PBSS2515VPN NEXPERIA | Alldatasheet

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Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

Supersedes data of 2001 Nov 07

2005 Jan 11

15 V low VCE(sat) NPN/PNP

2005 Jan 11 2

NXP Semiconductors Product data sheet

15 V low VCE(sat) NPN/PNP transistor PBSS2515VPN

FEATURES

  • 300 mW total power dissipation
  • Very small 1.6 × 1.2 mm ultra thin package
  • Excellent coplanarity due to straight leads
  • Low collector-emitter saturation voltage
  • High current capability
  • Improved thermal behaviour due to flat lead
  • Replaces two SC75/SC89 packaged low VCEsat transistors on same PCB area
  • Reduces required PCB area
  • Reduced pick and place costs. APPLICATION
  • General purpose switching and muting
  • Low frequency driver circuits
  • LCD backlighting
  • Audio frequency general purpose amplifier applications
  • Battery driven equipment (mobile phones, video cameras and hand-held devices).

DESCRIPTION

NPN/PNP low VCEsat transistor pair in a SOT666 plastic package. MARKING QUICK REFERENCE DATA PINNING TYPE NUMBER MARKING CODE PBSS2515VPN N8 SYMBOL PARAMETER MAX. UNIT VCEO collector-emitter voltage 15 V ICM peak collector current 1 A RCEsat equivalent on-resistance <500 mΩ PIN DESCRIPTION 1, 4 emitter TR1; TR2 2, 5 base TR1; TR2 6, 3 collector TR1; TR2 handbook, halfpage MAM443 13 2 TR1 TR2 6 45 123 46 5 Top view Fig.1 Simplified outline (SOT666) and symbol.

ORDERING INFORMATION

PBSS2515VPN − plastic surface mounted package; 6 leads SOT666

2005 Jan 11 3

NXP Semiconductors Product data sheet In accordance with the Absolute Maximum Rating System (IEC 60134). Note 1. Transistor mounted on an FR4 printed-circuit board. THERMAL CHARACTERISTICS Notes 1. Transistor mounted on an FR4 printed-circuit board. 2. The only recommended soldering method is reflow soldering. SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT Per transistor; for the PNP transistor with negative polarity VCBO collector-base voltage open emitter − 15 V VCEO collector-emitter voltage open base − 15 V VEBO emitter-base voltage open collector − 6 V IC collector current (DC) − 500 mA ICM peak collector current − 1 A IBM peak base current − 100 mA Ptot total power dissipation Tamb ≤ 25 °C; note 1 − 200 mW Tstg storage temperature −65 +150 °C Tj junction temperature − 150 °C Tamb operating ambient temperature −65 +150 °C Per device Ptot total power dissipation Tamb ≤ 25 °C; note 1 − 300 mW SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient notes 1 and 2 416 K/W

2005 Jan 11 4

NXP Semiconductors Product data sheet Tamb = 25 °C unless otherwise specified. Note 1. Pulse test: t p ≤ 300 μs; δ ≤ 0.02. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Per transistor; for the PNP transistor with negative polarity ICBO collector-base cut-off current VCB = 15 V; IE = 0 A − − 100 nA VCB = 15 V; IE = 0 A; Tj = 150 °C − − 50 μA IEBO emitter-base cut-off current VEB = 5 V; IC = 0 A − − 100 nA hFE DC current gain VCE = 2 V; IC = 10 mA 200 − − VCE = 2 V; IC = 100 mA; note 1 150 − − VCE = 2 V; IC = 500 mA; note 1 90 − − VCEsat collector-emitter saturation voltage IC = 10 mA; IB = 0.5 mA − − 25 mV IC = 200 mA; IB = 10 mA − − 150 mV IC = 500 mA; IB = 50 mA; note 1 − − 250 mV RCEsat equivalent on-resistance IC = 500 mA; IB = 50 mA; note 1 − 300 <500 mΩ VBEsat base-emitter saturation voltage IC = 500 mA; IB = 50 mA; note 1 − − 1.1 V VBE base-emitter turn-on voltage VCE = 2 V; IC = 100 mA; note 1 − − 0.9 V NPN transistor fT transition frequency IC = 100 mA; VCE = 5 V; f = 100 MHz 250 420 − MHz Cc collector capacitance VCB = 10 V; IE = Ie = 0 A; f = 1MHz − 4.4 6 pF PNP transistor fT transition frequency IC = −100 mA; VCE = −5 V; f = 100 MHz 100 280 − MHz Cc collector capacitance VCB = −10 V; IE = Ie = 0 A; f = 1MHz − − 10 pF

2005 Jan 11 5

NXP Semiconductors Product data sheet handbook, halfpage 400 600 200 MLD643 10−1 11 0 IC (mA) hFE 102 103 (2) (1) (3) Fig.2 DC current gain as a function of collector current; typical values. TR1 (NPN) VCE = 2 V. (1) T amb = 150 °C. (2) T amb = 25 °C. (3) T amb = −55 °C. handbook, halfpage 200 1200 400 600 800 1000 MLD645 110−1 IC (mA) VBE (mV) 10 10 2 103 (1) (3) (2) Fig.3 Base-emitter voltage as a function of collector current; typical values. TR1 (NPN) VCE = 2 V. (1) T amb = −55 °C. (2) T amb = 25 °C. (3) T amb = 150 °C. handbook, halfpage 103 102 MLD647 10−1 11 0 IC (mA) VCEsat (mV) 102 103 (1) (3) (2) Fig.4 Collector-emitter saturation voltage as a function of collector current; typical values. TR1 (NPN) IC/IB = 20. (1) T amb = 150 °C. (2) T amb = 25 °C. (3) T amb = −55 °C. handbook, halfpage 200 1200 400 600 800 1000 MLD646 110−1 IC (mA) VBEsat (mV) 10 10 2 103 (2) (3) (1) Fig.5 Base-emitter saturation voltage as a function of collector current; typical values. TR1 (NPN) IC/IB = 20. (1) T amb = 150 °C. (2) T amb = 25 °C. (3) T amb = −55 °C.

2005 Jan 11 6

NXP Semiconductors Product data sheet handbook, halfpage 102 10−1 MLD648 10−1 11 0 IC (mA) RCEsat (Ω) 102 103 (2) (1) (3) Fig.6 Equivalent on-resistance as a function of collector current; typical values. TR1 (NPN) IC/IB = 20. (1) T amb = 150 °C. (2) T amb = 25 °C. (3) T amb = −55 °C. handbook, halfpage (1)(2)(3)(4) (6) (8) IC (mA) VCE (V) 1200 800 400 21 0 468 MLD644 (9) (10) (7) (5) Fig.7 Collector current as a function of collector-emitter voltage; typical values. (1) I B = 4.6 mA. (2) I B = 4.14 mA. (3) I B = 3.68 mA. (4) I B = 3.22 mA. (5) I B = 2.76 mA. (6) I B = 2.3 mA. (7) I B = 1.84 mA. (8) I B = 1.38 mA. (9) I B = 0.92 mA. (10) IB = 0.46 mA. TR1 (NPN) Tamb = 25 °C.

2005 Jan 11 7

NXP Semiconductors Product data sheet handbook, halfpage 400 600 200 MLD649 −10−1 −1 −10 IC (mA) hFE −102 −103 (2) (1) (3) Fig.8 DC current gain as a function of collector current; typical values. TR2 (PNP) VCE = −2 V. (1) T amb = 150 °C. (2) T amb = 25 °C. (3) T amb = −55 °C. handbook, halfpage −200 −1200 −400 −600 −800 −1000 MLD651 −1−10−1 IC (mA) VBE (mV) −10 −102 −103 (1) (3) (2) Fig.9 Base-emitter voltage as a function of collector current; typical values. TR2 (PNP) VCE = −2 V. (1) T amb = −55 °C. (2) T amb = 25 °C. (3) T amb = 150 °C. handbook, halfpage −103 −102 −10 MLD653 −10−1 −1 −10 IC (mA) VCEsat (mV) −102 −103 (1)(2) (3) Fig.10 Collector-emitter saturation voltage as a function of collector current; typical values. TR2 (PNP) IC/IB = 20. (1) T amb = 150 °C. (2) T amb = 25 °C. (3) T amb = −55 °C. handbook, halfpage −200 −1200 −400 −600 −800 −1000 MLD652 −1−10−1 IC (mA) VBEsat (mV) −10 −102 −103 (2) (3) (1) Fig.11 Base-emitter saturation voltage as a function of collector current; typical values. TR2 (PNP) IC/IB = 20. (1) T amb = 150 °C. (2) T amb = 25 °C. (3) T amb = −55 °C.

2005 Jan 11 8

NXP Semiconductors Product data sheet handbook, halfpage 103 102 10−1 MLD654 −10−1 −1 −10 IC (mA) RCEsat (Ω) −102 −103 (1) (3)(2) Fig.12 Equivalent on-resistance as a function of collector current; typical values. TR2 (PNP) IC/IB = 20. (1) T amb = 150 °C. (2) T amb = 25 °C. (3) T amb = −55 °C. handbook, halfpage (1)(2)(3)(4) (5) (6) (7) (8) (10) IC (mA) VCE (V) −1200 −800 −400 MLD650 (9) Fig.13 Collector current as a function of collector-emitter voltage; typical values. (1) I B = −7 mA. (2) I B = −6.3 mA. (3) I B = −5.6 mA. (4) I B = −4.9 mA. (5) I B = −4.2 mA. (6) I B = −3.5 mA. (7) I B = −2.8 mA. (8) I B = −2.1 mA. (9) I B = −1.4 mA. (10) IB = −0.7 mA. TR2 (PNP) Tamb = 25 °C.

2005 Jan 11 9

NXP Semiconductors Product data sheet mm 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 0.5 e 1.0 1.7 1.5 0.1 y 0.1 DIMENSIONS (mm are the original dimensions) 0.3 0.1 SOT666 bp pin 1 index D e A Lp detail X HE EA S 0 1 2 mm scale A 0.6 0.5 c X 123 456 Plastic surface-mounted package; 6 leads SOT66 6 YS w M A

2005 Jan 11 10

NXP Semiconductors Product data sheet

  1. Please consult the most recently issued document before initiating or completing a design. 2. The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. DOCUMENT STATUS(1) PRODUCT STATUS(2) DEFINITION Objective data sheet Development This document contains data from the objective specification for product development. Preliminary data sheet Qualification This document contains data from the preliminary specification. Product data sheet Production This document contains the product specification. DISCLAIMERS General ⎯ Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes ⎯ NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use ⎯ NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications ⎯ Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values ⎯ Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale ⎯ NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license ⎯ Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control ⎯ This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data ⎯ The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

For additional information please visit: http://www.nxp.com For sales offices addresses send e-mail to: salesaddresses@nxp.com © NXP B.V. 2009 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. Printed in The Netherlands R75/03/pp11 Date of release: 2005 Jan 11 Document order number: 9397 750 14429