VOUT (V) 200 400 600 800 1000 1200 1400 1600 1800 2000 0 100 200 300 400 500 Output Current IOUT (mA) Dropout Voltage VDIF (mV) -40°C 25°C 125°C (VIN=3.5V) 100 200 300 400 500 600 700 800 900 1000 0 100 200 300 400 500 Output Current IOUT (mA) Dropout Voltage VDIF (mV) -40°C 25°C 125°C (VIN=3.5V) 100 200 300 400 500 600 700 800 0 100 200 300 400 500 Output Current I OUT (mA) Dropout Voltage VDIF (mV) -40°C 25°C 125°C
NO.EC-337-181101 8) Dropout Voltage vs. Output Voltage (Ta=25℃) 9) リ Ripple Rejection vs. Input Voltage (Ta=25℃, Ripple = 0.2 Vpp) VR=1.8V, IOUT=1mA VR=1.8V, IOUT=30mA VR=3.3V, IOUT=1mA VR=3.3V, IOUT=30mA 200 400 600 800 1000 1200 1400 1600 1800 2000 Output Voltage VOUT (V) Dropout Voltage VDIF (mV) IOUT=1mA IOUT=10mA IOUT=100mA IOUT=500mA (VIN=3.5V) 100 3.5 5 6.5 8 9.5 11 12.5 14 Input Voltage VIN (V) Ripple Rejection RR (dB) 100Hz 1kHz 10kHz 100kHz IOUT = 1mA 100 3.5 5 6.5 8 9.5 11 12.5 14 Input Voltage VIN (V) Ripple Rejection RR (dB) 100Hz 1kHz 10kHz 100kHz IOUT = 30mA 100 3.5 5 6.5 8 9.5 11 12.5 14 Input Voltage VIN (V) Ripple Rejection RR (dB) 100Hz 1kHz 10kHz 100kHz IOUT = 1mA 100 3.5 5 6.5 8 9.5 11 12.5 14 Input Voltage VIN (V) Ripple Rejection RR (dB) 100Hz 1kHz 10kHz 100kHz IOUT = 30mA
NO.EC-337-181101 VR=5.0V, IOUT=1mA VR=5.0V, IOUT=30mA 10) Ripple Rejection vs. Frequency (Ta=25℃, Ripple=0.2 Vpp) VR=1.8V VR=3.3V VR=5.0V 100 5 6.5 8 9.5 11 12.5 14 Input Voltage VIN (V) Ripple Rejection RR (dB) 100Hz 1kHz 10kHz 100kHz IOUT = 1mA 100 5 6.5 8 9.5 11 12.5 14 Input Voltage VIN (V) Ripple Rejection RR (dB) 100Hz 1kHz 10kHz 100kHz IOUT = 30mA 100 0.01 0.1 1 10 100 1000 Frequency [kHz] Ripple Rejection RR(dB) IOUT=1mA IOUT=30mA IOUT=150mA VIN = 4.0V 100 0.01 0.1 1 10 100 1000 Frequency [kHz] Ripple Rejection RR(dB) IOUT=1mA IOUT=30mA IOUT=150mA VIN = 5.3V 100 0.01 0.1 1 10 100 1000 Frequency [kHz] Ripple Rejection RR(dB) IOUT=1mA IOUT=30mA IOUT=150mA VIN = 7.0V
NO.EC-337-181101 11) Input Transient Respon (Ta=25°C) VR=1.8V, COUT=0.1μF VR=1.8V, COUT=10μF VR=3.3V, COUT=0.1μF VR=3.3V, COUT=10μF VR=5.0V, COUT=0.1μF VR=5.0V, COUT=10μF 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0 50 100 150 200 250 300 Time (μs) Output Voltage VOUT (V) 0.0 1.0 2.0 3.0 4.0 5.0 Input Voltage VIN (V) COUT = 0.1μF Input Voltage 3.5 <=> 4.5V (tr=tf=5usec) Outut Voltage 1.5 1.6 1.7 1.8 1.9 2.0 2.1 0 100 200 300 400 500 600 700 800 Time (μs) Output Voltage VOUT (V) 0.0 1.0 2.0 3.0 4.0 5.0 Input Voltage VIN (V) COUT = 10μF Input Voltage 3.5 <=> 4.5V (tr=tf=5usec) Outut Voltage 3.0 3.1 3.2 3.3 3.4 3.5 3.6 0 50 100 150 200 250 300 Time (μs) Output Voltage VOUT (V) 0.8 1.8 2.8 3.8 4.8 5.8 Input Voltage VIN (V) COUT = 0.1μF Input Voltage 4.3 <=> 5.3V (tr=tf=5usec) Outut Voltage 3.0 3.1 3.2 3.3 3.4 3.5 0 100 200 300 400 500 600 700 800 Time (μs) Output Voltage VOUT (V) 0.8 1.8 2.8 3.8 4.8 5.8 Input Voltage VIN (V) COUT = 10μF Input Voltage 4.3 <=> 5.3V (tr=tf=5usec) Outut Voltage 4.7 4.8 4.9 5.0 5.1 5.2 5.3 0 50 100 150 200 250 300 Time (μs) Output Voltage VOUT (V) 2.5 3.5 4.5 5.5 6.5 7.5 Input Voltage VIN (V) COUT = 0.1μF Input Voltage 6.0 <=> 7.0V (tr=tf=5usec) Outut Voltage 4.7 4.8 4.9 5.0 5.1 5.2 5.3 0 100 200 300 400 500 600 700 800 Time (μs) Output Voltage VOUT (V) 2.5 3.5 4.5 5.5 6.5 7.5 Input Voltage VIN (V) COUT = 10μF Input Voltage 6.0 <=> 7.0V (tr=tf=5usec) Outut Voltage
NO.EC-337-181101 12) Load Transient Response (Ta=25°C) VR=1.8V, COUT=0.1μF VR=1.8V, COUT=10μF VR=3.3V, COUT=0.1μF VR=3.3V, COUT=10μF VR=5.0V, COUT=0.1μF VR=5.0V, COUT=10μF 150 300 0 50 100 150 200 250 300 350 Time (μs) Output Current IOUT (mA) -0.2 0.8 1.8 2.8 3.8 Output Voltage VOUT (V) Output Current 1mA <=>150mA (tr=tf=0.5usec) Output Voltage 150 300 Time (ms) Output Current IOUT (mA) 1.4 1.6 1.8 2.0 2.2 Output Voltage VOUT (V) Output Current 1mA <=>150mA (tr=tf=0.5usec) Output Voltage 150 300 0 50 100 150 200 250 300 350 Time (μs) Output Current IOUT (mA) 1.3 2.3 3.3 4.3 5.3 Output Voltage VOUT (V) Output Current 1mA <=>150mA (tr=tf=0.5usec) Output Voltage 150 300 Time (ms) Output Current IOUT (mA) 2.9 3.1 3.3 3.5 3.7 Output Voltage VOUT (V) Output Current 1mA <=>150mA (tr=tf=0.5usec) Output Voltage 150 300 0 50 100 150 200 250 300 350 Time (μs) Output Current IOUT (mA) 3.0 4.0 5.0 6.0 7.0 Output Voltage VOUT (V) Output Current 1mA <=>150mA (tr=tf=0.5usec) Output Voltage 150 300 Time (ms) Output Current IOUT (mA) 4.6 4.8 5.0 5.2 5.4 5.6 5.8 6.0 6.2 Output Voltage VOUT (V) Output Current 1mA <=>150mA (tr=tf=0.5usec) Output Voltage
NO.EC-337-181101 13) CE Transient Response (Ta=25℃, VIN=14V, IOUT=1mA, COUT=0.1μ～47μF) VR=1.8V, CE at rising VR=1.8V, CE at falling VR=3.3V, CE at rising VR=3.3V, CE at falling VR=5.0V, CE at rising VR=5.0V, CE at falling Time (ms) CE Input Voltage VCE (V) Output Voltage VOUT (V) -200 200 400 600 800 1000 1200 Inrush Current (mA) VCE 0.1uF 1.0uF 4.7uF 10uF 47uF CE Input Voltage Output Voltage Inrush Crurent 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 1 02 03 04 05 06 0 Time (ms) CE Input Voltage VCE (V) Output Voltage VOUT (V) VCE 0.1uF 1.0uF 4.7uF 10uF 47uF CE Input Voltage Output Voltage Time (ms) CE Input Voltage VCE (V) Output Voltage VOUT (V) -200 200 400 600 800 1000 1200 Inrush Current (mA) VCE 0.1uF 1.0uF 4.7uF 10uF 47uF CE Input Voltage Output Voltage Inrush Crurent 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0 1 02 03 04 05 06 07 08 0 Time (ms) CE Input Voltage VCE (V) Output Voltage VOUT (V) VCE 0.1uF 1.0uF 4.7uF 10uF 47uF CE Input Voltage Output Voltage Time (ms) CE Input Voltage VCE (V) Output Voltage VOUT (V) -200 200 400 600 800 1000 1200 Inrush Current (mA) VCE 0.1uF 1.0uF 4.7uF 10uF 47uF CE Input Voltage Output Voltage Inrush Crurent 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 0 1 02 03 04 05 06 07 08 09 0 1 0 0 Time (ms) CE Input Voltage VCE (V) Output Voltage VOUT (V) VCE 0.1uF 1.0uF 4.7uF 10uF 47uF CE Input Voltage Output Voltage
NO.EC-337-181101 14) Detector Threshold vs. Temperature VD=1.6V VD=3.0V VD=4.6V 15) DOUT Pin Voltage vs. SENSE Pin Input Voltage (DOUT pulled-up to 5V with 100kΩ) VD=1.6V VD=3.0V 1.568 1.584 1.600 1.616 1.632 -40 -20 0 20 40 60 80 100 120 Ta (℃) Detector Threshold VDET (V) 2.940 2.970 3.000 3.030 3.060 -40 -20 0 20 40 60 80 100 120 Ta (℃) Detector Threshold VDET (V) 4.508 4.554 4.600 4.646 4.692 -40 -20 0 20 40 60 80 100 120 Ta (℃) Detector Threshold VDET (V) Input Voltage V SENSE (V) Output Voltage DOUT (V) Input Voltage V SENSE (V) Output Voltage DOUT (V)
NO.EC-337-181101 VD=4.6V 16) Release Output Delay Time vs. Input Voltage 17) Release Output Delay Time vs. Temperature 220 225 230 235 240 245 250 255 260 0 4 8 12 16 20 24 28 32 36 Output Delay Time for Release tPLH (ms) Input Voltage VIN (V) CD = 0.22μF 220 225 230 235 240 245 250 255 260 - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 Output Delay Time for Reset tdelay (ms) Ta (℃) CD = 0.22μF 18) Detect Output Delay Time vs. Temperature 19) Release Output Delay Time External Capacitor and Detect Delay Time vs. for C D Pin - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 Output Delay Time for Release tdelay (μs) Ta (℃) Input Voltage VSENSE (V) Output Voltage DOUT (V) 0.01 0.1 100 1000 0.001 0.01 0.1 1 10 100 1000 Output Delay Time for Release [tdelay (ms)] Output Delay Time for Reset [tdelay (ms)] External Capacitance CD (nF) tdelay tPHL
NO.EC-337-181101 20) WDT tWD / tOW / tCW / tIGN vs. Input Voltage 21) Reset Time vs. Input Voltage 22) Long Open Window Time vs. Input Voltage R8360SxxxB/D 23) WDT tWD / tOW / tCW / tIGN vs. Temperature 0 4 8 1 21 62 02 42 83 23 6 Input Voltage V IN (V) Monitoring Time tWD / Open Window Time tOW / Closed Window Time tCW / Ignore Time tIGN (ms) CTW = 10nF tWD / tOW / tCW / tIGN 8.4 8.6 8.8 9.0 9.2 9.4 9.6 9.8 10.0 10.2 10.4 0 4 8 12 16 20 24 28 32 36 Input Voltage V IN (V) Reset Time tWR (ms) CTW = 10nF 0 4 8 1 21 62 02 42 83 23 6 Input Voltage V IN (V) Long Term Open Window Time tOWL (ms) CTW = 10nF - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 Ta (℃) Monitoring Time tWD / Open Window Time tOW / Closed Window Time tCW / Ignore Time tIGN (ms) CTW = 10nF tWD / tOW / tCW / tIGN
NO.EC-337-181101 24) Reset Time vs. Temperature 25) Long Open Window Time vs. Temperature R8360SxxxB/D 26) WDT tWD / tOW / tCW / tIGN /tOWL / tRST Vs. External Capacitor for CTW Pin 27) Nch. Driver Output Current vs. VDS 28) Nch. Driver Output C urrent vs. Input Voltage 8.4 8.6 8.8 9.0 9.2 9.4 9.6 9.8 10.0 10.2 10.4 - 4 0 - 2 00 2 04 06 08 0 1 0 0 1 2 0 Ta (℃) Reset Time tWR (ms) CTW = 10nF -40 -20 0 20 40 60 80 100 120 Ta (℃) Long Term Open Window Time tOWL (ms) CTW = 10nF 0.01 0.1 100 1000 10000 0.001 0.01 0.1 1 10 100 1000 External Capacitance CTW (nF) Window Time (ms) tWD / tOW / tCW / tIGN tOWL tRST V DS (V) (VRESETB / VDOUT / VWDO) Nch Driver Output Current (mA) ( IOUTRSTB / IOUTDOUT / IOUTWDO ) VIN=3.5V VIN=4.0V VIN=5.0V VIN=6.0V VIN=5.0, 6.0V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0 2 4 6 8 10 12 14 Input Voltage VIN (V) Nch Driver Output Current (mA) ( IOUTRSTB / IOUTDOUT / IOUTWDO ) -40°C 25°C 105°C 125°C VDS (VRESETB / VDOUT / VWDO) = 0.1V
NO.EC-337-181101 ESR vs. Output Current The IC is recommended to use a ceramic type capacitor, but the IC can be used other capacitors of the lower ESR type. The relation between the output current (IOUT) and the ESR of output capacitor is shown below. R8360x VDD V OUT CE C1 C2 IOUT C1 = Ceramic0.1 μF, C2 = Ceramic0.1 μF GND ESR Measurement conditions: Frequency Band: 10 Hz to 2 MHz Measurement Temperature: −40°C to 125°C Hatched area: Noise level is 40 μV (average) or below Ceramic Capacitor: C1 = C2 = Ceramic 0.1 μF VR=1.8V VR=3.3V VR=5.0V 0.01 0.1 100 1000 0 50 100 150 200 250 300 Output Current IOUT (mA) Equivalent Series Resistance ESR (Ω) VIN = 3.5V to 36V Ta=-40°C 125°C 0.01 0.1 100 1000 0 50 100 150 200 250 300 Output Current IOUT (mA) Equivalent Series Resistance ESR (Ω) VIN = 3.5V to 36V Ta=-40°C 125°C 0.01 0.1 100 1000 0 50 100 150 200 250 300 Output Current IOUT (mA) Equivalent Series Resistance ESR (Ω) VIN = 5.0V to 36V Ta=-40°C 125°C
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