PI3USB3102

PI3USB3102 PERICOM | Alldatasheet

Document overview

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Technical content

Features

ÎÎ 1:2 mux/demux for USB 3.0SS, 2.0HS, and 2.0FS signals ÎÎ Switches Tx, Rx, Dx, and USB_ID from USB3.0 connector ÎÎ Insertion Loss for superspeed channels @ 2.5 GHz: -1.7dB ÎÎ -3dB Bandwidth for superspeed channels: 4.7GHz ÎÎ Return loss for superspeed channels @ 2.5GHz: -16dB ÎÎ Low Bit-to-Bit Skew, 7ps max (between '+' and '-' bits) ÎÎ Low Crosstalk for superspeed channels: -25dB@5.0 Gbps ÎÎ Low Off Isolation for superspeed channels: -25dB@5.0 Gbps ÎÎ VDD Operating Range: 3.3V +/-10% ÎÎ ESD Tolerance: 2kV HBM ÎÎ Low channel-to-channel skew, 35ps max ÎÎ Packaging (Pb-free & Green): à 32 TQFN (ZL)

Description

Pericom Semiconductor’s PI3USB3102 USB3.0 and USB2.0 Com- bo Switch is a complete 1:2 switching solution for SuperSpeed USB 3.0 signals. PI3USB3102 provides differential high-speed lanes for the USB3.0 4.8 Gbps TX and RX lanes as well as a differ- ential lane for 480 Mbps USB 2.0 signals and the USB_ID signal. PI3USB3102 can be used to connect two hosts to a single device or a single host to two devices. PI3USB3102 offers excellent signal integrity for high-speed sig - nals and low power dissipation. Insertion loss is 1.7 dB and return loss is -16 dB at 2.5 GHz. Power dissipation is 6.6 mW maximum. Application Routing of USB3.0 signals with low signal attenuation between source and sink. Block Diagram PI3USB3102 USB3.0 and USB2.0 Combo Switch Tx+ Tx Rx+ Rx USB_ID Tx+A Tx -A Rx+A Rx-A Tx+B Tx-B Rx+B Rx-B Logic Control OE D+A D-A USB_ID A D+B D- B USB_ID B SS SEL HS SEL 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 Pin Assignment (TQFN-32) GND Tx- Tx+ HS_SEL SS_SEL Rx+ Rx- Rx-A Rx+A Tx-B Tx+B GND Rx-B Rx+B OE USB_ID USB_IDA D-A Tx+A D+B D-B Tx-A D+A GND 16 28 VDD VDD VDD USB_IDB VDD VDD VDD OE SS_SEL HS_SEL Function Low Low Low Port A active for all channels Low Low High Port A for SS, port B for HS and ID Low High Low Port B for SS, port A for HS and ID Low High High Port B active for all channels High x x I/O's are hi-z and IC is power down Truth Table 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 Pin Description pin# pin Name Signal Type Description 1 Tx+ I/O positive differential USB3.0 Tx signal for COM port 2 Tx- I/O negative differential USB3.0 Tx signal for COM port 3 VDD Power 3.3V +/-10% power supply 4 Rx+ I/O positive differential USB3.0 Rx signal for COM port 5 Rx- I/O negative differential USB3.0 Rx signal for COM port 6 D+ I/O positive differential USB2.0 signal for COM port 7 D- I/O negative differential USB2.0 signal for COM port

8 USB_ID I/O USB_ID for COM port

9 VDD Power 3.3V +/-10% power supply

10 SS_SEL I

switch logic control for SuperSpeed Path If HIGH, then path B is selected for SuperSpeed channels only If LOW, then path A is selected for SuperSpeed channels only 11 OE I Output enable. if OE is low, IC is enabled. If OE is high, then IC is power down and all I/Os are hi-z 12 VDD Power 3.3V +/-10% power supply

13 USB_IDB I/O USB_ID for port B

14 D-B I/O negative differential USB2.0 signal for port B 15 D+B I/O positive differential USB2.0 signal for port B 16 VDD Power 3.3V +/-10% power supply

17 USB_IDA I/O USB_ID for port A

18 D-A I/O negative differential USB2.0 signal for port A 19 D+A I/O positive differential USB2.0 signal for port A 20 VDD Power 3.3V +/-10% power supply

21 GND Ground Ground

22 Rx-B I/O negative differential USB3.0 Rx signal for port B 23 Rx+B I/O positive differential USB3.0 Rx signal for port B 24 Tx-B I/O negative differential USB3.0 Tx signal for port B 25 Tx+B I/O positive differential USB3.0 Tx signal for port B 26 Rx-A I/O negative differential USB3.0 Rx signal for port A 27 Rx+A I/O positive differential USB3.0 Rx signal for port A

28 GND Ground Ground

29 VDD Power 3.3V +/-10% power supply 30 Tx-A I/O negative differential USB3.0 Tx signal for port A 31 Tx+A I/O positive differential USB3.0 Tx signal for port A

32 HS_SEL I

switch logic control for USB2.0 (D+/-) and USB_ID path If High, path B is selected If LOW, path A is selected 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 (TA = –40°C to +85°C, VDD = 3.3V ±10%) Parameter Description Test Conditions(1) Min Ty p(1) Max Units VIH Input HIGH Voltage Guaranteed HIGH level 1.5 VVIL Input LOW Voltage Guaranteed LOW level 0.75 VIK Clamp Diode Voltage, Dx VDD = Max., IIN = –18mA –0.8 –1.1 IIH Input HIGH Current VDD = Max., VIN = VDD ±5 µAIIL Input LOW Current VDD = Max., VIN = GND ±5 IOFF_HS/ID I/O leakage when part is off for D+, D- and USB_ID signals only VDD = 0V, VINPUT = 0V to 3.6V 20 RON_SS On resistance between input to out- put for SuperSpeed signals VDD = 3.3V, Vinput = 0V to 1V, IINPUT = 20mA 10 13 Ohm RON_FS On resistance between input to out- put for USB2.0 FS signals (D+/D-) VDD = 3.3V, Vinput = 0 to 3.3V, IINPUT = 20mA 7 9 Ohm RON_HS On resistance between input to out- put for USB2.0 HS signals (D+/D-) VDD = 3.3V, Vinput = -0.4V to + 0.4V, IINPUT = 20mA 4 6 Ohm USB_ID_I Input voltage tolerance on USB_ID path 5.5 V USB_ID_O Output voltage on USB_ID path USB_ID input from 0V to 5.25V 3.6 V Note: Stresses greater than those listed under MAXI - MUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional op - eration of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maxi- mum rating conditions for extended periods may affect reliability. Maximum Ratings (Above which useful life may be impaired. For user guidelines, not tested.) Power Supply Characteristics (TA = –40°C to +85°C) Parameter Description Test Conditions(1) Min Ty p(1) Max Units ICC Quiescent Power Supply Current VDD = Max., VIN = GND or VDD 2 mA 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 Dynamic Electrical Characteristics over Operating Range (TA = -40º to +85ºC, VDD = 3.3V ±10%) Parameter Description Test Conditions Ty p. Max Units XTALK Crosstalk on SuperSpeed Channels See Fig. 1 for Measurement Setup f= 2.5 GHz -25dB dB OIRR OFF Isolation on SuperSpeed Channels See Fig. 2 for Measurement Setup, f= 2.5 GHz -22dB ILOSS Differential Insertion Loss on SuperSpeed Channels @5.0Gbps (see figure 3) -1.7 dB Rloss Differential Return Loss on SuperSpeed channels @ 2.5GHz -16 dB BW_SS Bandwidth -3dB for SuperSpeed path (Tx±/ Rx±) See figure 3 4.7 GHz BW_HS -3dB BW for USB high speed path (D+/-) See figure 3 1.5 GHz Tsw a-b time it takes to switch from port A to port B 1 us Tsw b-a time it takes to switch from port B to port A 1 us Tstartup Vdd valid to channel enable 10 us Twa keup Enabling output by changing OE from low to High 10 us 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at V DD = 3.3V, TA = 25°C ambient and maximum loading. Switching Characteristics (TA= -40º to +85ºC, VDD = 3.3V±10%) Parameter Description Min. Ty p. Max. Units Tpd Propagation delay (input pin to output pin) 80 ps tb-b Bit-to-bit skew within the same differential pair 5 ps tch-ch Channel-to-channel skew 35 ps 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 Fig 1. Crosstalk Setup Fig 2. Off-isolation setup BALANCED PORT1 DUT BALANCED PORT2 BALANCED PORT1 BALANCED PORT2 DUT BALANCED PORT1 BALANCED PORT2 DUT Fig 3. Differential Insertion Loss set up 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 1.00E+07 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) -20.0 -30.0 -40.0 -50.0 -60.0 -70.0 -80.0 -90.0 -100.0 Crosstalk (dB) Fig 4. Xtalk for SuperSpeed channels (Tx/Rx) 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 1.00E+07 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) -30.0 -40.0 -50.0 -60.0 -70.0 -80.0 Off Isolation (dB) -0.0 -10.0 -20.0 Fig 5. Off Isolation for SuperSpeed channels (Tx/Rx). Red is for path B and Blue is for path A 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 1.00E+07 1.00E+08 1.00E+09 1.00E+10 Frequency (Hz) -1.0 -2.0 -3.0 -4.0 -5.0 -6.0 Insertion Loss (dB) -0.0 Fig 6. Insertion Loss for SuperSpeed channels (Tx/Rx). Red is for path B and Blue is for path A 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 RT 4pF CL VDD VIN VOUT 200-ohm 200-ohm 2 * Vdd Pulse Generator D.U.T Test Circuit for Electrical Characteristics(1-5) Notes: 1. CL = Load capacitance: includes jig and probe capacitance. 2. RT = Termination resistance: should be equal to Z OUT of the Pulse Generator 3. Output 1 is for an output with internal conditions such that the output is low except when disabled by the output control. 4. Output 2 is for an output with internal conditions such that the output is high except when disabled by the output control. 5. All input impulses are supplied by generators having the following characteristics: PRR ≤ MHz, Z O = 50Ω, tR ≤ 2.5ns, t F ≤ 2.5ns. 6. The outputs are measured one at a time with one transition per measurement. Switching Waveforms Voltage Waveforms Enable and Disable Times tPLZ 50% 50% VDD VOH VOL tPHZ tPZL tPZH Output 1 Output 2 VOL VOH SEL 10% 90% Switch Positions Test Switch tPLZ, tPZL (output on B-side) 2 * Vdd tPHZ, tPZH (output on B-side) GND Prop Delay Open Test Circuit for Dynamic Electrical Characteristics DUT Agilent PNA-L Network Analyzer Balanced port 1 Balanced port 2 12-0264

USB3.0 and 2.0 Combo switch 11/09/12 Packaging Mechanical: 32-Contact TQFN (ZL) Note: For latest package info, please check: http://www.pericom.com/products/packaging/mechanicals.php1 DESCRIPTION: 32-contact, Thin Fine Pitch Quad Flat No-Lead (TQFN) PACKAGE CODE: ZL (ZL32) DOCUMENT CONTROL #: PD-2044 REVISION: A DATE: 10/09/09 09-0125

Ordering Information

Ordering Code Package Code Package Description PI3USB3102ZLE ZL Pb-free & Green, 32-contact TQFN, Copper Wire PI3USB3102ZLE+DA ZL Pb-free & Green, 32-contact TQFN, Gold Wire Notes:

• Thermal characteristics can be found on the company web site at www.pericom.com/packaging/
• "E" denotes Pb-free and Green
• Adding an "X" at the end of the ordering code denotes tape and reel packaging 12-0264