PLH3535-WCUV01 P-TEC | Alldatasheet
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Technical content
Features
Durable and Rugged RoHS Compliant Easy mounting on PCB Mechanical Dimensions Recommended soldering Pad Design Recommend Stencil Pattern Design (Marked Area is Opening) Notes: 1. Dimensions in millimeters unless otherwise noted 2. Tolerance is ±0.13mm unless otherwise noted. 3. Specifications subject to change without notice
www.p-tec.net 081115 Rev0 MS Page 2 of 8 Device Selection Guide Model Number Chip Resin Material Emitting Color Clear PLH3535-WCUV01 InGaAiN Ultraviolet (UV) Radiometric Power and Forward V oltage (Tj =25 °C) Color Performance at Test Current 350mA Performance at 700mA Group Min. Radiometric Power (mW) Vf Typical Radiometric Power (mW) Min Max U40 (380~390nm) D1 200 3 4 340 D2 240 3 4 410 D3 280 3 4 475 U50 (390~400nm) D4 320 3 4 545 D5 360 3 4 610 E1 400 3 4 680 E2 440 3 4 750 U60 (400~410nm) D4 320 3 4 545 D5 360 3 4 610 E1 400 3 4 680 E2 440 3 4 750 E3 480 3 4 815 U70 (410~420nm) D4 320 3 4 545 D5 360 3 4 610 E1 400 3 4 680 E2 440 3 4 750 E3 480 3 4 815 E4 520 3 4 885
www.p-tec.net 081115 Rev0 MS Page 3 of 8 Forward Voltage Binning Part Number Performance at Test Current (350mA) Vf Group Minimum (V) Maximum (V) PLH3535-WCUV01 V30 3.0 3.2 V32 3.2 3.4 V34 3.4 3.6 V36 3.6 3.8 V38 3.8 4.0 Absolute Maximum Ratings at Ta=25°C Parameter Rating DC Forward Current (mA) 800mA LED Junction Temperature 150°C LED Operating Temperature -40°C ~ 125°C Storage Temperature -40°C ~ 125°C Soldering Temperature Max. 260°C / Max. 10 sec. (JEDEC 020c) ESD Sensitivity 2,000V HBM (JESD-22A-114-B) Preconditioning Acc. to JEDEC Level 2 Notes: 1. Never operate the LEDs in reverse bias. 2. Do not drive at rated current for more than 5 seconds without proper thermal management. 3. When the LEDs are illuminating, operating current should be decided after considering the packages maximum temperature. Electrical and Optical Characteristics at Ta=25°C Color Peak Wavelength (λp) 2ϴ1/2 Temperature Coefficient of Vf (mV/°C) Thermal Resistance Junction to Pad Min Max ΔVF /ΔTJ (°C/W) RΘJ‐L U40 380 390 125 -2~-4 4.4 U50 390 400 125 -2~-4 4.4 U60 400 410 125 -2~-4 4.4 U70 410 420 125 -2~-4 4.4 Notes:1. The peak/dominant wavelength is measured with an accuracy of ±1nm.
www.p-tec.net 081115 Rev0 MS Page 4 of 8 Electrical and Optical Curves
www.p-tec.net 081115 Rev0 MS Page 5 of 8 Thermal design Thermal design of the end product is important. The thermal resistance between the junction and the solder point (RΘJ‐S) and the end product should be designed to minimize the thermal resistance from the solder point to ambient in order to optimize the emitter life and optical characteristics. The maximum operation current is determined by the plot of Allowable Forward Current vs. Ambient Temperature. The junction temperature can be correlated to the thermal resistance between the junction and ambient (Rja) by the following equation. Tj=Ta + Rja*W Tj: LED junction temperature Ta: Ambient temperature Rja: Thermal resistance between the junction and ambient W: Input power (IF*VF)
www.p-tec.net 081115 Rev0 MS Page 6 of 8 Reflow Soldering The LEDs can be soldered using the parameter listed below. As a general guideline, the users are suggested to follow the recommended soldering profile provided by the manufacturer of the solder paste. Although the recommended soldering conditions are specified in the list, reflow soldering at the lowest possible temperature is preferred for the LEDs.
www.p-tec.net 081115 Rev0 MS Page 7 of 8 Packing Information The carrier tape is conformal to EIA-481D Note: All Dimensions are in millimeters
www.p-tec.net 081115 Rev0 MS Page 8 of 8 Record Of Revisions Rev. Description Date Page
0 Released Spec 08/11/15 --
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