BPW-34-BS AMSOSRAM | Alldatasheet
Document overview
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Technical content
1 Version 1.7 | 2018-06-21 Produktdatenblatt | Version 1.1 www.osram-os.com BPW 34 BS DIL SMT Silicon PIN Photodiode with Enhanced Blue Sensitiv- ity; in SMT
Applications
—Electronic Equipment Features: —Package: clear epoxy —Corrosion Robustness Class: 3B —ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) —Especially suitable for applications from 350 nm to 1100 nm —Short switching time (typ. 25 ns) —DIL plastic package with high packing density
Ordering Information
Type Photocurrent Photocurrent Ordering Code typ. Ee = 1 mW/cm²; λ = 400 nm; VR = 5 V Ee = 1 mW/cm²; λ = 400 nm; VR = 5 V IP IP BPW 34 BS-Z ≥ 10.8 µA 14.8 µA Q65110A2625
2 Version 1.7 | 2018-06-21 Maximum Ratings TA = 25 °C Parameter Symbol Values Operating Temperature Top min. max. -40 °C 85 °C Storage temperature Tstg min. max. -40 °C 85 °C Reverse voltage V R max. 32 V Total power dissipation Ptot max. 150 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD 2 kV
3 Version 1.7 | 2018-06-21 Characteristics TA = 25 °C Parameter Symbol Values Spectral sensitivity VR = 5 V; Std. Light A; T = 2856 K S typ. 75 nA/lx Wavelength of max sensitivity λS max typ. 850 nm Spectral range of sensitivity λ10% typ. 350 ... 1100 nm Radiant sensitive area A typ. 7.45 mm² Dimensions of active chip area L x W typ. 2.73 x 2.73 mm x mm Half angle φ typ. 60 ° Dark current VR = 10 V IR typ. max. 2 nA 30 nA Spectral sensitivity of the chip λ = 400 nm Sλ typ. 0.2 A / W Quantum yield of the chip λ = 400 nm η typ. 0.62 Electrons / Photon Open-circuit voltage Ev = 1000 lx; Std. Light A VO typ. 390 mV Short-circuit current Ee = 0.5 mW/cm²; λ = 400 nm ISC typ. 7.4 µA Rise time V R = 5 V; RL = 50 Ω; λ = 850 nm tr typ. 0.025 µs Fall time V R = 5 V; RL = 50 Ω; λ = 850 nm tf typ. 0.025 µs Forward voltage IF = 100 mA; E = 0 VF typ. 1.3 V Capacitance VR = 0 V; f = 1 MHz; E = 0 C0 typ. 72 pF Temperature coefficient of voltage TCV typ. -2.6 mV / K Temperature coefficient of short-circuit current Std. Light A TCI typ. 0.18 % / K Noise equivalent power VR = 10 V; λ = 400 nm NEP typ. 0.127 pW / Hz1/2 Detection limit D* typ. 2.2e12 cm x Hz1/2 / W
4 Version 1.7 | 2018-06-21 λ OHF01001 relS 400 600 800 1000 1200 100 nm Relative Spectral Sensitivity 1), 2) Srel = f (λ) OHF01402 40 30 20 10 20 40 60 80 100 1200.40.60.81.0 ϕ 0.2 0.4 0.6 0.8 1.0 100 Directional Characteristics 1), 2) Srel = f (φ)
5 Version 1.7 | 2018-06-21 OHF00080 Ι R RV 0 5 10 15 V 20 1000 2000 3000 4000 pA Dark Current 1), 2) IR = f (VR) ; E = 0 E OHF01066 V 010 PΙ -110 10 1 10 2 10 4 10 0 10 1 10 2 10 34 10 310 210 110 10 0 VO µ Am V ΙP VO 10 3 lx Photocurrent/Open-Circuit Voltage 1), 2) IP (VR = 5 V) / VO = f (Ev) V OHF00081 R -210 C 0 -110 010 110 210V pF 100 Capacitance 1), 2) C = f (VR); f = 1 MHz; E = 0;
6 Version 1.7 | 2018-06-21 OHF05716 AT 100 101 102 103 10-1 ˚C02 04 06 08 0 100 RI nA Dark Current 2) IR = f (TA); E = 0; VR = 10 V T OHF00958 A totP 0 20 40 60 80 ˚C 100 mW 100 120 140 160 Power Consumption Ptot = f (TA);
7 Version 1.7 | 2018-06-21 Dimensional Drawing 3) Approximate Weight: 44.0 mg Package marking: Cathode Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)
8 Version 1.7 | 2018-06-21 Reflow Soldering Profile Product complies to MSL Level 4 acc. to JEDEC J-STD-020E 00 s OHA04525 100 150 200 250 300 50 100 150 200 250 300 t T St t Pt Tp240 ˚C 217 ˚C 245 ˚C 25 ˚C L Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C 2 3 K/s Time tS TSmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 s Ramp-down rate* T P to 100 °C 3 6 K/s Time 25 °C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
9 Version 1.7 | 2018-06-21 Taping 3) Tape and Reel 4) W FE Direction of unreeling N A OHAY0324 Label Leader: Trailer: 13.0 Direction of unreeling ±0.25 min. 160 mm * min. 400 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D
10 Version 1.7 | 2018-06-21 Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 1500 Barcode-Product-Label (BPL)
11 Version 1.7 | 2018-06-21 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. Dry Packing Process and Materials 3) OHA00539 OSRAM Moisture-sensitive label or print Barcode label Desiccant Humidity indicator Barcode label OSRAM Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. WET Do not eat. Comparator check dot parts still adequately dry. examine units, if necessary examine units, if necessary 15% 10%bake units bake units If wet, change desiccant If wet, Humidity Indicator MIL-I-8835 If wet, M oisture Level 3 Floor tim e 168 Hours M oisture Level 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or reflow, vapor-phase reflow, or equivalent processing (peak package 2. After this bag is opened, devices that will be subjected to infrared 1. Shelf life in sealed bag: 24 m onths at < 40 ˚C and < 90% relative hum idity (RH). M oisture Level 5a at factory conditions of (if blank, seal date is identical with date code). a) M ounted within b) Stored at body tem 3. Devices require baking, before m ounting, if: Bag seal date M oisture Level 1 M oisture Level 2 M oisture Level 2a4. If baking is required, b) 2a or 2b is not m et. Date and tim e opened: reference IPC/JEDEC J-STD-033 for bake procedure. Floor tim e see below If blank, see bar code label Floor tim e > 1 Year Floor tim e 1 Year Floor tim e 4 W eeks10% RH. M oisture Level 4 M oisture Level 5 ˚C). OPTO SEMICONDUCTORS MOISTURE SENSITIVE This bag contains CAUTION Floor tim e 72 Hours Floor tim e 48 Hours Floor tim e 24 Hours 30 ˚C/60% RH. LEVEL If blank, see bar code label Transportation Packing and Materials 3) OHA02044 PACKVAR:R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BA TCH NO (X) PRO D NO (9D) D/C 11(1T) LO T NO 210021998 123GH1234 0 24 5 (Q)QTY : 2000 014 (G) GROUP:
260 C RT240 C
R 220 C R ML Bin3 :Bin2: Q-1-2 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY PACKVAR: R077Additional TEXT P-1+Q-1 Multi TOPLED Muster OSRAM Opto Semiconductors (6P) BATCH NO: (X) PROD NO: (9D) D/C: 11(1T) LOT NO: 210021998 123GH1234 0 24 5 (Q)QTY: 2000 0144 (G) GROUP:
260 C RT
240 C R
220 C R
MLBin3:Bin2: Q-1-20 Bin1: P-1-20 LSY T676 2 2a Temp ST R18 DEMY OSRAM Packing Sealing label Barcode label M oisture Leve l 3 Fl oo r tim e 16
8 Hours
e Leve l 6 Floor tim e 6 Hours a) Hum idity Indicator Card is > 10% when re ad at 23 ˚C ± 5 ˚C , or reflow, vapor- pha se ref low, or equiva lent proce ssing (peak packa ge 2. After this bag is opened, device s that will be su bjecte d to inf rared 1. Sh elf life in sea led bag: 24 m on th s at 40 ˚C and < 90% relative hu mi dity (R M oisture Le vel 5a at factory co nditions of (if blank, se al date is ide ntica l with da te co de) M ounte d within b) St ore d at body tem Devic es re quire baking, be fo re m ounting, if: Bag seal date M oisture Leve l 1 M oisture Leve l 2 M oistur e Leve l 2a4. If baking is require b) 2a or 2b is not me Dat e and tim e op ened re fere nce IPC/JED EC J-ST D-033 for bake pr ocedur Floo r tim e se e below If blan k, see b ar co de label Floo r tim e >
1 Year
r Floor tim e 4 W eeks10% RH. M oistur e Le ve l 4 Mo isture Level 5 ˚C). OPT O SE MICONDUCT OR S MO ISTURE SE NSITIVE This ba g contains CA UTIO N Floo r tim e 72 Hours Floor time
48 Hours
24 Hours
/60% RH LE VE L If blank, see bar code label Barcode label
12 Version 1.7 | 2018-06-21 Dimensions of transportation box in mm Width Length Height 195 ± 5 mm 195 ± 5 mm 30 ± 5 mm
13 Version 1.7 | 2018-06-21 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo- sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita- tion, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There- fore, we recommend that customers minimize LED exposure to aggressive substances during storage, pro- duction, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related informations please visit www.osram-os.com/appnotes
14 Version 1.7 | 2018-06-21 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language word- ings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version in the OSRAM OS Webside. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi- nate the customer-specific request between OSRAM OS and Buyer and/or Customer.
15 Version 1.7 | 2018-06-21 Glossary 1) Testing temperature: TA = 25°C 2) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not nec- essarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 4) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
16 Version 1.7 | 2018-06-21 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.