PL762-WCB26 P-TEC | Alldatasheet
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Technical content
PART NO. : PL762-WCB26 HIGH POWER AUTOMOTIVE LED PRELIMINARY y ATTENTION
ats Conemare Ce HIGH POWER Package Dimensions 7.62+0.5 J [~ Lal 7.6240.5 aN ! 2 3 23.0+0.2 | aa } 4,440.2 { 0.5 , , 7 2.5 i ay 7540.5 0.4+0.2 i i { 1.55+0.2 _. .-s.ons03 - L coeae Notes: 1. All dimensions are in mm. 2. Tolerance is £0.25mm unless otherwise noted.
Description
Part No. Lens Color Material Emitting Color VER.: 01 Date: 2012/04/28 Page: 1/4
Absolute Maximum Ratings at Ta=25C Festus SP Electrical and Optical Characteristics: acy |» [eam [vw [om [oe Ca a Od ewe fw [em | fe pe ES ES Ee Pincers | fo Saemiinninon [| ewe | [| Notes:1.The datas tested by IS tester. 2. Customer’s special requirements are also welcome. VER.: 01 Date: 2012/04/28 Page: 2/4
PL762-WCB26 AUTOMOTIVE LED Typical Electrical/Optical Characteristic Curves (25° Ambient Temperature Unless Otherwise Noted) 109 SRR EE eee eee ate gL @ [it ttt tt | | 3 1500 HA pT ee ee 7 peeeceraeccien SanUP ANNU ee oe, BEEF TT e {TTT YT TT | § 30}, 24 28 32 36 40 44 0 aN al : 0 90 Applied Voltage (V) Forward Current (mA) Forward Current VS. Applied Voltage Ambient Temperature VS. Relative intensity 50 0° —10°—-20° PTET TT Ty TTT Ty 30° eco ALLE / © web SER | 0° POPS SEER Bo tT TINE TTT OSA ROIOOY 50° iS ~ 09 KR TELL IES e COOP CESS a E 10 PTT LTT TENET 7 ONT OKS c\\ 70° PAE s0° ORIG EY HERES oo 0 2 40° 60 80 100 120 ed a Ambient Temperature Ta(C) 05 03 O1 0.2 04 06 Ambient Temperature VS. Forward Current Radiation Diagram VER.: 01 Date: 2012/04/28 Page: 3/4
Outside US 719.5803122 AUTOMOTIVE LED Precautions: TAKE NOTE OF THE FOLLOWING IN USE OF LED 1. Temperature in use Since the light generated inside the LED needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. Consequently, the heat resistant ability of the resin used for LED is usually low; therefore, please be careful on the following during use. Avoid applying external force, stress, and excessive vibration to the resins and terminals at high temperature. The glass transition temperature of epoxy resin used for the LED is approximately 120-130°C. At atemperature exceeding this limit, the coefficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. If external force or stress is applied at that time, it may cause a wire rupture. 2. Soldering Please be careful on the following at soldering. After soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temperature), <Same for products with terminal leads> (1) Soldering measurements: Distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) Dip Soldering: Pre-heat: 90°C max. (Backside of PCB), Within 60 seconds. Solder bath: 260+5°C (Solder temperature), Within 5 seconds. (3) Hand Soldering : 350°C max. (Temperature of soldering iron tip), Within 3 seconds 3. Insertion Pitch of the LED leads and pitch of mounting holes need to be same 4. Others Since the heat resistant ability of the LED resin is low, SMD components are used on the same PCB, please mount the LED after adhesive baking process for SMD components. In case adhesive baking is done after LED lamp insertion due to a production process reason, make sure not to apply external force, stress, and excessive vibration to the LED and follow the conditions below. Baking temperature: 120°C max. Baking time: Within 60 seconds If soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the LED to normal temperature. VER.: 01 Date: 2012/04/28 Page: 4/4