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Signal Processing Subscriber Line Interface Codec Filter SLICOFI® PEB 3065 Version 3.2 PEF 3065 Version 3.2 Data Sheet 01.98 DS 2
Revision History: Current Version: 01.98 Previous Version: 03.95 (V 1.0) Page (in previous Version) Page (in current Version) Subjects (major changes since last revision) Edition 01.98 Published by Siemens AG, HL TS, Balanstraße 73,
81541 München
© Siemens AG 1997. All Rights Reserved. Attention please! As far as patents or other rights of third parties are concerned, liability is only assumed for components, not for applications, processes and circuits implemented within components or assemblies. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. For questions on technology, delivery and prices please contact the Semiconductor Group Offices in Germany or the Siemens Companies and Representatives worldwide (see address list). Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Siemens Office, Semiconductor Group. Siemens AG is an approved CECC manufacturer. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs in- curred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 of the Semiconductor Group of Siemens AG, may only be used in life-support devices or systems2 with the express written approval of the Semiconductor Group of Siemens AG. 1 A critical component is a component used in a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain hu- man life. If they fail, it is reasonable to assume that the health of the user may be endangered.
Semiconductor Group 3 01.98
3.4 SLICOFI
5.6 IOM
Semiconductor Group 4 01.98 IOM ® , IOM® -2 and SLICOFI® are registered trademarks of Siemens AG
Semiconductor Group 5 01.98
1 General Description
The Signal Processing Subscriber Line Interface Codec Filter SLICOFI (PEB 3065/PEF 3065) is a logic continuation of the well established family of the SIEMENS PCM-Codec-Filter-IC's with the vertical integration of all DC-feeding, Supervision and Meterpulse Injection features on chip as well. Fabricated in a standard 1 µm BiCMOS technology the SLICOFI is tailored for very flexible solutions in digital communication systems. For the first time the SLICOFI uses the benefits of a DSP not only for the voice channel but even for line feeding and supervision which leads to a very high flexibility without the need for external components. Based on an advanced digital filter concept, the PEB 3065/PEF 3065 provides excellent transmission performance. The new filter concept (second generation in SIEMENS-Codec-family) leads to a maximum of independence between the different filter blocks. Each filter block can be seen as a one to one representative of the corresponding network element. Together with the software package SLICOS, filter optimizing to different applications can be done in a clear and straight forward procedure. The AC frequency behavior is mainly determined by the digital filters. Using the new oversampling 1 bit-AD/DA converter, linearity is only limited by second order parasitic effects. The new - digital - solution of line feeding offers free programmability of feeding current and voltage as well as very fast settling of the dc-operating point after transitions. A 0.3 Hz lowpass filter in the DC-loop is mainly responsible for the system stability. Additionally teletax generation and filtering is implemented as well as free programmable (balanced) ring generation with zero-crossing injection. Offhook detection with programmable thresholds is possible in all operating modes. To reduce overall power consumption of the line card, the SLICOFI provides a special mode called Power Denial where Offhook is done via 2 high voltage inputs ( VLINE1 and VLINE2) directly connected to the line if the HV-SLIC is switched off.
Semiconductor Group 6 01.98 Signal Processing Subscriber Line Interface Codec Filter SLICOFI PEB 3065 PEF 3065 Data Sheet for the Version 3.2 CMOS Type Package PEB 3065N V3.2 P-LCC-44 / Tube PEB 3065N V3.2 P-LCC-44 / Tape in Real PEF 3065N V3.2 P-LCC-44 / Tape in Real
1.1 Features
- Single chip CODEC and FILTER including all LOW VOLTAGE SLIC functions
- Only few external components required
- No trimming or adjustments required
- Specification according to relevant CCITT, LSSGR and DBP recommendations
- Digital signal processing technique
- Advanced low power 1 µm BiCMOS 1) technology
- PCM encoded digital voice transmission (A-Law or µ-Law)
- Four pin serial IOM-2 Interface
- Standard P-LCC-44 package
- High performance AD and DA Conversion
- Programmable digital filters for – Impedance matching – Transhybrid balancing – Frequency response –G a i n
- Advanced test capabilities – Integrated line and circuit tests – Two programmable tone generators
- Optimized HV-SLIC Interface
- Fully digital programmable DC-Characteristic – Programmable Constant Current from 0-70 mA – Programmable Resistive Values from 0-2 × 500 Ω
- Programmable Integrated Teletax Injection and Filtering during Conversation and Onhook – Programmable up to 125 mVrms (5 Vrms at ab-wire) – Programmable frequency 12/16 kHz 1) Abbreviations see chapter 10.4.
Semiconductor Group 7 01.98
- Polarity reversal (programmable soft or hard)
- Integrated (balanced) Ringing Generation with zero crossing injection – Programmable frequency between 16.6 and 70 Hz (up to 300 Hz for test) – Programmable amplitude up to 2.125 Vrms (85 Vrms at ab-wire)
- Four operating modes: Power Denial, Power Down, Active and Ringing
- Offhook detection with programmable thresholds for all operating modes
- Integrated Ring Trip Detection with zero crossing turn off function
- Ground Start and Loop Start possible
- Integrated checksum Calculation for CRAM
- Line Card Identification
Semiconductor Group 8 01.98
2 Pin Configuration
28 27 26 25 24 23 22 21 20 19 18 29 N.C.REXT CAP ILID-L N.C.ID-M RESERVED VLINE2 ID-H C2RES C1RESERVED IO2I1 IO1O1 SEL24 TS2 TS1 TS0 TE2 FSC DCL DD DU DDDV V2W PDN GNDA TE1 GNDIT ITAC TE3 IT N.C. GNDD N.C. VLINE1 VBIM VDDA VSS PEB 3065 R REF SLICOFI R
Semiconductor Group 9 01.98
2.1 Pin Definition and Functions
The following tables group the pins according to their functions. They include pin number, pin name, type, a brief description of the function, and cross-references referring to the sections in which the pin functions are discussed. Table 1 Pin No. Name Type Function Reference 27 GNDA − Analog Ground chapter 9.1.1 1 GNDD − Digital Ground chapter 9.1.1 VDDA −+ 5 V Analog Supply Voltage chapter 9.1.1 2 VDDD −+ 5 V Digital Supply Voltage chapter 9.1.1 33 VSS −− 5 V Analog Supply Voltage chapter 9.1.1 Table 2 IOM ® -2 Pins Pin No. Name Type Function Reference
6 DU O IOM-2 Data Upstream chapter 4
5 DD I IOM-2 Data Downstream chapter 4
4 DCL I IOM-2 Data-Clock chapter 4
3 FSC I IOM-2 Frame-Sync. chapter 4
43 TS0 I Time Slot selection Pin 0 chapter 4
42 TS1 I Time Slot selection Pin 1 chapter 4
41 TS2 I Time Slot selection Pin 2 chapter 4
40 SEL24 I Select DCL = 2 or 4 MHz chapter 4
Table 3 Interface to HV-SLIC Pin No. Name Type Function Reference
25 VBIM I Battery Image Input chapter 7
28 PDN O Set the HV-SLIC to Power Denial chapter 7
19 IT I Transversal Current Input (AC + DC) chapter 7
21 ITAC I Transversal Current Input (for AC) chapter 7
22 GNDIT I Analog Ground chapter 7
15 IL I Longitudinal Current Input chapter 7
Semiconductor Group 10 01.98
26 V2W O Two Wire Output Voltage chapter 7
9 C1 O Ternary Interface to HV-SLIC chapter 7
10 C2 O Ternary Interface to HV-SLIC chapter 7
11 VLINE 1 I Offhook-Detection in Power Denial
12 VLINE 2 I Offhook-Detection in Power Denial
Pin No. Name Type Function Reference 7 IO1 I/O User-Programmable I/O Pin chapter 5.6 8 IO2 I/O User-Programmable I/O Pin chapter 5.6 38 I1 I Fixed Input Pin chapter 5.6 39 O1 O Fixed Output Pin chapter 5.6 Table 5 Miscellaneous Function Pins Pin No. Name Type Function Reference Values 36 RES I Reset chapter 6.1
30 CAP I External Capacitor to GNDA 68 nF 5%
23 RREF I External Resistor to GNDA 30 k 1%
29 REXT I External Ring Sync. Input chapter 6.6 31 ID-L I External Identification (Pin strapping) chapter 10.2 32 ID-M I External Identification (Pin strapping) chapter 10.2
35 ID-H I External Identification (Connect
ASIC) chapter 10.2
20 TE3 O Test Pin, mustn’t be connected −
24 TE1 − Test Pin (Not connected) −
44 TE2 O Test Pin, mustn’t be connected −
Table 3 Interface to HV-SLIC (cont’d) Pin No. Name Type Function Reference
Semiconductor Group 11 01.98 Table 6 Pins not Used Pin No. Name Type Function Reference
13 RESERVED − Reserved (not connected) −
37 RESERVED O Reserved test pin, mustn’t be
14 N.C. − Not connected (not used) − 16 N.C. − Not connected (not used) − 17 N.C. − Not connected (not used) − 18 N.C. − Not connected (not used) −
SLICOFI® Principles Semiconductor Group 12 01.98
3 SLICOFI ® Principles
Five Oversampling AD/DA converters are necessary for data conversion to gain the aspired programmability in the DSP. Generally the SLICOFI can be divided between the AC-Loop which is handling the voice and additionally teletax and the DC-Loop for line feeding, ringing injection and supervision.
3.1 SLICOFI
® Signal Flow Graph: AC Figure 2 Transmit Path The analog input signal has to be connected to pin 21 (ITAC) by an external capacitor (680 nF - 1µF) for AC/DC separation. After passing a simple initializing prefilter (PREFI) the voice signal is converted to a 1-bit digital data stream in the ΣΔ -converter. The first down sampling steps are done in fast running digital hardware filters. The following steps are implemented in the micro code which has to be executed by the central Digital Signal Processor. This DSP-machine is able to handle the workload for the DC-loop as well. At the end the fully processed signal (flexibly programmed in many parameters) is transferred to the IOM-2 Interface in a PCM-compressed signal representation. Receive Path The digital input signal is received via the IOM-2 Interface. Expansion, PCM-lowpass-filtering, gain correction and frequency response correction are the next ITS10183 XFIX2TTXFI AGR RFIX2 + + IM2 1IM IMFIX2 IMFIX1 AR2 2AX + THFIX TH XFIX1 RFIX1 FRR FRX AX1 1AR CMP EXP ITAC V2W Output Input TG21TG User Programmable Block Functional Block Fixed Filter Block PCM PCMAGX IMFIX3 A D D A DHPX DHPRA AGTTX D TTGEN Transmit Path Receive Path
SLICOFI® Principles Semiconductor Group 13 01.98 steps which are done by the DSP-machine. The up sampling interpolation steps are again processed by fast hardware structures to reduce the DSP-workload. The upsampled 1-bit data stream is then converted to an analog equivalent which is smoothed by a POST-Filter (POFI). At the summing point the values of the TTX-Generator and the DC-loop are added and then transferred to the output pin 26 V2W ). Loops There are two different loops implemented: The Impedance Matching (IM) loop which is divided in 3 separate loops to guarantee very high flexibility to various impedances, and the Transhybrid Balancing (TH) loop.
3.2 SLICOFI
® Signal Flow Graph: DC Figure 3 DC Characteristic The incoming information at pin IT (scaled transversal current (AC + DC) transferred to a voltage via a resistor) is first lowpass filtered (0.3 Hz) for stability and noise reasons and then fed into the DC-characteristic block. This consists of two branches which represents different kinds of feeding behavior. In typical applications it acts as a programmable constant current source ( Rin > 30 k). If the desired value cannot be held ITS10182 IT V2W Output Input User Programmable Block Functional Block Fixed Filter Block PCM PCM A D D A LP DCCHAR + RNG CHOP ITAC DCX AG AG DCR AC LOOP
SLICOFI® Principles Semiconductor Group 14 01.98 feeding switches automatically and smooth to the resistive branch (Rin > 0-1 k). For superposing voice as well as Teletax pulses the necessary drop at the line can be calculated and taken into account as well. The outgoing DC-feeding value - superposed with the AC-Loop result at the summing point is transferred to pin 26 ( V2W ). Supervision The HOOK-information is the most important one and the SLICOFI provides this information via CIDU (see chapter 5.6), in all operating modes: For Power Denial via 2 high voltage input pins (VLINE) directly connected to the line. For each other mode the line current information (from pin IT) is transferred via an ADC to the DSP where the Offhook information is extracted in the proper way: Power Down: Offhook is detected if Constant current feeding is possible. Active: Offhook is detected if the incoming voltage at IT exceeds a programmed value. To avoid instable information, lowpass filtering and a hystereses is provided (2 independent programmable values for Offhook and Onhook detection). Ringing: Ring Trip occurs if the DC-value at IT exceeds the programmed Ring Trip threshold. The AC-value is filtered by the SLICOFI automatically. Ring Trip detection is reported within 2 cycles of the ring period and then the internal ring generator is switched off within 3 cycles at zero crossing of the ring voltage. Ground key (CIDU-6: GNK) is reported if the absolute value of the voltage at pin IL exceeds 255 mV. With a programmable lowpass filter (see chapter 5.6) interfering frequencies (e.g. power lines with 50/60 Hz) can be filtered very effectively.
3.3 Test Features
The SLICOFI provides two different kinds of test features: Internal test loops for circuit testing and defined test loops to perform board and line tests. There are loops for testing AC and DC path. As a special feature it is possible to switch signals to and from the DC-path via the IOM-2 Interface. Additionally there is the possibility to cut off the AC-receive and transmit path. (The different kinds of testmodes are described in chapter 10.3)
SLICOFI® Principles Semiconductor Group 15 01.98
3.4 SLICOFI ® Signal Block Diagram
D HW-Fi HW-Fi HW-Fi HW-Fi HW-Fi Komp. Kompand PLA µ - Program ALU1 ALU2 RAM1 RAM2 CLU CRAM Control FlagControl CTL INT R IOM -2 I/O Ports DBUS Test Pin HV- Interface IT ITAC Ωk 1.5 1.5 Ωk nF 680 A/B-Supply A/B-Sensor HV-Control HV-SLIC IL IT INV AGND BGNDbatV+ V- bat AGND BGND a b LINEV ECIC 30 kΩDDDV DDAV SSV R REF 68 nF CAP POfi POfi A A D D A A D A D
IOM ® -2 Interface Semiconductor Group 16 01.98 4I O M ® -2 Interface The IOM-2 interface consists of two data lines and two clock lines. DU (data upstream) carries data from the SLICOFI to a master device. DD (data downstream) carries data from the master device to the SLICOF. A frame synchronization clock signal (8 kHz, FSC) as well as a data clock signal (2048 kHz or 4096 kHz, DCL) has to be supplied to the SLICOFI. The SLICOFI handles data as described in the IOM-2 specification for analog devices. Figure 5 IOM ® -2 Interface Timing for 8 voice channels (per 8 kHz frame) ITT10165 Detail A 125 FSC DD DU DCL DD DU M XR MVoice Channel Detail A TS0 0TS 1TS 2TS 3TS 4TS 5TS 6TS 7TS TS7TS6TS5TS4TS3TS2TS1 M RX M µ s Voice Channel Don't Care High Impedance Monitor Channel Monitor Channel C/I Channel C/I Channel
IOM ® -2 Interface Semiconductor Group 18 01.98 IOM ® -2 Time Slot Assignment An assignment of 8 time slots is possible for each voice-channel. The IOM-2 operating mode and time slot selection is set completely by pin-strapping. 1) Time slots 1, 2, 3 and 5 are not working with DCL = 2048 kHz. For a workaround in the 2MHz mode please contact the SIEMENS HL Application group. Table 7 SEL24 TS2 TS1 TS0 IOM ® -2 Operating Mode 0 0 0 0 Time slot 0; DCL = 2048 kHz 0 0 0 1 Time slot 1; DCL = 2048 kHz 1) 0 0 1 0 Time slot 2; DCL = 2048 kHz 1) 0 0 1 1 Time slot 3; DCL = 2048 kHz 1) 0 1 0 0 Time slot 4; DCL = 2048 kHz 0 1 0 1 Time slot 5; DCL = 2048 kHz 1) 0 1 1 0 Time slot 6; DCL = 2048 kHz 0 1 1 1 Time slot 7; DCL = 2048 kHz 1 0 0 0 Time slot 0; DCL = 4096 kHz 1 0 0 1 Time slot 1; DCL = 4096 kHz 1 0 1 0 Time slot 2; DCL = 4096 kHz 1 0 1 1 Time slot 3; DCL = 4096 kHz 1 1 0 0 Time slot 4; DCL = 4096 kHz 1 1 0 1 Time slot 5; DCL = 4096 kHz 1 1 1 0 Time slot 6; DCL = 4096 kHz 1 1 1 1 Time slot 7; DCL = 4096 kHz
Programming the SLICOFI® Semiconductor Group 19 01.98
5 Programming the SLICOFI ®
With the appropriate commands, the SLICOFI can be programmed and verified very flexible via the IOM-2 Interface monitor channel. Data transfer to the SLICOFI starts with a SLICOFI-specific address byte (81H ). With the second byte one of 3 different types of commands (SOP, TOP or COP) is selected. SOP and COP can be used as a write or read command, the TOP-Command is used for reading only. Due to the extended SLICOFI feature control facilities, SOP, COP and TOP commands contain additional information (e.g. number of subsequent bytes) for programming (write) and verifying (read) the SLICOFI status. A write command is followed by up to 8 bytes of data. The SLICOFI responds to a read command with its IOM2 specific address and the requested information, that is up to 15 bytes of data (see chapter 5.2). Attention: Each byte on the monitor channel has to be sent twice at least according to the IOM2 Monitor handshake procedure. (For more information on IOM-2 specific Monitor Channel Data Structure see chapter 10).
5.1 Types of Monitor Bytes
The 8-bit Monitor bytes have to be interpreted as either commands or status information stored in Configuration Registers or the Coefficient Ram. There are three different types of SLICOFI commands which are selected by bit 2 and 3 as shown below. … don't care) SOP Status Operation: SLICOFI status setting/monitoring TOP Transfer Operation: Read Certain Status Options only COP Coefficient Operation: filter coefficient setting/monitoring Storage of programming information: 8 (9) status configuration registers: (SCR0), SCR1, … SCR8 accessed by SOP commands B i t 76543210 B i t 76543210 B i t 76543210
Programming the SLICOFI® Semiconductor Group 20 01.98 8 test configuration registers: STCR1 … STCR8 accessed by SOP commands
18 Transfer configuration registers: TCR1, TCR2… TCR18 accessed by TOP
1 Coefficient RAM: CRAM accessed by COP commands
5.2 SLICOFI ® Programming Procedure
(DD… Data Downstream, DU… Data Upstream, only the Monitor Bytes are considered) SOP – Write Commands D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e S O P - W r i t e 0 B y t e 0 0100 I d l e D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e S O P - W r i t e 2 B y t e s 0 0101 I d l e SCR1 Data Idle SCR2 Data Idle D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e S O P - W r i t e 8 B y t e s 0 0110 I d l e SCR1 Data Idle :: : SCR8 Data Idle D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e S O P - W r i t e 8 B y t e s 0 0111 I d l e STCR1 Data Idle :: : STCR8 Data Idle
Programming the SLICOFI® Semiconductor Group 21 01.98 TOP – Write Commands no write command possible; reading only. COP – Write Commands SOP – Read Commands D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e COP-Write 8 Bytes 0 0 0 Idle Coeff. 1 Data Idle :: : Coeff. 8 Data Idle D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e SOP-Read 1 Byte 1 0 1 0 0 Idle I d l e 10000001A d d r e s s Idle Data SCR0 D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e SOP-Read 3 Bytes 1 0 1 0 1 Idle I d l e 10000001A d d r e s s Idle Data SCR0 Idle Data SCR1 Idle Data SCR2 D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e SOP-Read 9 Bytes 1 1 1 0 Idle I d l e 10000001A d d r e s s Idle Data SCR0 :: : Idle Data SCR8
Programming the SLICOFI® Semiconductor Group 22 01.98 TOP – Read Commands D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e SOP-Read 8 Bytes 1 1 1 1 Idle I d l e 10000001A d d r e s s Idle Data STCR1 :: : Idle Data STCR8 D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e T O P - R e a d 1 B y t e 1 1100 I d l e I d l e 10000001A d d r e s s Idle Data TCR1 D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e T O P - R e a d 3 B y t e s 1 1101 I d l e I d l e 10000001A d d r e s s Idle Data TCR1 Idle Data TCR2 Idle Data TCR3 D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e T O P - R e a d 1 5 B y t e s 1 1110 I d l e I d l e 10000001A d d r e s s Idle Data TCR4 :: : Idle Data TCR18
Programming the SLICOFI® Semiconductor Group 23 01.98 COP – Read Commands Example for a Mixed Command D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e COP-Read 8 Bytes 1 0 0 Idle I d l e 10000001A d d r e s s Idle Data Coeff. 1 :: : Idle Data Coeff. 8 D D 76543210B i t 76543210 D U A d d r e s s 10000001 I d l e SOP-Write 2 Bytes 0 0 1 0 1 Idle SCR1 Data Idle SCR2 Data Idle COP-Write 8 Bytes 0 0 0 Idle Coeff. 1 Data Idle Coeff. 2 Data Idle Coeff. 3 Data Idle Coeff. 4 Data Idle Coeff. 5 Data Idle Coeff. 6 Data Idle Coeff. 7 Data Idle Coeff. 8 Data Idle SOP-Read 3 Bytes 1 0 1 0 1 Idle I d l e 10000001A d d r e s s Idle Data SCR0 Idle Data SCR1 Idle Data SCR2 A d d r e s s 10000001 I d l e COP-Read 8 Bytes 1 0 0 Idle I d l e 10000001A d d r e s s
Programming the SLICOFI® Semiconductor Group 24 01.98 Idle Data Coeff. 1 Idle Data Coeff. 2 Idle Data Coeff. 3 Idle Data Coeff. 4 Idle Data Coeff. 5 Idle Data Coeff. 6 Idle Data Coeff. 7 Idle Data Coeff. 8 A d d r e s s 10000001 I d l e T O P - R e a d 1 B y t e 1 1100 I d l e I d l e 10000001A d d r e s s Idle Data TCR1 D D 76543210B i t 76543210 D U
Programming the SLICOFI® Semiconductor Group 25 01.98
5.3 SOP Command
To modify or evaluate the SLICOFI status, the contents of up to 8 configuration registers SCR1, … SCR8 may be transferred to, or up to 9 (incl. SCR0) from the SLICOFI. This is done by a SOP-Command (status operation command). With LSEL = 11 some test registers can be set/read (for internal use only!). The two commands POLNR and RST are only valid if RW = 0 (write); they are ignored for RW = 1 (read) RW Read/Write Information: Enables reading from the SLICOFI or writing information to the SLICOFI RW = 0 Write to SLICOFI RW = 1 Read from SLICOFI POLNR General DC feeding Information: Normal or Reverse Polarity POLNR = 0 sets the SLICOFI to Normal Polarity feeding POLNR = 1 sets the SLICOFI to Reverse Polarity feeding RST Software Reset RST = 0 Normal Operation RST = 1 Reset SLICOFI (same as Reset pin 36 (RES)): sets the SLICOFI to the basic setting mode (see chapter 6.1). LSEL Length select information (also see programming procedure, chapter 5.2). This field identifies the number of subsequent data bytes If RW = 0 Write to SLICOFI LSEL = 00 no byte of data is following LSEL = 01 2 bytes of data are following (SCR1, SCR2) LSEL = 10 8 bytes of data are following (SCR1,... SCR8) LSEL = 11 Accesses Test Registers (see Appendix) If RW = 1 Read from SLICOFI LSEL = 00 1 byte of data is following (SCR0) LSEL = 01 3 bytes of data are following (SCR0, SCR1, SCR2) LSEL = 10 9 bytes of data are following (SCR0, … SCR8) LSEL = 11 Accesses Test Registers (see Appendix, chapter 10.3) B i t 76543210
0 RW POLNR RST 0 1 LSEL1 LSEL0
Programming the SLICOFI® Semiconductor Group 26 01.98 SCR0 Configuration Register 0 Configuration Register SCR0 can be read only. It gives a mirror of the SOP-Command itself to control its contents and represents the reset value as defined below. Reset value: 54H (if only SCR0 is read. It depends on LSEL1 and LSEL0.) POLNR General DC feeding Information: Normal or Reverse Polarity POLNR = 0 indicates, that the SLICOFI was set to Normal Polarity feeding POLNR = 1 indicates, that the SLICOFI was set to Reverse Polarity feeding1) RSTST Status of Reset Indicates the occurrence of a reset: RSTST = 1 if there has been a Reset by any of the following three reasons: – via the Reset-pin (RES) – via the Power on Reset – via the Software Reset (SOP–Command) the RSTST-bit is set to ‘1’. RSTST = 0 no Reset has occurred since the last SOP-Read (with LSEL = 00b). This bit is cleared only by a SOP-read with LSEL = 00b at the end of the data transmission. LSEL is the mirror of the SOP-Read LSEL contents. 1) The internal manipulation with “Reverse meterpulses” is not indicated by that bit. B i t 76543210 0 1P O L N R RSTST 0 1 LSEL1 LSEL0
Programming the SLICOFI® Semiconductor Group 27 01.98 SCR1 Configuration Register 1 Configuration register SCR1 defines the basic feeding modes of the SLICOFI and enables/disables test features: Reset value: 00H PD SLICOFI is set either in Power Down or Power Denial mode together with CIDD-bits CIDD6,7 (see chapter 6). PD = 0 SLICOFI set to Power Denial mode; line supervision via VLINE1, 2 PD = 1 SLICOFI set to Power Down mode N/BB SLICOFI is in normal or Boosted Battery mode (see chapter 6.5). N/BB = 0 Normal feeding N/BB = 1 Changes ternary interface to HV-SLIC which sets the HV-SLIC to Boosted Battery mode LB Handling of Loop Back functions for on chip test loops LB = 0 normal function LB = 1 the desired Loop Back function (analog or digital) is enabled (selected by SCR6, together with the TM-bit (SCR2-3)) ETG1 Enables programmable Test Tone Generator 1 ETG1 = 0 Test Tone Generator 1 is disabled ETG1 = 1 Test Tone Generator 1 is enabled HI-b For HV-SLIC test function HI-b = 0 normal operation HI-b = 1 changes ternary Interface to HV-SLIC which sets the b-leg of the line into high impedance state HI-a For HV-SLIC test function HI-a = 0 normal operation HI-a = 1 changes ternary Interface to HV-SLIC which sets the a-leg of the line into high impedance state DHP-X Disable Transmit Highpass for test reasons (see chapter 10.3) DHP-X = 0 Transmit Highpass Filter is enabled DHP-X = 1 Transmit Highpass Filter is disabled COR Cut Off Receive Path for test reasons (see chapter 10.3) COR = 0 Receive Path transmission is available COR = 1 Receive Path is disabled B i t 76543210 PD N/BB LB ETG1 HI-b HI-a DHP-X COR
Programming the SLICOFI® Semiconductor Group 28 01.98 SCR2 Configuration Register 2 Configuration register SCR2 defines some testmode output results, some special SLMA-mode requirements and the possibility to program 2 I/O-ports. Reset value: 00H (then as measured) MVA Internal measurement results shown in the following 3 bits are valid or not valid (read only) (see chapter 10.3) MVA = 0 the following 3 ok-bit results are not valid MVA = 1 the following 3 ok-bit results are valid OKTON Test Tone measurement information (read only) - programmed via COP-command (Testloop: DLB_4M and TG1 enabled, see chapter 10.3) OKTON = 0 Test tone value out of defined range OKTON = 1 Test tone value in defined range OKTTX Test teletax metering information (read only) - programmed via COP-command (see chapter 10.3) OKTTX = 0 Test teletax metering value smaller than defined value OKTTX = 1 Test teletax metering value larger than defined value OKRNG Test Ring tone information (read only) – programmed via COP-command (see chapter 10.3) OKRNG = 0 Ring tone value smaller than defined value OKRNG = 1 Ring tone value larger than defined value TM enables or disables the SLICOFI Testmodes (see chapter 10.3) TM = 0 resets the assigned tests (normal mode) TM = 1 sets the assigned tests (selected by SCR6, together with the LB-bit (SCR1-5)) NOSL No slope: means that the ramping of teletax (TTX) signal is switched off NOSL = 0 Slope of TTX-Signal is smooth NOSL = 1 Hard switch of TTX-Signal IO1 Selection for programmable IO - Pin IO1 IO1 = 0 sets the pin IO1 as an input IO2 = 1 sets the pin IO1 as an output IO2 Selection for programmable IO - Pin IO2 IO1 = 0 sets the pin IO2 as an input IO2 = 1 sets the pin IO2 as an output B i t 76543210 MVA OKTON OKTTX OKRNG TM NOSL IO1 IO2
Programming the SLICOFI® Semiconductor Group 29 01.98 SCR3 Configuration Register 3 Configuration register SCR3 defines the meterpulse settings and the Data Upstream Persistency Counter. Reset value: 8AH TTXNO Meterpulses are represented by teletax (TTX) with 12 or 16 kHz or with Reverse Polarity TTXNO = 0 Meterpulses are represented with 12 kHz or 16 kHz TTXNO = 1 Meterpulses are represented with Reverse Polarity TTX12 Teletax-signal with 12 kHz or 16 kHz TTX12 = 0 16 kHz teletax-signal TTX12 = 1 12 kHz teletax-signal SOREV The reversal pulse is either soft or hard SOREV = 0 hard reversal SOREV = 1 soft reversal Note: For proper function special coefficients generated by SLICOS should be used. To realize this function following settings must be done: 1. Enable the testregisters (Configuration Register 5: SCR5-1 (ENTR)=1), (page 32) 2. The testregisterblock must be load with STCR3-0 (SOFTVER) = 1, (see chapter 10.3) B i t 76543210 TTXNO TTX12 SOREV PDADIS DUP3 DUP2 DUP1 DUP0
Programming the SLICOFI® Semiconductor Group 30 01.98 STCR3 Test Configuration Register 3 3. SCR3-5 (SOREV) = 1 PDADIS The automatic HV-SLIC Power Down - Active switching (see chapter 6.4) can be switched off PDADIS = 0 use automatic Power Down-Active switching PDADIS = 1 disables automatic Power Down-Active switching DUP To restrict the rate of upstream C/I-bit changes, deglitching (persistence checking) of the status information from the SLICOFI may be applied. New status information will be transmitted upstream, after it has been stable for N milliseconds. N is binary programmable in the range of 1 to 15 ms in steps of 1 ms; with DUP = 0 H the deglitching is disabled. Reset value is 10 ms. The HOOK, SLCX and the I(O)-bits are influenced (different counters but same programming). Detailed info see chapter 5.4. B i t 76543210 0000000
Programming the SLICOFI® Semiconductor Group 31 01.98 SCR4 Configuration Register 4 Configuration register SCR4 defines the basic SLICOFI settings which enable / disable the programmable digital filters and the second tone generator. Reset value: 00H TH Set transhybrid Balancing Filter – together with the bit FIXC (SCR5-5). For FIXC = 1 the TH-Filter is set to HTH = for ZBRD ; for FIXC = 0: TH = 0 TH-filter is disabled TH = 1 TH-filter is enabled (use programmed values) IM Set DSP-implemented Impedance Matching Filter - together with the bit FIXC (SCR5-5). For FIXC = 1 the IM-Filter is set to H IM = for 900; for FIXC = 0: IM = 0 IM-filter is disabled IM = 1 IM-filter is enabled (use programmed values) FRX Enable FRX- (Frequency Response Transmit) Filter FRX = 0 FRX-filter is disabled (H FRX =1 ) FRX = 1 FRX-filter is enabled (use programmed values) FRR Enable FRR- (Frequency Response Receive) Filter FRR = 0 FRR-filter is disabled (HFRR =1 ) FRR = 1 FRR-filter is enabled (use programmed values) AX Set AX- (Amplification/Attenuation Transmit) Filter AX = 0 AX-filter is set to default value (HAX = 10 dB) AX = 1 AX-filter is enabled (use programmed values) AR Set AR- (Amplification/Attenuation Receive) Filter AR = 0 AR-filter is set to default value (HAR = − 15.11 dB) AR = 1 AR-filter is enabled (use programmed values) ETG2 Enable programmable Test Tone Generator 2 ETG2 = 0 Test Tone Generator 2 is disabled ETG2 = 1 Test Tone generator 2 is enabled PTG User programmable frequency or fixed frequency is selected PTG = 0 fixed frequency for both Test Tone Generators TG1 = 1008 Hz, TG2 = 2 kHz PTG = 1 programmed frequency for both Test Tone Generators B i t 76543210 TH IM FRX FRR AX AR ETG2 PTG
Programming the SLICOFI® Semiconductor Group 32 01.98 SCR5 Configuration Register 5 Configuration register SCR5 defines various different features. Reset value: 20H DHP-R Disable Receive Highpass for test reasons (see chapter 10.3) DHP-R = 0 Receive Highpass Filter is enabled DHP-R = 1 Receive Highpass Filter is disabled LAW PCM - law selection LAW = 0 A-Law is selected LAW = 1 µ-Law (µ255 PCM) is selected FIXC The SLICOFI uses either fixed coefficients or the programmed ones. FIXC = 0 programmed coefficients used FIXC = 1 fixed coefficients used fixed coefficients: (see chapter 6.2) LIN Linear mode selection (16 bit linear information in voice channel A (upper byte) and B (lower byte). LIN = 0 PCM-mode is selected LIN = 1 linear mode is selected IDR Initialize Data RAM IDR = 0 normal operation is selected IDR = 1 contents of Data RAM is set to 0 (for test purposes) REXTEN Ringing External REXTEN = 0 normal operation REXTEN = 1 used for external (unbalanced) ringing ENTR Enable Test Mode Register ENTR = 0 normal operation: the contents of the Test Registers are permanently set to the default values ENTR = 1 the contents of the Test Registers can be changed B i t 76543 2 10 DHP-R LAW FIXC LIN IDR REXTEN ENTR 0
Programming the SLICOFI® Semiconductor Group 33 01.98 SCR6 Configuration Register 6 Configuration register SCR6 defines various test features and test loops. Reset value: 00H COT8 Cut Off Transmit Path at 8 kHz for test reasons (Input of Compression) COT8 = 0 transmit path transmission is enabled COT8 = 1 transmit path is disabled (output is zero for µ-law and linear mode, + 1 (= LSB) for A-law) COT16 Cut Off Transmit Path at 16 kHz for test reasons (Input of TH-Filter) COT16 = 0 transmit path transmission is enabled COT16 = 1 transmit path is disabled OPIMAN Open analog Impedance Matching Loop (IMAN) OPIMAN = 0 normal operation OPIMAN = 1 opens analog IM-Loop (H IMAN =0 ) OPIM4M Open fast digital Impedance Matching Loop (IM4M) OPIM4M = 0 normal operation OPIM4M = 1 opens fast digital IM-Loop (HIM4M =0 ) TEST LOOPS 4 bit field for various analog and digital test loops can be set together with LB and TM (see chapter 10.3, for detailed information). Bit 7 6 5 4 3 2 1 0 COT8 COT16 OPIMAN OPIM4M TEST LOOPS
Programming the SLICOFI® Semiconductor Group 34 01.98 SCR7 Configuration Register 7 Configuration register SCR7 is the Mask register. With it each bit of TCR1 (Signalling register) can be masked; that means changes of such a “masked bit” are not causing a change of the SLCX - bit (Data Upstream C/I-channel byte). Reset value: FF H HOOKM Mask bit for Offhook information HOOKM = 0 each change of the HOOK bit leads to an interrupt (SLCX-bit) HOOKM = 1 changes of HOOK bit are neglected GNKM Mask bit for ground key information GNKM = 0 each change of the GNK bit leads to an interrupt (SLCX-bit) GNKM = 1 changes of GNK bit are neglected VB/2M Mask bit for half battery information VB/2M = 0 each change of the VB/2 bit leads to an interrupt (SLCX-bit) VB/2M = 1 changes of VB/2 bit are neglected ICONM Mask bit for constant current information ICONM = 0 each change of the ICON bit leads to an interrupt (SLCX-bit) ICONM = 1 changes of ICON bit are neglected TEMPM Mask bit for over temperature information TEMPM = 0 each change of the TEMPA bit leads to an interrupt (SLCX-bit) TEMPM = 1 changes of TEMPA bit are neglected CFAILM Mask bit for clock fail information CFAILM = 0 each change of the CFAIL bit leads to an interrupt (SLCX-bit) CFAILM = 1 changes of CFAIL bit are neglected Information about changing half battery- and constant current- information will be neglected on both of the Power Denial and the Ringing state, and information about changing ground key information will be neglected in the Power Denial state. B i t 76543210 HOOKM GNKM VB/2M ICONM TEMPM CFAILM 1 1
Programming the SLICOFI® Semiconductor Group 35 01.98 SCR8 Configuration Register 8 Configuration register SCR8 defines some Test Mode Settings and the Ground Key/External Indication Data Upstream Persistency Counter. Reset value: 05H DCANAL Test bit to shorten internally the IT with the V2W pin DCANAL = 0 normal operation DCANAL = 1 the DC Analog Loop is closed CHOPACT Transforms DC-Test values to 500 Hz rectangular values at the PCM interface CHOPACT = 0 normal operation CHOPACT = 1 chopping function is activated DCHOLD Holds the actual DC-value at the V2W output DCHOLD = 0 normal operation DCHOLD = 1 hold DC-value at V2W EXT_MCLK1 External Masterclock (16 MHz) EXT_MCLK1 = 0 internal masterclock is used EXT_MCLK1 = 1 external masterclock is used To use an external masterclock of 16 MHz following steps must be done: 1. IO1 must be set to input and becomes the input-pin of the masterclock (page 42) 2. Connect the internal clockline to IO1 and disable the PLL by setting the bit EXT_MCLK1 = 1 DUPGNK To restrict the rate of upstream C/I-bit changes, deglitching (persistence checking) of the status information from the SLICOFI may be applied. New status information will be transmitted upstream, after it has been stable for N milliseconds. N is binary programmable in the range of 4 to 60 ms in steps of 4 ms, with DUPGNK = 0h the deglitching is disabled. Reset value is 20 ms. The HOOK bit (for external Indication) and the GNK bit are influenced. Detailed info see chapter 5.6. B i t 7 6 543 2 1 0 DCANAL CHOPACT DCHOLD EXT_MCLK 1 DUPGNK3 DUPGNK2 DUPGNK1 DUPGNK0
Programming the SLICOFI® Semiconductor Group 36 01.98
5.4 TOP Command
If no status modification of the SLICOFI is required (there is no TOP-write operation) a transfer operation byte TOP may be transferred. RW Read Information: Enables reading from the SLICOFI RW = 0 No operation RW = 1 Read from SLICOFI LSEL Length select information (also see programming procedure, chapter 5.2). This field identifies the number of subsequent data bytes. LSEL = 00 Read TCR1 (Signalling Register) only LSEL = 01 Read 3 bytes of data (TCR1, TCR2, TCR3) LSEL = 10 Read extended line card design and configuration information only (TCR4, … TCR18). Details see chapter 10.2 LSEL = 11 future reserved TCR1 Configuration Register 1 TCR1 is the Signalling register. It indicates status information. If there is any change of one or more bit, it is indicated via the SLCX bit in the C/I-channel. Each bit can be masked by SCR7 Register. Reset value: 00H HOOK Loop information On/Offhook (same as in C/I-channel) HOOK = 0 Onhook HOOK = 1 Offhook GNK Ground key or Ground start information via IL-pin (same as in C/I-channel) interrupt masked in Power Denial State GNK = 0 no longitudinal current detected GNK = 1 longitudinal current detected B i t 76543210
0 RW 0 0 1 1 LSEL1 LSEL0
HOOK GNK VB/2 ICON TEMPA CFAIL x x
Programming the SLICOFI® Semiconductor Group 37 01.98 VB/2 Half battery voltage across the HV-SLIC is detected (V2W compared to VBIM/2) interrupt masked in Power Denial and Ringing State VB/2 = 0 line voltage smaller than half battery (| V2W | > | VBIM/2 |) VB/2 = 1 line voltage larger than half battery (| V2W | < | VBIM/2 |) ICON Current limitation information interrupt masked in Power Denial and Ringing State ICON = 0 Resistive Feeding ICON = 1 Constant Current Feeding TEMPA Temperature alarm of the HV-SLIC which is signalled through the HV-SLIC Interface (see chapter 7). TEMPA = 0 normal temperature TEMPA = 1 Temperature alarm from HV-SLIC detected CFAIL Clock Fail: Not the right count of clock cycles between two frame syncs CFAIL = 0 no clock fails detected CFAIL = 1 clock fails detected The CFAIL bit is not influenced by the DUP-counter (each failure is reported). x undefined Any change of these bits is signalled via the interrupt-bit (SLCX) in the C/I-DU-channel. There are two types of generating an interrupt: – Each toggling of a non-masked TCR1-bit combined with a DUP-counter – Toggling of the non-masked CFAIL-bit (no filtering by the DUP-counter) The status information is stored in the TCR1-register by an interrupt or - if there is no interrupt - before reading this register only. The HOOK- and the GNK-input are directly filtered by an own DUP-/DUPGNK-counter too and they are also directly included in the C/I-DU-channel. Reading the TCR1-register is possible in two ways: – Reading only TCR1 (TOP-command with LSEL = 0b) – Reading TCR1 with other TCR-registers (TOP-command with LSEL = 0b) The first way gives the actual status of all TCR1-inputs if the internal interrupt is not active and actualizes the TCR1-register. Is the interrupt active the content of TCR1-register is read and the interrupt is cleared. The second way gives the content of TCR1-register and nothing will be changed. The following figure shows the flow diagram of the interrupt logic.
Programming the SLICOFI® Semiconductor Group 38 01.98 Figure 8 Flow Diagram of the Interrupt Logic ITD10170 Reset Yes No Chng Inp. and Outp. diff. betw. Signaling reg. Reg = 0, counter ready, no INT Mask No No CFAIL Start Counter No Reset INT_REQ Set INT_REQ Yes Read Only TCR1 INT No Read TCRYes No Transfer Actual TCR1 (Inp.State) to R IOM -2 Reset INT Reset INT_REQ Actual TCR1 R (Inp.State) to IOM -2 Transfer Not Actual TCR1 IOM (Outp.State) to R Transfer Change Reset Counter Yes INT_REQ Counter Ready Yes Yes Set INT Write States from Input TCR1 to Output TCR1 No No No Yes Yes No Yes Yes set DUP Counter Set INT Read Only TCR1 NoYes Read TCRYes Actual TCR1 IOM (Inp.State) Reset INT Reset INT_REQ to -2 R Transfer Transfer Not Actual TCR1 (Outp.State) -2IOMto R No
Programming the SLICOFI® Semiconductor Group 39 01.98 TCR2 and TCR3 Configuration Registers 2 and 3 TCR2 and TCR3 are the checksum of all the Coefficient bytes written into the Coefficient RAM (CRAM) of the SLICOFI by the COP-Command. TCR2 TCR3 OKCS shows, if the checksum is valid or the internal checksum calculation is not yet finished 1) OKCS = 0 checksum is not valid OKCS = 1 checksum is valid Algorithm of defining the checksum: x16 x10 x7 x 1 With that algorithm you can reach a fault coverage of: (1 - 2-15) 1) After each change of the CRAM contents (COP-write or COP-read) the checksum has to be recalculated. During calculation time OKCS = 0. B i t 76543210 LOW Byte of CRAM-checksum B i t 76543210 OKCS HIGH Byte of CRAM-checksum
Programming the SLICOFI® Semiconductor Group 40 01.98 TCR4 to TCR18: Configuration Register 4 to 18 These 15 bytes are the possible design information bytes which are described in chapter 10.2 more detailed for the extended I0M-2 Channel Identification Command using an external ASIC. TCR4 TCR5 TCR18 TCR4 - TCR18 show the contents of the serial input of the ASIC via IDH-pin. B i t 76543210 Byte 0 B i t 76543210 Byte 1 B i t 76543210 Byte 14
Programming the SLICOFI® Semiconductor Group 41 01.98
5.5 COP Command
With a COP Command coefficients for the programmable filters can be written to the SLICOFI Coefficient RAM or read from the Coefficient RAM via the IOM-2 interface for verification. (Filter optimizing to different applications is supported by the software package SLICOS.) RW Read / Write RW = 0 Subsequent data is written to the SLICOFI RW = 1 Read data from the SLICOFI CODE includes number of following bytes and filter-addresses 1) For generating a correct checksum all not used bits must be set to ‘0’. B i t 76543210 RW CODE 4 CODE 3 CODE 2 0 CODE 1 CODE 0 0 0 0 0 0 0 TH-Filter coefficients (part 1) (followed by 8 bytes of data) 0 0 0 0 0 1 TH-Filter coefficients (part 2) (followed by 8 bytes of data) 0 0 0 0 1 0 TH-Filter coefficients (part 3) (followed by 8 bytes of data) 0 0 0 0 1 1 IM-Filter coefficients (part 1) (followed by 8 bytes of data) 0 0 1 0 0 0 IM-Filter coefficients (part 2) (followed by 8 bytes of data) 0 0 1 0 0 1 FRX-Filter coefficients (followed by 8 bytes of data) 0 0 1 0 1 0 FRR-Filter coefficients (followed by 8 bytes of data) 0 0 1 0 1 1 DC-Loop coefficient (part 1) (followed by 8 bytes of data) 0 1 0 0 0 0 DC-Loop coefficient (part 2) (followed by 8 bytes of data) 0 1 0 0 0 1 DC-Loop coefficient (part 3) (followed by 8 bytes of data) 0 1 0 0 1 0 TTX and DC-Loop coefficient (followed by 8 bytes of data) 0 1 0 0 1 1 AX-Filter coefficients (followed by 8 bytes of data) 0 1 1 0 0 0 AR-Filter coefficients (followed by 8 bytes of data)
011001 T G 1 - F i l t e r + B P 1 + L M - B P
(followed by 8 bytes of data) 0 1 1 0 1 0 TG2-Filter+BP2 coefficients (followed by 8 bytes of data) 0 1 1 0 1 1 Testing (levelmeter) coefficients (followed by 8 bytes of data)
Programming the SLICOFI® Semiconductor Group 42 01.98
5.6 IOM ® -2 Interface Command / Indication Byte
The Command/Indication (C/I) channel is used to communicate real time status information and for fast controlling of the SLICOFI. Data on the C/I channel is continuously transmitted in each frame until new data is to be sent. Data Downstream C/I - Channel Byte (receive) - CIDD Note that there is no address DD direction because there is only one SLICOFI per IOM2-channel. This byte is used for fast controlling of the SLICOFI. Each transfer to the SLICOFI has to last for at least 2 consecutive frames (FSC-cycles) so that it is accepted internally. Changes (spikes) of less than 2 FSC cycles are neglected. RING see table below (for details see chapter 6). CONV see table below (for details see chapter 6). TIM Timing bit to control the timing of ringing or meterpulses (for details see chapter 6). TIM = 0 SLICOFI is in the ringing pause or no meterpulse is on. TIM = 1 SLICOFI is in the ringing phase or output of a meterpulse is running. IO1 Value for the programmable Input/Output Pin IO1 (Pin 7) if programmed as an output pin. If the bit REXTEN (SCR5-2) is set to 1 (external ringing) the internally created Ring Burst On Signal (for an external relay driver) is switched to the IO1 pin instead of the IO1-bit (for more details see chapter 6 , page 51). IO1 = 0 The corresponding pin at the digital interface of the SLICOFI is set to a logic 0. IO1 = 1 The corresponding pin at the digital interface of the SLICOFI is set to a logic 1. B i t 765432 RING CONV TIM IO1 IO2 O1 Table 8 RING CONV Description 0 0 Power Denial or Power Down State (depending on PD-bit (SCR1-7) 0 1 Active State 1 0 Power Down or (automatic) Power Down Ring Pause 1 1 (normal) Ringing State
Programming the SLICOFI® Semiconductor Group 43 01.98 IO2 Value for the programmable Input/Output Pin IO2 (Pin 8) if programmed as an output pin. IO2 = 0 The corresponding pin at the digital interface of the SLICOFI is set to a logic 0. IO2 = 1 The corresponding pin at the digital interface of the SLICOFI is set to a logic 1. O1 Value for the fixed Output Pin O1 (Pin 39). O1 = 0 The corresponding pin at the digital interface of the SLICOFI is set to a logic 0. O1 = 1 The corresponding pin at the digital interface of the SLICOFI is set to a logic 1. Data Upstream C/I - Channel Byte (transmit) - CIDU Note that there is no address in DU direction too. This byte is used for fast transfer of the most important and time critical informations from the SLICOFI. HOOK Indication of the loop condition (filtered via the DUP-counter or the DUPGNK-counter in Power Denial State). HOOK = 0 Subscriber is Onhook. HOOK = 1 Subscriber is Offhook. GNK Indication if a ground connection is detected (filtered via the DUPGNK-counter). The function is disabled in Power Denial State (GNK is set to 0). GNK = 0 No ground connection detected. GNK = 1 Ground connection detected. SLCX Interrupt bit: Summary output of the whole signalling register (TCR1) if they are not masked - filtered via the DUP counter (see SCR7; the interrupt logic is described in detail in chapter 5.4, page 36). SLCX = 0 No unmasked bit in the signalling register has toggled. SLCX = 1 Any unmasked bit in the signalling register has toggled. IO1 Logical state of the programmable Input/Output Pin IO1 (Pin 7) - even if not programmed as an input pin. IO1 = 0 The corresponding pin at the digital interface of the SLICOFI is receiving a logic 0. IO1 = 1 The corresponding pin at the digital interface of the SLICOFI is receiving a logic 1. B i t 765432 HOOK GNK SLCX IO1 IO2 I1
Programming the SLICOFI® Semiconductor Group 44 01.98 IO2 Logical state of the programmable Input/Output Pin IO2 (Pin 8) - even if not programmed as an input pin.1) IO2 = 0 The corresponding pin at the digital interface of the SLICOFI is receiving a logic 0. IO2 = 1 The corresponding pin at the digital interface of the SLICOFI is receiving a logic 1. I1 Logical state of the programmable Input Pin I1 (Pin 38). I1 = 0 The corresponding pin at the digital interface of the SLICOFI is receiving a logic 0. I1 = 1 The corresponding pin at the digital interface of the SLICOFI is receiving a logic 1. The DUP- (DUPGNK) - counters filter the status-information and the input-pin I1 respectively. The counters count down and generate enable-signals for the registers if they are zero. Then they start counting again at the programmed value. If a status-information or an input-signal changes the proper counter is set and continues counting down. There are three different DUP-counters for HOOK, SLCX and the input-pin and one DUPGNK-counter for HOOK in PDen-mode or GNK in all other modes. Changing the mode freezes the actual status of HOOK and sets the actual HOOK-counter.1) If the Input/Output Pin is programmed as an output the corresponding bit in the CIDU is ‘1’
Semiconductor Group 45 01.98
6 Operating Modes
The SLICOFI supports 4 different Operating Modes: Power Denial (PDen), Power Down (PDown), Active and Ringing which are controlled via the upper 3 bits of the Data Downstream C/I channel byte (CIDD). Table 9 RiING-(CIDD7) CONV-(CIDD6) TIM-(CIDD5) Mode 0 0 x PDen: PD (SCR1-7) = 0 0 0 x PDown: PD (SCR1-7) = 1 1 0 0 PDown (Ring Pause) 01 0 A c t i v e 0 1 1 Active with Meterpulse on 1 x 1 Ringing: Ring Burst On 1 1 0 Ringing: Ring Pause
Semiconductor Group 46 01.98 Figure 9 ITS10155 PDown (Ring Pause) PDen Ring Burst onActive Meterpulse Rev. Pol. TTX Burst on Normal Ring Pause 000 PD = 1 011 TTXNO = 1 010 011 TTXNO = 1 010 010 011 TTXNO = 0 011 TTXNO = 0 000 PD = 0 1x1 111 110 110 100 101 100 HV-SLIC Pdown R HV-SLIC R Active PDADIS = 0 and OffhookPDADIS = 0 and PDADIS = 1 or Onhook ResetRing, Conv and Tim bits (e.g. )100 HW-Reset SW-Reset POWERON- Reset
Semiconductor Group 47 01.98
6.1 Reset Behavior
The SLICOFI has 3 different reset sources that are all internally connected. The Reset pin RES (pin 36), which works totally asynchronous to the external clocks. The Reset bit (Within SOP - command, bit 4). The reset is valid for SOP-write only. Power On Reset. If internal VDDD gets above 1.5 Volts the SLICOFI is Reset by Power On Reset. All 3 different sources set the SLICOFI to the basic setting modes (see below). After a reset caused by any of the sources mentioned above, the reset bit (SCR0-4 = RSTST) in read direction is set to one. This bit is cleared (RSTST = 0) after it has been read by a SOP-read operation with the LSEL bits set to 00b (means: read only SCR0 byte). A SOP-read with other LSEL bits reads the actual RSTST value, but does not clear it. The Reset pin RES has a Schmitt-Trigger input to reduce the sensitivity for spikes. In addition the pin RES has a spike rejection. All spikes smaller than typ. 70 ns are neglected. The pin RES can be set to 1 for an unlimited time but at least 125µs is recommended; during that, the DU pin is set to high impedance. The SLICOFI leaves this mode automatically with the beginning of the next 8 kHz-frame (or after pin RES is released).
6.2 Basic Setting Modes
After RESET, the SLICOFI automatically is switched to its basic settings in which it uses internal default values for all filters and settings (AC and DC), so that the SLMA still works in a kind of “emergency mode” and can be handled by C/I-Interface commands only. This means that for an (un-)determined reset (e.g. Power On Reset) the SLICOFI is reset, but can be switched to or return automatically to any operating mode presented to the C/I-channel after 2 FSC cycles. In all modes the SLMA stays stable, supervision and DC-feeding are still working and conversation can go on in a proper way until all filters and settings have been reloaded by SOP and COP-commands. So what happens internally after reset? – all configuration registers are set to their default values (note that the Coefficient RAM is not reset) – the RSTST-bit (SCR0-4) is set to 1 to indicate that a reset has taken place – The IOM-2 interface is reset. Running communication is stopped – DU is in high impedance state – AC- and DC-loop use the default values and not the programmed ones (see below)
Semiconductor Group 48 01.98 Boosted Battery is reset to normal feeding Reverse Polarity is reset to Normal Polarity all bits of the Signalling Register are masked and reset to 0 the Data Upstream C/I channel byte is reset to 0 (and IO’s are set to Input pins) C1 and C2 are set to PDNR and PDN is set high A-Law is chosen Table 10 DC Parameter Values Unit Test Condition/Result Const I 26 mA limit for Constant Current (for Active and Power Down) RFS 2 × 150 Feeding Resistance (for Active and Power Down - excluding the external Fuse resistors) Vdrop 10 V Overall voltage drop (to reach maximum length and there is no Teletax) fRing 25 Hz Ring Frequency ARing 1.7 V Ring rms-value at V2W PDen 1.45 Vrms Power Denial Voltage for Offhook Offhook 8 mA Offhook Detection (for Power Down, Ringing and Active without hysteresis) DC-Lowpass 0.3/5 Hz DC- Lowpass set to 0.3 and 5 Hz respectively Levelmeter undefined (parameters stored in CRAM) DUP 10 ms Data Upstream Persistency Counter is set to 10 ms DUPGNK 20 ms Data Upstream Persistency Counter for GNK is set to 20 ms Table 11 AC Parameter Values Unit Test Condition/Result IM-Filter 900 Approximately 900 Real Input Impedance TH-Filter TH BRD Approximately BRD-Impedance for Balanced Network AX 10 dB Attenuation Transmit (this means about 0 dB for SLMA) AR − 15.11 dB Attenuation Receive (this means about − 7 dB for SLMA) ATTX 190 mV Teletax Generator Amplitude at V2W ; but note that the SLICOFI is set to TTXNO = 1 with reset
Semiconductor Group 49 01.98
6.3 Power Denial (PDen)
After a Reset (including the Power On Reset) the SLICOFI is set to Power Denial State. In Power Denial all functions that are not necessary are disabled to minimize power consumption. Via the two pins VLINE1 and VLINE2 the SLICOFI is directly connected to the a - and b - wire, while the PDN-Pin is set high (which turns off the HV-SLIC). While the interface is fully working - including programmability of the registers with SOP- or TOP commands and the Coefficient RAM (COP commands) the rest of the SLICOFI is turned off except the supervision of the line. The change of the line state is reported via the HOOK-bit in the IOM-2 Data upstream channel. To avoid spurious Offhook - informations caused by longitudinal induction the HOOK - bit is low pass filtered (programmable with the DUPGNK - counter in PDen state only). The HV-interface pins C1, C2 are switched off. The voice channel Data Downstream is directly fed into the voice channel Data Upstream. The HOOK-indication in PDen is optimized for longitudinal suppression up to 65 Vrms for the Offhook transition.
6.4 Power Down (PDown)
In Power Down Mode the DC-Loop of the SLICOFI is fully working; the AC-Loop is still turned off. The output voltage at the V2W pin is controlled via the IT input in such a way that it behaves like a programmable constant current source. Current limitation is used for detecting Offhook, too. The change of the line state is reported via the HOOK-bit in the IOM-2 Data upstream channel. To avoid spurious Offhook-informations the HOOK-bit is lowpass filtered (programmable with DUP-counter). The ternary HV-interface (C1, C2) is set to Power Down mode. If Offhook is detected the HV-interface is set to one of the active modes. This can be avoided by setting PDADIS = 1 (SCR3-4). Then the HV-SLIC interface is set to Power Down anyway. The longitudinal current supervision via the IL pin is activated in this mode. The voice channel Data Downstream is directly fed into the voice channel Data Upstream. Together with the bits Hi-a and Hi-b of the configuration register 1 (SCR1-2 and SCR1-3) simple handling of Ground Start function is possible. fTTX SOREV 16 kHz Teletax Generator frequency; but note that the SLICOFI is set to TTXNO = 1 with reset for Metering with Polarity Reversal: Hard Reversal is used. TG1 1008 Hz Tone Generator 1 and AC-levelmeter Bandpass TG2 2000 Hz Tone Generator 2 ( + 2 dB compared to TG1) Table 11 AC (cont’d) Parameter Values Unit Test Condition/Result
Semiconductor Group 50 01.98
6.5 Active Mode (Act)
In Active Mode (“Conversation State”) both AC-and DC-Loop are fully working. The output voltage at the V2W pin is controlled via the IT input pin in such way, that it behaves like a constant current source which turns automatically into a programmable resistive feeding source due to the DC-Characteristic values (see chapter 3.2, page 13 for more details). The ternary HV-interface is set to one of the active modes. Polarity The SLICOFI supports either normal or reverse Polarity which is set by the POLNR-bit (SOP-5). The information is transferred to the HV-Interface and simultaneously a 180 degree phase shift of the AC- and DC-Loop is done. The performance and the functionality is not influenced by that. Boosted Battery To feed subscriber lines with enhanced loop resistance the SLICOFI supports the Boosted Battery mode. The HV-Interface pins are set to Boosted Battery (BB) mode and the maximum V2W output voltage is extended to − 3.2 V. Meterpulses The SLICOFI supports two different kinds of meterpulses: Meterpulses with 12/16 kHz (Teletax Metering) and with polarity reversal. In the Active Mode the Timing bit (TIM) controls the meterpulse which might be 12/16 kHz or reversal. The decision between Table 12 Pin No./Pin Name CIDD7 CIDD6 CIDD5 SCR1-7 SCR1-3 SCRI1-2 PIN 28 PIN 9 PIN 10 RING CONV TIM PD HI-b HI-a PDN C1 C2 PDNH - Loop open (Iab < 30µA) 001x x x 1 VOL VOL PDNR 0 0 0 0 not (11) 1 VOZ VOZ PDown 0 0 0 1 0 0 0 VOH VOH PDown (with Hi-a) 0 0 0 1 0 1 0 VOL VOH PDown (with Hi-b) 0 0 0 1 1 0 0 VOZ VOH b-line high impedance (Ground Start) 000x 1 1 0 VOZ VOH
Semiconductor Group 51 01.98 these two ways is made by the bit TTXNO (SCR3-7). If bit TTXNO is set to 1, then the meterpulse is reversal. In this case the Timing bit is linked to POLNR (SOP-5) by an EXOR gate. If bit TTXNO is set to 0, then the Timing bit and POLNR are completely independent from another and Teletax Metering is used. Metering with Polarity Reversal Hard or Soft (SOREV, SCR 3-5) As long as the TIM bit of the C/I-channel is set to 1, the SLICOFI is changing the actual polarity of the HV-Interface and performs an immediate 180 degree phase shift of the AC- and DC-Loop. Teletax Metering Injection For countries with Teletax Metering, the SLICOFI provides either a 12 or 16 kHz Signal (switchable with the bit TTX12 (SCR3-6)) 1) which amplitude is free programmable up to 250 mVrms at V2W . The SLICOFI filters the Teletax pulses in transmit direction, too. The slope of the pulses are internally shaped, so that the noise during switching and transmission is less than 50 mV at V2W and 1 mV at the IOM-2 interface (psophometrically weighted). With the bit NOSL (SCR2-2) the slope can be switched off. In that case the switching noise is not defined (for signalling only).
6.6 Ringing Mode
The SLICOFI generally supports balanced ringing. If the SLICOFI is set to Ringing Mode, the HV-Interface is set to Ringing Mode, the AC-loop is turned off and the DC-Loop is automatically opened. The voice channel Data Downstream is directly fed into the voice channel Data Upstream. Balanced Ringing The sine wave of the ringing is generated in the SLICOFI. The frequency and the amplitude are free programmable between 16 and 70 Hz and up to 2.125 Vrms at V2W , respectively2). In Ring Pause 0 V is provided at V2W . If the Ring Burst On (RBO) command is sent to the SLICOFI via the C/I-channel (RING and TIM = 1) the begin and end (TIM = 0) of the ring burst is automatically synchronized at the voltage zero crossing. If the DC-current at the IT-pin exceeds the programmed value, Offhook is detected within 2 periods of the ringing frequency and the Ring Burst at V2W is switched off within 3 periods. During Offhook the Ring Burst On command is neglected. 1) Note, that the right Teletax Coefficient Set (via COP-command) must be provided, too. 2) Note that the DC-value is 0. So DC injection has to be performed by the HV-SLIC.
Semiconductor Group 52 01.98 Unbalanced (external) Ringing The sine wave for ringing is generated by an external ring generator. To coordinate with the SLICOFI following settings must be done: 1. IO1 set as an output 2. SCR5-2 (REXTEN) = 1 3. RING-(CIDD7) = 1 (PDown: Ring Pause) 4. TIM-(CIDD5) = 1 (Ringing: Ring Burst On) Pin REXT: a positive puls according to zerocrossing of the ringer voltage RINGING: 5. signal for relays on IO1 6. HV-SLIC in PDen Mode 7. SLICOFI in PDown Mode, Offhook-detection via VLINE1,2 RING PAUSE: 8. TIM-(CIDD5) = 0 (PDown: Ring Pause), Offhook-detection via IT (in the same way as balanced ringing)
Semiconductor Group 53 01.98
7 SLIC Interface
2 Wire Output Voltage (V 2W )
The V2W output voltage pin (26) represents the sum for AC- and DC-loop together with Teletax info or Ring Burst at the receive path. The buffer is designed for a load of RL > 600 and C L < 10 pF and directly connected to the HV-SLIC in typical applications. Transversal Current Sense AC - Input (ITAC) The pin ITAC (21) is the input voltage pin for the AC transversal current information from the HV-SLIC in the transmit path. AC/DC separation is done by an external highpass filter (capacitor range between 680 nF - 1µF). The input resistance is larger than 20 k. Current/voltage conversion is done via an external resistor (same for pin IT). Transversal Current Sense DC - Input (IT) The pin IT (19) is the input voltage pin for the DC transversal current information from the HV-SLIC in the transmit path. The signal is internally filtered via a 0.3 Hz lowpass. The input resistance is larger than 20 k. Current/voltage conversion is done via an external resistor (same for pin ITAC). Longitudinal Current Sense - Input (IL) The scaled longitudinal current information transferred from the HV-SLIC – the current-voltage conversion is done by an external resistor – is lowpass filtered (time programmable using DUPGNK-counter) and is reported via the Data Upstream C/I-channel (CIDU-6). In Power Denial, the GNK-bit is set to ‘0’ and the setting of the Interrupt bit (CIDU-5) caused by GNK is prohibited. Changing from PDen to any other mode, the DUPGNK-counter is set to the programmed value; so the change of the GNK information (CIDU-6) is lowpass filtered anyway. Battery Image Input ( VBIM) The information about the actually used battery voltage (VBAT ) of the SLMA is transferred from the HV-SLIC via the VBIM pin to the SLICOFI. In order to give some information about the operating point of the SLMA there is a comparison of the actual battery voltage and the output voltage V2W of the SLICOFI. This information is transferred via the Signalling register (TCR1-5: VB/2). If | V2W | < | VBIM / 2 | the VB/2-bit is set to 1, else to 0. Ternary Interface (C1, C2) and HV-SLIC Switch Off Output (PDN) In order to set the HV-SLIC to the different operating states, the information of the SLMA-controller is passed through from the IOM-2-channel to the ternary HV-SLIC-Interface pins C1 and C2.
Semiconductor Group 54 01.98 BB - Boosted battery RP - Reverse Polarity NP - Normal Polarity HI-b - High Impedance b-leg HI-a - High Impedance a-leg PDNH - Power Denial High Impedance PDNR - Power Denial Resistive For signalling “Over temperature” the HV-SLIC drains a current ( IOT ) from pin 9. The message is transferred via the Signalling register (TCR1-3). This is possible in any operating states of the HV-Interface except for Power Denial. The HV-SLIC (PEB 4065) has two different Power Denial Modes: 1. PDNR, the resistive mode which provides a connection of 15 kΩ from TIP and RING to BGND and VBAT , respectively 2. PDNH, offers high impedance at TIP and RING In this mode (PDN = 1) the HV-SLIC is completely turned off. Line supervision is done via the VLINE1,2 pins. In all other modes, PDN is set to GND (RON < 250Ω). Line Sense Pins (V LINE1,2) In Power Denial state the line supervision is done via the VLINE1,2 pins. If the voltage VLINE between the two pins exceeds the programmed value, Offhook is reported via the Data Upstream C/I-channel (CIDU-7)1). To reach the longitudinal voltage suppression, the incoming signal is low pass filtered using the values that are programmed by the DUPGNK counter (no longitudinal current information present in PDen, but the same interferences). 1) Note: VLINE = VLINE1 - VLINE2; so the voltage of VLINE1 has to be higher than VLINE2 for correct external indication Table 13 C2 (PIN 10) VOL VOZ VOH VOL RING RP/PDNH RING NP HI-a C1 (PIN 9) VOZ BB RP BB NP/PDNR HI-b VOH Active RP Active NP PDown
Transmission Characteristics Semiconductor Group 55 01.98
8 Transmission Characteristics
The target figures in this specification are based on the subscriber-line board requirements. The proper adjustment of the programmable filters (transhybrid balancing, impedance matching, frequency-response correction) needs a complete knowledge of the SLICOFI’s analog environment. Unless otherwise stated, the transmission characteristics are guaranteed within the test conditions. Test Conditions TA =0 °C to 70°C; VDDD = VDDA =5V ± 5%; VSS = − 5V ± 5%; GNDA = GNDD = 0 V RL >6 0 0Ω ; C L <1 0p F ( a t V2W ); HIM =H TH =0 ; HFRX =H FRR =1 AR = 0 dB AX = 0 dB f = 1004 Hz; 0 dBm0; A-Law or µ-Law; In Transmit direction for µ-law an additional gain of 1.94 dB is implemented. The 0 dBm0 definitions for Receive and Transmit are different. A 0 dBm0 signal in Transmit direction is equivalent to 206 mVrms [165 mVrms]. (A -Law, [µ-Law]). A 0 dBm0 signal in Receive direction is equivalent to 118 mVrms. Figure 10 With VIT = 0 dBm0|SLICOFI = − 11.51 dBm0|600 = 206 mV for transmit With VV2W = 0 dBm0|SLICOFI = − 16.34 dBm0|600 = 118 mV for receive ITS10169 SLICOFI R PEB 3065 680 nF 1500 Ω ITAC IT 206 mVITV V V2W 118 mV V2W Rec 0 dBm0 0 dBm0 Trans R IOM -2
Transmission Characteristics Semiconductor Group 56 01.98 Table 14 Parameter Symbol Limit Values Unit Test Condition min. typ. max. Gain absolute transmit receive IMAN-Loop TTX-injection G X G R G IMAN G TTX − 0.20 − 0.20 − 0.5 − 0.7 ± 0.05 ± 0.05 ± 0.1 ± 0.3 0.20 0.20 0.5 0.7 dB dB dB dB adding to − 7.2 dB Loop gain Total Harmonic distortion transmit receive Ringing injection TTX injection THD T THD R THD Rng THD TTX − 56 − 56 − 35 − 60 − 48 − 48 − 34 − 40 dB dB dB dB at 0 dBm0; f = 1 kHz; 2nd, 3rd order at 0 dBm0; f = 1 kHz; 2nd, 3rd order f = 16.3-70 Hz f = 12 kHz and 16 kHz Idle channel noise transmit receive N TP N TTX_TP N G_TP N RP N TTX_RP − 69 − 65 − 58 − 88 − 87 − 67 − 60 − 53 − 81 − 80 dBm0p dBm0p dBm0p dBm0p dBm0p Teletax countries, burst off A-law, psophometric: VIN =0V Teletax burst on A-law, psophometric: VIN =0V AX = 30 dB Teletax countries, burst off A-law, psophometric: VIN =0V Teletax countries, burst off A-law, psophometric idle code +0 Teletax burst on A-law, psophometric idle code +0
Transmission Characteristics Semiconductor Group 57 01.98
8.1 Frequency Response
Receive: reference frequency 1 kHz, signal level 0 dBm0, HFRR =1 Figure 11 Transmit: reference frequency 1 kHz, signal level 0 dBm0, HFRX =1 Figure 12 -0.25 0.4 0 0.2 0.6 3.4 12 Frequency 2.4 3 kHz 3.6 0.25 0.45 0.65 0.9 Attenuation0 1.4 dB
2 ITD10176
0.3 -0.25 0.6 0.4 0.3 1 3.62.4 Frequency 23 3.4 kHz 0.9 Attenuation 0.25 0.65 0.45 1.4 dB
2 ITD10175
Transmission Characteristics Semiconductor Group 58 01.98
8.2 Group Delay
Maximum delays when the SLICOFI is operating with HTH =H IM = 0 and HFRR =H FRX =1 including delay through A/D- and D/A converters. Specific filter programming may cause additional group delays. Group Delay deviations stay within the limits in the figures below. Group Delay absolute values: Signal level 0 dBm0 Group Delay Distortion receive and transmit: Signal level 0 dBm0, fTest @ TGmin Table 15 Parameter Symbol Limit Values Unit Test Condition min. typ. max. Transmit delay D XA 250 312 375 µs fTest @ TGmin Receive delay D RA 250 312 375 µs fTest @ TGmin Digital loop back D RX 630 µs fTest @ TGmin 0.50 100 0.6 13 1.5 2 2.6 Frequency 2.5 kHz3.5 4 Δ 300 200 150 400 µ TG S
500 ITD10174
Transmission Characteristics Semiconductor Group 59 01.98
8.3 Out-of-Band Signals at Analog Output (receive)
With a 0 dBm0 sine wave with frequency f (300 Hz to 3.4 kHz) applied to the digital input, the level of any resulting out-of-band signal at the analog output will stay at least X dB below a 0 dBm0, 1 kHz sine wave reference signal at the analog output Figure 13 4.6 Band Discrimination X Receive OUT of 0.06 0.1 3.4 4 dB 61 08 kHz f 18 200 ITD10223 3.4… 4.6 kHz: X = –14 π 4000 f– sin
Transmission Characteristics Semiconductor Group 60 01.98
8.4 Out-of-Band Signals at Analog Input (transmit)
With a 0 dBm0 out-of-band sine wave signal with frequency f (< 100 Hz or 3.4 kHz to 100 kHz) applied to the analog input, the level of any resulting frequency component at the digital output will stay at least X dB below a 0 dBm0, 1 kHz sine wave reference signal at the analog input. Figure 14 1) Poles at 12 kHz± 150 Hz respectively 16 kHz± 150 Hz and harmonics will be provided. kHz f 1000.06 0.1 3.4 4 4.6 6 10 18 dB Transmit OUT of Band Discrimination X ITD07268 3.4… 4.0 kHz: X 14 π 4000 f– –= 4.0… 4.6 kHz: X 18 π4000 f– 7 9---–sin –=
Transmission Characteristics Semiconductor Group 61 01.98
8.5 Overload Compression
Transmit: measured with sine wave f= 1004 Hz. Figure 15 ITD10162 -0.25 0.25 0 Fundamental Input Power 1 2 3 3.4 4 56 dBm07 Fundamental Output Power dBm0
Transmission Characteristics Semiconductor Group 62 01.98
8.6 Gain Tracking (receive or transmit)
The gain deviations stay within the limits in the figures below. Receive: measured with sine wave f=1 0 0 4H z reference level is − 10 dBm0. A R = 6 dB Figure 16 Transmit: measured with sine wave f=1 0 0 4H z reference level is − 10 dBm0. A X = 0 dB Figure 17 -55-70 -0.5 -0.25 -1.4 -60 -50 -40 GΔ 1.4 0.5 0.25 dB -20 Input Level -30 -10 dBm001 0 ITD10160 -30 -55-70 -1.4 -0.25 -0.5 -60 -50 -40 GΔ 1.4 0.5 0.25 dB -20 Input Level -10 dBm001 0 ITD10161
Transmission Characteristics Semiconductor Group 63 01.98
8.7 Total Distortion
The signal to distortion ratio exceeds the limits in the following figure: Receive: measured with sine wave f= 1004 Hz (C-message weighted for µ-law, psophometrically weighted for A-law). Figure 18 Σ(AR1 + AR2 )=7d B Transmit: measured with sine wave f= 1004 Hz (C-message weighted for µ-law, psophometrically weighted for A-law). Table 16 Parameter Symbol Limit Values Unit Test Condition min. typ. max. Signal to Distortion at full attenuation SD att_R − 13 − 7 dB Signal S = − 40 dB AR =3 0d B -60 -50 -45 -40 -30 Input Level -20 -10 dBm0 0 S/D dB ITD10173
Transmission Characteristics Semiconductor Group 64 01.98 Figure 19 AX = − 7d B Table 17 Parameter Symbol Limit Values Unit Test Condition min. typ. max. Signal to Distortion at full gain SD att_T − 17 − 12 dB Signal S = − 40 dB AX =− 30 dB Signal to Distortion in IMAN Loop SD IMAN − 39 − 30 dB Signal S = − 45 dB -60 -45-50 -40 dBm0 Input Level -30 -20 -10 0 10 S/D dB ITD10172
Transmission Characteristics Semiconductor Group 65 01.98
8.8 Transhybrid Loss
The quality of Transhybrid-Balancing is very sensitive to deviations in gain and group delay – deviations inherent to the SLICOFI A/D- and D/A-converters as well as to all external components used on a line card (HV-SLIC). Measurement of SLICOFI Transhybrid-Loss: A 0 dBm0 sine wave signal with a frequency in the range between 300-3400 Hz is applied to the digital input. The resulting analog output signal at pin V2W is connected to the pin ITAC via a 1 le filters FRR, AR , FRX, AX and IM are disabled, the balancing filter TH is enabled with coefficients optimized for this configuration (V2W = ITAC). The resulting echo measured at the digital output is at least X dB below the level of the digital input signal as shown in the table below Table 18 COP-write Coefficients TH-Filter Part 1 00 H 00 80 80 18 00 08 00 88 TH-Filter Part 2 01 H 08 00 AF 84 04 AC 2B 90 TH-Filter Part 3 02 H DA AB B3 22 DB 37 88 00 Table 19 Parameter Symbol Limit Values Unit Test Condition min. typ. Transhybrid Loss at 500 Hz THL500 33 50 dB Transhybrid Loss at 2500 Hz THL2500 29 44 dB Transhybrid Loss at 3000 Hz THL3000 27 42 dB
Electrical Characteristics
Semiconductor Group 66 01.98
9 Electrical Characteristics
9.1 Absolute Maximum Ratings
Note: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Functional operation under these conditions is not implied. Exposure to conditions beyond those indicated in the recommended operational conditions of this specification may effect device reliability. 1) All Pins except VLINE1 and VLINE2 (11, 12); for these Pins VESD < 500 V due to process limitation Table 20 Parameter Symbol Limit Values Unit Test Condition min. max. VDDA referred to GNDA VDDD referred to GNDD VSS referred to GNDA GNDA with respect to GNDD VDDA with respect toVDDD VLINE1,2 referred to GND − 0.3 − 0.3 − 5.5 − 0.3 − 0.3 − 75 7.0 7.0 0.3 0.3 0.3 V V V V V V Analog input and output voltage referred to VDDA = 5 V; (VSS = −5V ) referred to VSS = − 5V ; (VDDA = 5 V) − 10.3 − 0.3 0.3 10.3 V V All digital input voltages referred to GNDD = 0 V; (VDDD = 5 V) referred to VDDD = 5 V; (GNDD = 0 V) − 0.3 − 5.3 5.3 0.3 V V DC input and output current at any input or output pin (free from latch -up) 100 mA Storage temperature Ambient temperature under bias TSTG TA − 65 − 10 125 Power dissipation PD 1W ESD-integrity (according MIL-Std 883D, method 3015.7) 1) VESD 1000 V
Semiconductor Group 67 01.98
9.1.1 Operating Range
TA = − 40 to 85°C; VDD = VDDD = VDDA =5V ± 5%; VSS = − 5V ± 5%; GNDD = GNDA = 0 V 1) Power dissipation and supply currents are target values. Table 21 Parameter Symbol Limit Values Unit Test Condition min. typ. max. VDD supply current1) Power Denial Power Down Active Active with TTX Ringing IDD PDen IDDPDown IDDAct IDDTTX IDDRng mA mA mA mA mA VSS supply current1) Power Denial Power Down Active Active with TTX Ringing ISS PDen ISSPDown ISSAct ISSTTX ISSRng 3,5 4,5 3.5 mA mA mA mA mA Power supply rejection-ratio receive VDD receive VSS transmit VDD transmit VSS PSRR dB dB dB dB ripple: 1 kHz, 70 mVrms at V2W at V2W at IOM-2 at IOM-2 Power dissipation Power Denial Power Down Active Active with TTX Ringing PDen PDown Act TTX Rng 128 160 110 195 231 110 mW mW mW mW mW
Semiconductor Group 68 01.98
9.2 Digital Interface
TA = − 40 to 85°C; VDD = VDDD = VDDA =5V ± 5%; VSS = − 5V ± 5 % ; G N D D=G N D A=0V Table 22 Parameter Symbol Limit Values Unit Test condition min max. For all input pins (including IO-Pins): Low-input pos.-going Low-input neg.-going Low-input Hysteresis VT+ VT- VH − 0,3 1.35 0.5 3.15 VDD + 0,3 V V V see figure below see figure below VH = VT+ − VT- Input leakage current IIL − 11 µA − 0.3≤ Vin≤ VDD Spike rejection for RESET (pin 36) trej 50 200 ns Ternary Inputs: ID-L, ID-M (pins 31, 32) High level Zero level Low level VIHID VIMID VILID 2.0 − 0.8 0.8 − 2.0 V V V For all output pins except DU (Pin 6; including IO-Pins): Low-output voltage High-output voltage for DU-pin (Pin 6) Low-output voltage High-output voltage VOL VOH VOLDU VOHDU 3.5 3.5 0.45 0.45 V V V V IO = − 2 mA (typ. at IO = − 3.5 mA) IO = 400µA IO = − 4 mA (typ. at IO = − 7 mA) IO = 400µA
Semiconductor Group 69 01.98 Figure 20 ITD10168 OUTV INVV T- V T+
Semiconductor Group 70 01.98
9.3 DC-Feeding
9.3.1 DC-Feeding ( TA =0 t o 7 0°C)
TA = − 0 to 70°C; VDD = VDDD = VDDA =5V ± 5%; VSS = − 5V ± 5 % ; G N D D=G N D A=0V
9.3.2 DC-Feeding ( TA = − 40 to 85°C)
TA = − 40 to 85°C; VDD = VDDD = VDDA =5V ± 5%; VSS = − 5V ± 5 % ; G N D D=G N D A=0V Table 23 Parameter Symbol Limit Values Unit Test condition min. typ. max. “Line Current” Measurement: Transmit VIT offset VIT gain VIT gain VIT THD- − 25 0.94 − 1.06 40 50 1.06 0.94 mV dB direct/reverse polarity f < 50 Hz, direct polarity f < 50 Hz, reverse polarity direct/reverse polarity “Line Voltage” Feeding: Receive Receive Boosted V2W offset V2W gain V2W THD V2W offset V2W gain V2W THD − 25 0.94 − 40 1.5 1.6 1.06 1.7 mV dB mV dB normal battery, f = 300 Hz normal battery, f = 300 Hz normal battery boosted battery, f = 300 Hz boosted battery, f = 300 Hz boosted battery Table 24 Parameter Symbol Limit Values Unit Test Condition min. typ. max. “Line Current” Measurement: Transmit VIT offset VIT gain VIT gain VIT THD- − 30 0.94 1.06 40 50 1.06 0.94 mV dB direct/reverse polarity f<5 0H z , d i r e c t p o l a r i t y f<5 0H z , r e v e r s e p o l a r i t y direct/reverse polarity
Semiconductor Group 71 01.98
9.4 HV-SLIC Interface
TA = − 40 to 85°C; VDD = VDDD = VDDA =5V ± 5%; VSS = − 5V ± 5%; GNDD = GNDA = 0 V “Line Voltage” Feeding: Receive Receive Boosted V2W offset V2W gain V2W THD V2W offset V2W gain V2W THD −30 0.927 −48 1.48 1.6 1.073 1.72 mV dB mV dB normal battery, f=3 0 0H z normal battery, f=3 0 0H z normal battery boosted battery, f=3 0 0H z boosted battery, f=3 0 0H z boosted battery Table 25 Parameter Symbol Limit Values Unit Test Condition/Result min. typ. max. Ground Key Detection at Pin IL VILLo VILHi − 217 293 217 − 293 mV mV GNK = 0 GNK = 1 Half Battery Information at Pin V2W VV2WLo VV2WHi − 1.35 − 1.65 V V VBIM = − 3V VB/2 = 0 VB/2 = 1 PDN-Pin max. Ron Ron 90 250 in Active-Mode to GND Table 24 (cont’d) Parameter Symbol Limit Values Unit Test Condition min. typ. max.
Semiconductor Group 72 01.98
9.5 IOM ® -2 Interface Timing
1) VLINE = VLINE1 -VLINE2 Output voltage: HV-SLIC-Interface Pins 9, 10 (C1, C2) High level Zero level Low level Current drained from pin 9 (C1) in all 3 states VOHHV VOMHV VOLHV IOTLo IOTHi 2.5 − 0.8 480 0.8 − 2.5 320 V V V µA µA Iout <1 0 Iout <1 0 Iout <1 0 TEMPA = 0 TEMPA = 1 External Indication VEXT_off VEXT_0 VEXT_6 − 200 0.5 0.3 200 1.3 1.5 mV V V measured at IOM-2 without DC VLINE = 0 V without DC VLINE = 6 V with DC = 30 V VLINE 1) = 6 V Table 25 (cont’d) Parameter Symbol Limit Values Unit Test Condition/Result min. typ. max. ITT10159 tDCL tDCLh tFSC_S tFSC_H tFSC tt DD_H tdDU DD_S DCL FSC DD DU 10% 90%
Semiconductor Group 73 01.98 1) DCL = 2048 kHz: tFSC =2 5 6 × tDCL 2) DCL = 4096 kHz: tFSC =5 1 2 × tDCL 3) Depending on Pull up resistor (typical 1… 10 k) Table 26 Switching Characteristics Parameter Symbol Limit Values Unit min. typ. max. Period DCL “slow” mode1) Period DCL “fast” mode2) DCL Duty Cycle Period FSC FSC set-up time FSC hold time tDCL tDCL tDCLh tFSC tFSC_S tFSC_H 125 tDCLh kHz kHz µs ns ns DD data in set-up time DD data in hold time DU data out delay (intrinsic) DU data out delay tDD_S tDD_H tdDUintr. tdDU 150 250 ns ns ns ns
Semiconductor Group 74 01.98
9.6 IOM ® -2 Command/Indication Interface Timing (DCL = 4096 kHz)
Table 27 Switching Characteristics Parameter Symbol Limit Values Unit min. typ. max. Command out delay tdCout 0n s Command out high impedance Command out active tdCZ tdCA 150 150 200 200 ns ns Indication in set-up time Indication in hold time tlin_s tlin_h 200 ns ns ITT10158 10% 90% tlin_htlin_s High Imp. tdCA tdCZ High Imp. One Frame Later Last Monitor Bit IN Old Command Valid tdCOUT MXMRLast C/I Bit DCL DD Command OUT DD DU Ind. IN All Outputs.
4 MHz
All Outputs. Command OUT Command OUT All Outputs. Bit OUT Last Monitor New Command Valid First Indication Bit OUT All Inputs.
Semiconductor Group 75 01.98
9.7 IOM ® -2 Command/Indication Interface Timing (DCL = 2048 kHz)
Table 28 Switching Characteristics Parameter Symbol Limit Values Unit min. typ. max. Command out delay tdCout 0n s Command out high impedance Command out active tdCZ tdCA 150 150 200 200 ns ns Indication in set-up time Indication in hold time tlin_s tlin_h 200 ns ns ITT10157 10% 90% tlin_htlin_s High Imp. tdCA tdCZ High Imp. One Frame Later Last Monitor Bit IN Old Command Valid tdCOUT MXMRLast C/I Bit DCL DD Command OUT DD DU Ind. IN All Outputs.
2 MHz
All Outputs. Command OUT Command OUT All Outputs. Bit OUT Last Monitor New Command Valid First Indication Bit OUT All Inputs.
Semiconductor Group 76 01.98
9.8 External Masterclock
Table 29 Switching Characteristics Parameter Symbol Limit Values Unit min. typ. max. Period MCLK MCLK Duty Cycle tMCLK tMCLKh 40 1/16.384 MHz ITT10180 MCLK MCLKt tMCLKh
Semiconductor Group 77 01.98
10 Appendix
10.1 IOM ® -2 Interface Monitor Transfer Protocol
The monitor channel is used for the transfer of maintenance information between two functional blocks. Using two monitor control bits (MR and MX) per direction, the data are transferred in a complete handshake procedure. The MR and MX bits in the fourth octet (C/I channel) of the IOM2 frame are used for the handshake procedure of the monitor channel The monitor channel transmission operates on a pseudo-asynchronous basis: – Data transfer (bits) on the bus is synchronized to Frame Sync FSC – Data flow (bytes) are asynchronously controlled by the handshake procedure. For example: Data is placed onto the DD-Monitor-Channel by the Monitor-transmitter of the master device (DD-MX-Bit is activated i.e. set to ‘0’). This data transfer will be repeated within each frame (125 µs rate) until it is acknowledged by the SLICOFI Monitor-receiver by setting the DU-MR-bit to ‘0’, which is checked by the Monitor-transmitter of the master device. Thus, the data rate is not 8-Kbytes/s. Figure 25 ITS10156 Monitor- Transmitter MR MX MR MX Master Device MX MR MX MR DD DU SLICOFI R Receiver Monitor- Transmitter Monitor- Receiver Monitor-
Semiconductor Group 78 01.98 Monitor Handshake Procedure The monitor channel works in 3 states Idle state A pair of inactive (set to ‘1’) MR- and MX-bits during two or more consecutive frames: End of Message (EOM) Sending state MX-bit is activated (set to ‘0’) by the Monitor-transmitter, together with data-bytes (can be changed) on the Monitor-channel Acknowledging MR-bit is set to active (set to ‘0’) by the Monitor-receiver, together with a data-byte remaining in the Monitor-channel. A start of transmission is initiated by a Monitor-transmitter in sending out an active MX-bit together with the first byte of data (the address of the receiver) to be transmitted in the Monitor-channel. This state remains until the addressed Monitor-Receiver acknowledges the received data by sending out an active MR-bit, which means that the data-transmission is repeated each 125µs frame (minimum is one repetition). During this time the Monitor-transmitter evaluates the MR-bit. Flow control, means in the form of transmission delay, can only take place when the transmitters MX and the receivers MR bit are in active state. Since the receiver is able to receive the monitor data at least twice (in two consecutive frames), it is able to check for data errors. If two different bytes are received the receiver will wait for the receipt of two identical successive bytes (last look function) A collision resolution mechanism (check if another device is trying to send data during the same time) is implemented in the transmitter. This is done by looking for the inactive (‘1’) phase of the MX-bit and making a per bit collision check on the transmitted monitor data (check if transmitted ‘1’s are on DU/DD-line; DU/DD-line are open-drain lines). Any abort leads to a reset of the SLICOFI command stack, the device is ready to receive new commands. To obtain a maximum speed data transfer, the transmitter anticipates the falling edge of the receivers acknowledgment. Due to the inherent programming structure, duplex operation is not possible. It is not allowed to send any data to the SLICOFI, while transmission is active.
Semiconductor Group 79 01.98 Figure 26 State Diagram of the SLICOFI Monitor Transmitter MR … MR - bit received on DD - line MX … MX - bit calculated and expected on DU - line MXR … MX - bit sampled on DU - line CLS … Collision within the monitor data byte on DU - line RQT … Request for transmission form internal source ABT … Abort request/indication ITD02458 Idle MX = 1 MX = 0 1st Byte MX = 1 nth Byte ACK MX = 0 Wait for ACK Wait MX = 1 MX = 1 Abort EOM MX = 1 MR MR MR MR Initial State CLS/ABT Any State RQT. .RQTMR .RQTMR MR RQT. .RQTMR MR + MXR MXR MR MXR. .MXRMR MR
Semiconductor Group 80 01.98 Figure 27 State Diagram of the SLICOFI Monitor Receiver MR … MR - bit calculated and transmitted on DU - line MX … MX - bit received data downstream (DD - line) LL … Last lock of monitor byte received on DD - line ABT … Abort indication to internal source Monitor Channel Data Structure The monitor channel is used for the transfer of maintenance information between two functional blocks. By use of two monitor control bits (MR and MX) per direction, the data are transferred in a complete handshake procedure. ITD02459 Idle MR = 1 MR = 0 1st Byte REC New Byte MR = 1 Abort Byte Valid MX MX MX MX MX Initial State MR = 0 Wait for LL MX MX MXMX MX ABT Any State nth Byte REC LL. .LLMX .LLMXMX LL. .LLMX .LLMX MR = 1 Wait for LL MR = 0 MR = 0 MR = 1
Semiconductor Group 81 01.98 Address Byte Messages to and from the SLICOFI are started with the following byte: Thus providing information for only one analog line, the SLICOFI is one device on one IOM-2 time slot. Monitor data for the analog channel is selected by the SLICOFI specific command (SOP, TOP or COP) following.
10.2 Channel Identification Command (CIC)
In order to unambiguously identify different devices by software, a two Byte identification command is defined for analog lines IOM-2 devices. A device requesting the identification of the SLICOFI will send the following 2 byte code: Each device will then respond with its specific identification code. For the SLICOFI this two byte identification code is: CONF an optional 4-bit code indicating the specific hardware environment. A typical application of the CONF code is the differentiation of various types of line circuits that use the same SLICOFI/SLIC hardware within the same system. For the realization of the Channel Identification Commands on the line card, it needs 3 pins at the SLICOFI. There are two inputs that can handle a ternary code (ID-L and ID-M). One pin is a binary input (ID-H) which is switchable as a digital serial interface of a shift register, to transfer special line card design informations up to 15 bytes into the monitor channel of the IOM-2 interface. There are two different solutions of the CIC for the SLICOFI to identify the version of the line card. B i t 76543210 10000001 10000000 00000000
1000 C O N F
Semiconductor Group 82 01.98 Figure 28 Solution 1 (“Normal” Channel Identification Command): The input of the 3 pin interface (ID-H, ID-L, ID-M) is transferred to the 4 bit CONF information using the following truth-table: Table 30 SLICOFI Ports CONF-inf. ID-H ID-M ID-L (4 bits) + 5 V + 5 V + 5 V + 5 V + 5 V + 5 V + 5 V + 5 V 0 V 0 V 0 V 0 V 0 V 0 V 0 V 0 V − 5 V − 5 V − 5 V 0 V 0 V 0 V + 5 V + 5 V + 5 V + 5 V 0 V 0 V 0 V − 5 V − 5 V − 5 V − 5 V 0 V + 5 V − 5 V 0 V + 5 V − 5 V 0 V 0 V − 5 V + 5 V 0 V − 5 V + 5 V 0 V − 5 V 0 0 0 0 0 0 0 1 0 0 1 0 0 0 1 1 0 1 0 0 0 1 0 1 0 1 1 0 0 1 1 1 1 0 0 0 1 0 0 1 1 0 1 0 1 0 1 1 1 1 0 0 1 1 0 1 1 1 1 0 1 1 1 1 ITS10167 SLICOFI R H M L +5 V; 0 V; -5 V +5 V; 0 V +5 V; 0 V; -5 V ASIC FSC DCL Binary Input Ternary Inputs
Semiconductor Group 83 01.98 This is a 16 possible individual line card design information or an address pointer for the system to get more basic information. The information is read through the IOM-2 monitor channel with the CIC command. Solution 2 (Extended Channel Identification Command): The second realization step is that the combination of ports (M + L) =+ 5 V changes the input port ID-H to a shift register input. An external shift register on the line card transmits up to 15 bytes of special HW + FW line card design information (TCR4 - TCR18). The information is read through the IOM2 monitor channel with the TOP Command. The LSEL bits TOP Command's register must be ‘10’ - code for reading extended line card design and configuration information from TCR4 - TCR18 registers, which are sequential reading using two shift register. The CONF code is ‘1111’ by this extended identification. The first schematic gives an overview of the different timings for the extended channel identification. Table 31 SLICOFI Ports CONF-inf. ID-H ID-M ID-L (4 bits) X + 5 V + 5 V 1 1 1 1
Semiconductor Group 84 01.98 Figure 29 General Timing ITD10179 Detail A 125 FSC DU DCL TSx M XR MVoice Channel A M RX M µ s Voice Channel A Don't Care High Impedance Monitor Channel Monitor Channel C/I Channel C/I Channel x = 0 - 7 CIB 0 12 3 4 5 6 7 89 1 0 11 1213 14 10 32 54 6 DD DU 7 - 0 CIBx...Channel Identification Byte TS0 TS1 TS2 TS3 TS4 TS5 TS6 TS7 TS0 TS1 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 7 - 0 ITT10178 Bit 7 FSC DCL ID-H Detail A for SEL24 = 1 4096 kHz Bit 6Don't Care CIBO CIBx ... Channel Identification Byte Detail A for SEL24 = 1 ID-H 2048 kHz FSC DCL Don't Care Bit 7 Bit 6 CIBO
Semiconductor Group 85 01.98 Expected Input of the ASIC (via ID - H; ID - L = ID - M 0 = + 5V ) If - for example - the SLICOFI has the time slot 6 (TSx = 110, see chapter 4, page 16, too), the Monitor Channel of TS6 looks like the following (for all other time slots equivalent). Figure 30 Expected Input Timing and IOM-2 Interface Timing and Switching characteristic: To be defined.
10.3 Test Modes
Various loops and tests (to cut off at different points or disable some filters) for testing either the chip or the board and the line are implemented in the SLICOFI. Table 32 LB TM T3 T2 T1 T0 Testloop SCR1-5 SCR2-3 SCR6-3 SCR6-2 SCR6-1 SCR6-0 1 0 0 0 0 1 ALB_ADC 10 0 1 0 1 D L B _ 4 M 1 0 1 0 0 0 DLB_PCM 1 0 1 1 0 0 DC_ALB 1 0 all other combinations of T3: T0 don't use 11 0 0 0 1 R V P 11 0 0 1 0 T V P ITD10177 125 FSC DU DCL µ s CIB 1234 CIB0-14 TS TSTSTS TSTS TS TS TS TSTSTS TSTS 35 4 TSTS TS TSTSTS TSTS 35 4 TSTS TS TSTSTS TSTS 35 4 TSTS TS TS TS TS TS TS 435 TS TS 760 TSTSTS TSTS 213 TSTS 546 29 30 Ch A TCR C/I CIB0 = TCR4 CIB0 = TCR4 CIB1 = TCR5 CIB1 = TCR5 Ch C/ITCR Ch TCR
5 C/I Ch TCR
CIB14 = TCR18 CIB14 = TCR18 CIB0-14 CIB0-14 CIB0-14 CIB0-14 CIB0-14 4A 4A
Semiconductor Group 86 01.98 Testregister (STCR1 to 8) - Summary The Testregisters (accessed by the SOP-command with LSEL = 11b) are for internal use only. The 8 Testregisters can only be read or written en bloc. They are enabled/disabled by the Enable Testregister bit ENTR (SCR5-1). For ENTR = 0 the STCRs are set to the basic settings - so no refresh is necessary. But note there are complex internal connections; so do use only the following two commands: ACDACDIS and EXT_MCLK. All other bits MUST be set as described below. STCR1 Test Configuration Register 1 Reset value: 00 H STCR2 Test Configuration Register 2 Reset value: 00 H general remark All bits of STCR1 are set if necessary automatically by regular testloops. So setting STCR1-bits to ‘1’, together with a testloop, the certain action is inverted. EXT_MCLK Possibility to provide the SLICOFI with external clock (see also page 35, EXT_MCLK, SCR8-4; There are no functional differences between these two settings!) EXT_MCLK = 0 Internal masterclock is used EXT_MCLK = 1 External masterclock is used 11 0 0 1 1 L C 11 0 1 0 0 R C 11 0 1 0 1 I L T 1 1 0 1 1 0 DC-THRU 1 1 all other combinations of T3: T0 don’t use
0 X X X X X all loops off
0 0 EXT_MCLK 0 0 ACDACDIS 0 0 Table 32 (cont’d) LB TM T3 T2 T1 T0 Testloop SCR1-5 SCR2-3 SCR6-3 SCR6-2 SCR6-1 SCR6-0
Semiconductor Group 87 01.98 To use an external masterclock of 16 MHz following steps must be done: 1) IO1 must be set to input and becomes the input-pin of the masterclock 2) Enable the testregisters (Configuration Register 5: SCR5-1 (ENTR) =1) 3) The testregisterblock must be programmed (Test Configuration Register 2: STCR2-5 (EXT_MCLK) = 1) ACDACDIS Disables AC-DAC ACDACDIS = 0 normal operation ACDACDIS = 1 disables AC-DAC STCR3 Test Configuration Register 3 Reset value: 00H STCR4 Test Configuration Register 4 Reset value: 5F H STCR5 Test Configuration Register 5 Reset value: 00 H STCR6 to STCR8 Test Configuration Register 6 to 8 Reset value: 00 H B i t 76543210 00 0 00000 B i t 76543210 01 0 11111 B i t 76543210 00 0 00000 B i t 76543210 00 0 00000
Semiconductor Group 88 01.98 ALB_ADC (Analog loop with ADC and DAC) This testloop feasibles the test of AC analog parts including ADC and DAC. Initializing the testloop: Reset Active Mode Disable Impedance matching filter (OPIMAN (SCR6_5) = 1, OPIM4M (SCR6_4) = 1, IM (SCR4_6) = 0) Testloop Figure 31 ITS10181 AGR TTXFI Transmit Path Receive Path *) OPIMAN (SCR6_5) = 1 A D A D AGX ITAC V2W IM2 IM FIX2 IM FIX3 FIX1 IM1 IM XFIX2 X1 RFIX2 AX2 AR2 + XFIX1 TH RFIX2 THFIX DHPX FRX DHPR FRR AX1 AR1 CMP EXP TG1 TG2 PCM Output PCM Input *) *) ALB_ADC A DAG TTX OPIM4N (SCR6_4) = 1 IM (SCR4_6) = 0 TTX GEN
Semiconductor Group 89 01.98 DLB_4M (Digital loop up to 4 MHz) This testloop feasibles the test of AC digital parts including DSP. Initializing the testloop: Reset Store owns coefficients (generated by SLICOS) Active Mode Select programmed coefficients (FIXC (SCR5_5) = 0) Open Impedance matching and Transhybrid loop (OPIM4M (SCR6_4) = 1, IM (SCR4_6) = 0, TH (SCR4_7) = 0) Testloop Figure 32 ITS10184 AGR TTXFI Transmit Path Receive Path *) OPIMAN (SCR6_4) = 1 A D A D AGX ITAC V2W IM2 IM FIX2IM FIX3 FIX1 IM1 IM XFIX2 X1 RFIX2 AX2 AR2 + XFIX1 TH RFIX1 THFIX DHPX FRX DHPR FRR AX1 AR1 CMP EXP TG1 TG2 PCM Output PCM Input *) *) A DAG TTX TH (SCR4_7) = 0 IM (SCR4_6) = 0 TTX GEN DLB_4M
Semiconductor Group 90 01.98 DLB_PCM (Digital loop only PCM-interface) This testloop is the basic setting after Reset and the NOT Active Mode. It releases a shortcut between DD and DU. In Active Mode this loop can be programmed. Initializing the testloop: Reset or in Active Mode: Testloop Figure 33 ITS10185 AGR TTXFI Transmit Path Receive Path A D A D AGX ITAC V2W IM2 IM FIX2IM FIX3 FIX1 IM1 IM XFIX2 X1 RFIX2 AX2 AR2 + XFIX1 TH RFIX1 THFIX DHPX FRX DHPR FRR AX1 AR1 CMP EXP TG1 TG2 PCM Output PCM Input A DAG TTX TTX GEN DLB_PCM
Semiconductor Group 91 01.98 DC_ALB (DC analog loop) This testloop feasibles the test of the analog DC parts (max. frequency of the testsignal 4 kHz). Initializing the testloop: Reset Active Mode Open analog loop (OPIMAN (SCR6_5) = 1, ACDACDIS (STCR2_2) = 1) Testloop Figure 34 ITS10186 A D A V2W AC LOOP LP03AG DCX ITAC AG DCR LP5CHAR DC RECT CMP COMP EXP RNG OK ?MEAN VAL. THRESH Output PCM Input PCM OPIMAN (SCR6_5) = 1*) ACDACDIS (STCR2_2) = 1 IT DC_ALB
Semiconductor Group 92 01.98 RVP (Ringer voltage present) This testloop feasibles the test of the ringer burst level. Initializing the testloop: Reset Store owns coefficients and voltage level for measurement (generated by SLICOS) Select programmed coefficients (FIXC (SCR5_5) = 0) Open analog loop (OPIMAN (SCR6_5) = 1, ACDACDIS (STCR2_2) = 1) Ringing Mode, Ring Burst On (RBO) command Testloop Test condition is indicated in MVA (SCR2_7) and result of the comparison is stored in OKRNG (SCR2_4). The mean value can get at PCM Output, too. Figure 35 ITS10187 A D A V2W AC LOOP LP03AG DCX ITAC AG DCR LP5CHAR DC RECT CMP COMP EXP RNG OK ?MEAN VAL. THRESH Output PCM Input PCM OPIMAN (SCR6_5) = 1*) ACDACDIS (STCR2_2) = 1 IT
Semiconductor Group 93 01.98 TVP (Teletax voltage present) This testloop feasibles the test of the teletax burst level which includes the test of TTX adaptation and basic functions of HV-SLIC. Initializing the testloop: Reset Store owns coefficients and voltage level for measurement (generated by SLICOS) Select programmed coefficients (FIXC (SCR5_5) = 0) Active Mode, Teletax Burst On: TTXNO (SCR3_7) = 0 Testloop Test condition is indicated in MVA (SCR2_7) and result of the comparison is stored in OKTTX (SCR2_5). The rectified value can get at PCM Output, too. (During the testloop the last DC value is hold.) Figure 36 ITS10188 A D A V2W AC LOOP LP03AG DCX ITAC AG DCR LP5CHAR DC RECT CMP COMP EXP RNG OK ?MEAN VAL. THRESH Output PCM Input PCM IT TTX AG A D GEN TTX DAC-HOLD TTXK
Semiconductor Group 94 01.98 LC (Loop current measurement) This testloop feasibles a DC test of the line (shortcut, resistance, operating point) and basic function of the HV-SLIC. Initializing the testloop: Reset Store owns coefficients (generated by SLICOS) Select programmed coefficients (FIXC (SCR5_5) = 0) Open analog loop (OPIMAN (SCR6_5) = 1, ACDACDIS (STCR2_2) = 1) Active Mode Testloop Figure 37 ITS10189 A D A V2W AC LOOP LP03AG DCX ITAC AG DCR LP5CHAR DC RECT CMP COMP EXP RNG OK ?MEAN VAL. THRESH Output PCM Input PCM OPIMAN (SCR6_5) = 1*) ACDACDIS (STCR2_2) = 1 IT
Semiconductor Group 95 01.98 RC (Ringer capacitance measurement) This testloop feasibles the test of the line concerning the ringer. Initializing the testloop: Reset Store owns coefficients (generated by SLICOS) Select programmed coefficients (FIXC (SCR5_5) = 0) Open analog loop (OPIMAN (SCR6_5) = 1, ACDACDIS (STCR2_2) = 1) Ringing Mode, Ring Burst On (RBO) command Testloop Figure 38 ITS10190 A D A V2W AC LOOP LP03AG DCX ITAC AG DCR LP5CHAR DC RECT CMP COMP EXP RNG OK ?MEAN VAL. THRESH Output PCM Input PCM OPIMAN (SCR6_5) = 1*) ACDACDIS (STCR2_2) = 1 IT
Semiconductor Group 96 01.98 ILT (Longitudinal current measurement) This testloop feasibles the test of the line. Initializing the testloop: Reset Store owns coefficients (generated by SLICOS) Select programmed coefficients (FIXC (SCR5_5) = 0) Open analog loop (OPIMAN (SCR6_5) = 1, ACDACDIS (STCR2_2) = 1) Active Mode Testloop Figure 39 ITS10191 A D A IL V2W AC LOOP LP03AG DCX ITAC AG DCR LP5CHAR DC RECT CMP COMP EXP RNG OK ?MEAN VAL. THRESH Output PCM Input PCM OPIMAN (SCR6_5) = 1*) ACDACDIS (STCR2_2) = 1 IT
Semiconductor Group 97 01.98 DC_THRU (DC loop) This testloop feasibles the test of the DC parts. Initializing the testloop: Reset PDown Mode (AC-Loop disactivated) Testloop Figure 40 ITS10192 A D A IT V2W AC LOOP LP03AG DCX ITAC AG DCR LP5CHAR DC RECT CMP COMP EXP RNG OK ?MEAN VAL. THRESH Output PCM Input PCM
Semiconductor Group 98 01.98
10.4 List of Abbreviations
ADC Analog Digital Converter AGDCR Attenuation DC Receive AGDCX Attenuation DC Transmit AGR Attenuation Receive AGX Attenuation Transmit AGTTX Attenuation Teletax AR Attenuation Receive AX Attenuation Transmit BB Boosted Battery BiCMOS Bipolar Complementary Metal Oxid Semiconductor BP Band Pass C/I-DD Channel Identification-Data Downstream C/I-DU Channel Identification-Data Upstream C1, 2 Digital Interface to HV-SLIC CAP External Capacitor to GNDA CCITT Commité Consultatif International de Telephone et Telegraph CHOP Chopper (see SCR8_6) CMP Compander CODEC Coder Decoder COMP Comparator (Testloops, Levelmetering) COP Coefficient Operation CRAM Coefficient RAM DAC Digital Analog Converter DAC-HOLD DC DAC Hold (Testloop TVP) DBP Deutsche Bundes Post DCCHAR DC Characteristic block DCL Data Clock DD Data Downstream
Semiconductor Group 99 01.98 DHP_R Disable Receive Highpass (SCR5_7) DHP_X Disable Transmit Highpass (SCR1_1) DSP Digital Signal Processor DU Data Upstream DUP Data Upstream Persistency Counter DUPGNK Data Upstream Persistency Counter for GNK EXP Expander FRR Frequency Response Receive Filter FRX Frequency Response Transmit Filter FSC Frame Sync. GNDIT Analog Ground GNK Ground Key HV-SLIC High Voltage Subscriber Line Interface Circuit I1 Fixed Input Pin ID-L External Identification ID-M External Identification IH-H External Identification IL Longitudinal Current Input IM Impedance Matching Filter (programmable) IMFIX Impedance Matching Filter (fixed) IO User Programmable I/O Pin IOM-2-Interface ISDN Oriented Modular Interface ISDN Integrated Service Digital Network IT Transversal Current Input (for AC and DC) ITAC Transversal Current Input (for AC)
Semiconductor Group 100 01.98 LP03 Low Pass 0.3 Hz LP5 Low Pass 5 Hz LSSGR Local area transport access Switching System Generic Requirements MEAN VAL. Mean Value (Testloops, Levelmetering) MR Monitor Receive MX Monitor Transmit O1 Fixed Output Pin PCM Pulse Code Modulation PDen Power Denial PDN Power Down PDN PDN Pin (Sets the HV SLIC to Power Denial) POFI Post Filter PREFI Antialiasing Pre Filter RB Ring Burst RECT Rectifier (Testloops, Levelmetering) RES Reset REXT External Ring Sync. Input RFIX Receive Filter (fixed) RNG Ring Generator RREF External Resistor to GNDA SCR Status Configuration Register SEL24 Select Data Clock 2 or 4 MHz SLIC Subscriber Line Interface Circuit SLICOS SLICOFI Oriented Software SLMA Subscriber Loop Marging SLXC Summary Line Card Outputs SOP Status Operation STCR Status Test Configuration Register
Semiconductor Group 101 01.98 TCR Transfer Configuration Register TE 1-3 Test Pin TG Tone Generator TH Transhybrid Balancing THFIX Transhybrid Balancing Filter (fixed) THRESH Threshhold (Testloops, Levelmetering) TOP Transfer Operation TS Time Slot TS 0-2 Time Slot selection Pin TTX Teletax TTXFI Teletax Adaptation TTXGEN Teletax Generator V2W Two Wire Output Voltage VBIM Battery Image Input VLINE1, 2 Offhook-Detection in Power Denial Mode X Transmit Filter (programmable) XFIX Transmit Filter (fixed)
Semiconductor Group 102 01.98 Figure 41 P-LCC-44 (SMD) (Plastic Leaded C hip C arrier) GPL05102 Sorts of Packing Package outlines for tubes, trays etc. are contained in our Data Book “Package Information” Dimensions in mmSMD = Surface Mounted Device