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www.p-tec.net 090718 Rev0 MS Page 1 of 18 PROD UCT SPECIFICATION Part Number PLC3631A4-WCY06 Details
- Single Color Surface Mount LED
- PLCC-4 3.6 x 3.1 x 3.5mm
- 2,000 piece reels
- Emitting Color: Amber
- AlInGaP chip material Feat ures
- High Luminous Intensity
- Compliant to AEC-Q101 Standard
- Water Resistant (IPX7)
- Ideal for transportation signage or exterior automotive lighting
- RoHS Compliant Mechanical Dimensions Note 1. Specifications subject to change without notice 2. Tolerance of measurement of dimensions: ±0.2mm
www.p-tec.net 090718 Rev0 MS Page 2 of 18 Devi ce Selection Guide Model Number Chip Resin PLC3631A4-WCY06 Material Emitting Color Water Clear AlInGaP Amber Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation Pd 210 mW Forward Current IF 60 mA Peak Forward Current (1) IFP 80 mA Reverse Voltage VR 5 V LED Junction Temperature (2) Tj 125 ℃ Operating Temperature Topr -40~+100 ℃ Storage Temperature Tstg -40~+100 ℃ Soldering Temperature Tsol Reflow Soldering: 260℃ for 10 sec Hand Soldering: 350℃ for 3 sec Notes: 1. Pulse width ≦ 0.1 msec, duty ≦ 1/10 2. Proper current rating must be observed to maintain junction temperature below the maximum at all the time. Electrical and Optical Characteristics at Ta=25℃ Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage VF -- 2.6 -- V IF=50mA Luminous Intensity Φv -- 11000 -- mcd Dominant Wavelength λd -- 590 -- nm Viewing Angle 2θ 1/2 -- 30 -- deg Reverse Current IR -- -- 10 μA VR=5V
www.p-tec.net 090718 Rev0 MS Page 3 of 18 Lumi nous Intensity Rank Limits (IF = 50mA) Part Number Luminous Intensity 35 36 37 38 PLC3631A4-WCY06 6600-8600 8600-11200 11200-14600 14600-19000 Note: Tolerance of measurement of luminous intensity: ±12% For ward Voltage Rank Limits VF Rank Min Max Unit Condition V2A 2.1 2.4 V IF = 50mA V2B 2.4 2.7 V2C 2.7 3.0 Note: Tolerance of measurement of Forward Voltage：±0.1V Do minant Wavelength Limits (IF = 50mA) Bin Code Min Max Unit Condition Y4 580 585 nm IF = 50mA Y5 585 590 Y6 590 595 Note: Tolerance of measurement of Color Coordinates：±1nm Do not use this area for electrical contact. Cu-area ≥16mm2 Per Pad Recommended Soldering Pad Pattern
www.p-tec.net 090718 Rev0 MS Page 4 of 18 Typ ical Electrical / Optical Characteristic Curves
- Ta = 25℃ Unless Otherwise Noted 1.6 1.8 2.8 3.0 Forward Current If(mA) 2.0 2.2 2.4 2.6 Forward Voltage Vf (V) Figure1. Forward Current VS. Forward Voltage 0 20 40 60 80 100 Wavelength Shift d Ambient Temperature Ta (℃ ) Figure2. Wavelength Shift VS. Ambient Temperature
www.p-tec.net 090718 Rev0 MS Page 5 of 18 0 20 40 60 80 100 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Relative Luminous Intensity Ambient Temperature Ta(℃) Figure3. Relative Luminous Intensity VS. Ambient Temperature 0 20 40 60 80 100 Forward Current If(mA) Ambient TemperatureTa (℃) RthJA:300℃/W Figure4. Forward Current VS. Ambient Temperature
www.p-tec.net 090718 Rev0 MS Page 6 of 18 0 20 40 60 Wavelength Shiftd Forward Current If (mA) Figure5. Wavelength Shift VS. Forward Current Figure6. Relative Luminosity VS. View Angle
www.p-tec.net 090718 Rev0 MS Page 7 of 18 400 700 800 0.0 0.2 0.4 0.6 0.8 1.0 Relative Luminous Intensity 500 600 Wavelength d(nm) Figure7. Spectral Power Distribution VS. Wavelength 0 20 40 60 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Relative Luminous Intensity Forward Current If(mA) Figure8. Relative Luminous Intensity VS. Forward Current
www.p-tec.net 090718 Rev0 MS Page 8 of 18 Pac kage – Tape Dimensions Symbol A0 B0 K0 P0 P P2 T Symbol E F D0 D1 W
www.p-tec.net 090718 Rev0 MS Page 9 of 18 Reel Dimensions (1) Qua ntity: 2,000/Reel (2)Tolerance ±0.2mm unless otherwise mentioned
www.p-tec.net 090718 Rev0 MS Page 10 of 18 P ackaging P ackage Name Package Dimension Distribution of layer in box Total Amount Size Unit Amount Unit Amount Unit Reel 330 mm 1 Reel 2000 pcs Inner Box 405 x 385 x 95 mm 5 Reel 10000 pcs Outer Box 395 x 395 x 410 mm 4 Inner Box 40000 Pcs
www.p-tec.net 090718 Rev0 MS Page 11 of 18 Sold ering Characteristics IR-reflow Condition (PB Free) Area Title Symbol Min Max Unit (1) Preheat Ramp-up rate Vp 1 5 ℃/sec Temperature Tp 150 -- ℃ Time Tp -- -- ℃ (2) Equilibrium Ramp-up rate Ve -- -- ℃/sec Temperature Te 150 200 ℃ Time Te 60 120 sec (3) Reflow Ramp-up rate Vr 1 5 ℃/sec Temperature Tr 220 -- ℃ Time Tr -- 60 Sec Peak Temperature Trp -- 260 ℃ Peak Time Trp -- 10 Sec (4) Cooling Ramp-down rate Vc 3 6 ℃/sec Hand Soldering (Iron Condition) Soldering Iron:30W Max Temperature 350°C Max Soldering Time:3 Seconds Max(Once)
www.p-tec.net 090718 Rev0 MS Page 12 of 18 ■ JEDEC Information – JEDEC is used to determine what classification level should be used for initial reliability qualification. Once identified, the LEDs can be properly packaged, stored and handled to avoid subsequent thermal and mechanical damage during the assembly solder attachment and/or repair operation. PLCC 3528 series are certified at level 3. Characteristics for PLCC 3528 series Level Floor Life Soak Requirements Standard Accelerated Equivalent Time Condition Time(hours) Condition Time(hours) Condition Notes: The standard soak time includes a default value of 24 hours for semiconductor manufacturer’s exposure time (MET) between bake and bag, and includes maximum time allowed out of the bag at the distributor’s facility
www.p-tec.net 090718 Rev0 MS Page 13 of 18 R eliability Test No. Test Item Test Conditions Test Duration Failure Criteria Units Failed/Tested
1 Resistance to
Max: 260℃, 10sec, reflows Pretreatment 30℃, 70%, 168 hours 3 times #1 0/30
2 Solderability Ta=245℃, 10 sec
Pretreatment 30℃, 70%, 168 hours -- #3 0/10
3 Temperature Cycle -40℃~100℃ 1000
cycles #1 0/77
4 High Temperature
Forward Bias Ta=85℃, Tj=125℃ 1000 hrs. #2 0/77
5 High Temperature
High Humidity Bias Ta=85℃, RH-85%, Tj=125℃ 1000 hrs. #2 0/77
6 Power and
Temperature Cycle -40℃~100℃ IF=50mA 1000 cycles #2 0/77 7 Wire Bond Integrity Ta=120℃ 500 hrs. #1 0/5 F ailure Criteria Criteria # Items Conditions Failure Criteria 1 Forward Voltage(VF) IF=50mA >U.S.L.X1.1 Luminous Intensity(IV) IF=50mA <L.S.L.X0.7 2 Forward Voltage(VF) IF=50mA >U.S.L.X1.1 Luminous Intensity(IV) IF=50mA <L.S.L.X0.5
3 Solderability Less than 95% Solder coverage
www.p-tec.net 090718 Rev0 MS Page 14 of 18 Handling of Epoxy Resin LEDs Handling Indications i. When handling the product, do not touch it directly with bare hands as it may contaminate the surface and affect on optical characteristics. In the worst cases, excessive force to the product might result in catastrophic failure due to package damage and/or wire breakage. ii. When handling the product with tweezers, LEDs should only be handled from the side and make sure that excessive force is not applied to the resin portion of the product. Failure to comply can cause the resin portion of the product to be cut, chipped, delaminated and/or deformed, and wire to be broken, and thus resulting in catastrophic failure. Pick and place Recommended conditions: Outer nozzle＞Φ2.5mm Avoid direct contact to the encapsulant with picking up nozzle. Failure to comply might result in pick and place processes or damage to encapsulant. In the worst cases, catastrophic failure of the LEDs due to wire deformation and/or breakage.
www.p-tec.net 090718 Rev0 MS Page 15 of 18 Storage Storage Conditions A．Before opening the package: The LEDs should be kept at ≦40°C and ≦90%RH. The LEDs should be used within a year. When storing the LEDs, moisture proof packaging with absorbent material is recommended. B．After opening the package: The LEDs should be kept at ≦30°C and ≦60%RH. The LEDs should be soldered within 168 hours after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material. It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again. If the moisture absorbent material has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: more than 24 hours at 65 ± 5°C This product has silver plated metal parts that are inside and/or outside the package body. The silver plating becomes tarnished when being exposed to an environment which contains corrosive gases. Any LED with tarnished leads may lead to poor solderability and deterioration of optical characteristics. Please do not expose the LEDs to corrosive atmosphere during storage. After assembly and during use, silver plating can be affected by the corrosive gases emitted by components and materials in close proximity of the LEDs within an end product, and the gases
www.p-tec.net 090718 Rev0 MS Page 16 of 18 entering into the product from the external atmosphere. The above should be taken into consideration when designing. Moisture Proof Package When moisture is absorbed into the SMT package it may vaporize and expand during soldering. There is a possibility that this can cause exfoliation of the contacts and damage to the optical characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture to a minimum in the package. The moisture proof package is made of an aluminum moisture proof bag. A package of a moisture absorbent material is inserted into the aluminum moisture proof bag. The Epoxy l changes its color from blue to red as it absorbs moisture. Please avoid rapid transitions in ambient temperature, especially in high humidity environments where condensation can occur. Recommended circuit In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. It is recommended to use Circuit B which regulates the current flowing through each LED. In the meanwhile, when driving LEDs with a constant voltage in Circuit A, the current through the LEDs may vary due to the variation in forward voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the absolute maximum rating. This product should be operated in forward bias. A driving circuit must be designed so that the product is not subjected to either forward or reverse voltage while it is off. In particular, if a reverse voltage is continuously applied to the product, such operation can cause migration resulting in LED damage. Heat Generation – Thermal design of the end product is of paramount importance. Please consider the heat generation of the LED when making the system design. The coefficient of temperature increase per input electric power is affected by the thermal resistance of the circuit board and density of
www.p-tec.net 090718 Rev0 MS Page 17 of 18 LED placement on the board, as well as other components. It is necessary to avoid intense heat generation and operate within the maximum ratings given in this specification. The operating current should be decided after considering the ambient maximum temperature of LEDs. Static Electricity Static electricity or surge voltage damages the LEDs. It is recommended that a wrist band or an anti-electrostatic glove be used when handling the LEDs. All devices, equipment and machinery must be properly grounded. It is recommended that precautions be taken against surge voltage to the equipment that mounts the LEDs. When inspecting the final products in which LEDs were assembled, it is recommended to check whether the assembled LEDs are damaged by static electricity or not. It is easy to find static-damaged LEDs by a light-on test or a VF test at a lower current (below 1mA is recommended). Damaged LEDs will show some unusual characteristics such as the leak current remarkably increases, the forward voltage becomes lower, or the LEDs do not light at the low current. Criteria: (VF > 2.0V at IF=0.5mA) Cleaning – It is recommended that isopropyl alcohol be used as a solvent for cleaning the LEDs. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Freon solvents should not be used to clean the LEDs because of worldwide regulations. Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Before cleaning, a pre-test should be done to confirm whether any damage to the LEDs will occur.
www.p-tec.net 090718 Rev0 MS Page 18 of 18 Record Of Revisions Rev. Comments Page Date
0 Released Spec -- 09/07/18
Approved By Checked By Prepared By