F0094U OSRAM | Alldatasheet

Document overview

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Technical content

Features

 Typ. total radiant power: 15 mW @ 100 mA in TOPLED ® package  Chip size 300 x 300 µm 2  Very highly efficient GaAs LED  Good linearity (Ie = f [IF]) at high currents  DC or pulsed operations are possible  High reliability  High pulse handling capability

Applications

 Miniature photointerrupters  Industrial electronics  Drive and control circuits  Automotive technology  Sensor technology  Alarm and safety equipment  IR free air transmission

F 0094U, F 0094V Elektrische Werte (gemessen auf TO18-Bodenplatte ohne Verguss, TA = 25 °C) Bezeichnung Parameter Symbol Symbol Wert1) Value1) Einheit Unit min. typ. max. Wellenlänge der Strahlung Wavelength at peak emission IF = 10 mA λpeak 950 nm Spektrale Bandbreite bei 50% von Imax, IF = 10 mA Spectral bandwidth at 50% of Imax ∆λ 55 nm Sperrspannung Reverse voltage IR = 10 µA, VR 53 0 V Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ie from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω tr, tf 0.5/0.4 µs Durchlaβspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs VF 1.35 3.0 1.5 V Gesamtstrahlungsfluβ4) Total radiant flux4) IF = 100 mA, tp = 20 ms F 0094U F 0094V Φ e 4.8 4.2 mW mW Temperaturkoeffizient2) von λ Temperature coefficient2) of λ IF = 100 mA; TC λ 0.3 nm/K Temperaturkoeffizient2) von VF Temperature coefficient2) of VF IF = 100 mA; TC V -1.5 mV/K

F 0094U, F 0094V 2002-02-04 3 Mechanische Werte Mechanical values Bezeichnung Parameter Symbol Symbol Wert1) Value1) Einheit Unit min. typ. max. Chipkantenlänge (x-Richtung) Length of chip edge (x-direction) Lx 0.28 0.3 0.32 mm Chipkantenlänge (y-Richtung) Length of chip edge (y-direction) Ly 0.28 0.3 0.32 mm Durchmesser des Wafers Diameter of the wafer D 76.2 mm Chiphöhe Die height H 170 185 200 µm Bondpaddurchmesser Diameter of bondpad d 135 µm Bezeichnung Parameter Wert Value Vorderseitenmetallisierung Metallization frontside Aluminium Aluminum R ückseitenmetallisierung Metallization backside Goldlegierung Gold alloy Trennverfahren Dicing Sägen Sawing Verbindung Chip - Träger Die bonding Kleben Epoxy bonding

F 0094U, F 0094V 2002-02-04 4 Grenzwerte3) (TA = 25 °C) Maximum Ratings 3) (TA = 25°C) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Maximaler Betriebstemperaturbereich Maximum operating temperature range Top - 40...+100 °C Maximaler Lagertemperaturbereich Maximum storage temperatur range Tstg - 40...+100 °C Maximaler Durchlaßstrom Maximum forward current IF 100 mA Maximaler Stoßstrom maximum surge current tp = 10 µs, D = 0.005 IS 3A Maximale Sperrschichttemperatur Maximum junction temperature Tj 125 °C

F 0094U, F 0094V 2002-02-04 5 Relative Spectral Emission2) Irel = f (λ), TA = 25 °C Forward Current2) ,IF = f (VF), single pulse, tp = 20 µs, TA = 25 °C Radiant Intensity2) Single pulse, tp = 20 µs, TA = 25 °C Permissible Pulse Handling Capability2) IF = f (tP) duty cycle D = parameter, TA = 25 °C OHR01938 λ relΙ 880 920 960 1000 nm 1060 100 OHR01554 FV -210 -110 010 110 01 2 3 4 5 6 V 8 AΙF Ιe Ιe 100 mA = f (IF) Ι OHR00864 F -110 10 -2 -1 10 010 A 10 1 10 0 mA)(100eΙ eΙ 10 1 τ OHR00865 -510 10 2 ΙF 10 3 10 4 DC 0.2 0.5 0.1 0.005 0.01 0.02 0.05 T ΙF TD = mA -410 -310 -210 -110 010 110 210s D = τ τ

F 0094U, F 0094V Ma ßzeichnung Chip Outlines Ma ße werden als typische1) Werte wie folgt angegeben: mm (inch) / Dimensions are specified as typical1) values as follows: mm (inch). GMOY6080 0.185 (0.0073) 0.135 (0.0053) p-contact n-contact 0.3 (0.0118)

F 0094U, F 0094V 2002-02-04 7 Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg © All Rights Reserved. Attention please! The information generally describes the type of component and shall not be considered as assured characteristics or detailed specification. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our sales organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You will have to bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized by us for such purpose! Critical components 5), may only be used in life-support devices or systems6) with the express written approval of OSRAM OS. 1) Typical (refered to as typ.) data are defined as long-term production mean values and are only given for information. This is not a specified value. For final electrical testing a spot check with sufficient statistical accuracy is carried out. Minimum and maximum values( refered to as min. and max.) refer to the limits of the sample measurement. 2) Based on data measured in OSRAM Opto Semiconductor’s TOPLED ® package. They represent typical1) data. 3) Maximum ratings are strongly package dependent and may differ between different packages. The values given represent the chip in an OSRAM OS TOPLED® package and are only valid for this package. 4) Value is referenced to the vendor’s measurement system (correlation to customer product(s) is required). 5)A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 6)Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.