R8160S080B

R8160X NISSHINBO | Alldatasheet

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Technical content

200 mA 36 V Input Ultra Low Supply Current VR for Automotive Applications NO.EC-348-160930 OUTLINE The R8160x is a CMOS-based ultra low supply current voltage regulator featuring 200 mA output current and 36 V input voltage. This device consists of an Output Short -circuit Protection Circuit, an Over-current Protection Circuit, and a Thermal Shutdown Circuit in addition to the basic regulator circuits. The operating temperature range is between −40°C to 125°C, and the maximum input voltage is 36 V. All these features allow this device to become an ideal power source for ECUs. 9.0 V. The output voltage accuracy is ±1.6%. The packages for this device range from high-density mounting to ultra high wattage. The R8160x is offered in a 5-pin SOT-23-5, a 5-pin SOT-89-5, and a 6-pin HSOP-6J package.

FEATURES

• Input Voltage Range (Maximum Rating) ············· 3.5 V to 36 V (50 V) *Contact our sales representatives for other voltages.
• Built-in Output Short-circuit Protection Circuit ······ Typ. 80 mA
• Ceramic capacitors are recommended

APPLICATIONS

• Power source for ECUs such as EV inverter and battery charge control unit

NO.EC-348-160930 BLOCK DIAGRAM R8160xxxxB VDD VOUT CE GND Current Limit Short Protection Vref Thermal Shutdown Circuit SELECTION GUIDE The set output voltage and the package type are user-selectable. Product Name Package Quantity per Reel Pb Free Halogen Free R8160NxxxB-TR-FE SOT-23-5 3,000 pcs Yes Yes R8160HxxxB-T1-FE SOT-89-5 1,000 pcs Yes Yes R8160SxxxB-E2-FE HSOP-6J 1,000 pcs Yes Yes xxx: Specify the set output voltage (VSET) *Contact our sales representatives for other voltages. R8 Automotive Class Code Operating Temperature Range Guaranteed Specs Temperature Range Screening −40°C to 125°C −40°C to 125°C High and Low Temperature

NO.EC-348-160930 PIN DESCRIPTIONS 4 5 2 3 (mark side) 1 3 5 4 1 3 6 4 SOT-23-5 SOT-89-5 HSOP-6J SOT-23-5 Pin No. Symbol Description

1 GND*1 Ground Pin

2 GND*1 Ground Pin

3 CE Chip Enable Pin (Active-high)

4 VOUT Output Pin

5 VDD Input Pin

*1 The GND pin must be wired together when it is mounted on board. SOT-89-5 Pin No. Symbol Description

1 VOUT Output Pin

2 GND*2 Ground Pin

4 GND*2 Ground Pin

*2 The GND pin must be wired together when it is mounted on board. HSOP-6J Pin No. Symbol Description

2 GND*3 Ground Pin

4 GND*3 Ground Pin

5 GND*3 Ground Pin

6 VDD Input Pin

*3 The GND pin must be wired together when it is mounted on board.

NO.EC-348-160930 PIN EQUIVALENT CIRCUIT DIAGRAMS VOUT Driver CE VOUT Pin CE Pin ABSOLUTE MAXIMUM RATINGS Symbol Item Rating Unit VIN Input Voltage −0.3 to 50 V VIN Peak Input Voltage*1 60 V VCE Input Voltage (CE Pin) −0.3 to 50 V VOUT Output Voltage −0.3 to VIN + 0.3 ≤ 50 V IOUT Output Current 300 mA PD Power Dissipation SOT-23-5 Standard Land Pattern 525 mW SOT-89-5 Standard Land Pattern 1120 High Wattage Land Pattern 1620 HSOP-6J Standard Land Pattern 2100 Ultra High Wattage Land Pattern 3400 Tj Junction Temperature −40 to 150 °C Tstg Storage Temperature Range −55 to 150 °C *1 Duration time: 200 ms *2 Refer to PACKAGE INFORMATION for detailed information. ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum rat ings are not assured. RECOMMENDED OPERATING CONDITIONS Symbol Item Rating Unit VIN Input Voltage 3.5 to 36 V Ta Operating Temperature Range −40 to 125 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.

NO.EC-348-160930

ELECTRICAL CHARACTERISTICS

CIN = COUT = 0.1 μF, unless otherwise noted. R8160xxxxB (−40°C ≤ Ta ≤ 125°C) Symbol Item Conditions Min. Typ. Max. Unit ISS Supply Current VIN = 14 V IOUT = 0 mA VSET ≤ 5.0 V 2.2 6.5 μA 5.0 V < VSET 2.5 6.8 Istandby Standby Current VIN = 36 V, VCE = 0 V 0.1 1.0 μA VOUT Output Voltage VSET + 1 V ≤ VIN ≤ 36 V IOUT = 1 mA V ∆VOUT /∆IOUT Load Regulation VIN = VSET + 3.0 V 1 mA ≤ IOUT ≤ 200 mA Refer to the Product- specific Electrical Characteristics mV ∆VOUT /∆VIN Line Regulation VSET + 1 V ≤ VIN ≤ 36 V, IOUT = 1 mA -0.02 0.01 0.02 %/V VDIF Dropout Voltage IOUT = 200 mA Refer to the Product- specific Electrical Characteristics V ILIM Output Current Limit VIN = VSET + 3.0 V 220 350 420 mA ISC Short Current Limit VIN = 3.5 V, VOUT = 0 V 60 80 110 mA VCEH CE Input Voltage “H” 2.0 36 V VCEL CE Input Voltage “L” 0 1.0 V IPD CE Pull-down Current VCE = 2 V 0.2 0.6 μA TTSD Thermal Shutdown Temparature Junction Temperature 150 160 °C TTSR Thermal Shutdown Released Temperature Junction Temperature 125 135 °C R8160xxxxB Product-specific Electrical Characteristics (−40°C ≤ Ta ≤ 125°C) Product Name VOUT (V) (Ta = 25°C) VOUT (V) (−40°C ≤ Ta ≤ 125°C) ∆VOUT/∆IOUT (mV) VDIF (V)

NO.EC-348-160930 TYPICAL APPLICATIONS C1 R8160x VDD VOUT CE GND C1 = Ceramic 0.1 µF C2 = Ceramic 0.1 µF VOUT CE Control R8160x Typical Applications TECHNICAL NOTES Phase Compensation In the R8160x, phase compensation is provided to secure stable operation even when the load current is varied. For this purpose, make sure to use 0.1 μF or more of a capacitor (C2). In case of using a tantalum type capacitor and the ESR (Equivalent Series Resistance) value of the capacitor is large, the output might be unstable. Evaluate the circuit including consideration of frequency characteristics. Connect 0.1 μF or more of a capacitor (C1) between VDD and GND, and as close as possible to the pins. PCB Layout For SOT-23-5 package type, wire the following GND pins together: No. 1 and No. 2 For SOT-89-5 package type, wire the following GND pins together: No. 2 and No. 4. For HSOP-6J package type, wire the following GND pins together: No. 2, No. 4, and No. 5. Thermal Shutdown R8160x has a built-in thermal shutdown circuit, which stops the regulator operation if the junction temperature of this device increases to 160°C (Typ.) or higher. If the temperature drops to 135°C (Typ.) or lower, the regulator restarts the operation. Unless eliminating the overheating problem, the regulator turns on and off repeatedly and as a result, a pulse shaped output voltage is generated.

NO.EC-348-160930 TYPICAL APPLICATION FOR IC CHIP BREAKDOWN PREVENTION C1 R8160x VDD VOUT CE GND C1 = Ceramic 0.1 µF C2 = Ceramic 0.1 µF VOUT CE Control When a sudden surge of electrical current travels along the V OUT pin and GND due to a short -circuit, electrical resonance of a circuit involving an output capacitor (C2) and a short circuit inductor generates a negative voltage and may damage the device or the load devices. Connecting a schottky diode (D1) between the VOUT pin and GND has the effect of preventing damage to them.

NO.EC-348-160930

PACKAGE INFORMATION

POWER DISSIPATION (SOT-23-5) Power Dissipation (P D) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions Standard Test Land Pattern Environment Mounting on Board (Wind velocity = 0 m/s) Board Material Glass cloth epoxy plastic (Double sided) Board Dimensions 40 mm x 40 mm x 1.6 mm Copper Ratio Top side: Approx. 50%, Back side: Approx. 50% Through-holes φ 0.5 mm x 44 pcs Measurement Result: (Ta = 25°C, Tjmax = 150°C) Standard Test Land Pattern Free Air Power Dissipation 525 mW 310 mW Thermal Resistance θja = (150 - 25°C)/0.525 W = 238°C/W 400°C/W IC Mount Area (Unit: mm) Ambient Temperature vs. Power Dissipation Measurement Board Pattern 100 200 300 400 500 600 100 125 150 Ambient Temperature（℃） Power Dissipation PD (mW) On Board Standard Land Pattern Free Air 525 310

NO.EC-348-160930 PACKAGE DIMENSIONS (SOT-23-5) 2.9±0.2 1.9±0.2 (0.95) (0.95) 5 4 1 2 3 1.6-0.1 +0.2 2.8±0.3 0.4±0.1 0.8±0.1 1.1±0.1 0～0.1 0.15-0.05 +0.1 Unit: mm 0.2min. MARK SPECIFICATION (SOT-23-5) : Product Code … Refer to MARK SPECIFICATION TABLE (SOT-23-5) : Lot Number … Alphanumeric Serial Number : : Lot Sub Number …Alphanumeric Serial Number 5 4 1 2 3 SOT-23-5 Mark Specification

NO.EC-348-160930 MARK SPECIFICATION TABLE (SOT-23-5) R8160NxxxB Product Name   VSET R8160N033B A0 3.3 V R8160N034B A1 3.4 V R8160N050B A2 5.0 V R8160N060B A3 6.0 V R8160N080B A 4 8.0 V R8160N085B A 5 8.5 V R8160N090B A 6 9.0 V

NO.EC-348-160930 POWER DISSIPATION (SOT-89-5) Power Dissipation ( PD) depends on conditions of mounting on board. This specification is based on the measurement at the condition below: Measurement Conditions High Wattage Land Pattern Standard Land Pattern Environment Mounting on Board (Wind velocity = 0 m/s) Mounting on Board (Wind velocity = 0 m/s) Board Material Glass cloth epoxy plastic (Double sided) Glass cloth epoxy plastic (Double sided) Board Dimensions 30 mm × 30 mm × 1.6 mm 50 mm × 50 mm × 1.6 mm Copper Ratio Top side : Approx. 20% , Back side : Approx. 100% Top side : Approx. 10% , Back side : Approx. 100% Through-hole φ0.85 mm × 10 pcs - Measurement Result (Ta = 25°C, Tjmax = 150°C) High Wattage Land Pattern Standard Land Pattern Free Air Power Dissipation 1620 mW 1120 mW 620 mW Thermal Resistance 77°C/W 111°C /W 200°C /W IC Mount Area (Unit: mm) Power Dissipation vs. Ambient Temperature Measurement Board Pattern 7.5 15 7.5 High Wattage Standard 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 100 125 150 Ambient Temperature（℃） Power Dissipation PD （ｍW） On Board High Wattage Land Pattern On Board Standard Land Pattern Free Air 1620 1120 620

NO.EC-348-160930 PACKAGE DIMENSIONS (SOT-89-5) 1.5±0.1 1.5±0.1 0.47±0.1 0.42±0.1 0.42±0.1 1.5±0.1 0.4±0.1 0.4±0.1 0.1 S S 0.3±0.2 0.3±0.2 4 5 3 2 1 Bottom View 0.42±0.1 4.5±0.1 1.6±0.2 4.35±0.1 2.5±0.1 0.4±0.3 5 4 1 2 3 φ1.0 1.00±0.2 Unit: mm MARK SPECIFICATION (SOT-89-5) : Product Code … Refer to MARK SPECIFICATION TABLE (SOT-89-5) : Lot Number … Alphanumeric Serial Number : Lot Sub Number …Alphanumeric Serial Number ①②③ ④⑤⑥ ⑦⑧⑨ SOT-89-5 Mark Specification

NO.EC-348-160930 MARK SPECIFICATION TABLE (SOT-89-5) R8160HxxxB Product Name     VSET R8160H033B K33B 3.3 V R8160H034B K34B 3.4 V R8160H050B K50B 5.0 V R8160H060B K60B 6.0 V R8160H080B K80B 8.0 V R8160H085B K85B 8.5 V R8160H090B K90B 9.0 V

NO.EC-348-160930 POWER DISSIPATION (HSOP-6J) The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following conditions are used in this measurement. Measurement Conditions Ultra-high Wattage Land Pattern Standard Land Pattern Environment Mounting on Board (Wind Velocity = 0 m/s) Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-layer Board) Glass Cloth Epoxy Plastic (Double-sided Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm 50 mm × 50 mm × 1.6 mm Copper Ratio 96% 50% Through-holes φ 0.3 mm × 28 pcs φ 0.5 mm × 24 pcs Measurement Result (Ta = 25°C, Tjmax = 150°C) Ultra-high Wattage Land Pattern Standard Land Pattern Free Air Power Dissipation 3400 mW 2100 mW 675 mW Thermal Resistance 37°C/W 59°C/W 185°C/W Ultra-high Wattage Standard IC Mount Area (mm) Power Dissipation vs. Ambient Temperature Measurement Board Pattern 250 500 750 1000 1250 1500 1750 2000 2250 2500 2750 3000 3250 3500 0 25 50 75 100 125 150 Power Dissipation PD (mW) Ambient Temperature (°C) 3400 2100 On Board Ultra-high Wattage Land Pattern On Board Standard Land Pattern 675 Free Air 76.2 114.3

NO.EC-348-160930 PACKAGE DIMENSIONS (HSOP-6J) 3.81 123 5.02±0.3 654 Unit: mm 0.10 0.12 M 0.605TYP . 0.15±0.1 1.5±0.1 1.67±0.1 0.4±0.1 0.60±0.2 0.2-0.05 6.0±0.3 3.9±0.2 +0.10 MARK SPECIFICATION (HSOP-6J) : Product Code … Refer to MARK SPECIFICATION TABLE (HSOP-6J) : Lot Number … Alphanumeric Serial Number : Lot Sub Number …Alphanumeric Serial Number ⑤⑥ ⑦ ①②③④ HSOP-6J Mark Specification

NO.EC-348-160930 MARK SPECIFICATION TABLE (HSOP-6J) R8160SxxxB Product Name     VSET R8160S033B B33B 3.3 V R8160S034B B34B 3.4 V R8160S050B B50B 5.0 V R8160S060B B 60 B 6.0 V R8160S080B B 80 B 8.0 V R8160S085B B 85 B 8.5 V R8160S090B B 90B 9.0 V

NO.EC-348-160930 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Output Current (Ta = 25°C) R8160x033B R8160x050B R8160x090B 2) Output Voltage vs. Input Voltage (Ta = 25°C) R8160x033B R8160x050B 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 3.6 0 100 200 300 400 Output Voltage VOUT (V) Output Current IOUT (mA) VIN=5.3V 6.3V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 0 100 200 300 400 Output Voltage VOUT (V) Output Current IOUT (mA) VIN=7V 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 0 100 200 300 400 Output Voltage VOUT (V) Output Current IOUT (mA) VIN=11V 12V 0.0 0.3 0.6 0.9 1.2 1.5 1.8 2.1 2.4 2.7 3.0 3.3 3.6 Output Voltage VOUT (V) Input Voltage VIN (V) IOUT=1mA 50mA 100mA 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Output Voltage VOUT (V) Input Voltage VIN (V) IOUT=1mA 50mA 100mA

NO.EC-348-160930 R8160x090B 3) Supply Current vs. Temperature R8160x033B R8160x050B R8160x090B 4) Supply Current vs. Input Voltage (R8160x033B) 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 1 2 3 4 5 6 7 8 9 10 11 12 Output Voltage VOUT (V) Input Voltage VIN (V) IOUT=1mA 50mA 100mA -40 -25 0 25 50 75 100 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply Current Iss (μA) Ta (°C) VIN = 14V -40 -25 0 25 50 75 100 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply Current Iss (μA) Ta (°C) VIN = 14V -40 -25 0 25 50 75 100 125 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 Supply Current Iss (μA) Ta (°C) VIN = 14V 0 6 12 18 24 30 36 Supply Current Iss (μA) Input Voltage VIN (V) Ta=-40°C 25°C 110°C

NO.EC-348-160930 5) Output Voltage vs. Temperature (IOUT = 1mA) R8160x033B R8160x050B R8160x090B 6) Dropout Voltage vs. Output Current R8160x033B R8160x050B -40 -25 0 25 50 75 100 125 3.234 3.267 3.300 3.333 3.366 Output Voltage VOUT (V) Ta (°C) VIN = 14V -40 -25 0 25 50 75 100 125 4.900 4.950 5.000 5.050 5.100 Output Voltage VOUT (V) Ta (°C) VIN = 14V -40 -25 0 25 50 75 100 125 8.820 8.910 9.000 9.090 9.180 Output Voltage VOUT (V) Ta (°C) VIN = 14V 0.0 0.5 1.0 1.5 2.0 0 50 100 150 200 Dropout Voltage VDIF (V) Output Current IOUT (mA) Ta=-40°C 25°C 125°C 0.0 0.5 1.0 1.5 0 50 100 150 200 Dropout Voltage VDIF (V) Output Current IOUT (mA) Ta=-40°C 25°C 125°C

NO.EC-348-160930 R8160x090B 7) Dropout Voltage vs. Output Voltage (Ta = 25°C) 8) Ripple Rejection vs. Input Voltage (Ta = 25°C, Ripple = 0.2 Vpp) R8160x033B R8160x050B R8160x090B 0.0 0.2 0.4 0.6 0.8 1.0 0 50 100 150 200 Dropout Voltage VDIF (V) Output Current IOUT (mA) Ta=-40°C 25°C 125°C 0.0 0.5 1.0 1.5 3 4 5 6 7 8 9 Dropout Voltage VDIF (V) Output Voltage VOUT (V) IOUT=1mA 50mA 100mA 200mA Ripple Rejection Ratio RR (dB) Input Voltage VIN (V) f=100Hz 1kHz 10kHz 100kHz IOUT=50mA Ripple Rejection Ratio RR (dB) Input Voltage VIN (V) f=100Hz 1kHz 10kHz 100kHz IOUT=50mA Ripple Rejection Ratio RR (dB) Input Voltage VIN (V) f=100Hz 1kHz 10kHz 100kHz IOUT=50mA

NO.EC-348-160930 9) Ripple Rejection vs. Frequency (Ta = 25°C, Ripple = 0.2 Vpp) R8160x033B R8160x050B R8160x090B 10) Input Transient Response (Ta = 25°C) R8160x033B R8160x050B 0.01 0.1 1 10 100 1000 Ripple Rejection Ratio RR (dB) Frequency (kHz) VIN = 5.3V IOUT=1mA 50mA 100mA 0.01 0.1 1 10 100 1000 Ripple Rejection Ratio RR (dB) Frequency (kHz) VIN = 7.0V IOUT=1mA 50mA 100mA 0.01 0.1 1 10 100 1000 Ripple Rejection Ratio RR (dB) Frequency (kHz) VIN = 11.0V IOUT=1mA 50mA 100mA 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 5.8 6.3 6.8 -1 0 1 2 3 4 5 6 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage tr=tf=1μs Output Voltage IOUT=1mA C2=0.1μF 10μF 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 -1 0 1 2 3 4 5 6 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage tr=tf=1μs Output Voltage IOUT=1mA C2=0.1μF 10μF

NO.EC-348-160930 R8160x090B 11) Load Transient Response (Ta = 25°C) R8160x033B R8160x050B R8160x090B 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 -1 0 1 2 3 4 5 6 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage tr=tf=1μs Output Voltage IOUT=1mA C2=0.1μF 10μF 2.1 2.4 2.7 3.0 3.3 3.6 3.9 4.2 4.5 4.8 5.1 -100 0 100 200 300 400 500 600 700 800 Output Current IOUT (mA) Output Voltage VOUT (V) time (ms) Output Current tr=tf=0.5μs Output Voltage C2=0.1μF 1mA 10μF 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 -100 0 100 200 300 400 500 600 700 800 Output Current IOUT (mA) Output Voltage VOUT (V) time (ms) Output Voltage Output Current tr=tf=0.5μs 1mA C2=0.1μF 10μF 5.4 6.3 7.2 8.1 9.0 9.9 10.8 11.7 12.6 13.5 14.4 -100 0 100 200 300 400 500 600 700 800 Output Current IOUT (mA) Output Voltage VOUT (V) time (ms) Output Voltage Output Current tr=tf=0.5μs 1mA C2=0.1μF 10μF

NO.EC-348-160930 12) CE Transient Response (Ta = 25°C) R8160x033B R8160x050B R8160x090B 100 200 300 400 500 600 700 800 900 0.0 1.1 2.2 3.3 4.4 5.5 Inrush Current (mA) Output Voltage VOUT (V) time (ms) Output Voltage C2=0.1μF 10μF Inrush Current CE Input Voltage 1μF 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 -2 0 2 4 6 8 10 12 14 Output Voltage VOUT (V) time (ms) Output Voltage CE Input Voltage C2=10μF IOUT=1mA C2=0.1μF IOUT=100mA C2=10μF,IOUT=100mA & C2=0.1μF,IOUT=1mA 100 200 300 400 500 600 700 800 900 0.0 2.0 4.0 6.0 8.0 10.0 Inrush Current (mA) Output Voltage VOUT (V) time (ms) Output Voltage C2=0.1μF 10μF Inrush Current CE Input Voltage 1μF 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 -2 0 2 4 6 8 10 12 14 Output Voltage VOUT (V) time (ms) Output Voltage CE Input Voltage C2=10μF IOUT=1mA C2=10μF,IOUT=100mA & C2=0.1μF,IOUT=1mA C2=0.1μF IOUT=100mA 100 200 300 400 500 600 700 800 900 0.0 3.0 6.0 9.0 12.0 15.0 Inrush Current (mA) Output Voltage VOUT (V) time (ms) Output Voltage C2=0.1μF 10μF Inrush Current CE Input Voltage 1μF 0.0 2.0 4.0 6.0 8.0 10.0 12.0 14.0 -2 0 2 4 6 8 10 12 14 Output Voltage VOUT (V) time (ms) Output Voltage CE Input Voltage5V 0V C2=10μF IOUT=1mA C2=10μF,IOUT=100mA & C2=0.1μF,IOUT=1mA C2=0.1μF IOUT=100mA

NO.EC-348-160930 13) Power-on Transient Response (Ta = 25°C, VCE = 5 V) R8160x033B R8160x050B R8160x090B 100 200 300 400 500 600 700 800 900 0.0 1.6 3.2 4.8 6.4 8.0 Inrush Current (mA) Output Voltage VOUT (V) time (ms) Output Voltage C2=0.1μF 10μF Inrush Current Input Voltage 5.3V 1μF 100 200 300 400 500 600 700 800 900 0.0 2.0 4.0 6.0 8.0 10.0 Inrush Current (mA) Output Voltage VOUT (V) time (ms) Output Voltage C2=0.1μF 10μF Inrush Current Input Voltage7V 1μF 100 200 300 400 500 600 700 800 900 0.0 3.0 6.0 9.0 12.0 15.0 Inrush Current (mA) Output Voltage VOUT (V) time (ms) Output Voltage C2=0.1μF 10μF Inrush Current Input Voltage 11V 1μF

NO.EC-348-160930 14) Load Dump (Ta = 25°C) R8160x033B R8160x050B R8160x090B 15) Cranking (Ta = 25°C) R8160x050B R8160x090B 1.8 2.3 2.8 3.3 3.8 4.3 4.8 5.3 5.8 6.3 6.8 -10 0 10 20 30 40 50 60 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage Output Voltage C2=0.1μF 10μF 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 -10 0 10 20 30 40 50 60 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage Output Voltage C2=0.1μF 10μF 7.5 8.0 8.5 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 -10 0 10 20 30 40 50 60 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage Output Voltage C2=0.1μF 10μF 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 -1 0 1 2 3 4 5 6 7 8 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage Output Voltage C2=0.1μF 10μF 1.5 3.0 4.5 6.0 7.5 9.0 10.5 12.0 13.5 15.0 16.5 -1 0 1 2 3 4 5 6 7 8 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage Output Voltage C2=0.1μF 10μF

NO.EC-348-160930 Input Transient/Load Transient vs. Output Capacity (C2) R8160 performs a stable operation by using 0.1 µF of ceramic capacitor as the output capacitor. However, the variation of output voltage may not meet the demand of the system when input voltage and load current vary. In such cases, the variation of output voltage can be minimized significantly by using 10 µF or higher ceramic capacitor. When using a high-capacity electrolytic capacitor for the output line, place the electrolytic capacitor a few centimeters apart from the IC after arranging the ceramic capacitor close to the IC. Input Transient Response Load Transient Response R8160x050B R8160x050B 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 -1 0 1 2 3 4 5 6 Input Voltage VIN (V) Output Voltage VOUT (V) time (ms) Input Voltage tr=tf=1μs Output Voltage IOUT=1mA C2=0.1μF 10μF 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 -100 0 100 200 300 400 500 600 700 800 Output Current IOUT (mA) Output Voltage VOUT (V) time (ms) Output Voltage Output Current tr=tf=0.5μs 1mA C2=0.1μF 10μF

NO.EC-348-160930 ESR vs. Output Current It is recommended that a cerami c type capacitor be used for this device. However, other types of capacitors having lower ESR can also be used. The relation between the output current (IOUT) and the ESR of output capacitor is shown below. R8160xxxxB VDD VOUT CE IOUT C1 = Ceramic 0.1 μF, C2 = Ceramic 0.1 μF GND ESR Measurement Conditions Frequency Band: 10 Hz to 2 MHz Measurement Temperature: −40°C to 125°C Hatched area: Noise level is 40 μV (average) or below Ceramic Capacitors: C1 = 0.1 μF, C2 = 0.1 μF R8160x033B R8160x050B R8160x090B 0.01 0.1 100 1000 0 50 100 150 200 Equivalent Series Resistance ESR (Ω) Output Current IOUT (mA) VIN=3.5V to 36V 0.01 0.1 100 1000 0 50 100 150 200 Equivalent Series Resistance ESR (Ω) Output Current IOUT (mA) VIN=5V to 36V 0.01 0.1 100 1000 0 50 100 150 200 Equivalent Series Resistance ESR (Ω) Output Current IOUT (mA) VIN=9V to 36V

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