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P-Channel 20V Fast Switching MOSFET QM2403V-DS-F0000, Jul. 2019 Copyright© uPI Semiconductor Corp. All Rights reserved. www.upi-semi.com General Description The QM2403V is a high performance trench P-channel MOSFET which utilizes extremely high cell density to provide low Rdson and gate charge characteristics. It is ideally suited to support most of the small power switching and load switch applications. The QM2403V meets RoHS and Green Product requirements while supporting full function reliability. Features Product Summary Advanced high cell density Trench technology Super Low Gate Charge Excellent CdV/dt effect decline Green Device Available VDS RDS(ON) max (VGS=-4.5V) ID (TA=25 °C) -20V 55mΩ -3.8A
Applications
High Frequency Point-of-Load Synchronous Buck Converter for MB/N B/UMPC/VGA Pin Configuration Networking DC-DC Power System Load Switch
Ordering Information
e Top Marking QM2403V TSOP6
QM2403V-DS-F0000, Jul. 2019 Copyright© uPI Semiconductor Corp. All Rights reserved. www.upi-semi.com Absolute Maximum Ratings Symbol Parameter Rating Units VDS Drain-Source Voltage -20 V VGS Gate-Source Voltage ±8 V ID@TA=25°C Continuous Drain Current, V GS @ -4.5V1 -3.8 A ID@TA=70°C Continuous Drain Current, V GS @ -4.5V1 -3 A IDM Pulsed Drain Current 2 -15.2 A PD@TA=25°C Total Power Dissipation 3 1.1 W TSTG Storage Temperature Range -55 to 150 °C TJ Operating Junction Temperature Range -55 to 150 °C Thermal Data Symbol Parameter Typ. Max. Unit RθJA Thermal Resistance Junction-Ambient 1 -- 110 °C/W RθJC Thermal Resistance Junction-Case 1 -- 70 °C/W
QM2403V-DS-F0000, Jul. 2019 Copyright© uPI Semiconductor Corp. All Rights reserved. www.upi-semi.com P-Channel Electrical Characteristics P-Channel Electrical Characteristics: (TJ=25 ℃, unless otherwise noted) Symbol Parameter Conditions Min Typ Max Unit BVDSS Drain-Source Breakdown Voltage V GS=0V , ID=-250uA -20 -- -- V △BVDSS /△TJ BVDSS Temperature Coefficient Reference to 25°C , I D=-1mA -- -0.016 -- V/°C RDS(ON) Static Drain-Source On-Resistance2 VGS=-4.5V , ID=-3A -- 44 55 mΩ VGS=-2.5V , ID=-2A -- 56 70 VGS=-1.8V , ID=-1A -- 73 85 VGS(th) Gate Threshold Voltage VGS=VDS , ID =-250uA -0.3 -0.5 -1.0 V △VGS(th) VGS(th) Temperature Coefficient -- 3.97 -- mV/°C IDSS Drain-Source Leakage Current VDS=-16V , VGS=0V , TJ=25°C -- -- 1 uA VDS=-16V , VGS=0V , TJ=55°C -- -- 5 IGSS Gate-Source Leakage Current VGS=±8V , VDS=0V -- -- ±100 nA gfs Forward Transconductance V DS=-5V , ID=-3A -- 14 -- S Qg Total Gate Charge VDS=-15V , VGS=-4.5V , ID=-3A -- 12.1 16.9 nC Qgs Gate-Source Charge -- 1.5 2.1 Qgd Gate-Drain Charge -- 3.1 4.3 td(on) Turn-On Delay Time VDS=-10V , VGS=-4.5V , RG=3.3, ID=-3A -- 4.4 8.8 ns tr Rise Time -- 45 81 td(off) Turn-Off Delay Time -- 48.4 97 tf Fall Time -- 30.4 60.8 Ciss Input Capacitance VDS=-15V , VGS=0V , f=1MHz -- 938 1313 pF Coss Output Capacitance -- 108 151 Crss Reverse Transfer Capacitance -- 96 134
QM2403V-DS-F0000, Jul. 2019 Copyright© uPI Semiconductor Corp. All Rights reserved. www.upi-semi.com Diode Characteristics Symbol Parameter Conditions Min. Typ. Max. Unit IS Continuous Source Current 1,4 VG=VD=0V, Force Current -- -- -3.8 A ISM Pulsed Source Current2,4 -- -- -15.2 A VSD Diode Forward Voltage2 V GS=0V , IS=-1A , TJ=25°C -- -- -1 V trr Reverse Recovery Time IF=-3A , di/dt=100A/µs , TJ=25°C -- 28 -- nS Qrr Reverse Recovery Charge -- 9 -- nC Note: 1. Test data conducted with surface mount attachment to 1 inch 2, FR‐4 board utilizing 2oz copper 2. Pulse Test. Pulse width ≦300uS, duty cycle ≦ 2% 3. The power dissipation is limited by a 150 °C maximum junction temperature 4. The data is theoretically the same as I D and IDM. In real applications, it will be limited by total power
QM2403V-DS-F0000, Jul. 2019 Copyright© uPI Semiconductor Corp. All Rights reserved. www.upi-semi.com 0 0.2 0.4 0.6 0.8 1 -VDS , Drain-to-Source Voltage (V) -IS Source Current(A) TJ=25℃TJ=150℃ 0.2 0.6 1.4 1.8 -50 0 50 100 150 TJ ,Junction Temperature (℃ ) Normalized VGS(th) 0.2 0.6 1.0 1.4 1.8 -50 0 50 100 150 TJ , Junction Temperature (℃) Normalized On Resistance Typical Characteristics Fig.1: Typical Output Characteristics Fig.2: On-Resistance vs. G-S Voltage Fig.3: Forward Characteristics of Reve rse Fig.4: Gate-Charge Characteristics Fig.5: Normalized V GS(th) vs. TJ Fig.6: Normalized R DSON vs. TJ
QM2403V-DS-F0000, Jul. 2019 Copyright© uPI Semiconductor Corp. All Rights reserved. www.upi-semi.com 100 1000 10000 1 6 11 15 20 -VDS (V) Capacitance (pF) F=1.0MHz Ciss Coss Crss Fig.7: Capacitance Fig.8: Safe Operating Area Fig.9: Normalized Maximum Transient Thermal Impedance
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