SFH4258_12 OSRAM | Alldatasheet

Document overview

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Technical content

Features

 High Power Infrared LED  Half angle SFH 4258: ± 15°  Half angle SFH 4259: ± 25°  High forward current allowed at high temperature  Short switching times

Applications

 Infrared Illumination for cameras  IR Data Transmission  Optical sensors Safety Advices Depending on the mode of operation, these devices emit highly concentrated non visible infrared light which can be hazardous to the human eye. Products which incorporate these devices have to follow the safety precautions given in IEC 60825-1 and IEC 62471.

SFH 4258, SFH 4259 Grenzwerte (TA = 25 °C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range Top , Tstg – 40 … + 100 °C Sperrspannung Reverse voltage VR 5 V Vorwärtsgleichstrom Forward current IF 100 mA Stoßstrom, tp = 100 μs, D = 0 Surge current IFSM 1.5 A Verlustleistung Power dissipation Ptot 180 mW Wärmewiderstand Sperrschicht - Umgebung bei Montage auf FR4 Platine, Padgröße je 16 mm2 Thermal resistance junction - ambient mounted on PC-board (FR4), padsize 16 mm 2 each Wärmewiderstand Sperrschicht - Lötstelle bei Montage auf Metall-Block Thermal resistance junction - soldering point, mounted on metal block RthJA RthJS 300 140 K/W K/W Kennwerte (TA = 25 °C) Characteristics Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlänge der Strahlung Wavelength at peak emission IF = 100 mA λpeak 860 nm Centroid-Wellenlänge der Strahlung Centroid wavelength IF = 100 mA λcentroid 850 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA Δλ 42 nm Abstrahlwinkel Half angle SFH 4258 SFH 4259 ϕ ϕ ± 15 ± 25 Grad deg.

SFH 4258, SFH 4259 2010-12-17 3 Aktive Chipfläche Active chip area A 0.09 mm2 Abmessungen der aktiven Chipfläche Dimension of the active chip area L × B L × W 0.3 × 0.3 mm² Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Ω Switching times, Ιe from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 Ω tr, tf 12 ns Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 µs VF VF 1.5 (< 1.8) 2.4 (< 3.0) V V Sperrstrom Reverse current IR not designed for reverse operation μA Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms Φe typ 50 mW Temperaturkoeffizient von Ie bzw. Φe, IF = 100 mA Temperature coefficient of Ie or Φe, IF = 100 mA TCI – 0.5 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV – 0.7 mV/K Temperaturkoeffizient von λ, IF = 100 mA Temperature coefficient of λ, IF = 100 mA TCλ + 0.3 nm/K Kennwerte (TA = 25 °C) Characteristics (cont’d) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit

SFH 4258, SFH 4259 Strahlstärke Ie in Achsrichtung1) gemessen bei einem Raumwinkel Ω = 0.01 sr Radiant Intensity Ie in Axial Direction at a solid angle of Ω = 0.01 sr Bezeichnung Parameter Symbol Werte Values Einheit Unit SFH 4258 SFH 4258 SFH 4258 -AW Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max 125 100 200 mW/sr mW/sr Strahlstärke Radiant intensity IF = 1A, tp = 100 µs Ie typ. 400 600 800 mW/sr SFH 4259 SFH 4259 Strahlstärke Radiant intensity IF = 100 mA, tp = 20 ms Ie min Ie max mW/sr mW/sr Strahlstärke Radiant intensity IF = 1A, tp = 100 µs Ie typ. 250 350 mW/sr 1) Nur eine Gruppe in einer Verpackungseinheit (Streuung kleiner 2:1) / Only one group in one packing unit (variation lower 2:1)

SFH 4258, SFH 4259 2010-12-17 5 Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) Abstrahlcharakteristik Radiation Characteristics Irel = f (ϕ) 0.2 0.4 1.0 0.8 0.6 ϕ 1.0 0.8 0.6 0.4 50˚ 60˚ 70˚ 80˚ 90˚ 100˚ SFH 4258 SFH 4259 OHL00999 100˚ 90˚ 80˚ 70˚ 60˚ 50˚ 0.2 0.4 0.6 0.8 1.0ϕ

SFH 4258, SFH 4259 2010-12-17 6 Relative Spectral Emission Irel = f (λ) Forward Current IF = f (VF) Single pulse, tp = 20 μs 700 nm OHF04135 100 950750 800 850 Irel λ OHL01713 FI 10-4 0.5 1 1.5 2 2.5 V3 100 A FV -110 10-2 Radiant Intensity Single pulse, tp = 20 μs Permissible Pulse Handling Capability IF = f (τ), TA = 25 °, duty cycle D = parameter Ie Ie 100 mA = f (IF) OHL01715 10-3 mA 101 010 10-1 e e (100 mA) I I IF 010 110 210 31055 0.05 210-1-2-3-4-5 1010 1010 10 tp 10 10 s10 0.1 0.005 0.02 0.01 D = T tAIF D = IP T F Pt OHF02505 0.2 0.5 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 0.033 Max. Permissible Forward Current IF = f (TA), RthJA = 300 K/W 00 ˚C T IF mA OHL01716 A 100 120 20 40 60 80 120

SFH 4258, SFH 4259 2010-12-17 7 Maßzeichnung Package Outlines Maße in mm (inch) / Dimensions in mm (inch). Gehäuse / Package Power TOPLED® mit Linse, klarer Verguss / Power TOPLED® with lens, clear resin Anschlussbelegung pin configuration 1 = Kathode / cathode 2/3/4 = Anode / anode 3.8 (0.150) max. ø2.55 (0.100) 0.13 (0.005) 0.18 (0.007) 0.1 (0.004) typ 1.1 (0.043) 0.5 (0.020) 2.6 (0.102) 3.4 (0.134) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.7 (0.146) 3.3 (0.130) 4˚±1 GPLY6127 0.4 (0.016) 0.6 (0.024) 0.9 (0.035) 0.7 (0.028) 1.7 (0.067) 2.1 (0.083) 0.6 (0.024) 0.8 (0.031) ø2.60 (0.102) Package marking (2.4) (0.095) SFH 4258 3.5 (0.138) max. ø2.55 (0.100) 0.13 (0.005) 0.18 (0.007) 0.1 (0.004) typ 1.1 (0.043) 0.5 (0.020) 2.6 (0.102) 3.4 (0.134) 3.0 (0.118) 2.1 (0.083) 2.3 (0.091) 3.0 (0.118) 3.7 (0.146) 3.3 (0.130) 4˚±1 GPLY6128 0.4 (0.016) 0.6 (0.024) 0.9 (0.035) 0.7 (0.028) 1.7 (0.067) 2.1 (0.083) ø2.60 (0.102) Package marking (2.4) (0.095) SFH 4259

SFH 4258, SFH 4259 Empfohlenes Lötpaddesign Reflow Löten Recommended Solder Pad Design Reflow Soldering Empfohlenes Lötpaddesign Wellenlöten TTW Recommended Solder Pad Design TTW Soldering OHFP3021 Padgeometrie für verbesserte Wärmeableitung improved heat dissipation Paddesign for Lötstoplack Solder resist 0.8 (0.031) 3.7 (0.146) 1.1 (0.043) 2.3 (0.091) 3.3 (0.130) 1.5 (0.059) 11.1 (0.437) Cu Fläche / 16 mm per pad2 Cu-area 3.3 (0.130) 0.7 (0.028) OHPY3040 6.1 (0.240) 2.8 (0.110) 2 (0.079) 3 (0.118) 6 (0.236) 2 (0.079) 1 (0.039) Solder resist Lötstoplack PCB-direction Bewegungsrichtung der Platine 2 (0.079) Padgeometrie für improved heat dissipation verbesserte Wärmeableitung Paddesign for 2Cu Fläche / > 16 mm per pad Cu-area

SFH 4258, SFH 4259 2010-12-17 9 Lötbedingungen Vorbehandlung nach JEDEC Level 2 Soldering Conditions Preconditioning acc. to JEDEC Level 2 Reflow Lötprofil für bleifreies Löten (nach J-STD-020-D.01) Reflow Soldering Profile for lead free soldering (acc. to J-STD-020-D.01) Pb-Free (SnAgCu) Assembly Profile Feature Recommendation Max. Ratings Ramp-up Rate to Preheat*) 25°C to 150°C 2°K / sec 3°K / sec Time ts from TSmin to TSmax (150°C to 200°C 100s min. 60sec max. 120sec Ramp-up Rate to Peak*) TSmax to TP 2°K / sec 3°K / sec Liquidus Temperture TL 217°C Time tL above TL 80sec max. 100sec Peak Temperature TP 245°C max. 250°C Time tP within 5°C of the specified peak temperature TP - 5K 20sec min. 10sec max. 30sec Ramp-down Rate* TP to 100°C 3°K / sec 4°K / sec maximum Time 25°C to Peak temperature max. 8 min. All temperatures refer to the center of the package, measured on the top of the component * slope calculation ΔT/Δt: Δt max. 5 sec; fulfillment for the whole T-range 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L

SFH 4258, SFH 4259 Wellenlöten (TTW) (nach CECC 00802) TTW Soldering (acc. to CECC 00802) Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserv ed. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of tr ansport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or system s must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. OHLY0598 50 100 150 200 250 100 150 200 250 300 T t C s 235 C 10 s C... 260 1. Welle 1. wave 2. Welle 2. wave

5 K/s 2 K/sca 200 K/s

CC... 130100

2 K/s

Zwangskühlung forced cooling Normalkurve standard curve Grenzkurven limit curves

720-SFH4258-Z - Osram Opto Semiconductor SFH 4258-Z 720-SFH4259-Z - Osram Opto Semiconductor SFH 4259-Z