DATASHEET SEARCH SITE | WWW.ALLDATASHEET.COM

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 17

Technical content

Features

 Binning based on ANSI C78.377  MSL2 qualified according to J-STD 020  ESD 8KV (HGM: MIL-STD883 Class 3B)  RoHS & REACH Compliant Mechanical Dimensions Notes: 1. Dimensions in millimeters and tolerance is ±0.13mm unless otherwise noted 2. Specifications subject to change without notice

www.p-tec.net 102014 Rev1 MS Page 2 of 17 Device Selection Guide Model Number CRI Luminous Flux (lm) Typical CCT (K) Forward Voltage (V) Basic Order Code 350mA Calculated Min. @ 85Ԩ Group Min 25Ԩ Min 85Ԩ 700 mA 1000 mA Min Max PLBT3535HPF-YDCW70 >70 B35 120 102 178 224 5710-6530 2.8 3.4 B36 130 110 192 242 PLBT3535HPF-YDCW82 >82 B34 110 93 162 204 5710-6530 2.8 3.4 B35 120 102 178 224 PLBT3535HPF-YDPW82 >82 B34 110 93 162 204 5310-6020 2.8 3.4 B35 120 102 178 224 B36 130 110 192 242 PLBT3535HPF-YDPW70 >70 B35 120 102 178 224 4745-5310 2.8 3.4 B36 130 110 192 242 PLBT3535HPF-YDNW70 >70 B34 110 93 162 204 3710-4260 2.8 3.4 B35 120 102 178 224 B36 130 110 192 242 PLBT3535HPF-YDNW82 >82 B33 100 85 148 187 3710-4260 2.8 3.4 B34 110 93 162 204 B35 120 102 178 224 B32 90 76 133 167 PLBT3535HPF-YDWW82 >82 B32 90 76 133 167 2725-3045 2.8 3.4 B33 100 85 148 187 B34 110 93 162 204 PLBT3535HPF-YDWW70 >70 B29 70 59 122 133 1980-2240 2.8 3.4 B30 75 63 131 142 B31 80 68 119 149 PLBT3535HPF-YDCW82A >82 B34 110 93 162 204 6500 2.8 3.4 B30 120 102 178 224 B31 130 110 192 242 PLBT3535HPF-YDWW82A >82 B32 90 76 133 167 3000 2.8 3.4 B33 100 85 148 187 Notes: 1. Forward voltage (VF ) ±0.05V, Luminous flux (Φv) ±5%; CRI ±2 2. IS standard testing.

www.p-tec.net 102014 Rev1 MS Page 3 of 17 Absolute Maximum Ratings at Ta=25Ԩ Parameter Symbol Rating Unit Min Typical Max DC Forward Current IF -- 350 1000 mA Pulse Forward Current IPF -- -- 1500 mA Forward Voltage VF 2.8 -- 3.2 V Reverse Voltage VR -- -5 -- V Leakage Current (5V) IR -- -- 10 μA Junction Temperature TJ -- 150 -- Ԩ Storage Temperature Tstg -40 -- 100 Ԩ Soldering Temperature Tsol -- 260 -- Ԩ Thermal Resistance Junction / Solder Point RTH -- 8 -- Ԩ/W Viewing Angle 2 θ ½ -- 120 -- deg Notes: 1. For other ambient, limited setting of current will depend on derating curves 2. D=0.01s duty 1/10 3. When drive on maximum current, TJ must be kept below 150 4. Viewing angle (2θ ½) ±10°

www.p-tec.net 102014 Rev1 MS Page 4 of 17 Intensity Binning Bin Code (350mA) Min. Φv Max. Φv B29 70 75 B30 75 80 B31 80 90 B32 90 100 B33 100 110 B34 110 120 B35 120 130 B36 130 140 Forward Voltage Binning Bin Code (350mA) Min. VF Max. VF V2830 2.8 3.0 V3032 3.0 3.2

www.p-tec.net 102014 Rev1 MS Page 5 of 17 Color Coordinate Binning

www.p-tec.net 102014 Rev1 MS Page 6 of 17 Color Coordinate Binning CCT 3000K CIE X Y Center 0.4400 0.4030 306S 6STEP CCT 6500K CIE X Y Center 0.3130 0.3370 656S 6STEP

www.p-tec.net 102014 Rev1 MS Page 7 of 17 Relative Spectral Power Distribution

www.p-tec.net 102014 Rev1 MS Page 8 of 17 Electronic-Optical Characteristics Forward Current vs. Forward Voltage (Ta=25Ԩ) Relative luminous Flux vs. Forward Current (Ta=25Ԩ) Relative Flux vs. Junction Temperature (IF=350mA) Relative Chromaticity vs. Ambient temperture (IF=350mA)

www.p-tec.net 102014 Rev1 MS Page 9 of 17 Typical Spatial Distribution Thermal Design for De-Rating  The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics.

www.p-tec.net 102014 Rev1 MS Page 10 of 17 Suggested Stencil Pattern (Recommendations for Reference) Note: Suggested stencil t = 0.12mm

www.p-tec.net 102014 Rev1 MS Page 11 of 17 Packaging and Reel Dimensions

www.p-tec.net 102014 Rev1 MS Page 12 of 17 Notes: 1. Reeled products (minimum number of pieces is 100 and maximum is 1000) packed in sealed moisture-proof bags along with a desiccant; a maximum of five moisture-proof bags packed inside the box (size: 240mm x 195mm x 100mm ±5mm) and a maximum of four inside boxes are put in the outside box 2. (size: 410mm x 255mm x 240mm ±5mm) together with buffer material packed. 3. (Part No., Lot No., quantity should appear on the label of the moisture-proof bag and the cardboard box.)

www.p-tec.net 102014 Rev1 MS Page 13 of 17 Reflow Profile

www.p-tec.net 102014 Rev1 MS Page 14 of 17 Precautions 1. Recommendation for using LEDs 1.1 The lens of LEDs should not be exposed to dust or debris. Excessive dust and debris may cause a drastic decrease in the luminosity. 1.2 Avoid mechanical stress on LED lens. 1.3 Do not touch the LED lens surface. It would affect the optical performance of the LED due to the LED lens’ damage.

1.4 Pick & place tools are recommended for the remove of LEDs from the factory tape & reel packaging

  1. Pick & place nozzle The pickup tool was recommended and shown as below) 3. Lens handling Please follow the guideline to pick LEDs

3.1 Use tweezers to pick LEDs

3.2 Do not touch the lens by using tweezers

3.3 Do not touch lens with fingers

3.4 Do not apply more than 4N of lens (400g) directly onto the lens

www.p-tec.net 102014 Rev1 MS Page 15 of 17 4. Lens cleaning In the case which a small amount of dirt and dust particles remain on the lens surface, a suitable cleaning solution can be applied.

4.1 Try a gentle wiping with dust-free cloth

4.2 If needed, use dust-free cloth and isopropyl alcohol to gently clean the dirt from the lens surface.

4.3 Do not use other solvents as they may directly react with the LED assembly

4.4 Do not use ultrasonic cleaning which will damage the LEDs

  1. Carrier tape handling The following items are recommended when handling the carrier tape of LEDs

5.1 Do not twist the carrier tape

5.2 The inward bending diameter should not be smaller than 6cm for each carrier tape. 5.3 Do not bend the tape outward.

www.p-tec.net 102014 Rev1 MS Page 16 of 17 Test Items and Results of Reliability Notes: 1. USL: Upper specification level 2. LSL: Lower specification level Tested with P‐tec Standard Tested with P‐tec Standard Tested with P‐tec Standard

www.p-tec.net 102014 Rev1 MS Page 17 of 17 Record Of Revisions Rev. Comments Page Date

0 Released Spec -- 10/20/14

1 Added PLBT3535HPF-YDPW82 2 03/17/15

Approved By Checked By Prepared By