R5487L NISSHINBO | Alldatasheet

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1 Cell Li-ion/Li-polymer Protector

NO.EA-357-250917 OUTLINE The R5487L/R5497L Series are high voltage tolerance CMOS-based protection IC for over-charge/discharge and over -current of rechargeable one- cell Lithium -ion (Li+)/Lithium polymer battery. The R5487L/R5497L Series can detect over-charge/discharge of Li+ one-cell and excess load current, further include a short circuit protector for preventing large external short circuit current and the excess charge-current. The R5487L/R5497L Series are composed of four voltage detectors, reference unit s, a delay circuit, a short circuit protector, an oscillator, a counter, and logic circuits. The output of Over-charge detector or Excess charge-current detector switches to "L" level after internally fixed delay time, when charged voltage crosses the detector threshold from a low value to a high value. They have two types to release Over -charge detector. The one is called " Latch type ". The output of C OUT switches to "H" when a kind of load is connected to battery pack after a charger is disconnected from the battery pack, and the cell voltage becomes lower than over-charge detector threshold. The other is called "Auto Release type". The output of COUT switches to "H", when the cell voltage is lower than over-charge detector release threshold, or by disconnecting a charger when the battery voltage is lower than over-charge detector threshold. The output of Over -discharge detector or E xcess discharge -current detector switches to " L" level after internally fixed delay time, when discharged voltage crosses the detector threshold from a high value to a value lower than VDET2. They have two types to release Over -discharge detector. The one is called "Latch type". In the case that a charger is connected to the battery pack, and V DD level is more than over -discharge detector threshold, the output level of D OUT becomes “H” immediately. The other is called "Auto Release type". In the case that a charger is connected to the battery pack, and V DD level is more than over -discharge detector threshold, the output level of D OUT becomes “H” immediately. Without connecting a charger, if V DD pin voltage is equal or more than the released voltage from over-discharge, the output level of DOUT becomes “H”. An excess discharge -current and short circuit state can be sensed and cut off through the built in excess current detector with DOUT being enabled to low level. Once after detecting excess discharge- current or short circuit is released and DOUT level switches to high by detaching a load system from a battery pack. After detecting over-discharge, supply current will be kept extremely low by halting internal circuits' operation. When the output of C OUT is "H", if V - pin level is set at V SS−2V or lower, the delay time of detector can be shortened. Especially, the delay time of over -charge detector can be reduced into approximately 1/ 60. Therefore, testing time of protector circuit board can be reduced. Output type of C OUT and DOUT are CMOS. The R5487L/R5497L Series have DFN1414-6B and DFN1814-6B.

NO.EA-357-250917

FEATURES

Manufactured with High Voltage Tolerant Process Low Supply Current Max. 0.5 µA (Over-discharge Auto-release type) High Accuracy Detector Threshold ±10% (0.050 V ≤ VDET31 < 0.100 V) ±5 mV (VDET31 < 0.050 V) ±5 mV (VDET4 > −0.05 V) Variety of Detector Threshold Internal Fi xed Output D elay Time

  • Excess discharge-current detector Output Delay .. 12 ms Output Delay Time Shortening Function At COUT is "H", if V- level is set at typically –2V, the Output Delay time of all items except short-circuit can be reduced (Delay Time for over-charge becomes about 1/60 of normal state). Selectable Functions Ultra Small Package
  • The R5487L/R5497L Series have DFN1414-6B and DFN1814-6B. (1) Load Resistance Threshold for release from Over-Discharge Current Status (Ta = 25°C) Type 1: more than 300 kΩ Type 2: more than 25 kΩ

NO.EA-357-250917

APPLICATIONS

  • Li+ / Li Polymer protector of over-charge, over-discharge, excess-current for battery pack.
  • High precision protectors for smart-phones and any other gadgets using on board Li+ / Li Polymer battery SELECTION GUIDE The voltage code, on, and package for the ICs can be selected by the user’s request. Product Name Package Quantity per Reel Pb Free Halogen Free R5487Lyxx $∗-TR DFN1414-6B ⇒ wiring A 5,000 pcs Yes Yes R5497Lyxx $∗-TR DFN1414-6B ⇒ wiring B 5,000 pcs Yes Yes R5487Lyxx $∗-TR DFN1814-6B 5,000 pcs Yes Yes yxx: Set Voltage Code. Refer to Product Code List. In the case of DFN1414-6B, y: 5 to 8, In the case of DFN1814-6B, y: 1 to 4 Delay Time Code Code tVDET1 (s) tVDET2 (ms) tVDET3 (ms) tVDET4 (ms) tSHORT (µs) K 1 20 12 8 250 S 1 20 128 17 250 Function Code Code Over-Charge Over-Discharge Excess-discharge-current (1) 0V Charge D Auto-Release Auto-Release Auto-Release Type 1 OK F Auto-Release Auto-Release Auto-Release Type 1 NG M Auto-Release Auto-Release Auto-Release Type 2 OK P Auto-Release Auto-Release Auto-Release Type 2 NG Q Latch Latch Auto-Release Type 2 OK (1) Load Resistance Threshold for release from Over-Discharge Current Status (Ta = 25°C) Type 1: more than 300 kΩ Type 2: more than 25 kΩ

NO.EA-357-250917 Product Code Table Code Set Voltage Delay Time 0-V Charge VDET1 VREL1 VDET2 VREL2 VDET3 VDET4 VSHORT tVDET1 tVDET2 tVDET3 tVDET4 tSHORT [V] [V] [V] [V] [V] [V] [V] [s] [ms] [ms] [ms] [µs] R5487L : DFN1814-6B

NO.EA-357-250917 Product Code Table (Continued) Code Set Voltage Delay Time 0-V Charge VDET1 VREL1 VDET2 VREL2 VDET3 VDET4 VSHORT tVDET1 tVDET2 tVDET3 tVDET4 tSHORT [V] [V] [V] [V] [V] [V] [V] [s] [ms] [ms] [ms] [µs] R5487L : DFN1414-6B R5497L : DFN1414-6B Please contact our sales representatives if required a product code other than the above combinations.

NO.EA-357-250917 BLOCK DIAGRAMS

  • R5487L/R5497Lxxx$D, R5487L/R5497Lxxx$F, R5487L/R5497Lxxx$P, R5487L/R5497Lxxx$M VSS VDD Oscillator Counter Logic Circuit Delay Logic Circuit DOUT COUT Short Detector Level Shift DS Circuit VD1 VD2 VD4 VD3 Delay
  • R5487L/R5497Lxxx$Q, R5487L/R5497Lxxx$L VSS VDD Oscillator Delay Counter Logic Circuit Delay Logic Circuit DOUT COUT Short Detector Level Shift VD1 VD2 VD4 VD3 DS Circuit

NO.EA-357-250917 PIN DESCRIPTIONS DFN1814-6B DFN1414-6B ⇒wiring A DFN1414-6B ⇒wiring B R5487Lyxxxx (y:1 to 4) R5487Lyxxxx (y:5 to 8) R5497Lyxxxx (y:5 to 8) R5487L/R5497L Pin Configurations Pin No. Symbol Description R5487L R5497L DFN1814-6B DFN1414-6B (⇒ wiring A) DFN1414-6B ( ⇒ wiring B) 6 6 1 V- Pin for charger negative input 5 5 5 VDD Power supply pin, the substrate voltage level of the IC 2 1 2 COUT Output of over-charge detection, CMOS output 3 3 3 DOUT Output of over-discharge detection, CMOS output 1 2 6 NC No Connection pin 4 4 4 VSS V SS pin. Ground pin for the IC

NO.EA-357-250917 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Rating Unit VDD Input Voltage −0.3 to 12.0 V V- V- pin Input Voltage VDD−30 to VDD+0.3 V VCOUT C OUT pin Output Voltage VDD−30 to VDD+0.3 V VDOUT D OUT pin Output Voltage Vss-0.3 to VDD+0.3 V PD Power Dissipation (DFN1414-6B) 150 mW Power Dissipation (DFN1814-6B) 150 Tj Junction Temperature Range −40 to 125 °C Tstg Storage Temperature Range −55 to 125 °C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Symbol Parameter Rating Unit VDD1 Operating Voltage 1.5 to 5.0 V Ta Operating Temperature Range −40 to 85 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions . The semiconductor devices cannot operate normally over the recommended operating conditions , even if they are used over such ratings by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions.

NO.EA-357-250917

ELECTRICAL CHARACTERISTICS

R5487LxxxKD Electrical Characteristics Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VST Minimum Operating Voltage for 0V Charging Voltage Defined as VDD-V-, VDD-VSS = 0V 1.8 V A VDET1 Over-charge Threshold Voltage R1=330Ω VDET1 −0.020 VDET1 VDET1 +0.020 V B R1 = 330Ω, VDET1 −0.025 VDET1 +0.025 V VREL1 Released voltage from Over-charge R1 = 330Ω VREL1 −0.05 VREL1 VREL1 +0.05 V B tVDET1 Output Delay of tVREL1 Release Delay for VD1 VDD = 4.65V → 3.6V 11 16 21 ms C VDET2 Over-discharge Threshold Detect falling edge of supply voltage VDET2 −0.035 VDET2 VDET2 +0.035 V D VREL2 Released Voltage from Over-discharge Detect rising edge of supply voltage VREL2 ×0.975 VREL2 VREL2 ×1.025 V M tVDET2 Output Delay of Over-discharge VDET2 ≥ 2.1V, VDD = 3.6V → 2.0V 14 20 26 ms D VDET2 < 2.1V, VDD = 3.6V → 1.9V 14 20 26 ms tVREL2 Release Delay for VD2 VDET2 ≥ 2.1V, E VDET2 < 2.1V, VDET3 Excess discharge-current threshold Detect rising edge of 'V-' pin voltage, VDD = 3.1V V DET3 ≤ 0.05V VDET3 −0.005 VDET3 VDET3 +0.005 V F 0.05V < VDET3 < 0.1V VDET3 ×0.9 VDET3 ×1.1 V VDET3 ≥ 0.1V VDET3 −0.010 VDET3 +0.010 V tVDET3 Output delay of excess discharge-current VDD = 3.1V, V- = 0V → [VSHORT×0.77-0.01V ] 8 12 16 ms F tVREL3 Output delay of release from excess discharge- current VSHORT Short Protection Voltage V DD = 3.1V VSHORT ×0.75 VSHORT VSHORT ×1.25 V F tSHORT Delay Time for Short Protection V DD = 3.1V, V- = 0V → 0.5V 180 250 425 µs F RSHORT Reset Resistance for Excess Current Protection V DD = 3.6V,V- = 1.0V 14 20.5 27 kΩ F (1) Refer to TEST CIRCUITS for details. (2) Considering of variation in process parameters, we compensate for this characteristic related to temperature by laser- trim, however, this specification is guaranteed by design, not mass production tested.

NO.EA-357-250917 R5487LxxxKD Electrical Characteristics (Continued) Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VDET4 Excess charge-current Threshold Detect falling edge of 'V-' pin voltage, VDD = 3.1V VDET4 > -0.05V VDET4 −0.005 VDET4 VDET4 +0.005 V G VDET4 ≤ -0.05V VDET4 ×1.1 VDET4 ×0.9 V tVDET4 Output delay of excess charge-current V DD = 3.1V, V- = 0V → -1V 5 8 11 ms G tVREL4 Output delay of release from excess charge- current V DD = 3.1V, V- = -1V → 0V 0.7 1 .2 1.7 ms G VDS Delay Time Shortening Mode Voltage VDD = 3.6V -2.6 - 2.0 - 1.4 V G VOL1 Nch ON-Voltage of COUT Iol = 50µA, VDD = 4.8V 0.4 0.5 V H VOH1 Pch ON-Voltage of COUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V I VOL2 Nch ON-Voltage of DOUT VDET2 ≥ 2.1V, Iol = 50µA, VDD = 2.0V 0.2 0.5 V J VDET2 < 2.1V, Iol = 50µA, VDD = 1.9V 0.2 0.5 V VOH2 Pch ON-Voltage of DOUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V K IDD Supply Current VDD = 3.9V, V- = 0V 3.0 6.0 µA L (1) Refer to TEST CIRCUITS for details.

NO.EA-357-250917 R5487LxxxKM Electrical Characteristics Unless otherwise provided, Ta=25°C Symbol Parameter Conditions Min. T yp. M ax. Unit Circuit (1) VST Minimum Operating Voltage for 0V Charging Voltage Defined as VDD-V-, VDD-Vss = 0V 1.8 V A VDET1 Over-charge Threshold Voltage R1 = 330Ω VDET1 −0.020 VDET1 VDET1 +0.020 V B R1 = 330Ω, VDET1 −0.025 VDET1 +0.025 VREL1 Released voltage from Over-charge R1 = 330Ω VREL1 −0.05 VREL1 VREL +0.05 V B tVDET1 Output Delay of tVREL1 Release Delay for VD1 VDD = 4.65V → 3.6V 11 16 21 ms C VDET2 Over-discharge Threshold Detect falling edge of supply voltage VDET2 −0.035 VDET2 VDET2 +0.035 V D VREL2 Released Voltage from Over-discharge Detect rising edge of supply voltage VREL2 ×0.975 VREL2 VREL2 ×1.025 V M tVDET2 Output Delay of Over-discharge VDET2 ≥ 2.1V, VDD = 3.6V → 2.0V 14 20 26 ms D VDET2 < 2.1V, VDD = 3.6V → 1.9V 14 20 26 ms tVREL2 Release Delay for VD2 VDET2 ≥ 2.1V, VDET2 < 2.1V, VDET3 Excess discharge- current threshold Detect rising edge of 'V-' pin voltage, VDD = 3.1V VDET3 ≤ 0.05V VDET3 −0.005 VDET3 VDET3 +0.005 V F 0.05V < VDET3 < 0.1V VDET3 ×0.9 VDET3 ×1.1 V VDET3 ≥ 0.1V VDET3 −0.010 VDET3 +0.010 V VREL3 Released Voltage from Excess discharge- current Detect falling edge of 'V-' pin V oltage, VDD = 3.1V 1.82 1.935 2.05 V F tVDET3 Output delay of excess discharge-current VDD = 3.1V, V- = 0V → [VSHORT×0.77-0.01V ] 8 12 16 ms F tVREL3 Output delay of release f rom excess discharge- current VSHORT Short Protection Voltage V DD = 3.1V VSHORT ×0.75 VSHORT VSHORT ×1.25 V F tSHORT Delay Time for Short Protection V DD = 3.1V, V- = 0V → 0.5V 180 250 425 µs F (1) Refer to TEST CIRCUITS for details. (2) Considering of variation in process parameters, we compensate for this characteristic related to temperature by laser- trim, however, this specification is guaranteed by design, not mass production tested.

NO.EA-357-250917 R5487LxxxKM Electrical Characteristics (Continued) Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) RSHORT Reset Resistance for Excess Current Protection V DD = 3.6V,V- = 1.0V 18 22 26 k Ω F VDET4 Excess charge-current Threshold Detect falling edge of 'V-' pin voltage, VDD = 3.1V VDET4 > -0.05V VDET4 −0.005 VDET4 VDET4 +0.005 V G VDET4 ≤ -0.05V VDET4 ×1.1 VDET4 ×0.9 V tVDET4 Output delay of excess charge-current V DD = 3.1V, V- = 0V → -1V 5 8 11 ms G tVREL4 Output delay of release from excess charge- current V DD = 3.1V, V- = -1V → 0V 0.7 1 .2 1.7 ms G VDS Delay Time Shortening Mode Voltage VDD = 3.6V -2.6 - 2.0 - 1.4 V G VOL1 Nch ON-Voltage of COUT Iol = 50µA, VDD = 4.8V 0.4 0.5 V H VOH1 Pch ON-Voltage of COUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V I VOL2 Nch ON-Voltage of DOUT VDET2 ≥ 2.1V, Iol = 50µA, VDD = 2.0V 0.2 0.5 V J VDET2 < 2.1V, Iol=50µA, VDD=1.9V 0.2 0.5 V VOH2 Pch ON-Voltage of DOUT Ioh=-50µA, VDD = 3.9V 3.4 3.7 V K IDD Supply Current VDD = 3.9V, V- = 0V 3.0 6.0 µA L (1) Refer to TEST CIRCUITS for details.

NO.EA-357-250917 R5497LxxxKF Electrical Characteristics Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VNOCHG Maximum Operating Voltage for Inhibition of Charger Voltage Defined as VDD -Vss, VDD -V- = 4V 0.8 1.2 1.6 V A VDET1 Over-charge Threshold Voltage R1 = 330Ω VDET1 −0.020 VDET1 VDET1 +0.020 V B -20°C ≤ Ta ≤ 60°C(2) VDET1 −0.025 VDET1 +0.025 VREL1 Released voltage from Over-charge R1 = 330Ω VREL1 −0.05 VREL1 VREL1 +0.05 V B tVDET1 Output Delay of tVREL1 Release Delay for VD1 VDD = 4.65V → 3.6V 11 16 21 ms C VDET2 Over-discharge Threshold Detect falling edge of supply voltage VDET2 −0.035 VDET2 VDET2 +0.035 V D VREL2 Released Voltage from Over-discharge Detect rising edge of supply voltage VREL2 ×0.975 VREL2 VREL2 ×1.025 V M tVDET2 Output Delay of Over-discharge VDET2 ≥ 2.1V, VDD = 3.6V → 2.0V 14 20 26 ms D VDET2 < 2.1V, VDD = 3.6V → 1.9V 14 20 26 ms tVREL2 Release Delay for VD2 VDET2 ≥ 2.1V, E VDET2 < 2.1V, VDET3 Excess discharge- current threshold Detect rising edge of 'V-' pin voltage. VDD = 3.1V VDET3 ≤ 0.05V VDET3 −0.005 VDET3 VDET3 +0.005 V F 0.05V < VDET3 < 0.1V VDET3 ×0.9 VDET3 ×1.1 V VDET3 ≥ 0.1V VDET3 −0.010 VDET3 +0.010 V tVDET3 Output delay of excess discharge-current VDD = 3.1V, V- = 0V → [VSHORT × 0.77-0.01V ] 8 12 16 ms F tVREL3 Output delay of release from excess discharge- current VSHORT Short Protection Voltage V DD = 3.1V VSHORT ×0.75 VSHORT VSHORT ×1.25 V F tSHORT Delay Time for Short Protection VDD = 3.1V, V- = 0V → 0.5V 180 250 425 µs F RSHORT Reset Resistance for Excess Current Protection V DD = 3.6V, V- = 1.0V 14 20.5 27 k Ω F (1) Refer to TEST CIRCUITS for details. (2) Considering of variation in process parameters, we compensate for this characteristic related to temperature by laser- trim, however, this specification is guaranteed by design, not mass production tested.

NO.EA-357-250917 R5497LxxxKF Electrical Characteristics (Continued) Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VDET4 Excess charge-current Threshold Detect falling edge of 'V-' pin voltage, V DD = 3.1V VDET4 > -0.05V VDET4 −0.005 VDET4 VDET4 +0.005 V G VDET4 ≤ -0.05V VDET4 ×1.1 VDET4 ×0.9 V tVDET4 Output delay of excess charge-current V DD = 3.1V, V- = 0V → -1V 5 8 11 ms G tVREL4 Output delay of release from excess charge- current V DD = 3.1V, V- = -1V → 0V 0.7 1 .2 1.7 ms G VDS Delay Time Shortening Mode Voltage VDD = 3.6V -2.6 - 2.0 - 1.4 V G VOL1 Nch ON-Voltage of COUT Iol = 50µA, VDD = 4.8V 0.4 0.5 V H VOH1 Pch ON-Voltage of COUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V I VOL2 Nch ON-Voltage of DOUT VDET2 ≥ 2.1V Iol = 50µA, VDD = 2.0V 0.2 0.5 V J VDET2 < 2.1V Iol = 50µA, VDD = 1.9V 0.2 0.5 V VOH2 Pch ON-Voltage of DOUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V K IDD Supply Current VDD = 3.9V, V- = 0V 3.0 6.0 µA L (1) Refer to TEST CIRCUITS for details.

NO.EA-357-250917 R5487LxxxKP Electrical Characteristics Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VNOCHG Maximum Operating Voltage for Inhibition of Charger Voltage Defined as V DD -VSS, VDD -V- = 4V 0.8 1.2 1.6 V A VDET1 Over-charge Threshold Voltage R1 = 330Ω VDET1 −0.020 VDET1 VDET1 +0.020 V B -20°C ≤ Ta ≤ 60°C(2) VDET1 −0.025 VDET1 +0.025 VREL1 Released voltage from Over-charge R1 = 330Ω VREL1 −0.05 VREL1 VREL1 +0.05 V B tVDET1 Output Delay of tVREL1 Release Delay for VD1 VDD = 4.65V → 3.6V 11 16 21 ms C VDET2 Over-discharge Threshold Detect falling edge of supply voltage VDET2 −0.035 VDET2 VDET2 +0.035 V D VREL2 Released Voltage from Over-discharge Detect rising edge of supply voltage VREL2 ×0.975 VREL2 VREL2 ×1.025 V M tVDET2 Output Delay of Over-discharge VDET2 ≥ 2.1V, VDD = 3.6V → 2.0V 14 20 26 ms D VDET2 < 2.1V, VDD = 3.6V → 1.9V 14 20 26 ms tVREL2 Release Delay for VD2 VDET2 ≥ 2.1V, E VDET2 < 2.1V, VDET3 Excess discharge-current threshold Detect rising edge of 'V-' pin voltage, V DD = 3.1V VDET3 ≤ 0.05V VDET3 −0.005 VDET3 VDET3 +0.005 V F 0.05V < VDET3 < 0.1V VDET3 ×0.9 VDET3 ×1.1 V VDET3 ≥ 0.1V VDET3 −0.010 VDET3 +0.010 V VREL3 Released Voltage from Excess discharge-current Detect falling edge of 'V-' pin voltage, VDD = 3.1V 1.82 1.935 2.05 V F tVDET3 Output delay of excess discharge-current VDD = 3.1V, V- = 0V → [VSHORT×0.77-0.01V] 8 12 16 ms F tVREL3 Output delay of release from excess discharge- current VSHORT Short Protection Voltage V DD = 3.1V VSHORT ×0.75 VSHORT VSHORT ×1.25 V F tSHORT Delay Time for Short Protection V DD = 3.1V, V- = 0V → 0.5V 180 250 425 µs F RSHORT Reset Resistance for Excess Current Protection V DD = 3.6V, V- = 1.0V 18 22 26 kΩ F (1) Refer to TEST CIRCUITS for details. (2) Considering of variation in process parameters, we compensate for this characteristic related to temperature by laser- trim, however, this specification is guaranteed by design, not mass production tested.

NO.EA-357-250917 R5487LxxxKP Electrical Characteristics (Continued) Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VDET4 Excess charge-current Threshold Detect falling edge of 'V-' pin voltage, VDD = 3.1V VDET4 > -0.05V VDET4 −0.005 VDET4 VDET4 +0.005 V G VDET4 ≤ -0.05V VDET4 ×1.1 VDET4 ×0.9 V tVDET4 Output delay of excess charge-current V DD = 3.1V, V- = 0V → -1V 5 8 11 ms G tVREL4 Output delay of release from excess charge- current V DD = 3.1V, V- = -1V → 0V 0.7 1 .2 1.7 ms G VDS Delay Time Shortening Mode Voltage VDD = 3.6V -2.6 - 2.0 - 1.4 V G VOL1 Nch ON-Voltage of COUT Iol = 50µA, VDD = 4.8V 0.4 0.5 V H VOH1 Pch ON-Voltage of COUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V I VOL2 Nch ON-Voltage of DOUT VDET2 ≥ 2.1V, Iol = 50µA, VDD = 2.0V 0.2 0.5 V J VDET2 < 2.1V, Iol = 50µA, VDD = 1.9V 0.2 0.5 V VOH2 Pch ON-Voltage of DOUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V K IDD Supply Current VDD = 3.9V, V- = 0V 3.0 6.0 µA L (1) Refer to TEST CIRCUITS for details.

NO.EA-357-250917 R5487LxxxKQ Electrical Characteristics Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VST Minimum Operating Voltage for 0V Charging Voltage Defined as VDD -V-, VDD -VSS = 0V 1.8 V A VDET1 Over-charge Threshold Voltage R1 = 330Ω VDET1 −0.020 VDET1 VDET1 +0.020 V B -20°C ≤ Ta ≤ 60°C(2) VDET1 −0.025 VDET1 +0.025 tVDET1 Output Delay of tVREL1 Release Delay for VD1 VDD = 4.0V, V- = 0V → 0.2V 11 16 21 ms C VDET2 Over-discharge Threshold Detect falling edge of supply voltage VDET2 −0.035 VDET2 VDET2 +0.035 V D tVDET2 Output Delay of Over-discharge VDET2 ≥ 2.1V, VDD = 3.6V → 2.0V 14 20 26 ms D VDET2 < 2.1V, VDD = 3.6V → 1.9V 14 20 26 ms tVREL2 Release Delay for VD2 VDET2 ≥ 2.1V, E VDET2 < 2.1V, VDET3 Excess discharge-current threshold Detect rising edge of 'V-' pin voltage, V DD = 3.1V VDET3 ≤ 0.05V VDET3 −0.005 VDET3 VDET3 +0.005 V F 0.05V < VDET3 < 0.1V VDET3 ×0.9 VDET3 ×1.1 V VDET3 ≥ 0.1V VDET3 −0.010 VDET3 +0.010 V VREL3 Released Voltage from Excess discharge-current Detect falling edge of 'V-' pin voltage, VDD = 3.1V 1.82 1.935 2.05 V F tVDET3 Output delay of excess discharge-current VDD = 3.1V, V- = 0V → [VSHORT × 0.77-0.01V ] 8 12 16 ms F tVREL3 Output delay of release from excess discharge- current VSHORT Short Protection Voltage V DD = 3.1V VSHORT ×0.75 VSHORT VSHORT ×1.25 V F tSHORT Delay Time for Short Protection V DD = 3.1V, V- = 0V → 0.5V 180 250 425 µs F RSHORT Reset Resistance for Excess Current Protection V DD = 3.6V, V- = 1.0V 18 22 26 kΩ F (1) Refer to TEST CIRCUITS for details. (2) Considering of variation in process parameters, we compensate for this characteristic related to temperature by laser- trim, however, this specification is guaranteed by design, not mass production tested.

NO.EA-357-250917 R5487LxxxKQ Electrical Characteristics (Continued) Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VDET4 Excess charge-current Threshold Detect falling edge of 'V-' pin voltage, VDD = 3.1V VDET4 > -0.05V VDET4 −0.005 VDET4 VDET4 +0.005 V G VDET4 ≤ -0.05V VDET4 ×1.1 VDET4 ×0.9 V tVDET4 Output delay of excess charge-current VDD = 3.1V, V- = 0V → -1V 5 8 11 ms G tVREL4 Output delay of release from excess charge- current V DD = 3.1V, V- = -1V → 0V 0.7 1 .2 1.7 ms G VDS Delay Time Shortening Mode Voltage VDD = 3.6V -2.6 - 2.0 - 1.4 V G VOL1 Nch ON-Voltage of COUT Iol = 50µA, VDD = 4.8V 0.4 0.5 V H VOH1 Pch ON-Voltage of COUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V I VOL2 Nch ON-Voltage of DOUT VDET2 ≥ 2.1V, Iol = 50µA, VDD = 2.0V 0.2 0.5 V J VDET2 < 2.1V, Iol = 50µA, VDD = 1.9V 0.2 0.5 V VOH2 Pch ON-Voltage of DOUT Ioh = -50µA, VDD = 3.9V 3.4 3.7 V K IDD Supply Current VDD = 3.9V, V- = 0V 3.0 6.0 µA L (1) Refer to TEST CIRCUITS for details.

NO.EA-357-250917 R5487LxxxSD Electrical Characteristics Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VST Minimum Operating Voltage for 0V Charging Voltage Defined as VDD-V-, VDD-VSS = 0V 1.8 V A VDET1 Over-charge Threshold Voltage R1 = 330Ω VDET1 −0.020 VDET1 VDET1 +0.020 V B R1 = 330Ω, VDET1 −0.025 VDET1 +0.025 VREL1 Released voltage from Over-charge R1 = 330Ω VREL1 −0.05 VREL1 VREL1 +0.05 V B tVDET1 Output Delay of tVREL1 Release Delay for VD1 VDD = 4.65 V → 3.6 V 11 16 21 ms C VDET2 Over-discharge Threshold Detect falling edge of supply voltage VDET2 −0.035 VDET2 VDET2 +0.035 V D VREL2 Released Voltage from Over-discharge Detect rising edge of supply voltage VREL2 ×0.975 VREL2 VREL2 ×1.025 V M tVDET2 Output Delay of Over- discharge VDET2 ≥ 2.1V, VDD = 3.6 V → 2.0 V 14 20 26 ms D VDET2 < 2.1V, V DD = 3.6 V → 1.9 V 14 20 26 ms tVREL2 Release Delay for VD2 VDET2 ≥ 2.1V, E VDET2 < 2.1V, VDET3 Excess discharge-current threshold Detect rising edge of 'V-' pin voltage, V DD = 3.1V VDET3 ≤ 0.05 V VDET3 −0.005 VDET3 VDET3 +0.005 V F 0.05 V < VDET3 < 0.1 V VDET3 ×0.9 VDET3 ×1.1 V VDET3 ≥ 0.1 V VDET3 −0.010 VDET3 +0.010 V tVDET3 Output delay of excess discharge-current VDD = 3.1V, V- = 0 V → [VSHORT × 0.77-0.01V ] 85 128 171 ms F tVREL3 Output delay of release from excess discharge- current VSHORT Short Protection Voltage V DD = 3.1 V VSHORT ×0.75 VSHORT VSHORT ×1.25 V F tSHORT Delay Time for Short Protection V DD = 3.1 V, V- = 0V → 0.5V 180 250 425 µs F RSHORT Reset Resistance for Excess Current Protection V DD = 3.6V, V- = 1.0V 14 20.5 27 k Ω F (1) Refer to TEST CIRCUITS for details. (2) Considering of variation in process parameters, we compensate for this characteristic related to temperature by laser- trim, however, this specification is guaranteed by design, not mass production tested.

NO.EA-357-250917 R5487LxxxSD Electrical Characteristics (Continued) Unless otherwise provided, Ta=25°C Symbol Parameter Conditions M in. T yp. M ax. Unit Circuit (1) VDET4 Excess charge-current Threshold Detect falling edge of 'V-' pin voltage, VDD = 3.1V VDET4 > -0.05V VDET4 −0.005 VDET4 VDET4 +0.005 V G VDET4 ≤ -0.05V VDET4 ×1.1 VDET4 ×0.9 V tVDET4 Output delay of excess charge-current V DD = 3.1 V, V- = 0V → -1V 12 17 22 ms G tVREL4 Output delay of release from excess charge- current V DD = 3.1 V, V- = -1V → 0V 0.7 1 .2 1.7 ms G VDS Delay Time Shortening Mode Voltage VDD = 3.6 V -2.6 - 2.0 - 1.4 V G VOL1 Nch ON-Voltage of COUT Iol = 50µA, VDD = 4.8 V 0.4 0.5 V H VOH1 Pch ON-Voltage of COUT Ioh = -50µA, VDD = 3.9 V 3.4 3.7 V I VOL2 Nch ON-Voltage of DOUT VDET2 ≥ 2.1V, Iol = 50µA, VDD = 2.0 V 0.2 0.5 V J VDET2 < 2.1V, Iol = 50µA, VDD = 1.9 V 0.2 0.5 V VOH2 Pch ON-Voltage of DOUT Ioh = -50µA, VDD = 3.9 V 3.4 3.7 V K IDD Supply Current VDD = 3.9 V, V- = 0 V 3.0 6.0 µA L (1) Refer to TEST CIRCUITS for details.

NO.EA-357-250917 Test Circuits B V VDD VSS COUT D V VDD VSS DOUT G V VDD VSS COUT I V A VDD VSS COUT A OSCILLOSCOPE VDD DOUT COUT VSS V V C VDD VSS COUT E VDD VSS DOUT F V A VDD VSS DOUT H V A VDD VSS COUT J V A VDD VSS DOUT

NO.EA-357-250917 K V A VDD VSS DOUT L A VDD VSS M V VDD VSS DOUT

NO.EA-357-250917 THEORY OF OPERATION VD1 / Over-Charge Detector The VD1 monitors VDD pin voltage while charge the battery pack. When the V DD voltage crosses over-charge detector threshold VDET1 from a low value to a value higher than the VDET1, the VD1 can detect over-charge and an external charge control Nch MOSFET turn off with COUT pin being at “L” level. In terms of “Latch type” version, to reset the VD1 making the C OUT pin level to “H” again after detecting over- charge, in such conditions that a time when the VDD voltage is down to a level lower than over-charge voltage, by disconnecting a charger from the battery pack. Output voltage of C OUT pin becomes “H”, and it makes an external Nch MOSFET turn on, and charge cycle is available. Depending on the external characteristics of external components such as FETs, just by disconnecting a charger, over-charge state may not be released. In such a case, by connecting some load, the over-charge state is released. In other words, once over-charge is detected, even if the supply voltage becomes low enough, if a charger is continuously connected to the battery pack, recharge is not possible. Therefore, this over-charge detector has no hysteresis. To judge whether or not load is connected, the built -in excess-discharge current detector is used. In other words, by connecting some load, V- pin voltage becomes equal or more than excess- discharge current detector threshold and reset the over-charge detecting state. In terms of “Auto Release type” version, after detecting over -charge, if VDD pin voltage is equal or lower than the released voltage from over -charge, even if a charger is connected, over -charge detector is released. Further, in case that V DD pin level is lower than the over -charge detector threshold, if a charger is removed, over-charge detector is also released. Depending on the characteristics of external components such as FETs, just by disconnecting a charger, over -charge detector may not be released, and in this case, by connecting some load, the over-charge state is released. After detecting over -charge with the V DD voltage of higher than V DET1, connecting system load to the battery pack makes load current allowable through parasitic diode of external charge control FET. The COUT level would be “H” when the VDD level is down to a level below the V DET1 by continuous drawing of load current. Internal fixed output delay times for over-charge detection and release from over-charge exist. Even when the VDD pin level becomes equal or higher level than V DET1 if the VDD voltage would be back to a level lower than the VDET1 within a time period of the output delay time, VD1 would not output a signal for turning off the charge control FET. Besides, after detecting over-charge, while the VDD is lower than over -charge detector, even if a charger is removed and a load is connected, if the voltage is recovered within output delay time of release from over-charge, over-charge state is not released. A level shifter incorporated in a buffer driver for the COUT pin makes the “L” level of COUT pin to the V- pin voltage and the “H” level of COUT pin is set to VDD voltage with CMOS buffer. VD2 / Over-Discharge Detector The VD2 is monitoring a VDD pin voltage. When the VDD voltage crosses the over-discharge detector threshold VDET2 from a high value to a value lower than the VDET2, the VD2 can detect an over-discharge and the external discharge control Nch MOSFET turns off with the DOUT pin being at “L” level. In terms of “Latch type” version, to reset the VD2 with the D OUT pin level being “H” again after detecting over discharge, it is necessary to connect a charger to the battery pack. When the V DD voltage stays under over - discharge detector threshold V DET2, charge-current can flow through parasitic diode of an external discharge control MOSFET, then after the VDD voltage comes up to a value larger than VDET2, then, DOUT becomes “H” and discharging process would be able to advance through ON state MOSFET for discharge control.

NO.EA-357-250917 Connecting a charger to the battery pack makes the DOUT level being “H” instantaneously when the VDD voltage is higher than VDET2. In terms of “Auto Release type” version, released operation by connecting a charger is same as the other latch type. However, without a charger, if V DD pin voltage is equal or more than the released voltage from over - discharge, DOUT pin becomes “H” immediately. When a cell voltage equals to zero, “acceptable type” version: if the voltage of a charger is equal or more than 0V-charge minimum voltage limit (Vst), COUT pin becomes “H” and a system is allowable to charge. “Unacceptable type” version: if VDD voltage is less than charger inhibit maximum voltage (V nochg), even if a charger is connected, COUT level will be fixed at “L”, and charge current will be cut off. An output delay time for over -discharge detection is fixed internally. When the V DD level is down to equal or lower level than VDET2 if the VDD voltage would be back to a level higher than the V DET2 within a time period of the output delay time, VD2 would not output a signal for turning off the discharge control FET. Output delay time for release from over-discharge is also set. After detecting over -discharge by VD2, “ Latch type” version: supply current would be reduced and be into standby by halting unnecessary circuits and consumption current of IC itself is made as small as possible . (Max. 0.1µA at VDD=2.0V) “Auto Release type” version: supply current would be reduced and be into standby by halting circuits except the over-discharge released by voltage function. (Max. 0.5µA at VDD=2.0V) The output type of DOUT pin is CMOS having “H” level of VDD and “L” level of VSS. VD3 /Excess discharge-current Detector, Short Circuit Protector Both excess current detector and short circuit protection can work when both of control FETs are in “ON” state. When the V- pin voltage is up to a value between the short protection voltage V short and excess discharge- current threshold VDET3, VD3 operates and further soaring of V- pin voltage higher than Vshort makes the short circuit protector enabled. This leads the external discharge control Nch MOSFET turns off with the D OUT pin being at “L” level. An output delay time for the excess discharge- current detector is internally fixed. A quick recovery of V- pin level from a value between Vshort and VDET3 within the delay time keeps the discharge control FET staying “H” state. Output delay time for Release from excess discharge-current detection is also set. When the short circuit protector is enabled, the D OUT would be “L” and the delay time to release (Typ. 1.2ms) is also set. The V- pin has a built-in pull-down resistor (Rshort) to the VSS pin, that is, the resistance to release from excess- discharge current. After an excess discharge-current or short circuit protection is detected, removing a cause of excess discharge- current or external short circuit makes an external discharge control FET to an “ ON” state automatically with the V- pin level being down to the V SS level through built-in pulled down resistor. The reset resistor of excess discharge-current is off at normal state. Only when detecting excess discharge- current or short circuit, the resistor is on. Output delay time of excess discharge- current is set shorter than the delay time for over -discharge detector. Therefore, if V DD voltage would be lower than V DET2 at the same time as the excess discharge- current is detected, the R5487 are at excess discharge- current detection mode. By disconnecting a load, VD3 is automatically released from excess discharge-current.

NO.EA-357-250917 VD4 /Excess charge-current detector When the battery pack is chargeable and discharge is also possible, VD4 senses V- pin voltage. For example, in case that a battery pack is charged by an inappropriate charger, an excess current flows, then the voltage of V- pin becomes equal or less than excess charge- current detector threshold. Then, the output of C OUT becomes “L”, and prevents from flowing excess current in the circuit by turning off the external Nch MOSFET. Output delay of excess charge current is internally fixed. Even the voltage level of V- pin becomes equal or lower than the excess charge-current detector threshold, the voltage is higher than the VD4 threshold within the delay time, and the excess charge current is not detected. Output delay for the release from excess charge current (Typ. 1.2ms) is also set. VD4 can be released with disconnecting a charger and connecting a load. DS (Delay Shorten) function Output delay time of over-charge and over-discharge can be shorter than those setting value by forcing equal or less than the delay shortening mode voltage (Typ. −2.0V) to V- pin.

NO.EA-357-250917 TIMING CHART 1) Timing diagram of over-charge (Latch type) voltage and over-charge current VDD COUT Charge Current VDD VSS VDD VDET3 VDET4 Connect Load Excess Charge Current VDET1 t Connect Charger Connect Load Charge/ Discharge Current Discharge Current Disconnect Charger and Connect Load tVREL1 tVREL4 Connect Charger tVDET1 tVDET1 tVDET4 tVREL1 t t t

NO.EA-357-250917 2) Over-charge (Released by voltage Type) voltage, Excess charge current Operation VDD COUT Charge Current Discharge Current VDD VSS VDET3 Connect Charger Disconnect Charger Connect Load Connect Charger VDET1 t t t t Charge/ Discharge Current Excess Charge Current VDET4 VDD Charger OPEN Connect Load tVREL1 tVREL4 VREL1 tVREL1 tVDET1 tVDET1 tVDET4

NO.EA-357-250917 3) Over-discharge (Latch Type), Excess discharge current, Short circuit Excess Discharge Current Short VDD DOUT Charge Current VDD VSS VDD VSS VDET３ Vshort Connect Load Connect Charger VDET2 tVDET2 t t t t Open VDET4 tVREL2 tVREL2 tVREL3 tVREL3 Connect Load Open Discharge Current Charge / Discharge Current Connect Charger tshort tVDET2 tVDET3

NO.EA-357-250917 4) Over-discharge (Released by Voltage Type), Excess discharge current (Auto-Release Type 1), Short circuit VDD DOUT Charge Current Discharge Current VDD VSS VSS VDET3 Connect Load Connect Charger VDET2 t t t t Charge/ Discharge Current Excess Discharge Current VDET4 VDD Open Vshort Open Short tVREL3 tVREL2 tVREL3 tVREL2 tVDET2 tVDET2 tVDET3 tshort

NO.EA-357-250917 5) Over-discharge (Released by Voltage Type), Excess discharge current (Auto Release Type 2), Short circuit Excess V DET2 V DD D OUT V DD V SS V DD V DET3 V SS V DET4 Connect Load tV REL2 tV DET2 Connect Charger Open t t Charge/ Discharge Current Charge current Discharge current t t tV DET3 tV DET2 tV REL2 Discharge Current Short Open Vshort tshort tV REL3 tV REL3 V REL2 REL3 V

NO.EA-357-250917

APPLICATION INFORMATION

Typical Application Circuit VDD COUT DOUT VSS 0.1µF 1kΩ 330Ω R5487L/R5497L R1 and C1 stabilize a supply voltage to the R5487L/R5497L. A recommended R1 value is equal or less than 1kΩ. A large value of R1 makes detection voltage shift higher because of the conduction current flowed in the R5487L/R5497L. Further, to stabilize the operation of the R5487L/R5497L, use the C1 with the value in the range from 0.01µF to 0.1µF. To choose the most suitable value of C1, fully evaluation is necessary. R1 and R2 can operate also as parts for current limit circuit against reverse charge or applying a charger with excess charging voltage to the R5487L, battery pack. While small value of R1 and R2 may cause over power dissipation rating of the R5487L/R5497L , therefore a total of “R1+R2” should be 1kΩ or more. Besides, if a large value of R2 is set, release from over-discharge by connecting a charger might not be possible. In the case of “R5487L/R5497Lxxx$ M”, “R5487L/R5497Lxxx$Q”, “R5487L/R5497Lxxx$P”, k”, recommended R2 value is equal or less than 1kΩ. The recommended R2 value is 1KΩ. In the case of “R5487L/R5497Lxxx$D” and “R5487L/R5497Lxxx$F”, recommended R2 value is equal or less than 10kΩ. The recommended R2 value is 10KΩ. The typical application circuit diagram is just an example. This circuit performance largely depends on the PCB layout and external components. In the actual application, fully evaluation is necessary. Over-voltage and the over current beyond the absolute maximum rating should not be forced to the protection IC and external components. If the positive terminal and the negative terminal of the battery pack are short, even though the short protection circuit is built in the IC, during the delay time until detecting the short circuit, a large current may flow through the FET. Select an FET with large enough current capacity in order to endure the large current during the delay time. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire- containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products.

NO.EA-357-250917 TECHNICAL NOTES A peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a rated power. When designing a peripheral circuit, please be fully aware of the following points.

  • Please evaluate the product at the PCB level before use, as some symptoms may remain that cannot be confirmed by the evaluation at the IC level.
  • When using any coating or underfill to improve moisture resistance or joining strength, evaluate them adequately before using. In certain materials or coating conditions, corrosion by contained constituents, current leakage by moisture absorption, crack and delamination by physical stress can happen. If the curing temperature of the coating material or underfill material exceeds the absolute maximum rating, the electrical characteristics of this product may change.
  • When performing X -ray inspection in mass production process and evaluation build stage such as the product functions and characteristics confirmation, please confirm X -ray irradiation does not exceed 1.5Gy (absorbed dose for air).

PACKAGE DIMENSIONS DFN1814-6B Ver. B i

PACKAGE DIMENSIONS DFN1414-6B Ver. B i mensions (Unit: mm)

  1. T he products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us. 3. This product and any technical information relating thereto are subject to complementary export controls (so- called KNOW controls) under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade Control Law and its related regulations with respect to the complementary export controls. 4. The technical information described in this document shows typical characteristics and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death should first contact us.
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  • Combustion equipment In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases where operation requirements such as application conditions are confirmed by our company in writing after consultation with your company. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead to deterioration, destruction or failure of the products. We shall not be responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of the products. 8. Quality Warranty 8-1. Quality Warranty Period In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement, quality assurance agreement, delivery specifications, etc., it shall be followed. 8-2. Quality Warranty Remedies When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute for the defective product or refund the purchase price of the defective product. Note that such delivery or refund is sole and exclusive remedies to your company for the defective product. 8-3. Remedies after Quality Warranty Period With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company. 9. Anti-radiation design is not implemented in the products described in this document. 10. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 11. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 12. Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with general industrial waste or household waste. 13. Please contact our sales representatives should you have any questions or comments concerning the products or the technical information. Official website https://www.nisshinbo-microdevices.co.jp/en/ Purchase information https://www.nisshinbo-microdevices.co.jp/en/buy/