PLH7070-WCUV02 P-TEC | Alldatasheet

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 High reliability  RoHS Compliant  10W, 700mA Mechanical Dimensions Notes: 1. Dimensions in millimeters unless otherwise noted, 2. Tolerance is ±0.13mm unless otherwise noted, Soldering terminals may shift in the x, y direction. 3. Specifications subject to change without notice

www.p-tec.net 093015 Rev0 MS Page 2 of 9 Device Selection Guide Model Number Chip Resin Material Emitting Color Clear PLH7070-WCUV02 InGaAiN Ultraviolet (UV) Electro-Optical Characteristics Color Peak Wavelength (λp) 2ϴ1/2 Temperature Coefficient of Vf (mV/°C) Thermal Resistance Junction to Pad Min Max ΔVF /ΔTJ (°C/W) RΘJ‐L U2B 365 370 65 -17 3.2 °C/W U3A 370 375 65 -17 3.2 °C/W Notes: 1. The peak/dominant wavelength is measured with an accuracy of ±1nm. Absolute Maximum Ratings at Ta=25°C Parameter Rating DC Forward Current (mA) 700mA LED Junction Temperature 150°C LED Operating Temperature -40°C ~ 85°C Storage Temperature -40°C ~ 125°C Soldering Temperature Max. 260°C / Max 10sec. (JEDEC 020c) ESD Sensitivity 2,000 V HBM (JESD-22A-114-B) Reverse Voltage Not designed to be driven in reverse bias (VR≦5V) Preconditioning Acc. To JEDEC Level 2 Notes: 1. Never operate the LEDs in reverse bias. 2. Do not drive at rated current for more than 5 seconds without proper thermal management. 3. When the LEDs are illuminating, operating current should be decided after considering the packages maximum temperature. 4. Caution: These devices emit high intensity UV/NUV light. Necessary precautions must be taken during operation. Do not look directly into the light or look through the optical system when in operation. Protective eyewear should be worn at all times during operation. 5. Lens discoloration may occur with prolonged exposure to UV/NUV light. Lens material will need to be tested for UV/NUV light compatibility and durability.

www.p-tec.net 093015 Rev0 MS Page 3 of 9 Radiometric Power and Forward Voltage Color Performance at Test Current 700mA Group Min. Radiation Power (mW) Vf Min Max U2B (365-370nm) NH3 1200 13 17 NH4 1300 13 17 NH5 1400 13 17 NH6 1500 13 17 NH7 1600 13 17 U3A (370-375nm) NH3 1200 13 17 NH4 1300 13 17 NH5 1400 13 17 NH6 1500 13 17 NH7 1600 13 17 Note: 1. Radiometric Power is measured with an accuracy of ±10% 2. The forward voltage is measured with an accuracy of ±0.2V * Calculated values are for reference only.

www.p-tec.net 093015 Rev0 MS Page 4 of 9 Recommended Soldering Pad Design Recommended Soldering Pad Design (Marked Area is Opening)

www.p-tec.net 093015 Rev0 MS Page 5 of 9 Electrical and Optical Curves Relative Spectral Power Distribution, Tj=25°C Typical Spatial Radiation Pattern Typical Forward L-I Characteristics, Tj=25°C Typical Forward I-V Characteristics, Tj=25°C

www.p-tec.net 093015 Rev0 MS Page 6 of 9 Thermal Design Thermal design of the end product is important. The thermal resistance between the junction and the solder point (RΘJ‐S) and the end product should be designed to minimize the thermal resistance from the solder point to ambient in order to optimize the emitter life and optical characteristics. The maximum operation current is determined by the plot of Allowable Forward Current vs. Ambient Temperature. The junction temperature can be correlated to the thermal resistance between the junction and ambient (Rja) by the following equation. Tj=Ta + Rja*W Tj: LED junction temperature Ta: Ambient temperature Rja: Thermal resistance between the junction and ambient W: Input power (IF*VF)

www.p-tec.net 093015 Rev0 MS Page 7 of 9 Reflow Soldering The LEDs can be soldered using the parameter listed below. As a general guideline, the users are suggested to follow the recommended soldering profile provided by the manufacturer of the solder paste. Although the recommended soldering conditions are specified in the list, reflow soldering at the lowest possible temperature is preferred for the LEDs.

www.p-tec.net 093015 Rev0 MS Page 8 of 9 Packing Information The carrier tape is conformal to EIA-481D Note: All Dimensions are in millimeter

www.p-tec.net 093015 Rev0 MS Page 9 of 9 Record Of Revisions Rev. Description Date Page

0 Released Spec 09/30/15 --

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