PBLS1504Y NEXPERIA | Alldatasheet

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Technical content

Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia

1.1 General description

Low VCEsat PNP transistor and NPN resistor-equipped transistor in one package.

1.2 Features

1.3 Applications

1.4 Quick reference data

15 V PNP BISS loadswitch

Table 1. Product overview Table 2. Quick reference data

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Table 2. Quick reference data …continued Table 3. Discrete pinning

4 GND (emitter) TR2

Table 4. Ordering information Table 5. Marking codes

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. [1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. [1] Device mounted on a FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Table 7. Thermal characteristics

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Table 8. Characteristics

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 25 August 2009 5 of 14 NXP Semiconductors PBLS1504Y; PBLS1504V VCE =−2 V (1) Tamb = 150°C (2) Tamb =2 5°C (3) Tamb = −55 °C IC /IB =2 0 (1) Tamb = 150°C (2) Tamb =2 5°C (3) Tamb = −55 °C Fig 1. TR1(PNP): DC current gain as a function of collector current; typical values Fig 2. TR1(PNP): Collector-emitter saturation voltage as a function of collector current; typical values VCE =−2 V (1) Tamb = −55 °C (2) Tamb =2 5°C (3) Tamb = 150°C IC /IB =2 0 (1) Tamb = 150°C (2) Tamb =2 5°C (3) Tamb = −55 °C Fig 3. TR1(PNP): Base-emitter voltage as a function of collector current; typical values Fig 4. TR1(PNP): Base-emitter saturation voltage as a function of collector current; typical values 001aaa181 IC (mA) 200 400 600 h FE (1) (2) (3) 001aaa185 −102 −10 −103 VCEsat (mV) IC (mA) (1) (2) (3) 001aaa183 −500 −700 −300 −900 −1100 VBE (mV) −100 IC (mA) (1) (3) (2) 001aaa184 −600 −800 −400 −1000 −1200 VBEsat (mV) −200 IC (mA) (1) (2) (3)

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 25 August 2009 6 of 14 NXP Semiconductors PBLS1504Y; PBLS1504V Tamb = 25°C (1) IB =− 7.0 mA (2) IB =− 6.3 mA (3) IB =− 5.6 mA (4) IB =− 4.9 mA (5) IB =− 4.2 mA (6) IB =− 3.5 mA (7) IB =− 2.8 mA (8) IB =− 2.1 mA (9) IB =− 1.4 mA (10) IB =− 0.7 mA IC /IB = 20 (1) Tamb =−55 °C (2) Tamb =2 5°C (3) Tamb = 150°C Fig 5. TR1(PNP): Collector current as a function of collector-emitter voltage; typical values Fig 6. TR1(PNP): Equivalent on-resistance as a function of collector current; typical values VCE (V) 001aaa182 −400 −800 −1200 IC (mA) (1) (2) (3) (4) (6) (9) (8) (10) (7) (5) 001aaa186 IC (mA) 102 103 R CEsat (Ω ) 10−1 (2) (3) (1)

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 25 August 2009 7 of 14 NXP Semiconductors PBLS1504Y; PBLS1504V Tamb = 25°C (1) IC /IB = 100 (2) IC /IB = 50 (3) IC /IB = 10 Tamb = 25°C (1) IC /IB = 100 (2) IC /IB = 50 (3) IC /IB = 10 Fig 7. TR1(PNP): Collector-emitter saturation voltage as a function of collector current; typical values Fig 8. TR1(PNP): Equivalent-on resistance as a function of collector current; typical values 006aaa004 -10-1 -10-2 VCEsat (V) -10-3 IC (mA) (1) (2) (3) 006aaa005 IC (mA) 102 103 R CEsat (W ) 10-1 (1) (2) (3)

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 25 August 2009 8 of 14 NXP Semiconductors PBLS1504Y; PBLS1504V VCE =5V (1) Tamb = 150°C (2) Tamb =2 5°C (3) Tamb = −40 °C IC /IB = 20 (1) Tamb = 100°C (2) Tamb =2 5°C (3) Tamb = −40 °C Fig 9. TR2(NPN): DC current gain as a function of collector current; typical values Fig 10. TR2(NPN): Collector-emitter saturation voltage as a function of collector current; typical values VCE = 0.3 V (1) Tamb = −40 °C (2) Tamb =2 5°C (3) Tamb = 100°C VCE =5V (1) Tamb = −40 °C (2) Tamb =2 5°C (3) Tamb = 100°C Fig 11. TR2(NPN): On-state input voltage as a function of collector current; typical values Fig 12. TR2(NPN): Off-state input voltage as a function of collector current; typical values IC (mA) 10-1 102101 006aaa038 102 103 hFE (1) (2) (3) 006aaa039 IC (mA) 11 0 210 10-1 VCEsat (V) 10-2 (1) (2) (3) 006aaa040 IC (mA) 10−1 102101 VI(on) (V) 10−1 (1) (2) (3) 006aaa041 IC (mA) 10−2 101110−1 VI(off) (V) 10−1 (1) (3) (2)

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 25 August 2009 9 of 14 NXP Semiconductors PBLS1504Y; PBLS1504V

  1. Package outline Fig 13. Package outline SOT363 (SC-88) REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA SOT363 SC-88 wB Mbp D e pin 1 index A Lp Q detail X H E E v M A AB y 0 1 2 mm scale c X 13 2 456 Plastic surface-mounted package; 6 leads SOT363 UNIT A 1 max bp cD E e1 H E Lp Qy wv mm 0.1 0.30 0.20 2.2 1.8 0.25 0.10 1.35 1.15 0.65 e 1.3 2.2 2.0 0.2 0.10.2 DIMENSIONS (mm are the original dimensions) 0.45 0.15 0.25 0.15 A 1.1 0.8 04-11-08 06-03-16

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 25 August 2009 10 of 14 NXP Semiconductors PBLS1504Y; PBLS1504V Fig 14. Package outline SOT666 UNIT b p cD E e1 H E Lp w REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE 04-11-08 06-03-16 IEC JEDEC JEITA mm 0.27 0.17 0.18 0.08 1.7 1.5 1.3 1.1 0.5 e 1.0 1.7 1.5 0.1 y 0.1 DIMENSIONS (mm are the original dimensions) 0.3 0.1 SOT666 bp pin 1 index D e A Lp detail X H E EA S 0 1 2 mm scale A 0.6 0.5 c X 123 456 Plastic surface-mounted package; 6 leads SOT666 YS w M A

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. [1] For further information and the availability of packing methods, seeSection12. Table 9. Packing methods

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Table 10. Revision history

  • This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content.
  • Table 3 “Discrete pinning”: amended
  • Figure 13 “Package outline SOT363 (SC-88)”: updated
  • Figure 14 “Package outline SOT666”: updated PBLS1504Y_PBLS1504V_2 20041125 Product data sheet - PBLS1504V_1 PBLS1504V_1 20031107 Product specification - -

PBLS1504Y_PBLS1504V_3 © NXP B.V. 2009. All rights reserved. Product data sheet Rev. 03 — 25 August 2009 13 of 14 NXP Semiconductors PBLS1504Y; PBLS1504V

  1. Legal information

11.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

11.2 Definitions

Draft —The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet —A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.

11.3 Disclaimers

General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes —NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use —NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications —Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values —Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale —NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license —Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control —This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Quick reference data —The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding.

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 12. Contact information For more information, please visit:http://www.nxp.com For sales office addresses, please send an email to:salesaddresses@nxp.com Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification.

NXP Semiconductors PBLS1504Y; PBLS1504V © NXP B.V. 2009. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 August 2009 Document identifier: PBLS1504Y_PBLS1504V_3 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. 13. Contents