PEMH4 NEXPERIA | Alldatasheet

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  • Manufacturer or author: NXP Semiconductors
  • PDF pages: 9

Technical content

Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

Supersedes data of 2003 Oct 02

2004 Apr 14

PEMH4; PUMH4 NPN/NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open

2004 Apr 14 2

NXP Semiconductors Product data sheet NPN/NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open PEMH4; PUMH4

FEATURES

  • Built-in bias resistors
  • Simplified circuit design
  • Reduction of component count
  • Reduced pick and place costs.

APPLICATIONS

  • Low current peripheral driver
  • Replacement of general purpose transistors in digital
  • Control of IC inputs.

DESCRIPTION

NPN/NPN resistor-equipped transistors (see “Simplified outline, symbol and pinning” for package details). QUICK REFERENCE DATA SYMBOL PARAMETER TYP. MAX. UNIT VCEO collector-emitter voltage − 50 V IO output current (DC) − 100 mA TR1 NPN − − − TR2 NPN − − − R1 bias resistor 10 − kΩ R2 bias resistor open − − PRODUCT OVERVIEW Note 1. * = p: Made in Hong Kong. * = t: Made in Malaysia. TYPE NUMBER PACKAGE MARKING CODE(1) NPN/PNP COMPLEMENT PNP/PNP COMPLEMENTPHILIPS EIAJ PEMH4 SOT666 − H4 PEMD4 PEMB4 PUMH4 SOT363 SC-88 H*4 PUMD4 PUMB4 SIMPLIFIED OUTLINE, SYMBOL AND PINNING TYPE NUMBER SIMPLIFIED OUTLINE AND SYMBOL PINNING PIN DESCRIPTION PEMH4 1 emitter TR1 PUMH4 2 base TR1 3 collector TR2 4 emitter TR2 5 base TR2 6 collector TR1 handbook, halfpage MAM453 123 46 5 Top view 654 123 TR1 TR2

2004 Apr 14 3

NXP Semiconductors Product data sheet NPN/NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open PEMH4; PUMH4

ORDERING INFORMATION

In accordance with the Absolute Maximum Rating System (IEC 60134). Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. TYPE NUMBER PACKAGE NAME DESCRIPTION VERSION PEMH4 − Plastic surface mounted package; 6 leads SOT666 PUMH4 − Plastic surface mounted package; 6 leads SOT363 SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per transistor VCBO collector-base voltage open emitter − 50 V VCEO collector-emitter voltage open base − 50 V VEBO emitter-base voltage open collector − 5 V IO output current (DC) − 100 mA ICM peak collector current − 100 mA Ptot total power dissipation Tamb ≤ 25 °C SOT363 note 1 − 200 mW SOT666 notes 1 and 2 − 200 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Per device Ptot total power dissipation Tamb ≤ 25 °C SOT363 note 1 − 300 mW SOT666 notes 1 and 2 − 300 mW

2004 Apr 14 4

NXP Semiconductors Product data sheet NPN/NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open PEMH4; PUMH4 THERMAL CHARACTERISTICS Notes 1. Device mounted on an FR4 printed-circuit board, single-sided copper, standard footprint. 2. Reflow soldering is the only recommended soldering method. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL PARAMETER CONDITIONS VALUE UNIT Per transistor Rth(j-a) thermal resistance from junction to ambient Tamb ≤ 25 °C SOT363 note 1 625 K/W SOT666 notes 1 and 2 625 K/W Per device Rth(j-a) thermal resistance from junction to ambient Tamb ≤ 25 °C SOT363 note 1 416 K/W SOT666 notes 1 and 2 416 K/W SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per transistor ICBO collector-base cut-off current VCB = 50 V; IE = 0 − − 100 nA ICEO collector-emitter cut-off current VCE = 30 V; IB = 0 − − 1 μA VCE = 30 V; IB = 0; Tj = 150 °C − − 50 μA IEBO emitter-base cut-off current VEB = 5 V; IC = 0 − − 100 nA hFE DC current gain VCE = 5 V; IC = 1 mA 200 − − VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA − − 150 mV R1 input resistor 7 10 13 kΩ Cc collector capacitance VCB = 10 V; IE = ie = 0; f = 1 MHz − − 2.5 pF

2004 Apr 14 5

NXP Semiconductors Product data sheet NPN/NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open PEMH4; PUMH4 PACKAGE OUTLINE UNIT b p cD E e1 HE Lp w REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 IEC JEDEC JEITA mm 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 0.5 e 1.0 1.7 1.5 0.1 y 0.1 DIMENSIONS (mm are the original dimensions) 0.3 0.1 SOT666 bp pin 1 index D e A Lp detail X HE EA S 0 1 2 mm scale A 0.6 0.5 c X 123 456 Plastic surface-mounted package; 6 leads SOT66 6 YS w M A

2004 Apr 14 6

NXP Semiconductors Product data sheet NPN/NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open PEMH4; PUMH4 REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT363 SC-88 wBMbp D e pin 1 index A Lp Q detail X HE E v M A AB y 0 1 2 mm scale c X 13 2 456 Plastic surface-mounted package; 6 leads SOT36 3 UNIT A1 max bp cD E e1 HE Lp Qy wv mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.10.2 DIMENSIONS (mm are the original dimensions) 0.45 0.15 0.25 0.15 A 1.1 0.8 04-11-08 06-03-16

2004 Apr 14 7

NXP Semiconductors Product data sheet NPN/NPN resistor-equipped transistors; R1 = 10 kΩ, R2 = open PEMH4; PUMH4 DATA SHEET STATUS Notes 1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Printed in The Netherlands R75/05/pp8 Date of release: 2004 Apr 14 Document order number: 9397 750 13086