R1560X NISSHINBO | Alldatasheet
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60 V 100 mA Ultra-low Power Voltage Regulator
No. EA -395-240318 The R1560x is a CMOS -based ultra-low power voltage regulator featuring 60 V input voltage and 100 mA output current. The device includes a short current limit circuit, an overcurrent protection circuit and a thermal shutdown. These features make the R1560x an ideal constant voltage power source for electrical appliances.
- Supply current is as low as Typ. 3.0 μA, which can reduce current consumption at a system stop.
- The input voltage range is as wide as 5.5 V to 60 V, and the output voltage accuracy is as high as ±0.8%.
- High heat dissipation and space-saving HSOP-6J and TO-252-5-P2 packages.
- Input Voltage Range (Max. Rating): 5.5 V to 60 V (80 V)
- Operating Temperature Range: −40°C to 105°C
- Supply Current: Typ. 3.0 µA
- Dropout Voltage: Typ. 1.5 V (IOUT = 100 mA, VOUT = 5.0 V)
- Output Voltage Accuracy: ±0.8% (Ta = 25°C)
- Temp. Coefficient of Output Voltage: Typ. ±100 ppm/°C
- Line Regulation: Typ. 0.01%/V (6 V ≤ VIN ≤ 60 V)
- Short-circuit Current Limiting: limits to Typ. 50 mA
- Overcurrent Protection: triggers at Typ. 150 mA
- Thermal Shutdown: triggers at Typ.165°C xx: Set Output Voltage (VSET) Product Name Package R1560Sxx1B-E2-FE HSOP-6J R1560Jxx1B-T1-FE TO-252-5-P2 +48V/24V R1560x MCU VOUTCE VDD GND 5.0V/3.3V/1.8V VDD GND CIN COUT CE Control HSOP-6J 5.02 x 6.0 x 1.5 (mm) TO-252-5-P2 6.6 x 9.9 x 2.3 (mm)
- Refrigerators, Rice Cookers and Electric Kettles
- Laptop PCs, Digital TVs, Telephones and Home LAN System OVERVIEW KEY BENEFITS KEY SPECIFICATIONS SELECTION GUIDE PACKAGES TYPICAL APPLICATIONS
APPLICATIONS
No. EA-395-240318 SELECTION GUIDE The output voltage and the package type are user-selectable options. Selection Guide Product Name Package Quantity per Reel Pb Free Halogen Free R1560Sxx1B-E2-FE HSOP-6J 1,000 pcs Yes Yes R1560Jxx1B-T1-FE TO-252-5-P2 3,000 pcs Yes Yes xx: Set Output Voltage (VSET) BLOCK DIAGRAM VDD VOUT CE GND Current Limit Short Protection Vref Thermal Shutdown Circuit R1560x Block Diagram
No. EA-395-240318 PIN DESCRIPTIONS 1 3 6 4 1 2 3 4 5 HSOP-6J Pin Configuration TO-252-5-P2 Pin Configuration HSOP-6J Pin Description Pin No. Pin Name Description
1 VOUT Output Pin
2 GND(1) Ground Pin
3 CE Chip Enable Pin, Active-high
4 GND(1) Ground Pin
5 GND(1) Ground Pin
6 VDD Input Pin
TO-252-5-P2 Pin Description Pin No. Pin Name Description
1 VDD Input Pin
2 NC No Connection
3 GND Ground Pin
4 VOUT Output Pin
5 CE Chip Enable Pin, Active-high
Pin Equivalent Circuit Diagrams VOUT Driver CE VOUT Pin Equivalent Circuit Diagram CE Pin Equivalent Circuit Diagram (1) The GND pins are connected to each other on the board.
No. EA-395-240318 ABSOLUTE MAXIMUM RATINGS Absolute Maximum Ratings Symbol Parameter Rating Unit VIN Input Voltage −0.3 to 80 V VIN Peak Inrush Voltage (1) 90 V VCE CE Pin Input Voltage −0.3 to 80 V VOUT Output Voltage −0.3 to VIN + 0.3 ≤ 80 V IOUT Output Current 150 mA PD Power Dissipation(2) HSOP-6J JEDEC STD.51-7 2700 mW TO-252-5-P2 JEDEC STD.51-7 3800 Tj Junction Temperature −40 to 125 °C Tstg Storage Temperature Range −55 to 125 °C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Recommended Operating Conditions Symbol Parameter Rating Unit VIN Input Voltage 5.5 to 60 V Ta Operating Temperature Range −40 to 105 °C RECOMMENDED OPERATING CONDITONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Duration: 200 ms or less (2) Refer to POWER DISSIPATION for detailed information.
No. EA-395-240318
ELECTRICAL CHARACTERISTICS
CIN = 0.1 μF / COUT = 0.1 μF, unless otherwise noted. The specifications surrounded by are guaranteed by design engineering at −40°C ≤ Ta ≤ 105°C. R1560x Electrical Characteristics (Ta = 25°C) Symbol Parameter Test Conditions/Comments Min. Typ. Max. Unit ISS Supply Current VIN = 14 V VCE = 14 V IOUT = 0 mA VSET ≤ 5.0 V 3.0 8.0 μA VIN = 18 V VCE = 18 V IOUT = 0 mA VSET > 5.0 V 3.5 12 Istandby Standby Current VIN = 60 V, VCE = 0 V 0.1 2.0 μA VOUT Output Voltage VSET ≤ 5.0 V VIN = 14 V IOUT = 1 mA V VSET > 5.0 V VIN = 18 V IOUT = 1 mA VOUT /IOUT Load Regulation VIN = 8 V (VSET ≤ 5.0 V) VIN = VSET + 3 V (VSET > 5.0 V) 1 mA ≤ IOUT ≤ 100 mA Refer to Voltage-specific VOUT /VIN Line Regulation
6 V ≤ VIN ≤ 60 V
IOUT = 1 mA VSET ≤ 5.0 V −0.02 0.01 0.02 %/V VSET+1 V ≤ VIN ≤ 60 V IOUT = 1 mA VSET > 5.0 V −0.06 0.03 0.06 VDIF Dropout Voltage IOUT = 100 mA Refer to Voltage-specific ILIM Output Current Limit VIN = 8.0 V (VSET ≤ 5.0 V) VIN = VSET + 3 V (VSET > 5.0 V) 100 150 250 mA ISC Short-circuit Current VIN = 8.0 V (VSET ≤ 5.0 V) VIN = VSET + 3 V (VSET > 5.0 V) VOUT = 0 V 20 50 75 mA VCEH CE Input Voltage “H” VIN = 60 V 3.0 60 V VCEL CE Input Voltage “L” VIN = 60 V 0 0.3 V IPD CE Pull-down Current VIN = 60 V, VCE = 3 V 0.4 0.8 μA TTSD Thermal Shutdown Temperature Junction Temperature 150 165 °C TTSR Thermal Shutdown Release Temperature (1) Junction Temperature 125 135 °C All parameters are tested under the pulse load condition (Tj ≈ Ta = 25C). (1) If the VDD and CE pins are turned on at the same time when Ta > 125°C, the thermal shutdown can be activated.
No. EA-395-240318 R1560x Product-specific Electrical Characteristics (Ta = 25°C) Product Name VOUT (V) (Ta = 25°C) VOUT (V) (−40°C ≤ Ta ≤ 105°C) VOUT/IOUT (mV) VDIF (V) -300 30 300 3.7 4.0 -600 60 600 1.5 3.0
No. EA-395-240318 THEORY OF OPERATION Thermal Shutdown If the junction temperature increases above 165°C (Typ.), the operation of the regulator would stop. And if the junction temperature decreases below 135°C (Typ.), the operation of the regulator would restart. Unless the causes of temperature rising are removed, the regulator repeats turning on and off and the output waveform becomes a pulse shape.
APPLICATION INFORMATION
CIN = Ceramic 0.1 µF COUT = Ceramic 0.1 µF VOUT CE Control R1560x Typical Applications Equivalent Series Resistance vs. Output Current It is recommended that a ceramic type capacitor be used for this device. However, other types of capacitors having lower ESR can also be used. The relation between the output current (I OUT) and the ESR of output capacitor is shown below. R1560xxxxB VDD VOUT CE IOUT C1 = Ceramic 0.1 μF, C2 = Ceramic 0.1 μF GND ESR Measurement Conditions Frequency Band: 10 Hz to 2 MHz Measurement Temperature: −40°C to 105°C Capacitor: C1 = Ceramic 0.1 µF, C2 = Ceramic 0.1 µF ESR: 0 to 100 Ω VOUT: 1.8 V, 5.0 V It is confirmed that the output noise level is less than the specified value (40 µVrms ) under the measurement conditions above.
No. EA-395-240318 TECHNICAL NOTES The performance of a power source circuit using this device is highly dependent on a peripheral circuit. A peripheral component or the device mounted on PCB should not exceed its rated voltage, rated current or rated power. When designing a peripheral circuit, please be fully aware of the following points. Phase Compensation A phase compensation is provided to secure stable operation even when the load current is varied. For this purpose, use a 0.1-µF or more output capacitor (COUT) with good frequency characteristics and proper ESR (Equivalent Series Resistance). In case of using a tantalum type capacitor with a large ESR, the output might become unstable. Evaluate your circuit including consideration of frequency characteristics. Connect a 0.1- µF or more input capacitor (CIN) between the VDD and GND pins with shortest-distance wiring. PCB Layout As for the HSOP-6J package, ensure that the GND pins (Pin No. 2, 4 and 5) are connected to each other and the ground plane. Operating the Device below the Minimum Operating Voltage Operating the device below the recommended operating voltage range can make the output voltage unstable and make the output voltage higher than the set output voltage (VSET) of the device. In the case of turning on the VIN and CE pins at the same time, both pins must be turned on using a 100-V/ms or more slew rate in order to prevent the unstable operation upon start-up. In the case of turning on the VIN pin using a 100-V/ms or less slew rate, the CE pin must be turned on after the supply voltage becomes 5.5 V or more. In the case of turning off the VIN and CE pins at the same time, both pins must be turned off using a steep slew rate, -100 V/ms or higher in order to prevent the unstable operation. In the case of turning off the VIN pin using a slow rate, lower than -100 V/ms, the CE pin must be turned off before the supply voltage decreases to 5.5 V. Transient Response An output ceramic capacitor of COUT = 0.1 μF prevents R1560x series from phase oscillation to ensure the IC’s stable operation. However, variation in input voltage and load current would lead to an unstable output voltage which fails to meet the requirements of the system. Especially, in a high output version: VSET > 5 V, this results in slow response of the IC and a great variation in output. To avoid this problem, use a ceramic capacitor of COUT = 10 μF or more to minimize variation in output. Place the capacitor as close as possible to and outside of the IC when the electrolytic capacitor is used as an output line element.
No. EA-395-240318 TYPICAL CHARACTERISTICS Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Output Current (Ta = 25°C) R1560x181B R1560x501B R1560xE01B
No. EA-395-240318 2) Output Voltage vs. Input Voltage (Ta = 25°C) R1560x181B R1560x501B R1560xE01B 3) Supply Current vs. Temperature R1560x181B R1560x501B
No. EA-395-240318 R1560xE01B 4) Output Voltage vs. Temperature (IOUT = 1 mA) R1560x181B R1560x501B R1560xE01B
No. EA-395-240318 5) Supply Current vs. Input Voltage R1560x181B R1560x501B R1560xE01B 6) Dropout Voltage vs. Output Current R1560x181B R1560x501B
No. EA-395-240318 R1560xE01B 7) Ripple Rejection vs. Input Bias Voltage (Ta = 25°C, VRIPPLE = ± 0.2 V) R1560x181B R1560x501B COUT = 0.1 µF COUT = 0.1 µF R1560xE01B COUT = 10 µF
No. EA-395-240318 8) Ripple Rejection vs. Frequency (Ta = 25°C) R1560x181B R1560x501B VIN = 14 V ± 0.2 V ripple, COUT = 0.1 µF VIN = 14 V ± 0.2 V ripple, COUT = 0.1 µF R1560xE01B VIN = 18 V ± 0.2 V ripple, COUT = 10 µF 9) Input Transient Response (Ta = 25°C, IOUT = 1 mA) R1560x181B R1560x501B
No. EA-395-240318 R1560xE01B 10) Load Dump (Ta = 25°C, IOUT = 1 mA) R1560x181B R1560x501B R1560xE01B
No. EA-395-240318 11) Load Transient Response (Ta = 25°C, IOUT = 1 mA ↔ 20 mA ) R1560x181B R1560x181B VIN = 14 V, IOUT = 1 mA → 20 mA VIN = 14 V, IOUT = 20 mA → 1 mA R1560x501B R1560x501B VIN = 14 V, IOUT = 1 mA → 20 mA VIN = 14 V, IOUT = 20 mA → 1 mA R1560xE01B R1560xE01B VIN = 18 V, IOUT = 1 mA → 20 mA VIN = 18 V, IOUT = 20 mA → 1 mA
No. EA-395-240318 12) CE Start-up (Ta = 25°C) R1560x181B R1560x181B VIN = 14 V, COUT = 0.1 µF VIN = 14 V, COUT = 10 µF R1560x501B R1560x501B VIN = 14 V, COUT = 0.1 µF VIN = 14 V, COUT = 10 µF R1560xE01B VIN = 18 V, COUT = 10 µF
PD-HSOP-6J-(105125)-JE-A i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes 0.3 mm × 28 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 2700 mW Thermal Resistance (ja) ja = 37°C/W Thermal Characterization Parameter (ψjt) ψjt = 7°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern 500 1000 1500 2000 2500 3000 0 25 50 75 100 125 Power Dissipation PD (mW) Ambient Temperature (°C) 2700 105
PACKAGE DIMENSIONS HSOP-6J DM-HSOP-6J-JE-A i
i : Product Code … Refer to Part Marking List : Lot Number … Alphanumeric Serial Number HSOP-6J Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before attempting to use AOI.
R1560SxxxB Part Marking List Product Name R1560S181B D18 B R1560S251B D25 B R1560S281B D28 B R1560S301B D30 B R1560S331B D33 B R1560S341B D34 B R1560S501B D50 B R1560S701B D70 B R1560S801B D80 B R1560S901B D90 B R1560SA01B DA0 B R1560SC01B DC0 B R1560SE01B DE0 B
POWER DISSIPATION TO-252-5-P2 PD-TO-252-5-P2-(105125)-JE-C i The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes 0.4mm × 30pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 3800 mW Thermal Resistance (ja) ja = 26°C/W Thermal Characterization Parameter (ψjt) ψjt = 7°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter Power Dissipation vs. Ambient Temperature Measurement Board Pattern
PACKAGE DIMENSIONS TO-252-5-P2 DM-TO-252-5-P2-JE-C i
i : Product Code … Refer to Part Marking List ⑩: Lot Number … Alphanumeric Serial Number TO-252-5-P2 Part Markings NOTICE There can be variation in the marking when different AOI (Automated Optical Inspection) equipment is used. In the case of recognizing the marking characteristic with AOI, please contact our sales or our distributor before attempting to use AOI.
R1560JxxxB Part Marking List R1560J181B P1J181B _ R1560J251B P1J251B _ R1560J281B P1J281B _ R1560J301B P1J301B _ R1560J331B P1J331B _ R1560J341B P1J341B _ R1560J501B P1J501B _ R1560J701B P1J701B _ R1560J801B P1J801B _ R1560J901B P1J901B _ R1560JA01B P1JA01B _ R1560JC01B P1JC01B _ R1560JE01B P1JE01B _
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