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- PDF pages: 8
Technical content
Features
Low power consumption RoHS Compliant Black Surface, White Segment Easy mounting on PCB or socket Mechanical Dimensions Notes: 1. Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] unless otherwise noted. 2. Bending ≤ Length*1% 4. Specifications subject to change without notice
www.p-tec.net 041014 Rev0 MS Page 2 of 8 Device Selection Guide Model Number Chip Description Material Emitting Color Common Anode PDC80-CADW01 InGaN Super Bright White Absolute Maximum Ratings at Ta=25Ԩ Parameter Symbol Rating Unit Power Dissipation per Dice P AD 114 mW Derating Liner from 25Ԩ per Dice -- 0.4 mA/Ԩ Continuous Forward Current Per Dice I AF 30 mA Peak Current Per Dice (duty cycle 1/10, 1KHz) I PF 100 mA Reverse Voltage Per Dice VR 5 V Electrostatic Discharge (HBM) ESD 1500 V Operating Temperature Topr -35~+85 Ԩ Storage Temperature Tstg -35~+85 Ԩ Solder Conditions: 1/16 inch below seating plane for 3 seconds at 260Ԩ. Electrical and Optical Characteristics at Ta=25Ԩ Note: Chromaticity Coordinate Tolerance: ±0.01 Luminous General lv Bin Grade (IF=20mA) U V W X Y 70.881 92.145 92.146 119.790 119.791 155.729 155.730 202.449 202.450 263.184 Note: Unit=mcd Tolerance: ±20% Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage Per Segment VF -- 3.2 3.8 V IF=20mA Luminous Intensity Per Segment Iv 70 137 -- mcd IF=10mA Chromaticity Coordinates X -- 0.27 -- -- Y -- 0.25 -- -- Reverse Current I R -- -- 1000 μA VR=5V Luminous Intensity Matching Ratio Iv-m -- -- 2:1 -- IF=10mA
www.p-tec.net 041014 Rev0 MS Page 3 of 8 Color Rank Limits (IF=10mA)
www.p-tec.net 041014 Rev0 MS Page 4 of 8 All Light-On Segments Feature & Pad Position Internal Circuit Diagram
www.p-tec.net 041014 Rev0 MS Page 5 of 8 Typical Electrical / Optical Characteristic Curves (Ta = 25Ԩ Unless Otherwise Noted)
www.p-tec.net 041014 Rev0 MS Page 6 of 8 Precautions for Use 1. Recommended soldering conditions a. Wave soldering 2. Soldering Iron: a. Basic SPEC. is ≦5sec. When 260℃. If temperature is higher, time should be shorter (+10℃→ - 1sec.). Power dissipation of iron should be smaller than 15W, and temperature should be controllable. Surface temperature of the device should be under 230℃.
www.p-tec.net 041014 Rev0 MS Page 7 of 8 Packing Dimensions
www.p-tec.net 041014 Rev0 MS Page 8 of 8 Record Of Revisions Rev. Comments Date
0 Released spec 04/10/14
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