ES2DVR NEXPERIA | Alldatasheet

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Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

200 V, 2 A hyperfast PN-rectifier

12 January 2017 Product data sheet

small and flat lead SOD123W Surface-Mounted Device (SMD) plastic package.

  • Reverse voltage VR ≤ 200 V
  • Forward current IF ≤ 2 A
  • Hyperfast recovery time trr ≤ 25 ns
  • Pt doped life time control
  • Low inductance
  • Small and flat lead SMD plastic package
  • Package height typ. 1 mm
  • High power capability due to clip-bond technology
  • Planar die design 3. Applications
  • General-purpose rectification
  • Reverse polarity protection
  • Hyperfast switching
  • Freewheeling applications 4. Quick reference data

Table 1. Quick reference data [1] Very short test pulse to keep the junction termperature unchanged.

Table 2. Pinning information

1 K cathode

2 A anode

Table 3. Ordering information Table 4. Marking codes

Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. Table 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2. [3] Soldering point of cathode tab.

ES2DVR All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved Product data sheet 12 January 2017 4 / 13 aaa-026145 102 103 Zth(j-a) (K/W) 10-1 tp (s) 10-3 102 10310110-2 10-1 duty cycle = 1 0.01 0.25 0.33 0.75 0.05 0.10 0.50 0.02 0.20 FR4 PCB, standard footprint Fig. 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values aaa-026146 102 103 Zth(j-a) (K/W) 10-1 tp (s) 10-3 102 10310110-2 10-1 duty cycle = 1 0.01 0.25 0.20 0.330.50 0.75 0.10 0.05 0.02 FR4 PCB, mounting pad for cathode 1 cm2 Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values

Table 7. Characteristics [1] Very short test pulse to keep the junction termperature unchanged.

ES2DVR All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved Product data sheet 12 January 2017 6 / 13 VR (V) 0 20016080 12040 aaa-026163 Cd (pF) f = 1 MHz; Tamb = 25 °C Fig. 5. Diode capacitance as a function of reverse voltage; typical values aaa-026164 IF(AV) (A) 0 321 1.0 1.5 0.5 2.0 2.5 PF(AV) (W) (1) (2) (3) (4) Tj = 150 °C (1) δ = 0.1 (2) δ = 0.2 (3) δ = 0.5 (4) δ = 0.8 (5) δ = 1 Fig. 6. Average forward power dissipation as a function of average forward current; typical values VR (V) 0 20015050 100 aaa-026165 0.00050 0.00025 0.00075 0.00100 PR(AV) (W) (1) (2) (3) (4) Tj = 150 °C (1) δ = 1 (2) δ = 0.9 (3) δ = 0.8 (4) δ = 0.5 Fig. 7. Average reverse power dissipation as a function of reverse voltage; typical values Tamb (°C) 17512525 150100500 75 aaa-026166 1.0 0.5 1.5 2.0 IF(AV) (A) (1) (2) (3) (4) FR4 PCB, standard footprint Tj = 150 °C (1) δ = 1; DC Fig. 8. Average forward current as a function of ambient temperature; typical values

ES2DVR All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved Product data sheet 12 January 2017 7 / 13 Tamb (°C) 0 50 100 150 1751257525 aaa-026167 IF(AV) (A) (1) (2) (3) (4) FR4 PCB, mounting pad for cathode 1 cm2 Tj = 150 °C (1) δ = 1; DC Fig. 9. Average forward current as a function of ambient temperature; typical values Tsp (°C) 0 50 100 150 1751257525 aaa-026168 IF(AV) (A) (1) (2) (3) (4) Tj = 150 °C (1) δ = 1; DC Fig. 10. Average forward current as a function of solder point temperature; typical values 11. Test information time IF IR trr IR(meas) 006aad022 Fig. 11. Reverse recovery definition; step recovery

ES2DVR All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved Product data sheet 12 January 2017 8 / 13 003aac562 trr time 100 % 25 % IF dlF dt IR IRM Qr Fig. 12. Reverse recovery definition; ramp recovery 001aab912 time time VFRM VF IF VF Fig. 13. Forward recovery definition P t 006aaa812 duty cycle δ = Fig. 14. Duty cycle definition The current ratings for the typical waveforms are calculated according to the equations: IF(AV) = IM × δ with IM defined as peak current, IRMS = IF(AV) at DC, and IRMS = IM × √δ with IRMS defined as RMS current.

ES2DVR All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved Product data sheet 12 January 2017 9 / 13 12. Package outline 08-11-06Dimensions in mm 2.8 2.4 3.7 3.3 1.05 0.75 1.9 1.5 0.6 0.3 0.22 0.10 1.1 0.9 Fig. 15. Package outline SOD123W 13. Soldering 2.9 2.8 4.4 1.62.1 1.2 (2×) 1.1 (2×) solder lands solder resist occupied area solder paste 1.1 (2×) 1.2 (2×) sod123w_fr Dimensions in mm Fig. 16. Reflow soldering footprint for SOD123W

Table 8. Revision history

ES2DVR All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved Product data sheet 12 January 2017 11 / 13 15. Legal information Data sheet status Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. Definitions Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. 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ES2DVR All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved Product data sheet 12 January 2017 12 / 13 In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Bitsound, CoolFlux, CoReUse, DESFire, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, MIFARE, MIFARE Plus, MIFARE Ultralight, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP Semiconductors N.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation.

ES2DVR All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved Product data sheet 12 January 2017 13 / 13 16. Contents © NXP Semiconductors N.V. 2017. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 12 January 2017