PLBT2016 P-TEC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 16

Technical content

Features

  • Typical viewing angle 50% Iv: 120°
  • Binning based on ANSI C78.377
  • ROHS and REACH-compliant
  • MSL 3 qualified according to J-STD 020
  • ESD 2KV (HBM : MIL-STD-883 Class 2) Mechanical Dimensions Notes: 1. Dimension in millimeter [inch], and tolerance is ±0.13mm unless otherwise noted. 2. Specifications subject to change.

www.p-tec.net 102014 Rev0 JAS Page 2 of 16 Device Selection Guide Model Number Material Typical CCT °K Emitting Color Luminous Flux (lm) Wattage Basic Order Code Group Min PLBT2016.2-YDCW InGaN 4746-7040 Cool White B30 75

0.2 B31 80

PLBT2016.5-YDCW 4746-6530 Cool White B18 24

0.5 B19 26

PLBT20161W-YDCW 4746-7040 Cool White B22 35

1.0 B23 40

Absolute Maximum Ratings at Ta=25°C PLBT2016.2-YDCW Parameter Symbol Rating Unit Power Dissipation P D 0 . 2 W Continuous Forward Current I AF 6 0 m A Pulsed Forward Current IFP 500 (Note1) mA Reverse Voltage Vr -5 V Dice Temperature Tj 115° °C Operating Temperature Topr -40~+85 °C Storage Temperature Tstg -40~+100 °C Soldering Temperature Tsol 240°for5sec °C PLBT2016.5-YDCW Parameter Symbol Rating Unit Power Dissipation P D 0 . 5 W Continuous Forward Current I AF 100 mA Pulsed Forward Current IFP 500 (Note1) mA Reverse Voltage Vr -5 V Dice Temperature Tj 115° °C Operating Temperature Topr -40~+85 °C Storage Temperature Tstg -40~+100 °C Soldering Temperature Tsol 240°for5sec °C

www.p-tec.net 102014 Rev0 JAS Page 3 of 16 PLBT20161W-YDCW Parameter Symbol Rating Unit Power Dissipation P D 1 . 0 W Continuous Forward Current I AF 350 mA Pulsed Forward Current IFP 1000 (Note1) mA Reverse Voltage Vr -5 V Dice Temperature Tj 115° °C Operating Temperature Topr -40~+85 °C Storage Temperature Tstg -40~+100 °C Soldering Temperature Tsol 240°for5sec °C Notes: 1. Duty 1/10 Pulse Width 0.1ms 2. For other ambient, limited setting of current will depend on de-rating curves. 3. When drive on maximum current, TJ must be kept below 115°C Electrical and Optical Characteristics at Ta=25°C PLBT2016.2-YDCW Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage VF 3.0 -- 3.6 V IF=60mA Reverse Current Ir -- -- 10 µA Vr=5V Viewing Angle 2Ø1/2 -- 120±10° -- Deg IF=60mA PLBT2016.5-YDCW Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage VF 3.0 -- 3.6 V IF=100mA Reverse Current Ir -- -- 10 µA Vr=5V Viewing Angle 2Ø1/2 -- 120±10° -- Deg IF=100mA PLBT20161W-YDCW Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage VF 3.0 -- 3.6 V IF=350mA Reverse Current Ir -- -- 10 µA Vr=5V Viewing Angle 2Ø1/2 -- 120±10° -- Deg IF=350mA

www.p-tec.net 102014 Rev0 JAS Page 4 of 16 Intensity Binning Bin Code Min. Фv (lm) Max. Фv (lm) B18 24 26 B19 26 28 B20 28 30 B21 30 35 B22 35 40 B23 40 45 B24 45 50 B25 50 55 B30 75 80 B31 80 90 B32 90 100 B33 100 110 Forward Voltage Binning Bin Code Min. Vf Max. Vf V2830 2.8 3.0 V3032 3.0 3.2 V3234 3.2 3.4 V3236 3.4 3.6

www.p-tec.net 102014 Rev0 JAS Page 5 of 16 Color Coordinate Binning

www.p-tec.net 102014 Rev0 JAS Page 6 of 16 Typical Electrical / Optical Characteristic Curves PLBT2016.2-YDCW

www.p-tec.net 102014 Rev0 JAS Page 7 of 16 PLBT2016.5-YDCW

www.p-tec.net 102014 Rev0 JAS Page 8 of 16 PLBT20161W-YDCW Typical Spatial Distribution

www.p-tec.net 102014 Rev0 JAS Page 9 of 16 Relative Spectral Power Distribution

www.p-tec.net 102014 Rev0 JAS Page 10 of 16 Thermal Design for Derating 60mA 100mA 350mA

www.p-tec.net 102014 Rev0 JAS Page 11 of 16 Recommended Solder Pad

www.p-tec.net 102014 Rev0 JAS Page 12 of 16 Packing

www.p-tec.net 102014 Rev0 JAS Page 13 of 16 Notes: 1. Reeled products (minimum number of pieces is 100 and maximum is 1000) packed in sealed moisture-proof bags along with a desiccant; a maximum of five moisture-proof bags packed inside the box (size: 240mm x 195mm x 100mm ±5mm) and a maximum of four inside boxes are put in the outside box 2. (size: 410mm x 255mm x 240mm ±5mm) together with buffer material packed. 3. (Part No., Lot No., quantity should appear on the label of the moisture-proof bag and the cardboard box.)

www.p-tec.net 102014 Rev0 JAS Page 14 of 16 Reflow Temperature / Time Notes: 1. We recommend reflow temp of 240°C (±5°C). The maximum soldering temperature should b limited to 260°C 2. Do not cause stress to the epoxy resin while it is exposed to high temperature 3. Number of reflow process should not exceed 3 times.

www.p-tec.net 102014 Rev0 JAS Page 15 of 16 Precautions

www.p-tec.net 102014 Rev0 JAS Page 16 of 16 Reliability Notes: 1. USL: Upper specification level 2. LSL: Lower specification level Test Item Test Conditions Duration/ Cycle Number of Damage Reference Thermal Shock –40℃ 30min ↑↓5min 125℃ 30min 100 cycles 0/22 AEC-Q101 High Temperature Storage Ta=100℃ 1000 hrs 0/22 EIAJ ED-4701 200 201 Humidity Heat Storage Ta=85℃ RH=85% 1000 hrs 0/22 EIAJ ED-4701 100 103 Low Temperature Storage Ta=-40℃ 1000 hrs 0/22 EIAJ ED-4701 200 202 Life Test Ta=25℃ If=350mA 1000 hrs 0/22 Tested with factory standard High Humidity Heat Life Test 85℃ RH=85% If=350mA 1000 hrs 0/22 Tested with factory standard High Temperature Life Test Ta=85℃ 1000 hrs 0/22 Tested with factory standard ESD(HBM) 2KV at 1.5kΩ;100pf 3 Times 0/22 MIL-STD-883 Criteria for Judging the Damage Item Symbol Condition Criteria for Judgment Min Max Forward Voltage VF If=350mA _ USL 1×1.1 Reverse Current IR V R =5V _ 100μA Luminous Intensity Iv If=350mA LSL 2×0.7 _