PBHV8540X NEXPERIA | Alldatasheet
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Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. use http://www.nexperia.com salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e -mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia
5 December 2013 Product data sheet
(SC-62) medium power and flat lead Surface-Mounted Device (SMD) plastic package.
- High voltage
- Low collector-emitter saturation voltage VCEsat
- High collector current capability IC and ICM
- High collector current gain hFE at high IC
- AEC-Q101 qualified 3. Applications
- LED driver for LED chain module
- LCD backlighting
- Automotive motor management
- Hook switch for wired telecom
- Switch Mode Power Supply (SMPS) 4. Quick reference data
Table 1. Quick reference data
Table 2. Pinning information
1 E emitter
2 C collector
3 B base
Table 3. Ordering information Table 4. Marking codes Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2. Table 6. Thermal characteristics [1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 6 cm2.
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 4 / 14 006aab847 102 103 Zth(j-a) (K/W) 10- 1 10- 5 1010- 210- 4 10210- 1 tp (s) 10- 3 1031 duty cycle = 1 0.01 0.02 0.05 0.1 0.2 0.33 0.50.75 FR4 PCB, standard footprint Fig. 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values 006aab848 102 103 Zth(j-a) (K/W) 10- 1 10- 5 1010- 210- 4 10210- 1 tp (s) 10- 3 1031 duty cycle = 1 0.75 0.5 0.33 0.2 0.1 0.05 0.02 0.010 FR4 PCB, mounting pad for collector 6 cm2 Fig. 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
Table 7. Characteristics
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 6 / 14 006aab174 200 100 300 400 hFE IC (mA) 10- 1 1031021 10 (1) (2) (3) VCE = 10 V (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = -55 °C Fig. 4. DC current gain as a function of collector current; typical values 006aab175 VCE (V) 0 542 31 0.4 0.6 0.2 0.8 1.0 IC (A) IB (mA) = 175 140 105 Tamb = 25 °C Fig. 5. Collector current as a function of collector- emitter voltage; typical values 006aab176 0.8 0.4 1.2 1.6 VBE (V) IC (mA) 10- 1 1041031 10210 (1) (2) (3) VCE = 10 V (1) Tamb = -55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Fig. 6. Base-emitter voltage as a function of collector current; typical values 006aab177 0.5 0.9 1.3 VBEsat (V) 0.1 IC (mA) 10- 1 1041031 10210 (1) (2) (3) IC/IB = 5 (1) Tamb = -55 °C (2) Tamb = 25 °C (3) Tamb = 100 °C Fig. 7. Base-emitter saturation voltage as a function of collector current; typical values
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 7 / 14 006aab178 10- 1 VCEsat (V) 10- 2 IC (mA) 10- 1 1031021 10 (1) (2) (3) IC/IB = 5 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = -55 °C Fig. 8. Collector-emitter saturation voltage as a function of collector current; typical values 006aab179 10- 1 VCEsat (V) 10- 2 IC (mA) 10- 1 1031021 10 (1) (2) (3) Tamb = 25 °C (1) IC/IB = 20 (2) IC/IB = 10 (3) IC/IB = 5 Fig. 9. Collector-emitter saturation voltage as a function of collector current; typical values 006aab180 IC (mA) 10- 1 1031021 10 102 103 RCEsat (Ω) 10- 1 (1) (2) (3) IC/IB = 5 (1) Tamb = 100 °C (2) Tamb = 25 °C (3) Tamb = -55 °C Fig. 10. Collector-emitter saturation resistance as a function of collector current; typical values 006aab181 IC (mA) 10- 1 1031021 10 102 103 RCEsat (Ω) 10- 1 (2) (3)(1) Tamb = 25 °C (1) IC/IB = 20 (2) IC/IB = 10 (3) IC/IB = 5 Fig. 11. Collector-emitter saturation resistance as a function of collector current; typical values
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 8 / 14 11. Test information 006aaa003 IBon (100 %) IB input pulse (idealized waveform) IBoff 90 % 10 % IC (100 %) IC td ton 90 % 10 % tr output pulse (idealized waveform) tf t ts toff Fig. 12. BISS transistor switching time definition RC DUT mlb826 Vo RB (probe) 450 Ω (probe) 450 Ωoscilloscope oscilloscope VBB VI VCC Fig. 13. Test circuit for switching times
11.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications.
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 9 / 14 12. Package outline REFERENCESOUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA DIMENSIONS (mm are the original dimensions) SOT89 TO-243 SC-62 06-03-16 06-08-29 w M e E HE B B 0 2 4 mm scale bp3 bp2 bp1 c D Lp A Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads SOT89 1 2 3 UNIT A mm 1.6 1.4 0.48 0.35 c 0.44 0.23 D 4.6 4.4 E 2.6 2.4 HE Lp 4.25 3.75 e 3.0 w 0.13 1.5 1.2 0.8 bp2bp1 0.53 0.40 bp3 1.8 1.4 Fig. 14. Package outline SOT89
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 10 / 14 13. Soldering solder lands solder resist occupied area solder paste sot089_fr 1.2 1.9 2.25 4.75 (3×) 0.7 (3×) 0.6 (3×) 1.1 (2×) 1.2 0.85 0.2 0.5 1.7 4.85 3.95 4.6 1.51.5 Dimensions in mm Fig. 15. Reflow soldering footprint for SOT89 solder lands solder resist occupied area preferred transport direction during soldering sot089_fw 0.7 5.3 6.6 2.4 3.5 0.5 1.8 (2×) 1.5 (2×) 7.6 1.9 1.9 Dimensions in mm Fig. 16. Wave soldering footprint for SOT89
Table 8. Revision history
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 12 / 14 15. Legal information
15.1 Data sheet status
status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Preview — The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer.
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 13 / 14 No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V. HD Radio and HD Radio logo — are trademarks of iBiquity Digital Corporation.
NXP Semiconductors PBHV8540X 500 V, 0.5 A NPN high-voltage low VCEsat (BISS) transistor PBHV8540X All information provided in this document is subject to legal disclaimers. © NXP N.V. 2013. All rights reserved Product data sheet 5 December 2013 14 / 14 16. Contents © NXP N.V. 2013. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 5 December 2013