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Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 7
Technical content
Features
- Low power consumption
- RoHS Compliant
- Gray Face, White Segments, Film Overlay
- Easy mounting on PCB
- JEDEC MSL2a Mechanica l Dimensions Notes: Dimensions in millimeters [inch], and tolerance is ±0.25 [.010] unless otherwise noted. 2. Bending ≤ Length*1% 3. Specifications subject to change without notice PIN film 0.2mm
www.p-tec.net 020518 Rev0 MS Page 2 of 7 Devi ce Selection Guide Model Number Chip Note Material Emitting Color Common Cathode PDC202SM-CCDIB01 InGaN Ice Blue Absolute Maximum Ratings at Ta=25℃ Parameter Symbol Rating Unit Power Dissipation per Dice PAD 114 mW Derating Liner from 25℃ per Dice -- 0.4 mA/℃ Continuous Forward Current Per Dice IAF 30 mA Peak Current Per Dice (duty cycle 1/10, 1KHz) IPF 100 mA Reverse Voltage Per Dice VR 5 V Electrostatic Discharge (HBM) ESD 1000 V Operating Temperature Topr -40~+105 ℃ Storage Temperature Tstg -40~+105 ℃ Hand Soldering Temp Tsol 350 ℃ Electrical and Optical Characteristics at Ta=25℃ Luminous General lv Bin Grade (IF=5mA) Parameter Symbol Min. Typ. Max. Unit Condition Forward Voltage Per Segment VF -- 2.7 3.1 V IF=5mA Luminous Intensity Per Segment Iv -- 12 -- mcd IF=5mA Chromaticity Coordinates According to CIE1931 Reverse Current IR -- -- 50 μA VR=5V Luminous Intensity Matching Ratio Iv-m -- -- 2:1 -- IF=5mA 0.155 0.248 A 0.249 0.398 B 0.399 0.639 C 0.640 1.024 D 1.025 1.640 E 1.641 2.626 F 2.627 4.203 G 4.204 6.726 H 6.727 10.763 J 10.764 17.223 K 17.224 27.558 L 27.559 44.095 M 44.096 70.554 N 70.555 112.888 P 112.889 180.622 Q 180.622 288.996 R 288.997 462.396 S 462.397 739.835 T 739.836 1183.737 U 1183.738 1893.981 V 1893.982 3030.371 W 3030.372 4848.596 X 4848.597 7757.755 Y 7757.756 12412.409 4034.034 19859.857 19859.858 31775.772 31775.773 50841.237 50841.238 81345.981 81345.982 130153.572 130153.573 208245.717 208245.718 333193.148 333193.149 533109.039
www.p-tec.net 020518 Rev0 MS Page 3 of 7 All L ight-On Segments Feature & Pad Position Internal Circuit Diagram A B C D E G F DP Dig 1 Dig 2 Film Diagram
www.p-tec.net 020518 Rev0 MS Page 4 of 7 Ty pical Electrical / Optical Characteristic Curves
- (Ta = 25℃ Unless Otherwise Noted)
www.p-tec.net 020518 Rev0 MS Page 5 of 7 Sold ering Characteristics 1. IR-Reflow Soldering Profile (PB Free) 2. Hand Soldering (Iron Condition) a. Soldering Iron: 30W Max b. Temperature 350℃ Max c. Soldering Time: 3 Seconds Max (One Time) d. Distance: 1.6mm min (From seating plane)
www.p-tec.net 020518 Rev0 MS Page 6 of 7 Soldering Pad Size Reel & Packaging Dimensions Package Name Size Unit Amount Unit Amount Unit Note Reel Ø330 mm 1 Reel 1000 pcs / Bag L450xW430 mm 1 Reel 1000 pcs / Outer Box L430xW330xH270 mm 5 Bag 5000 pcs / P/N: PDC202SM-XXXXXX MSST: 430X330X270mm N.W: KGS Q\`TY PCS G.W: KGS MADE IN CHINA TRAY DATE CODE:
www.p-tec.net 020518 Rev0 MS Page 7 of 7 PDC 202SM-CCDIB01 Customer Approval Signatures Approved By Notes/Remarks Record Of Revisions Rev. Comments Page Date