PLH0025-WCR08 P-TEC | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 13
Technical content
Features
Durable and Rugged RoHS Compliant Easy mounting on PCB Mechanical Dimensions Notes: 1. Dimensions in millimeters unless otherwise noted 2. Tolerance is ±0.1mm unless otherwise noted. 3. Specifications subject to change without notice
www.p-tec.net 070815 Rev1 MS Page 2 of 13 Device Selection Guide Model Number Chip Lens Type Top Mount Reverse Mount Material Emitting Color Water Clear PLH00250-WCG17 PLH00250R-WCG17 AlInGaP Ultra Bright Yellow-Green PLH00250-WCY04 PLH00250R-WCY04 Ultra Bright Yellow PLH00250-WCA05 PLH00250R-WCA05 Ultra Bright Amber PLH00250-WCR08 PLH00250R-WCR08 Ultra Bright Red PLH00250-WCR26 PLH00250R-WCR26 Ultra Bright Deep Red PLH00250-WCB08 PLH00250R-WCB08 InGaN Blue PLH00250-WCG25 PLH00250R-WCG25 Pure Green PLH00250-WCW01 PLH00250R-WCW01 White Absolute Maximum Ratings at Ta=25°C Chip Power Dissipation (mW) Continuous Forward Current (mA) Pulse Forward Current (mA) Reverse Voltage (V) Operating Temperature (°C) Storage Temperature (°C) G17 Y04 A05 R08 R26 B08
117 G25
Note: 1. Condition for IFP is pulse of 1/10 duty and 0.1msec width 2. This product should be operated in forward bias. If a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. Electrical and Optical Characteristics at Ta=25°C Chip IF (mA) VF (V) λ(nm) IV(mcd) Viewing Angle 2θ1/2 typ λD λP typ G17 2.0 571 573 715 20° Y04 2.0 589 591 715 A05 2.0 605 609 700 R08 2.0 624 632 900 R26 1.9 632 645 780 B08 3.3 470 468 715 G25 3.3 527 520 1440 W01 3.3 X: 0.290 Y: 0.285 715
www.p-tec.net 070815 Rev1 MS Page 3 of 13 Soldering Pattern Top Mount Reverse Mount Luminous Intensity (lv) Bin Bin Luminous Intensity Range (mcd) Bin Luminous Intensity Range (mcd) Minimum Maximum Minimum Maximum U1 360.0 400.0 U2 400.0 450.0 V1 450.0 500.0 V2 500.0 560.0 W1 560.0 630.0 W2 630.0 715.0 X1 715.0 800.0 X2 800.0 900.0 Y1 900.0 1000.0 Y2 1000.0 1125.0 Z1 1125.0 1270.0 Z2 1270.0 1440.0 AA1 1440.0 1610.0 AA2 1610.0 1800.0 AB1 1800.0 2010.0 AB2 2010.0 2250.0 AC1 2250.0 2530.0 AC2 2530.0 2850.0 Note: @20mA / Ta=25O C, Tolerance: +/- 10%
www.p-tec.net 070815 Rev1 MS Page 4 of 13 Wavelength Bin Bin Wavelength Range (nm) Red (R08) Deep Red (R18) Amber (A05) Yellow (Y04) Yellow Green (G17) Min Max Min Max Min Max Min Max Min Max -- 615.0 630.0 630.0 650.0 F 619.0 615.0 594.5 597.0 H J Note: @20mA / Ta=25O C, Tolerance: +/- 5nm Bin Wavelength Range (nm) True Green (G25) Blue (B08) Min Max Min Max A 515.0 520.0 460.0 464.0 B 520.0 525.0 464.0 468.0 C 525.0 530.0 468.0 472.0 D 530.0 535.0 472.0 476.0 E 535.0 540.0 476.0 480.0 F 480.0 485.0 H J Note: @20mA / Ta=25O C, Tolerance: +/- 5nm
www.p-tec.net 070815 Rev1 MS Page 5 of 13 Forward Voltage (Vf) Bin Color Bin Code Spec Range Blue (B08) Green (G25) White (W01) G8 2.7-2.9 V H7 2.9-3.1 V H8 3.1-3.3 V J7 3.3-3.5 V J8 3.5-3.7 V K7 3.7-3.9 V Ultra Bright (G17, Y04, A05, R08, R26) -- 2.4V max Note: @20mA / Ta=25℃, Tolerance: + 0.05 V
www.p-tec.net 070815 Rev1 MS Page 6 of 13 Chromaticity Bin (for White W01 only) Rank C1 x 0.2500 0.2700 0.2700 0.2500 y 0.2500 0.2775 0.2325 0.2050 Rank C1 x 0.2700 0.2900 0.2900 0.2700 y 0.2775 0.3050 0.2600 0.2325 Rank D1 x 0.2900 0.3100 0.3100 0.2900 y 0.3050 0.3325 0.2875 0.2600 Rank D2 x 0.3100 0.3300 0.3300 0.3100 y 0.3325 0.3600 0.3150 0.2875 0.1 0.2 0.3 0.4 0.5
www.p-tec.net 070815 Rev1 MS Page 7 of 13 Precautions for Use 1. The chips should not be used directly in any type of fluid such as water, oil, organic solvent, etc. 2. When the LEDs are illuminating, the maximum ambient temperature should be first considered before operation. 3. LEDs must be stored in a clean environment. A sealed container with a nitrogen atmosphere is necessary if the storage period is over 3 months after shipping. 4. The LEDs must be used within seven days after unpacked. Unused products must be repacked in an anti- electrostatic package, folded to close any opening and then stored in a dry and cool space. 5. The appearance and specifications of the products may be modified for improvement without further notice. 6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to use a grounded wrist band and anti-electrostatic glove when handling the LEDs. If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs. Damaged LEDs will show some abnormal characteristics such as remarkable increase of leak current, lower turn-on voltage and getting unlit at low current.
www.p-tec.net 070815 Rev1 MS Page 8 of 13 Tape Dimensions (Top Mount) Part No. Dim. A Dim. B Dim. C Q’ty/Reel Unit: mm Tape Dimensions (Reverse Mount) Part No. Dim. A Dim. B Dim. C Q’ty/Reel Unit: mm
www.p-tec.net 070815 Rev1 MS Page 9 of 13 Reel Dimensions
www.p-tec.net 070815 Rev1 MS Page 10 of 13 Packing and Label Specifications Dry Pack All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times during transportation or storage. Every reel is packaged in a moisture protected anti-static bag. Each bag is properly sealed prior to shipment. Upon request, a humidity indicator will be included in the moisture protected anti-static bag prior to shipment. The packaging sequence is as follows:
www.p-tec.net 070815 Rev1 MS Page 11 of 13 Reflow Soldering Recommended tin glue specifications: melting temperature in the range of 178~192 OC The recommended reflow soldering profile is as follows (temperatures indicated are as measured on the surface of the LED resin): Lead Solder Profile Lead-free Solder Profile
www.p-tec.net 070815 Rev1 MS Page 12 of 13 Precautions Avoid exposure to moisture at all times during transportation or storage. Anti-Static precaution must be taken when handling GaN, InGaN, and AlInGaP products. It is suggested to connect the unit with a current limiting resistor of the proper size. Avoid applying a reverse voltage. Avoid operation beyond the limits as specified by the absolute maximum ratings. Avoid direct contact with the surface through which the LED emits light. If possible, assemble the unit in a clean room or dust-free environment. Reworking Rework should be completed within 5 seconds under 260C. The iron tip must not come in contact with the copper foil. Twin-head type is preferred. Cleaning Following are cleaning procedures after soldering: An alcohol-based solvent such as isopropyl alcohol (IPA) is recommended. Temperature x Time should be 50oC x 30sec. or <30oC x 3min Ultrasonic cleaning: < 15W/ bath; bath volume ≤ 1liter Curing: 100C max, <3min Cautions of Pick and Place Avoid stress on the resin at elevated temperature. Avoid rubbing or scraping the resin by any object. Electric-static may cause damage to the component. Please ensure that the equipment is properly grounded. Use of an ionizer fan is recommended.
www.p-tec.net 070815 Rev1 MS Page 13 of 13 Record Of Revisions Rev. Description Date Page
0 Released Spec 06/01/15 --
1 Revised IV(mcd) 07/08/15 2
PLH00250 (R) Customer Approval Signatures Approved By Checked By Prepared By