PMBT3904QA NEXPERIA | Alldatasheet
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Technical content
Datasheet sections
- 40 V, 200 mA NPN switching transistor
40 V, 200 mA NPN switching transistor
29 August 2018 Product data sheet
Device (SMD) plastic package with visible and solderable side pads.
- Leadless ultra small SMD plastic package
- Low package height of 0.37 mm
- Suitable for Automatic Optical Inspection (AOI) of solder joint
- Power dissipation comparable to SOT23 3. Applications
- General-purpose switching and amplification 4. Quick reference data
Table 1. Quick reference data
Table 2. Pinning information
1 B base
2 E emitter
3 C collector
4 C collector
Table 3. Ordering information Table 4. Marking codes
Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint.
Table 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. [3] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. FR4 PCB, 4-layer copper, tin-plated and standard footprint.
Table 7. Characteristics
IC (mA) 10-1 1031021 10 (1) (2) (3) VCE = 1 V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig. 5. DC current gain as a function of collector current; typical values VCE (V) 0 1084 62 006aab116 0.10 0.05 0.15 0.20 IC (A) 0.0 IB (mA) = 5.0 4.5 3.5 3.0 2.5 2.0 1.5 1.0 0.5 4.0 Tamb = 25 °C Fig. 6. Collector current as a function of collector- emitter voltage; typical values 006aab117 0.4 0.8 1.2 VBE (V) IC (mA) 10- 1 1031021 10 (1) (2) (3) VCE = 1 V (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 150 °C Fig. 7. Base-emitter voltage as a function of collector current; typical values 006aab118 IC (mA) 10- 1 1031021 10 0.5 0.9 1.3 VBEsat (V) 0.1 (1) (2) (3) IC/IB = 10 (1) Tamb = −55 °C (2) Tamb = 25 °C (3) Tamb = 150 °C Fig. 8. Base-emitter saturation voltage as a function of collector current; typical values PMBT3904QA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Product data sheet 29 August 2018 6 / 13
IC (mA) 10- 1 1031021 10 10- 1 VCEsat (V) 10- 2 (1) (3) (2) IC/IB = 10 (1) Tamb = 150 °C (2) Tamb = 25 °C (3) Tamb = −55 °C Fig. 9. Collector-emitter saturation voltage as a function of collector current; typical values PMBT3904QA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Product data sheet 29 August 2018 7 / 13
- Test information 006aaa003 IBon (100 %) IB input pulse (idealized waveform) IBoff 90 % 10 % IC (100 %) IC td ton 90 % 10 % tr output pulse (idealized waveform) tf t ts toff Fig. 10. Transistor switching time definition RC DUT mlb826 Vo RB (probe) 450 Ω (probe) 450 Ωoscilloscope oscilloscope VBB VI VCC Fig. 11. Test circuit for switching times PMBT3904QA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Product data sheet 29 August 2018 8 / 13
- Package outline ReferencesOutline version European projection Issue date IEC JEDEC JEITA SOT1215 sot1215_po 13-03-05 13-03-06 Unit mm min nom max 0.245 1.05 0.1 A Dimensions (mm are the original dimensions) Note 1. Dimension A is including plating thickness. DFN1010D-3: plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body: 1.1 x 1.0 x 0.37 mm SOT1215 A1 b 0.22 b1 D E1 e e1 0.20 0.225 0.25 0.275 0.17 0.195 0.16 0.240.40 0.37 0.34 0.04 0.325 0.275 1.150.30 0.25 scale L 0 1 mm 0.87 0.95 D1 E 0.95 1.05 b (2x) e pin 1 index area solderable lead end, protrusion max. 0.02 mm (3x) visible depend upon used manufacturing technology (2x) visible depend upon used manufacturing technology (4x) D b1 L (2x) E A 1 2 Fig. 12. Package outline DFN1010D-3 (SOT1215) PMBT3904QA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Product data sheet 29 August 2018 9 / 13
- Soldering SOT1215Footprint information for reflow soldering of DFN1010D-3 package sot1215_fr solder land solder resist solder land plus solder paste occupied area Dimensions in mm Issue date 12-11-23 13-03-06 0.3 0.75 1.1 0.40.35 (2x) 0.45 (2x) 0.3 1.2 0.25 (2x) 0.5 0.4 0.5 1.41.5 0.3 0.3 0.4 0.5 1.3 0.4 0.4 0.5 1.3 Fig. 13. Reflow soldering footprint for DFN1010D-3 (SOT1215) PMBT3904QA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Product data sheet 29 August 2018 10 / 13
Table 8. Revision history
- Legal information Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the internet at https://www.nexperia.com. Definitions Draft — The document is a draft version only. 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Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. PMBT3904QA All information provided in this document is subject to legal disclaimers. © Nexperia B.V. 2018. All rights reserved Product data sheet 29 August 2018 12 / 13