Q65110A4262

BP-104-SR AMSOSRAM | Alldatasheet

Document overview

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Technical content

1 Version 1.4 | 2018-06-21 Produktdatenblatt | Version 1.1 www.osram-os.com BP 104 SR DIL SMT Silicon PIN Photodiode

Applications

—LIDAR, Pre-Crash, ACC —Rain sensors Features: —Package: clear epoxy —Corrosion Robustness Class: 3B —Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. —ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) —Suitable for reflow soldering —Especially suitable for applications from 400 nm to 1100 nm —Short switching time (typ. 20 ns) —Suitable for SMT

Ordering Information

Type Photocurrent Photocurrent Ordering Code typ. Ev = 1000 lx; Std. Light A; VR = 5 V Ev = 1000 lx; Std. Light A; VR = 5 V IP IP BP 104 SR-Z ≥ 40 µA 55 µA Q65110A4262

2 Version 1.4 | 2018-06-21 Maximum Ratings TA = 25 °C Parameter Symbol Values Operating Temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Reverse voltage V R max. 20 V Total power dissipation Ptot max. 150 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV

3 Version 1.4 | 2018-06-21 Characteristics TA = 25 °C Parameter Symbol Values Wavelength of max sensitivity λS max typ. 850 nm Spectral range of sensitivity λ10% typ. 400 ... 1100 nm Radiant sensitive area A typ. 4.84 mm² Dimensions of active chip area L x W typ. 2.2 x 2.2 mm x mm Half angle φ typ. 60 ° Dark current VR = 10 V IR typ. max. 2 nA 30 nA Spectral sensitivity of the chip λ = 850 nm Sλ typ. 0.62 A / W Quantum yield of the chip λ = 850 nm η typ. 0.90 Electrons / Photon Open-circuit voltage Ev = 1000 lx; Std. Light A VO min. typ. 280 mV 360 mV Short-circuit current E v = 1000 lx; Std. Light A ISC typ. 50 µA Rise time V R = 5 V; RL = 50 Ω; λ = 850 nm tr typ. 0.02 µs Fall time V R = 5 V; RL = 50 Ω; λ = 850 nm tf typ. 0.02 µs Forward voltage IF = 100 mA; E = 0 VF typ. 1.3 V Capacitance VR = 0 V; f = 1 MHz; E = 0 C0 typ. 48 pF Temperature coefficient of voltage TCV typ. -2.6 mV / K Temperature coefficient of short-circuit current Std. Light A TCI typ. 0.18 % / K Noise equivalent power VR = 10 V; λ = 850 nm NEP typ. 0.041 pW / Hz1/2 Detection limit D* typ. 5.4e12 cm x Hz1/2 / W

4 Version 1.4 | 2018-06-21 λ OHF00078 relS 400 100 500 600 700 800 900 nm 1100 Relative Spectral Sensitivity 1), 2) Srel = f (λ) OHF01402 40 30 20 10 20 40 60 80 100 1200.40.60.81.0 ϕ 0.2 0.4 0.6 0.8 1.0 100 Directional Characteristics 1), 2) Srel = f (φ)

5 Version 1.4 | 2018-06-21 OHF00080 Ι R RV 0 5 10 15 V 20 1000 2000 3000 4000 pA Dark Current 1), 2) IR = f (VR) ; E = 0 lx310 OV PΙ mVAµ OV 010 10 1 10 2 10 3 10 4310 210 110 010 410210110 10 -1 ΙP 10 0 V OHF02283 E Photocurrent/Open-Circuit Voltage 1), 2) IP (VR = 5 V) / VO = f (Ev) OHF02284 VR Ι R 10-1 100 101 102 nA 2 4 6 8 10 12 14 16 V 20 Dark Current 1), 2) IR = f (VR) ; E = 0

6 Version 1.4 | 2018-06-21 V OHF01778 R -210 C 10 -1 10 0 10 1 10 2V pF Capacitance 1), 2) C = f (VR); f = 1 MHz; E = 0; OHF05717 AT 10-1 ˚C02 04 06 08 0 100 RI nA 100 101 102 103 104 Dark Current 2) IR = f (TA); E = 0; VR = 10 V

7 Version 1.4 | 2018-06-21 T OHF00394 A totP 0 20 40 60 80 ˚C 100 mW 100 120 140 160 Power Consumption Ptot = f (TA);

8 Version 1.4 | 2018-06-21 Dimensional Drawing 3) 4.5 (0.177) 4.3 (0.169) 4.0 (0.157) 3.7 (0.146) 1.5 (0.059) 1.7 (0.067) 0.9 (0.035) 0.7 (0.028) Photosensitive area Cathode lead GPLY70492.20 (0.087) x 2.20 (0.087) Chip position 6.2 (0.244) 6.7 (0.264) 1.1 (0.043) 1.2 (0.047) 0...0.1 (0...0.004) 0.3 (0.012) 0.9 (0.035) 0.2 (0.008) 0...5˚ 0.1 (0.004) 1.1 (0.043) Approximate Weight: 44.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)

9 Version 1.4 | 2018-06-21 Recommended Solder Pad 3) Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L

10 Version 1.4 | 2018-06-21 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* T P to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range Taping 3)

11 Version 1.4 | 2018-06-21 Tape and Reel 4) W FE Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 1500

12 Version 1.4 | 2018-06-21 Barcode-Product-Label (BPL) Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. Dry Packing Process and Materials 3) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label

13 Version 1.4 | 2018-06-21 Transportation Packing and Materials 3) OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO (X) PROD NO (9D) D/C: 11(1T) LO T NO 210021998 123GH1234 0 24 5 (Q)QTY : 2000 0144 (G) GROUP

260 C RT240 C

R 220 C R ML Bin3 :Bin2: Q-1-2 Bin1: P-1-20 LSY T676 2 2a Tem p ST R18 DEMY PACKVAR: R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP:

260 C RT

240 C R

220 C R

MLBin3:Bin2: Q-1-20 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label M oisture Leve l 3 Fl oo r tim e 16

8 Hours

M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C , or reflow, vapor- pha se ref low, or equiva lent proce ssing (peak packa ge 2. After this bag is opened, device s that will be subjecte d to infrared 1. Sh elf life in sealed bag: 24 m on th s at 40 ˚C and < 90% relative hu mi dity (R H). M oisture L evel 5a at factory co nditions of (if blank, seal date is identica l with da te co de) M ounte d within b) St ore d at body tem 3. Devic es re quire baking, bef ore m ounting, if: Bag seal date M oisture Leve l 1 M oisture Leve l 2 M oisture Leve l 2a4. If baking is require b) 2a or 2b is not me Date and tim e op ened re fere nce IPC/JED EC ST D-033 for bake procedur Floor tim e se e below If blan k, see ba r co de label Floor tim e >

1 Year

eeks10% RH. M oisture Le ve l 4 M oisture Level 5 ˚C). OPT O SE MICONDUCT ORS MO ISTU RE SE NSITIVE This ba g contains CA UTIO N Floo r tim e 72 Hours Floor time

48 Hours

24 Hours

/60% RH. LE VE L If blank, see bar code label Barcode label Dimensions of transportation box in mm Width Length Height 195 ± 5 mm 195 ± 5 mm 30 ± 5 mm

14 Version 1.4 | 2018-06-21 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita- tion, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro- duction, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related informations please visit www.osram-os.com/appnotes

15 Version 1.4 | 2018-06-21 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language word- ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the OSRAM OS Webside. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi- nate the customer-specific request between OSRAM OS and Buyer and/or Customer.

16 Version 1.4 | 2018-06-21 Glossary 1) Testing temperature: TA = 25°C 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec- essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 4) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

17 Version 1.4 | 2018-06-21 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.