R1810X NISSHINBO | Alldatasheet
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600 nA IQ Low Quiescent Current Boost DC/DC Converter for Energy Harvester No.EA-423-250303 100 1 10 100 1000 Efficiency[%] Output Current IOUT [uA] R1810x is a boost DC/DC converter for electrical power storage devices, especially dedicated for 1 cell photovoltaic energy harvester since the start-up voltage is Typ.0.35V. This product can start up with only 9uW, and applicable for charging 1 cell photovoltaic element. A system which is working under low-illuminance environment can be composed with the R1810x.
- Providing a low quiescent current (IQ_VOUT =Typ.600 nA), and high efficiency (66%@ IOUT=5 µA)
- Start up with low input energy, 9 µW (low illuminance) is possible.
- Maximum power point control function is built-in.
- Start-up voltage: Typ. 0.35V Max. 0.50V (0°C ≤ Ta ≤ 65°C), Max. 0.55V (-40°C ≤ Ta ≤ 85°C)
- Input Voltage Range: 0.2 V to 2.1 V (VSET=2.7V)
- Output Voltage Range: 2.3 V to 4.5 V
- Output Voltage Accuracy: ±5.0%
- Low current consumption: Typ.600 nA (Ta = 25°C, at no load)
- Start-up power: 9 µW (VMPSET = 0.5V / VSET = 2.6V)
- Maximum Power Point Control Voltage Setting: from 0.2V to 2.1V , in 50 mV increments
- Input Power Good Function
- Output Power Good Function L = 22 µH, CIN = 22 µF, CCP = 22 nF, CREG = 4.7 µF COUT = 4.7 µF Product name Package Quantity per Reel R1810Zxxx$-E2-T WLCSP-15-P1 5,000 pcs R1810Lxxx$-E2 DFN2735-14 5,000 pcs xxx: Select the combination Code number of the set output voltage (VSET) and the set maximum power voltage (VMPSET) ex. 001 Refer to the Product-specific Electrical Characteristics for detail information. $: Set output power good low (PGL) (Refer to selection guide.) E WLCSP-15-P1 2.88 x 1.68 x 0.4 (mm) DFN2735-14 3.5 x 2.7 x 0.6 (mm)
- Energy harvesting modules such as 1 cell photovoltaic element /thermoelectric power generation. OVERVIEW KEY SPECIFICATIONS KEY BENEFITS EFFICIENCY CURVE TYPICAL APPLICATION SELECTION GUIDE PACKAGES APPLICATION VIN=0.5V、VSET=2.6V
No.EA-423-250303 SELECTION GUIDE The set output voltage, the set maximum power point control voltage, and the output power good setting are user-selectable options. Selection Guide Product Name Package Quantity per Reel Pb Free Halogen Free R1810Zxxx$-E2-T WLCSP-15-P1 5,000 pcs Yes Yes R1810Lxxx$-E2 DFN2735-14 5,000 pcs Yes Yes xxx: Select the combination of the set output voltage (VSET) and the set maximum power point control voltage (VMPSET) by the code number. Ex. 001 Output voltage: from 2.3 V to 4.5 V in 0.1 V increments Maximum power point control voltage: from 0.2 V to 2.1 V in 0.05 V increments Refer to the Product-specific Electrical Characteristics for detail information. * Contact our sales representatives for other codes. It is recommended to set as VSET ≥ VMPSET + 1.0 V. $: Set output power good low (PGL) (1) A ; Vset x 80% B ; Vset x 70% C ; Vset x 60% D ; Vset x 50% The accuracy of the OUTPG detection voltage depends on the output set voltage. “-“; The OUTPG function cannot be used. please set the OUTPG pin to open. (1) OUTPG outputs "Low" when the output is below the threshold of PGL according to the table above. Output power good low OUTPG detection accuracy A - - - B - - - - - - - - 4.0% 4.0% Set Output Voltage Vset [V] 5.0% 5.0% 4.0% 4.0%
No.EA-423-250303 BLOCK DIAGRAM VOUT VOUT CP VIN GATE CONTROL MPPC GATE CONTROL VREG_ VFBSW VOUTUVLO REVERSE CURRENT PROTECTION VCP VREG LX LX VREG VOUT VREG VOUT VREG LX VREG VREG VREG INPG OUTPG TEST1 TEST2 TEST3 AGND PGND AGND AGND AGND AGND AGND PGND PGND AGNDAGND VREG VREG Starting Boost DCDC Converter Main DCDC Converter VREF VREF VREF VREG VOUT VREF VOUT AGND PGND AGND AGND AGND AGND AGND AGND AGND AGND AGND AGND AGNDAGND
No.EA-423-250303 PIN DESCRIPTIONS Top View Bottom View R1810Z (WLCSP-15-P1) Pin Configuration Top View Bottom View R1810L (DFN2735-14) Pin Configuration The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate level). The backside tab should be connected to the ground plane on the board. A E D C B E A B C D 14 8
No.EA-423-250303 R1810Z 、R1810L Pin Description Symbol Description I/O Pin No. R1810Z R1810L VIN Power Supply Input Pin. Apply input voltage between VIN pin and GND. Connect the input capacitor between the VIN pin and GND. I C3 5 VOUT Output voltage pin of step-up DC / DC converter. Connect the output load between VOUT pin and GND. Connect the output capacitor between VOUT pin and GND. O D1,E1 8 INPG Power good output pin for power input voltage (VIN). "High" level of the output voltage for CMOS output is the output voltage (VOUT) of the step-up DC / DC converter. Outputs "High" when VIN exceeds VMPSET and VOUT exceeds VOUTUVLOR※1. Please left open when not in use. O A1 13 VREG Output pin of step-up DC / DC converter (internal power supply) for startup. Supply voltage to the main DC / DC converter circuit that produces VOUT at startup. Please connect a capacitor between VREG pin and GND for voltage stabilization. O C1 11 LX The drain of the internal MOSFET. Connect an inductor between VIN pin and LX pin. O D2,D3 6 VCP Output pin of the startup internal step-up charge pump (internal power source). Supply voltage to the start-up DC / DC converter circuit that generates the VREG voltage at startup. Please connect a capacitor between the VCP pin and GND for voltage stabilization. O B1 12 OUTPG Power good output pin for VOUT. "High" level of the output voltage for CMOS output is VOUT. Outputs "High" when VOUT is VOUTPGH※1 or higher, and outputs "Low" when VOUT is VOUTPGL※1 or lower. Please left open when not in use. O A2 14 TEST 1,2,3 Test pins for the IC. Be sure to connect to AGND. - C2,B2,A3 9,4,1 AGND Analog ground of the internal circuit. Please connect to the PGND and GND. - B3 2 PGND Power ground of the internal circuit. Please connect to the AGND and GND. - E2,E3 7 NC No connection. It is recommended to make it open to prevent short circuit with adjacent pins during mounting. - - 3,10 ※1:Refer to electrical characteristics.
No.EA-423-250303 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings (GND = 0 V) Symbol Parameter Rating Unit VIN Input Pin Voltage −0.3 to 2.3 V VLX LX Pin Voltage −0.3 to 6.5 V VOUT Output Pin Voltage −0.3 to 6.5 V VREG Output Voltage of Boost DC to DC Converter for Start-up −0.3 to 6.5 V VCP Output Pin Voltage of Charge Pump Circuit −0.3 to 6.5 V VTEST1 to 3 Pin Voltage for Testing −0.3 to 6.5 V VINPG INPG Pin Voltage −0.3 to 6.5 V IINPG INPG Pin Current 10 mA VOUTPG OUTPG Pin Voltage -0.3 to 6.5 V IOUTPG OUTPG Pin Current 10 mA PD Power Dissipation Refer to the Power Dissipation in the supplementary item Tj Junction Temperature Range −40 to 85 C Tstg Storage Temperature Range −55 to 125 C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the lifetime and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings are not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Parameter Rating Unit VIN Input Voltage(1) 0.35 to 2.1 V Ta Operating Temperature Range −40 to 85 °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used ov er such conditions by momentary electronic noise or surge. The semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) The lower limit of the input voltage depends on the set output voltage. Please refer to Page.22 for details.
No.EA-423-250303
ELECTRICAL CHARACTERISTICS
The specifications surrounded by are guaranteed by design at −40°C ≤ Ta ≤ 85°C, not mass production tested. R1810x Electrical Characteristics (Ta = 25°C) Symbol Parameter Conditions Min. Typ. Max. Unit IQ_VOUT VOUT Pin Quiescent Current VIN = 0.5V, VOUT = 4.5 V, at no switching 600 3000 nA IQ_VIN VIN Pin Quiescent Current VIN = 0.5 V, VOUT = 4.5 V, at no switching 400 nA VOUT Output Pin Voltage VIN > VMP VSET 0.95 VSET 1.05 V VMP Accuracy of Maximum Power Point Control Voltage VOUT = VSET、VMPSET ≥0.5V -5 5 % VOUT = VSET、VMPSET <0.5V -50 50 mV VOUTPGH OUTPG “High” Threshold Voltage xxxA: 2.6V ≤ VSET xxxB: 3.1V ≤ VSET xxxC: 3.6V ≤ VSET xxxD: 4.3V ≤ VSET VSET 0.87 VSET 0.90 VSET 0.93 V VOUTPGL OUTPG “Low” Threshold Voltage xxxA: 2.6V ≤ VSET < 3.3V xxxB: 3.1V ≤ VSET < 3.3V VSET (PGL -0.05) VSET PGL VSET (PGL +0.05) V xxxA: 3.3V ≤ VSET xxxB: 3.3V ≤ VSET xxxC: 3.6V ≤ VSET xxxD: 4.3V ≤ VSET VSET (PGL -0.04) VSET PGL VSET (PGL +0.04) V VINPGH INPG “High” Threshold Voltage VMPSET 1.05 V VINPGL INPG “Low” Threshold Voltage VMPSET 0.95 V VOUTUVLOR VOUTUVLO Release Voltage 2.11 V VOUTUVLOF VOUTUVLO Detection Voltage 1.55 V VOUTPGH OUTPG "High" Output Voltage IOUTPG=-1µA VSET 0.9 V VINPGH INPG "High" Output Voltage IINPG=-1µA VSET 0.9 V VOUTPGL OUTPG ”Low” Output Voltage IOUTPG=1µA 0.1 V VINPGL INPG "Low" Output Voltage IINPG=1µA 0.1 V All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C). Test circuit is operated with “Open Loop Control” (GND = 0 V), unless otherwise specified.
No.EA-423-250303 The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C R1810xxxxA Product-specific Electrical Characteristics Product Name Output Voltage [V] Maximum Power Point Control Voltage [V] OUTPG”High” Detection Voltage [V] If VSET < 2.6V, the OUTPG function cannot be used.
No.EA-423-250303 Product Name OUTPG”Low” Detection Voltage [V] INPG”High” Detection Voltage [V] INPG”Low” Detection Voltage [V] R1810x016A - - - 0.525 0.475 If VSET < 2.6V, the OUTPG function cannot be used.
No.EA-423-250303 The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C R1810xxxxB Product-specific Electrical Characteristics Product Name Output Voltage [V] Maximum Power Point Control Voltage [V] OUTPG”High” Detection Voltage [V] If VSET < 3.1V, the OUTPG function cannot be used.
No.EA-423-250303 Product Name OUTPG”Low” Detection Voltage [V] INPG”High” Detection Voltage [V] INPG”Low” Detection Voltage [V] R1810x003B - - - 0.525 0.475 R1810x013B - - - 1.575 1.425 R1810x022B - - - 0.525 0.475 R1810x023B - - - 0.578 0.523 R1810x024B - - - 0.578 0.523 R1810x025B - - - 0.630 0.570 R1810x026B - - - 0.630 0.570 R1810x027B - - - 0.945 0.855 R1810x028B - - - 0.945 0.855 R1810x029B - - - 1.050 0.950 R1810x030B - - - 1.050 0.950 R1810x031B - - - 1.155 1.045 R1810x032B - - - 1.155 1.045 R1810x033B - - - 0.735 0.665 R1810x034B - - - 0.840 0.760 If VSET < 3.1V, the OUTPG function cannot be used.
No.EA-423-250303 The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C R1810xxxxC Product-specific Electrical Characteristics Product Name Output Voltage [V] Maximum Power Point Control Voltage [V] OUTPG”High” Detection Voltage [V] Product Name OUTPG”Low” Detection Voltage [V] INPG”High” Detection Voltage [V] INPG”Low” Detection Voltage [V] R1810x017C - - - 0.525 0.475 R1810x018C - - - 2.205 1.995 If VSET < 3.6V, the OUTPG function cannot be used.
No.EA-423-250303 The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C R1810xxxxD Product-specific Electrical Characteristics Product Name Output Voltage [V] Maximum Power Point Control Voltage [V] OUTPG”High” Detection Voltage [V] Product Name OUTPG”Low” Detection Voltage [V] INPG”High” Detection Voltage [V] INPG”Low” Detection Voltage [V] R1810x019D - - - 0.525 0.475 If VSET < 4.3V, the OUTPG function cannot be used.
No.EA-423-250303 TYPIC AL APPLICATION CIRCUIT R1810x Typical Application Circuit Recommended External Components Symbol Descriptions CIN Ceramic Capacitor, 22 µF or more CCP Ceramic Capacitor, 0.022µF or more CREG Ceramic Capacitor, 4.7 µF or more COUT Ceramic Capacitor, 4.7 µF or more Large-capacity Electrical Storage Device L Inductor, 22 µH COUT CREG CCP R1810 VIN VOUT VREG LX VCP TEST1 TEST2 TEST3 GND OUTPG GND CIN 光発電素子1セル or 熱電変換素子 INPG L Load
1 Cell
No.EA-423-250303 TECHNICAL NOTES The performance of the IC largely depends on the external components and circuitry layout. Especially, design the circuit carefully not to exceed each rating (voltage, current, power) for each component and the IC and consider the best layout pattern. Use a ceramic capacitor with low ESR (equivalent series resistance). We recommend 22uF as CIN which is set between VIN and GND. We recommend 4.7uF ceramic capacitor or 10uF or more ceramic capacitor with large capacity of electrical storage device as COUT. The capacitors should cover the operating temperature range, and effective capacitance should be more than our recommendation capacity with 0 bias. Note that insulation resistance should not be too small. If insulation resistance is small, the leakage current may increase. Such a system cannot be recommended. (Refer to Page.24, 31) We recommend an inductor with equal or more current rating (400mA or more), ESR, DC superimposition characteristics as our recommendation part. If ESR is large, or bad DC superimposition characteristics may lead to the bad efficiency. If the current rating is too small, the inductor may be broken down. If other than GND level is connected to the TEST1,2,3 pins, by the shoot current of logic circuits inside the IC, consumption current may increase. Make sure to connect these pins to the ground level.
No.EA-423-250303 OPERATION Boost DC/DC Converters For Energy Harvesting Generally, boost DC/DC converters are used to make a suitable voltage for MCU and logic circuits by boost the input voltage. The R1810s is not a general boost DC to DC converter, but it is dedicated for energy harvesting, in other words, the power generated by a photovoltaic element is converted and accumulated to an electrical storage device with high efficiency. By intermittent operation by the power from the electrical storage device, the system can operate continuously without using a primary battery or power supply. The R1810x has the function of the maximum power point control to generate power at the best suitable voltage point. To realize single cell photovoltaic element base, the start -up voltage is 0.5V and once after start -up, even if the input voltage goes down to 0. 2V, keeping on the operation is possible. Furthermore, start-up and charging to an electrical storage device with only 9uW input power, the system which operates under the low illuminance condition, can be built.
No.EA-423-250303 Maximum Power Point Control V (V) Time Time Input Voltage VIN Output Voltage VOUT VMP VSET Vicinity of the solar cell release voltage Intervals of the charge transfer to COUT by switching Intervals of CIN charge by solar cell The R1810x converts the power from the photovoltaic cell at the voltage (VMP), which is the maximum power generation possible point, and transferred to the power to COUT. In other words, when the input voltage of the R1810x increases by the power from a photovoltaic element, and when the voltage reaches maximum power voltage (VMP), switching operation starts and the R1810x transfers power to the COUT side. In case that the power transfer amount exceeds the supplied power from the photovoltaic element, the input voltage decreases by switching. Then, when the voltage of V IN becomes lower than V MP, the next switching stops and CIN is charged by the photovoltaic element and the voltage of VIN increases. When the input voltage reaches the VMP again, the R18 10x transfers power to COUT side. By repeating this operation enables transferring power to the COUT side with keeping the maximum power generation point of the photovoltaic element. Supplemental Remarks: If the photovoltaic power supply is low while the secondary capacitor is charged with the photovoltaic cell, the input voltage (V IN) will fall at every energy transfer point. The boost ratio can be big by connecting a bigger capacitance capacitor (CIN), the efficiency at charging is also improved.
No.EA-423-250303 Operation While The Output Voltage Is At Stable Set Output Voltage. VOUT Time Output Voltage Waveform at stable set output voltage point When the output voltage reaches to set output voltage, the operation of the R1810x is as follows: When the output voltage becomes higher than the set output voltage, even if VIN voltage is higher than VMP voltage, the switching stops. When the output voltage becomes equal to set VOUT voltage by a load, the switching resumes. By repeating this operation, the output voltage is maintained as the set output voltage.
No.EA-423-250303 Power Good (PG) Function When VOUT exceeds VOUT released voltage, VOUTUVLOR, the INPG pin becomes “High” (= VOUT level). Otherwise, the INPG pin holds “Low”. There are two cases the INPG pin becomes from “High” to “Low”. One is when VOUT falls below the VOUTUVLO detector threshold, VOUTUVLOF, and the other is in the case that the voltage level is less than VMP voltage, and the internal circuit recognizes the shading. If you do not use the INPG function, set the INPG pin to "Open". Typ. 4ms from when the switching starts and the voltage of VOUT exceeds 90% of VSET, the OUTPG pin becomes “High”. Depending on the PG pin voltage, the condition of the output can be judged, and sequence control is possible. While the OUTPG is ”High”, the output is same as set voltage. When the output becomes lower than the (PGL) of VSET, the OUTPG pin becomes “Low”. This preset value (PGL) can be selected from 50% and 80% with 10% increment depending on VSET. Refer to the “SELECTION GUIDE” about PGL setting. OUTPG function operates with using the VOUT voltage as the power supply, therefore regardless of the supply of VIN voltage, the operation is possible. For example, supposed that a system substantially operates a few times a day, and a large capacitance electrical storage device is connected with COUT, even if VIN voltage becomes too low, as long as VOUT voltage is beyond the VOUTUVLO released voltage (VOUTUVLOR), OUTPG can maintain “High”. However, if you use the OUTPG function, please note that the VSET value varies in between 50% and 80% of the PGL value to ensure the minimum operating voltage of the OUTPG function. If you do not use the PG function, Set the OUTPG pin to “Open”. Photovoltaic element VIN VOUT INPG OUTPG INPG"L"Detect Delay 1.5s(Min.) VMP VSETVPG VOUTUVLOR VSET×PGL VOUTPG=VOUT VINPG=VOUT OUTPG"H"Detect Delay 4ms(Typ.) INPG"H"Detect Delay 1.4ms(Typ.) OUTPG"L"Detect Delay 13ms(Typ.) With Light No Light Time
No.EA-423-250303 Cold Start Function When the start-up voltage or more voltage is input, initially the boost DC/DC converter for start-up operates. The internal power supply (VREG) for main DC/DC converter’s operation is generated by the built-in start-up boost DC/DC converter. When the main converter starts the operation and output voltage rises high enough, the internal power supply is generated from the output of the main DC/DC converter, then the boost DC/DC converter for startup stops the operation. ① Boost DC/DC converter for start-up operates and boost the power supply VREG of internal circuits. ② When VREG is beyond the threshold, the boost DC/DC converter for start-up stops, and the main DC/ DC converter starts the operation. While VREG maintains more than a certain voltage, the main DC/ DC converter operates and boost VOUT voltage. ③ Since the main DC/DC converter operates, the voltage of VREG becomes down due to the consumption current of internal circuits. When the voltage of VREG becomes lower than a certain voltage, the main DC/DC converter stops and the boost DC/DC converter for start-up boosts the voltage of VREG. ④ When the voltage of VREG becomes more than the threshold, the boost DC/DC converter for start-up stops and the main DC/DC converter starts operation. By repeating ③ and ④, the main converter boosts the voltage of VOUT pin until set output voltage, VSET. VIN VOUT Voltage Time VREG VMP スタートアップ電圧 Startup Voltage
No.EA-423-250303 Output Voltage Feedback Control Under the conditions that the cold start is completed and VOUT is boosted by the main DC/DC converter, when the voltage of VOUT reaches the VOUTUVLO released voltage, VOUTUVLO, the internal power supply VREG and VOUT are connected. This allows the main DC/DC converter to continue the operation without returning to the cold start condition, and to boost the output voltage until the set output voltage efficiently. Output Generation Function The R1810x stops boost operation when the output voltage exceeds VSET. The output voltage (VOUT) is tied to the internal power supply VREG by the output voltage feedback control. When the voltage of VOUT becomes lower than VSET due to the internal circuit consumption current or the external load current, the boost operation starts again until (VOUT) exceeds VSET. When a large capacitance electrical storage device described in “TYPICAL APPLICATION CIRCUIT” is connected, the ripple voltage will be extremely small. Reverse Current Protection Function While the main DC/DC converter is operating, when the high-side MOSFET turns on, COUT connected VOUT pin is charged, but due to the boost DC/DC converter’s topology, VIN < VOUT is true. After the charge is transferred to the output capacitor, when the reverse condition of VOUT and VIN is detected by comparing Lx and VOUT, the R1810x turns off the high-side driver not to flow the reverse current. By shading, the power generation level by a photovoltaic element decreases, the charge of CIN consumes by the consumption current of the IC and input voltage, VIN gradually decreases. Even if the input voltage is zero, reverse current protection function can operate. If input voltage becomes lower than output voltage, VOUT, by the reverse current protection function, the storage charge of COUT or a large capacitance electrical storage device is not drained in reverse. VSET VSET VSET VOUT time
No.EA-423-250303
Application Information
Set Output Voltage and Input Voltage Range. Depending on the setting value of the output voltage, the lower limit of the operable input voltage after the IC start-up is different. Refer to the table below. VSET [V] Input Voltage Range [V] 2.3 ≤ VSET ≤ 2.7 0.20 ≤ VIN ≤ 2.10 2.3 ≤ VSET ≤ 3.3 0.25 ≤ VIN ≤ 2.10 2.3 ≤ VSET ≤ 3.6 0.30 ≤ VIN ≤ 2.10 2.3 ≤ VSET ≤ 4.5 0.35 ≤ VIN ≤ 2.10
No.EA-423-250303 Case 2: The R1810 is connected to a Large-Capacity Power Storage Device. If the capacitance value of ceramic capacitor is small, output ripple becomes large, then the output ripple may exceed the voltage rating of the storage battery or rear-stage devices. Please adjust the set output voltage and the value of the ceramic capacitor not to exceed the voltage rating with considering the ripple with the total capacity that can be calculated with the ceramic capacitor and the storage battery. The guideline for the output ripple value from the total capacity of the ceramic capacitor and storage battery is calculated by the next formula. 1.35 ÷ C[μF]( Total Capacitance Value) ÷ ( VOUT[V] - VIN[V] ) + VOUT[V] < VABSOLUTE[V]( Absolute maximum rating value) Recommended example of large-capacity power storage device Manufacturer Product Part# Capacity Type Notes TDK CeraCharge™ BCT1812M101AG 100µAh All-solid-state Li-ion CeraCharge™ is a trademark of TDK. Nichicon SLB series SLB03070LR35 SLB03090LR80 SLB04255L040 SLB08115L140 0.35 mAh 0.8 mAh 4 mAh 14 mAh LiB(LTO*) NGK EnerCera® ET1210C-H ET2016C-R ET382704P-H 4 mAh 25mAh 20mAh LiB(LTO*) EnerCera® is a trademark of NGK. *Lithium-titanium-oxide Case 3: Efficiency Improvement Proposal Using 100μH Inductor. The efficiency of the R1810 can be significantly improved by changing the external inductor from 22μH to 100μH as shown in the left plot below. However, please note that electrical characteristics specified in this part are not guaranteed with the 100μH inductor. Especially, the load regulation degrades as shown in the right plot below. Also, when Vmp≥1.1V or boosting rate is high, the electric characteristics could change significantly. Please carefully evaluate the electric characteristics using the inductance value of 100μH. The 100μH inductor should have equivalent characteristics to the 22μH inductor "VLCF4028T-220MR72-2", which was used for characterization for this datasheet, on the maximum rated current, equivalent DC resistance, and DC superimposed characteristics. (Example: SPM7054VT-101M-D) Vout vs Iout Efficiency vs Iout
No.EA-423-250303 Case 4: The R1810 is used with a Sensor.
No.EA-423-250303 PCB Layout R1810Z ( WLCSP-15-P1 ) Board Layout Diagram Top Layer Bottom Layer R1810L ( DFN2735-14 ) Board Layout Diagram Top Layer Bottom Layer
No.EA-423-250303 Notes for PCB Layout. Since large current may flow through the VIN, VREG, VOUT, AGND, and PGND wiring, if the impedance of the wiring is high, unexpected noise or the unstable operation may result. Therefore, the impedance of wiring should be as low as possible. As for CIN, CCP, and COUT, make the wiring as short as possible to the VIN pin, VCP pin, and VOUT pin, respectively. Connect the AGND and PGND with low impedance point of the same board layer as the layer mounted the IC. Be sure to leave the NC pin node to "Open".
No.EA-423-250303 TYPICAL CHARACTERISTICS Note: Typical Characteristics are just reference data; not guaranteed with the value shown in the graphs. 1) Efficiency vs. Output Current Ta = 25℃ 2) Input Voltage vs. Output Voltage VSET = 2.6V, VMP = 0.5V Ta = 25℃ VSET = 2.6V, VMP = 0.5V Ta = 25℃ Bottom Voltage Average(Ripple Included) 3) Operating Quiescent Current vs. Temperature VMP = 0.5V 100 0.1 1 10 100 1000 Efficiency[%] Output Current IOUT [μA] Vset=2.6V,Vmp=0.5V Vset=2.6V,Vmp=1.0V Vset=4.5V,Vmp=0.5V VSET=2.6V,VMP=0.5V VSET=2.6V,VMP=1.0V VSET=4.5V,VMP=0.5V 2.40 2.45 2.50 2.55 2.60 2.65 2.70 2.75 2.80 Output Voltage VOUT [V] Input Voltage VIN [V] Vset=2.6V,Vmp=0.5VVSET=2.6V,VMP=0.5V 2.50 2.55 2.60 2.65 2.70 2.75 2.80 2.85 2.90 2.95 3.00 Output Voltage VOUT [V] Input Voltage VIN [V] VSET=2.6V,VMP=0.5V 100 200 300 400 500 600 700 800 900 1000 -50 -25 0 25 50 75 100 VOUT Quiescent Current IQ_VOUT [nA] Ta[℃] 003A 005A VSET=2.6V,VMP=0.5V VSET=4.5V,VMP=0.5V
No.EA-423-250303 4) Operating Quiescent Current vs. Temperature VSET = 2.6V, VMP = 0.5V 5) Minimum Starting Power Ramp up waveforms VSET = 2.6V, VMP = 0.5V, IIN=18μA Ta = 25℃ 6) Output Voltage vs. Output Current VSET = 2.6V, VMP = 0.5V Ta = 25℃ 500 1000 1500 2000 2500 3000 3500 -50 -25 0 25 50 75 100 VIN Quiescent Current IQ_VIN [nA] Ta [℃] TYPVSET=2.6V,VMP=0.5V 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 25 30 35 Voltage [V] Time [s] VIN[V] VOUT[V] VIN[V] VOUT[V] 2.00 2.20 2.40 2.60 2.80 3.00 3.20 3.40 0 500 1000 1500 2000 Output Voltage VOUT [V] Output Current IOUT [μA] 003A_s3VSET=2.6V,VMP=0.5V
No.EA-423-250303 7) Start-up by the power generation element 1 R1810Z003A, Photovoltaic Element = AM-30-11C (14.0×13.0mm) VSET = 2.6V, VMP = 0.5V, COUT = 1mF Ta = 25℃ 8) Start-up by the power generation element 2 R1810Z003A , Photovoltaic Element = FDSC-FSC6FG (44.5×40.5mm) VSET = 2.6V, VMP = 0.5V, COUT = 1mF Ta = 25℃ 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 500 1000 1500 2000 2500 3000 3500 Output Voltage VOUT [V] Time [s] 200lx 400lx 800lx 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 500 1000 1500 2000 2500 Output Voltage VOUT [V] Time [s] 80lx 100lx 200lx 400lx 800lx
No.EA-423-250303 Test Circuit 【Components list for our evaluation】 Symbol Part# Description CIN C1608JB1A226M 22 µF, Ceramic Capacitor CCP GRM155R71E223K 0.022 µF, Ceramic Capacitor CREG C1608JB1E475K 4.7 µF, Ceramic Capacitor COUT C1608JB1E475K 4.7 µF, Ceramic Capacitor L VLCF4028T-220MR72-2 22 µH, Inductor Test Circuit TYPICAL CHARACTERISTICS 1) to 6) Test Circuit TYPICAL CHARACTERISTICS 7)、8)
POWER DISSIPATION WLCSP-15-P1 PD-WLCSP-15-P1-(8585)-JE-A i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 101.5 mm x 114.5 mm x 1.6 mm Copper Ratio Outer Layer (First Layer): 10% Inner Layers (Second and Third Layers): 99.5 x 99.5mm 100% Outer Layer (Fourth Layer): 10% Measurement Result (Ta = 25°C, Tjmax = 85°C) Item Measurement Result Power Dissipation 710 mW Thermal Resistance (θja) θja = 84°C/W θja: Junction-to-Ambient Thermal Resistance Power Dissipation vs. Ambient Temperature Measurement Board Pattern
PACKAGE DIMENSIONS WLCSP-15-P1 DM-WLCSP-15-P1-JE-B i UNIT : mm
Visual Inspection Criteria WLCSP VI-160823 i No. Inspection Items Inspection Criteria Figure 1 Package chipping A≥0.2mm is rejected B≥0.2mm is rejected C≥0.2mm is rejected And, Package chipping to Si surface and to bump is rejected. 2 Si surface chipping A≥0.2mm is rejected B≥0.2mm is rejected C≥0.2mm is rejected But, even if A≥0.2mm, B≤0.1mm is acceptable. 3 No bump No bump is rejected.
4 Marking miss To reject incorrect marking, such as
another product name marking or another lot No. marking. 5 No marking To reject no marking on the package.
6 Reverse direction of
To reject reverse direction of marking character. 7 Defective marking To reject unreadable marking. (Microscope: X15/ White LED/ Viewed from vertical direction)
8 Scratch To reject unreadable marking
character by scratch. (Microscope: X15/ White LED/ Viewed from vertical direction)
9 Stain and Foreign
To reject unreadable marking character by stain and foreign material. (Microscope: X15/ White LED/ Viewed from vertical direction)
i A1 E1 : Product Code … Refer to Part Marking List : Lot Number … Alphanumeric Serial Number R1810Z (WLCSP-15-P1) Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI. ①②③④ A3 E3
Product Name ①② Product Name ①② Product Name ①② Product Name ①② R1810Z003A 10 R1810Z003B 20 R1810Z005C 30 R1810Z005D 40 R1810Z005A 12 R1810Z005B 22 R1810Z006C 31 R1810Z006D 41 R1810Z006A 13 R1810Z006B 23 R1810Z007C 32 R1810Z007D 42 R1810Z007A 14 R1810Z007B 24 R1810Z017C 33 R1810Z019D 43 R1810Z013A 15 R1810Z013B 25 R1810Z018C 34 R1810Z01 5A 1V R1810Z017B 26 R1810Z019C 35 R1810Z016A 16 R1810Z018B 27 R1810Z017A 17 R1810Z019B 28 R1810Z018A 18 R1810Z022B 29 R1810Z019A 19 R1810Z023B 2A R1810Z022A 1A R1810Z024B 2C R1810Z023A 1C R1810Z025B 2E R1810Z024A 1E R1810Z026B 2F R1810Z025A 1F R1810Z027B 2G R1810Z026A 1G R1810Z028B 2H R1810Z027A 1H R1810Z029B 2J R1810Z028A 1J R1810Z030B 2K R1810Z029A 1K R1810Z031B 2L R1810Z030A 1L R1810Z032B 2N R1810Z031A 1N R1810Z033B 2P R1810Z032A 1P R1810Z034B 2R R1810Z033A 1R R1810Z034A 1T R1810Z03 5A 1U
POWER DISSIPATION DFN2735-14 PD-DFN2735-14-(8585)-JE- B i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes φ 0.3 mm × 32 pcs Measurement Result (Ta = 25°C, Tjmax = 85°C) Item Measurement Result Power Dissipation 2500 mW Thermal Resistance (θja) θja = 24°C/W Thermal Characterization Parameter (ψjt) ψjt = 4°C/W θja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern
PACKAGE DIMENSIONS DFN2735-14 DM-DFN2735-14-JE-A i
i 14 8 1 7 : Product Code … Refer to Part Marking List : Lot Number … Alphanumeric Serial Number R1810L (DFN2735-14) Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or distributor before attempting to use AOI. ①②③ ④⑤⑥
Product Name ①②③④ Product Name ①②③④ Product Name ①②③④ Product Name ①②③④ R1810L003A GV 0 0 R1810L003B GW 0 0 R1810L005A GV 0 2 R1810L005B GW 0 2 R1810L005C GX 0 0 R1810L005D GY 00 R1810L006A GV 0 3 R1810L006B GW 0 3 R1810L006C GX 0 1 R1810L006D GY 0 1 R1810L007A GV 0 4 R1810L007B GW 0 4 R1810L007C GX 0 2 R1810L007D GY 0 2 R1810L013A GV 0 5 R1810L013B GW 0 5 R1810L015A GV 23 R1810L016A GV 0 6 R1810L017A GV 0 7 R1810L017B GW 0 6 R1810L017C GX 0 3 R1810L018A GV 0 8 R1810L018B GW 0 7 R1810L018C GX 0 4 R1810L019A GV 0 9 R1810L019B GW 0 8 R1810L019C GX 0 5 R1810L019D GY 0 3 R1810L022A GV10 R1810L022B GW 0 9 R1810L023A GV11 R1810L023B GW10 R1810L024A GV12 R1810L024B GW11 R1810L025A GV13 R1810L025B GW12 R1810L026A GV14 R1810L026B GW13 R1810L027A GV15 R1810L027B GW14 R1810L028A GV16 R1810L028B GW15 R1810L029A GV17 R1810L029B GW16 R1810L030A GV18 R1810L030B GW17 R1810L031A GV19 R1810L031B GW18 R1810L032A GV20 R1810L032B GW19 R1810L033A GV21 R1810L033B GW20 R1810L034A GV22 R1810L034B GW21
- T he products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the latest information thereon. 2. The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us. 3. This product and any technical information relating thereto are subject to complementary export controls (so- called KNOW controls) under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade Control Law and its related regulations with respect to the complementary export controls. 4. The technical information described in this document shows typical characteristics and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property rights or any other rights. 5. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death should first contact us.
- Aerospace Equipment
- Equipment Used in the Deep Sea
- Power Generator Control Equipment (nuclear, steam, hydraulic, etc.)
- Life Maintenance Medical Equipment
- Fire Alarms / Intruder Detectors
- Vehicle Control Equipment (automotive, airplane, railroad, ship, etc.)
- Various Safety Devices
- Traffic control system
- Combustion equipment In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases where operation requirements such as application conditions are confirmed by our company in writing after consultation with your company. 6. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. 7. The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead to deterioration, destruction or failure of the products. We shall not be responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of the products. 8. Quality Warranty 8-1. Quality Warranty Period In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement, quality assurance agreement, delivery specifications, etc., it shall be followed. 8-2. Quality Warranty Remedies When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute for the defective product or refund the purchase price of the defective product. Note that such delivery or refund is sole and exclusive remedies to your company for the defective product. 8-3. Remedies after Quality Warranty Period With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company. 9. Anti-radiation design is not implemented in the products described in this document. 10. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. 11. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. 12. Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with general industrial waste or household waste. 13. Please contact our sales representatives should you have any questions or comments concerning the products or the technical information. Official website https://www.nisshinbo-microdevices.co.jp/en/ Purchase information https://www.nisshinbo-microdevices.co.jp/en/buy/