PE9304 PSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Fixed divide ratio of 2
  • Low-power operation: 13.5 mA typical @ 3 V
  • Small package: 8-lead Ceramic SOIC
  • Guaranteed 100 Krads(Si) Total Dose Performance
  • Superior Single Event Upset Immunity

Table 1. Electrical Specifications (ZS = ZL = 50 Ω) Figure 2. Package Type

1000 MHz ≤ FIN < 2000 MHz +5 +12 dBm

2000 MHz ≤ FIN < 6000 MHz 0 +12 dBm

6000 MHz ≤ FIN ≤ 7000 MHz +5 +12 dBm

1000 MHz ≤ FIN < 2000 MHz 0 dBm

2000 MHz ≤ FIN < 6000 MHz -7

6000 MHz ≤ FIN ≤ 7000 MHz -12

Table 2. Pin Descriptions Table 3. Absolute Maximum Ratings devices are immune to latch-up. Figure 3. Pin Configuration Electrostatic Discharge (ESD) Precautions exceeding the rating specified in Table 3. may cause permanent device damage. limits in the DC Electrical Specifications table. extended periods may affect device reliability.

4 GND

7 OUT

Figure 5. Evaluation Board Schematic 2.2 pF was chosen for the evaluation board. for their design application. overall board thickness is 0.062”.

Figure 9. Package Drawing Table 4. Ordering Information

©2003-2006 Peregrine Semiconductor Corp. All rights reserved. Document No. 70-0152-02 │ UltraCMOS™ RFIC Solutions Sales Offices The Americas Peregrine Semiconductor Corporation

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San Diego, CA 92121 Tel: 858-731-9400 Fax: 858-731-9499 North Asia Pacific Peregrine Semiconductor K.K. Teikoku Hotel Tower 10B-6 1-1-1 Uchisaiwai-cho, Chiyoda-ku Tokyo 100-0011 Japan Tel: +81-3-3502-5211 Fax: +81-3-3502-5213 Peregrine Semiconductor, Korea #B-2402, Kolon Tripolis, #210 Geumgok-dong, Bundang-gu, Seongnam-si Gyeonggi-do, 463-480 S. Korea Tel: +82-31-728-4300 Fax: +82-31-728-4305 Europe Peregrine Semiconductor Europe Bâtiment Maine 13-15 rue des Quatre Vents F-92380 Garches, France For a list of representatives in your area, please refer to our Web site at: www.psemi.com Data Sheet Identification Advance Information The product is in a formative or design stage. The data sheet contains design target specifications for product development. Specifications and features may change in any manner without notice. Preliminary Specification The data sheet contains preliminary data. Additional data may be added at a later date. Peregrine reserves the right to change specifications at any time without notice in order to supply the best possible product. Product Specification The data sheet contains final data. In the event Peregrine decides to change the specifications, Peregrine will notify customers of the intended changes by issuing a DCN (Document Change Notice). The information in this data sheet is believed to be reliable. However, Peregrine assumes no liability for the use of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this data sheet are implied or granted to any third party. Peregrine’s products are not designed or intended for use in devices or systems intended for surgical implant, or in other applications intended to support or sustain life, or in any application in which the failure of the Peregrine product could create a situation in which personal injury or death might occur. Peregrine assumes no liability for damages, including consequential or incidental damages, arising out of the use of its products in such applications. The Peregrine name, logo, and UTSi are registered trademarks and UltraCMOS and HaRP are trademarks of Peregrine Semiconductor Corp. South Asia Pacific Peregrine Semiconductor, China Shanghai, 200040, P.R. China Tel: +86-21-5836-8276 Fax: +86-21-5836-7652 Space and Defense Products Americas: Tel: 858-731-9453 Europe, Asia Pacific:

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