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Table 1. Electrical Specifications @ +25°C, VDD = 2.75V (ZS = ZL = 50Ω)

1 RFC–RFX 50–3000 MHz 37 dBm

Note 1: Input 0.1 dB compression point is a linearity figure of merit. Refer to Table 3 for the operating RF input power (50Ω).

Table 1A. Electrical Specifications @ –40 to +105°C, VDD = 2.75V (ZS = ZL = 50Ω) Note 1: Input 0.1 dB compression point is a linearity figure of merit. Refer to Table 3 for the operating RF input power (50Ω). Parameter Path Condition Min Typ Max Unit Operational frequency 50 3000 MHz Insertion loss (symmetric ports) RFC–RFX 50–1000 MHz 0.50 0.75 dB 1000–2200 MHz 0.65 0.90 dB 2200–2700 MHz 0.80 1.10 dB 2700–3000 MHz 0.95 1.30 dB Isolation RFC–RFX 50–1000 MHz 30 32 dB 1000–2200 MHz 23 25 dB 2200–2700 MHz 21 23 dB 2700–3000 MHz 20 22 dB Return loss (active ports) RFC–RFX 50–1000 MHz 24 dB 1000–2200 MHz 19 dB 2200–2700 MHz 16 dB 2700–3000 MHz 14 dB Return loss (common ports) RFC–RFX 50–1000 MHz 23 dB 1000–2200 MHz 16 dB 2200–2700 MHz 14 dB 2700–3000 MHz 13 dB 2nd harmonic RFX +35 dBm output power, 850/900 MHz –83 –76 dBc +33 dBm output power, 1800/1900 MHz –85 –74 dBc 3rd harmonic RFX +35 dBm output power, 850/900 MHz –77 –69.5 dBc +33 dBm output power, 1800/1900 MHz –78 –68.5 dBc IMD3 RF Measured at 2.14 GHz at ANT port, input +20 dBm CW signal at 1.95 GHz and –15 dBm CW signal at 1.76 GHz –111 dBm Input IP2 RFC–RFX 50–3000 MHz 115 dBm Input IP3 RFC–RFX 50–3000 MHz 68 dBm Input 0.1 dB compression point Switching time 50% CTRL to 90% or 10% RF 1 2 μs

Figure 3. Pin Configuration (Top View) Table 2. Pin Descriptions

2 V DD Supply voltage

3 V2 Digital control logic input 2

4 V1 Digital control logic input 1

6 RF4

1 RF port

8 RF3 1 RF port

11 RFC 1 RF common

13 RF1 1 RF port

15 RF2 1 RF port

Table 3. Operating Ranges Table 4. Absolute Maximum Ratings

  1. Machine Model (JEDEC JESD22-A115)
  2. Charged Device Model (JEDEC JESD22-C101)

to the limits in the Operating Ranges table.

Table 5. Truth Table exceeding the specified rating. devices are immune to latch-up.

Figure 11. Isolation vs VDD (RFC–RFX) Figure 10. Isolation vs Temp (RFC–RFX)

SMA connectors J3, J5, J2 and J4, respectively. environmental conditions being evaluated. FR4 material with a total thickness of 62 mils. Figure 12. Evaluation Board Layouts

50 Ohm

13 RF1

14 N/C

15 RF2

16 N/C

1 N/C

2 VDD

Figure 13. Evaluation Board Schematic Caution: Contains parts and assemblies susceptible to damage by electrostatic discharge (ESD).

Figure 14. Package Drawing Figure 15. Top Marking Specification

0.10 C A B

Figure 16. Tape and Reel Specifications Table 6. Ordering Information specifications for product development. Specifications and features may change in any manner without notice. of this information. Use shall be entirely at the user’s own risk. No patent rights or licenses to any circuits described in this datasheet are implied or granted to any third party. For sales and contact information please visit www.psemi.com.