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High-frequency operation 1.5 - 3.5 GHz Fixed divide ratio of 8 Low-power operation 14 mA typical @ 3V across frequency Small package 8-lead formed flat pack Available as Die Table 1. Electrical Specifications @ +25 °C (ZS = ZL = 50 Ω) Figure 2. Package Type
Table 2. Pin Descriptions devices are immune to latch-up. Figure 3. Pin Configuration exceeding the rating specified in Table 3. 1 VDD Power supply pin. Bypassing is required.
3 DEC
4 GND
5 GND Ground pin
6 GND Ground pin
7 OUT
8 GND Ground Pin
Table 3. Absolute Maximum Ratings may affect device reliability.
Figure 4. Test Circuit Block Diagram
50 Ohm50 Ohm 100 pF 15 pF
as shown in the test circuit below.
Figure 5. High Frequency System Application
Figure 7. Evaluation Board Schematic
Figure 10. Package Drawing
Table 4. Ordering Information specifications for product development. Specifications and features may change in any manner without notice. of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party. are trademarks of Peregrine Semiconductor Corp. For sales and contact information please visit www.psemi.com. Figure 11. Top Marking Specifications