PSMN010-25YLC NEXPERIA | Alldatasheet
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Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
Table 1. Quick reference data
Table 2. Pinning information
4 G gate
Table 3. Ordering information
Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
Product data sheet Rev. 2 — 25 October 2011 4 of 15 NXP Semiconductors PSMN010-25YLC N-channel 25 V 10.6 mΩ logic level MOSFET in LFPAK using NextPower technology Fig 3. Single pulse avalanche rating; avalanc he current as a function of avalanche time Fig 4. Safe operating area; continuous and peak drain currents as a function of drain-source voltage 003aag231 10-1 102 10-3 10-2 10-1 1 10 tAL (ms) IAL (A) (1) (2) 003aag232 10-1 102 103 10-1 1 10 102 VDS (V) ID (A) Limit RDSon = VDS / ID DC 100 μs 10 ms tp =10 μs 100 ms 1 ms
Table 5. Thermal characteristics
Table 6. Characteristics
01234 VDS (V)
Product data sheet Rev. 2 — 25 October 2011 8 of 15 NXP Semiconductors PSMN010-25YLC N-channel 25 V 10.6 mΩ logic level MOSFET in LFPAK using NextPower technology Fig 8. Forward transconductance as a function of drain current; typical values Fig 9. Transfer characteristics; drain current as a function of gate-source voltage; typical values Fig 10. Sub-threshold drain current as a function of gate-source voltage Fig 11. Gate-source threshold voltage as a function of junction temperature 003aag236 0 1 02 03 04 0 I D (A) gfs (S) 003aag237 01234 VGS (V) ID (A) Tj = 25 °CTj = 150 °C 003aag238 10-6 10-5 10-4 10-3 10-2 10-1 0123 VGS (V) ID (A) Min Typ Max 003aag239 -60 0 60 120 180 Tj (°C) VGS(th) (V) Min (5mA) Max (1mA) ID = 5mA 1mA
Product data sheet Rev. 2 — 25 October 2011 9 of 15 NXP Semiconductors PSMN010-25YLC N-channel 25 V 10.6 mΩ logic level MOSFET in LFPAK using NextPower technology Fig 12. Drain-source on-state resistance as a function of drain current; typical values Fig 13. Normalized drain-source on-state resistance factor as a function of junction temperature Fig 14. Gate charge waveform definitions Fig 15. Gate-source voltage as a function of gate charge; typical values 003aag240 0 1 02 03 04 0 ID (A) RDSon (mΩ) 4.5 3.0VGS (V) = 2.8 3.5 003aag241 0.5 1.5 -60 0 60 120 180 Tj (°C) a VGS = 10V 4.5V 003aaa508 VGS VGS(th) QGS1 QGS2 QGD VDS QG(tot) ID QGS VGS(pl) 003aag242 048 1 2 Q G (nC) VGS (V) VDS = 12V 20V
Product data sheet Rev. 2 — 25 October 2011 10 of 15 NXP Semiconductors PSMN010-25YLC N-channel 25 V 10.6 mΩ logic level MOSFET in LFPAK using NextPower technology Fig 16. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values Fig 17. Source current as a function of source-drain voltage; typical values Fig 18. Reverse recovery timing definition 003aag243 102 103 10-1 1 10 102 VDS (V) C (pF) Ciss Crss Coss 003aag244 0 0.3 0.6 0.9 1.2 V SD (V) IS (A) Tj = 25 °CTj = 150 °C 003aaf 444 t (s ) ID (A) IRM
0.25 IRM
Product data sheet Rev. 2 — 25 October 2011 11 of 15 NXP Semiconductors PSMN010-25YLC N-channel 25 V 10.6 mΩ logic level MOSFET in LFPAK using NextPower technology 7. Package outline Fig 19. Package outline SOT669 (LFPAK; Power-SO8) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT669 MO-235 06-03-16 11-03-25 0 2.5 5 mm scale e b A2 bcA eUNIT DIMENSIONS (mm are the original dimensions) mm 1.10 0.95 A3A1 0.15 0.00 1.20 1.01 0.50 0.35 4.41 3.62 2.2 2.0 0.9 0.7 0.25 0.19 0.30 0.24 4.10 3.80 6.2 5.8 H 1.3 0.8 0.85 0.40 L 1.3 0.8 wyD (1) 5.0 4.8 E (1) 3.3 3.1 (1)D1(1) max 1 23 4 mounting base c Plastic single-ended surface-mounted package (LFPAK; Power-SO8); 4 leads SOT669 E H D A Aw M C C X 1/2 e yC θ θ (A )3 L A detail X Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
Table 7. Revision history Modifications: • Data sheet status changed from preliminary to product.
Product data sheet Rev. 2 — 25 October 2011 13 of 15 NXP Semiconductors PSMN010-25YLC N-channel 25 V 10.6 mΩ logic level MOSFET in LFPAK using NextPower technology 9. Legal information
9.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions
Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
9.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Document status [1] [2] Product status [3] Definition Objective [short] data sheet Development This document contai ns data from the objective specification for product development. Preliminary [short] data sheet Qua lification This document contains data from the preliminary specification. Product [short] data sheet Production This doc ument contains the product specification.
Product data sheet Rev. 2 — 25 October 2011 14 of 15 NXP Semiconductors PSMN010-25YLC N-channel 25 V 10.6 mΩ logic level MOSFET in LFPAK using NextPower technology Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications.
9.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation. 10. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PSMN010-25YLC N-channel 25 V 10.6 mΩ logic level MOSFET in LFPAK using NextPower technology © NXP B.V. 2011. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 October 2011 Document identifier: PSMN010-25YLC Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 11. Contents