PI3B3125LEX PERICOM | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 6

Technical content

Features

  • Near-Zero propagation delay
  • 5Ω switches connect inputs to outputs
  • Fast Switching Speed -4ns Max.
  • Ultra Low Quiescent Power (0.1µA Typical) – Ideally suited for notebook applications
  • Packaging (Pb-free & Green available): – 14-pin 150-mil wide plastic SOIC (W) – 14-pin 170-mil wide plastic TSSOP (L) – 16-pin 150-mil wide plastic QSOP (Q) PI3B3125 Block Diagram PI3B3126 Block Diagram 3.3V , 4-Bit, 2-Port Nanoswitch™ w/Individual Enables BE0 BE1 BE2 BE3 SW SW SW SW A B BE SW BE0 BE1 BE2 BE3 SW SW SW SW A B OE SW

3.3V , 4-Bit, 2-Port NanoSwitch™ w/Individual Enables

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PI3B3125 14-Pin Configuration PI3B3126 14-Pin Configuration PI3B3125 16-Pin Configuration PI3B3126 16-Pin Configuration Pin Description Pin Name Description BEN Switch Enable (PI3B3125) BEN Switch Enable (PI3B3126) A3-A0 Bus A B3-B0 Bus B VCC Power GND Ground Truth Table(1) PI3B3125 BEN PI3B3126 BEN AN BN VCC Function X(2) X Hi-Z Hi-Z GND Disconnect H L Hi-Z Hi-Z VCC Disconnect L H Bn An VCC Connect Notes: 1. H = High V oltage Level, L = Low V oltage Level, Hi-Z = High Impedance, X = Don't Care 2. A pull-up resistor should be provided for power-up protection. Note: Stresses greater than those listed under MAXIMUM RAT- INGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for ex - tended periods may affect reliability. Maximum Ratings (Above which the useful life may be impaired. For user guidelines, not tested.) VCC BE3 BE2 BE0 BE1 GND VCC BE3 BE2 BE0 BE1 GND VCC BE3 BE2 NC NC BE0 BE1 GND VCC BE3 BE2 NC NC BE0 BE1 GND

3.3V , 4-Bit, 2-Port NanoSwitch™ w/Individual Enables

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Capacitance (TA = 25°C, f = 1 MHz) Parameters(4) Description Test Conditions Typ. Units CIN Input Capacitance VIN = 0V 3.5 pFCOFF A/B Capacitance, Switch Off 8 Power Supply Characteristics Parameters Description Test Conditions(1) Min. Typ.(2) Max. Units ICC Quiescent Power Supply Current VCC = Max. VIN = GND or VCC 0.1 3 µAΔICC Supply Current per Input HIGH VCC = Max. VIN = 3.0V(3) 750 Parameters Description Test Conditions(1) Min. Typ.(2) Max. Units VIH Input HIGH V oltage Guaranteed Logic HIGH Level 2.0 VVIL Input LOW V oltage Guaranteed Logic LOW Level –0.5 0.8 IIH Input HIGH Current VCC = Max., VIN = VCC ±1 µAIIL Input LOW Current VCC = Max., VIN = GND ±1 IOFF Off Current VCC = 0, VOUT = 3 to 3.6V 10 VIK Clamp Diode V oltage VCC = Min., IIN = –18mA –1.2 V RON Switch On-Resistance(3) VCC = Min., VIN = 0.0V , ION = 48mA or 60mA 5 8 ΩVCC = Min., VIN = 2.4V , ION = 15mA 10 17 Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device. 2. Typical values are at VCC = 3.3V , +25°C ambient. 3. Per driven input (control inputs only); A and B pins do not contribute to ICC. Notes: 1. For Max. or Min. conditions, use appropriate value specified under Electrical Characteristics for the applicable device type. 2. Typical values are at VCC = 3.3V , TA = 25°C ambient and maximum loading. 3. Measured by the voltage drop between A and B pin at indicated current through the switch. On-Resistance is determined by the lower of the voltages on the two (A, B) pins. 4. This parameter is determined by device characterization but is not production tested.

3.3V , 4-Bit, 2-Port NanoSwitch™ w/Individual Enables

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PI3B3125 Switching Characteristics over Operating Range Parameters Description Conditions(1) PI3B3125 UnitsCom. Min. Max. tPLH tPHL Propagation Delay(2,3) Ax to Bx, Bx to Ax CL = 50pF RL = 500Ω 0.25 nstPZH tPZL Bus Enable Time CL = 50pF, RL = 500Ω, 1.0 3.0 tPHZ tPLZ Bus Disable Time RL = 500Ω 1.0 4.0 PI3B3126 Switching Characteristics over Operating Range Parameters Description Conditions(1) PI3B3126 UnitsCom. Min. Max. tPLH tPHL Propagation Delay(2,3) Ax to Bx, Bx to Ax CL= 50pF RL = 500Ω 0.25 nstPZH tPZL Bus Enable Time CL= 50pF, RL = 500Ω, 1.0 2.5 tPHZ tPLZ Bus Disable Time RL = 500Ω 1.0 4.0 Notes: 1. See test circuit and waveforms. 2. This parameter is guaranteed but not tested on Propagation Delays. 3. The bus switch contributes no propagational delay other than the RC delay of the On-Resistance of the switch and the load capacitance. The time constant for the switch alone is of the order of 0.25ns for 50pF load. Since this time constant is much smaller than the rise/fall times of typical driving signals, it adds very little propagational delay to the system. Propagational delay of the bus switch when used in a system is determined by the driving circuit on the driving side of the switch and its interaction with the load on the driven side. Applications Information Logic Inputs The logic control inputs can be driven up to +3.6V regardless of the supply voltage. For example, given a + 3.3V supply, IN may be driven low to 0V and high to 3.6V . Driving IN Rail-to-Rail® minimizes power consumption. Power-Supply Sequencing and Hot-Plug Information Proper power-supply sequencing is recommended for all CMOS devices. Always apply VCC and GND before applying signals to input/output or control pins. Rail-to-Rail is a registeredtrademark of Nippon Motorola, Ltd.

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Packaging Mechanical: 14-pin SOIC (W) Packaging Mechanical: 14-pin TSSOP (L) SEATING PLANE .050 BSC x 45˚ 0-8˚ .149 .157 X.XX X.XX DENOTES DIMENSIONS IN MILLIMETERS 3.78 3.99 .336 .344 8.55 8.75 .0155 .026 0.393 0.660 1.27 .053 .068 1.35 1.75 .2284 .2440 5.80 6.20 .013 .020 0.330 0.508 .0040 .0098 0.10 0.25 .0099 .0196 0.25 0.50 .0075 .0098 0.19 0.25 .016 .050 0.41 1.27 REF 0.193 0.201 0.047 0.002 0.006 SEATING PLANE 0.0256 typical 0.018 0.030 0.004 0.008 0.240 0.2641 0.169 0.177 X.XX X.XX DENOTES DIMENSIONS IN MILLIMETERS 0.05 0.15 6.1 6.7 0.45 0.75 0.09 0.20 4.3 4.5 1.20 max. 4.90 5.10 0.65 0.19 0.30 0.007 0.012

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Pericom Semiconductor Corporation • 1-800-435-2336 • www.pericom.com Packaging Mechanical: 16-pin QSOP (Q) .189 .197 .053 .069 .004 .010 SEATING PLANE .025 BSC .007 .010 .228 .244 .150 .157 .016 .050 X.XX X.XX DENOTES DIMENSIONS IN MILLIMETERS 0.635 4.80 5.00 1.35 1.75 5.79 6.19 0.101 0.254.008 .012 0.203 0.305 3.81 3.99 0.178 0.254 0.38 0.41 1.27 .008 0.203 .015 x 45° REF Detail A Detail A .008 0.20 MIN. Guage Plane .010 0.254 .041 1.04 REF .016 .035 0.41 0.89 0˚-6˚ .008 .013 0.20 0.33

Ordering Information

Ordering Code Package Code Package Desciption PI3B3125L L 14-Pin TSSOP PI3B3125LE L Pb-free & Green, 14-Pin TSSOP PI3B3125W W 14-pin SOIC PI3B3125WE W Pb-free & Green, 14-pin SOIC PI3B3125Q Q 16-pin QSOP PI3B3125QE Q Pb-free & Green, 16-pin QSOP PI3B3126L L 14-Pin TSSOP PI3B3126LE L Pb-free & Green, 14-Pin TSSOP PI3B3126W W 14-pin SOIC PI3B3126WE W Pb-free & Green, 14-pin SOIC PI3B3126Q Q 16-pin QSOP PI3B3126QE Q Pb-free & Green, 16-pin QSOP Notes: 1. Thermal Characteristics can be found on the web at www.pericom.com/packaging/