PAN9320 PANASONIC | Alldatasheet
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Technical content
Fully Embedded Stand-Alone Wi-Fi Module Product Specification Rev. 1.3 Wireless Modules
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 2 Overview The PAN9320 is a 2.4 GHz ISM band Wi-Fi-embedded module which includes a wireless radio and an MCU for easy integration of Wi-Fi connectivity into various electronic devices.
Features
- Fully embedded: integrated full-featured network stack
- Contains all necessary IoT functionality (Place & Play)
- Integrated webserver with AJAX/JSON for web
applications
- No stack or software implementation needed on a host MCU
- Simultaneous support of Access-Point & Infra- structure mode
- Fully automatical IP configuration
- DHCP server offers IP configuration in AP mode
- Access by names (http:/ /yourdevice)
- Integrated TCP/IP network stack: IPv4, ARP, and AutoIP
- Supports TLS/SSL, https, and Wi-Fi security (WPA2) for secure data connection
- Over-the-Air firmware update
- Two UART interfaces (command and transparent data)
- Integrated QSPI flash memory for customer web contents and configuration file (externally extendable with additional 2 MByte)
- Coexistence interface for external co-located 2.4 GHz radios (e. g. Bluetooth)
- Programming via standard JTAG
- Evaluation Kit with pre-installed web application for quick prototyping available
- Evaluation and development tool WiFigurator for Windows
- Getting started tutorials, PC tool, quickstart guide
- Wide temperature range of -30 °C to 70 °C
- FCC-/IC-/CE-certified Characteristics
- Surface Mount Type (SMT) 29.0 mm x 13.5 mm x 2.66 mm
- Marvell® 88W8782 WLAN System-on-Chip (SoC) and 88MC200 (MCU) inside
- Tx power up to +18 dBm @ IEEE 802.11b
- Rx sensitivity of -98 dBm @ IEEE 802.11b DSSS 1 Mbps
- 40 MHz channels up to 150 Mbps
- Power supply 3.0 to 3.6 V
- Current consumption 430 mA (Tx @ 11b,
11 Mbps) and 145 mA Rx
- Low power mode available Block Diagram Chip Antenna88MC200 MCU QSPI Flash
16 MbitReset/PD
UART0 (Cmd) UART1 (Data) Status LEDs GPIOs MCU Ready Factory Reset QSPI (Flash) Vcc 3.3 V LPF PAN9320 Fully Embedded Wi-Fi Module IEEE 802.11 b/g/n Crystal
32 MHz
40 MHz
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 3 By purchase of any of the products described in this document the customer accepts the document's validity and declares their agreement and understanding of its contents and recommendations. Panasonic reserves the right to make changes as required at any time without notification. Please consult the most recently issued Product Specification before initiating or completing a design. © Panasonic Industrial Devices Europe GmbH 2017. This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do not disclose it to a third party. All rights reserved. This Product Specification does not lodge the claim to be complete and free of mistakes. Engineering Samples (ES) If Engineering Samples are delivered to the customer, these samples have the status “Engineering Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and they may differ from the published Product Specification. Engineering Samples are not qualified and they are not to be used for reliability testing or series production. Disclaimer The customer acknowledges that samples may deviate from the Product Specification and may bear defects due to their status of development and the lack of qualification mentioned above. Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic disclaims liability for damages caused by: The use of the Engineering Sample other than for evaluation purposes, particularly the installation or integration in another product to be sold by the customer, Deviation or lapse in function of the Engineering Sample, Improper use of the Engineering Sample. Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental damages. In case of any queries regarding the Engineering Samples, please contact your local sales partner or the related product manager.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 4 Table of Contents
PAN9320 Wi-Fi Module
1 About This Document
Product Specification Rev. 1.3 Page 5
1.1 Purpose and Audience
This Product Specification provides details on the functional, operational, and electrical characteristics of the Panasonic PAN9310 and PAN9320 modules. It is intended for hardware design, application, and Original Equipment Manufacturers (OEM) engineers. The product is referred to as “the PAN9320” or “the module” within this document.
1.2 Revision History
Revision Date Modifications/Remarks 0.1 22.04.2015 1st preliminary version 1.0 26.11.2015 Panasonic code edited by adding model ENW49A02x3EF Information edited in the following chapters: 1.4 Related Documents,
2.1 Key Features, 7 WLAN Overview, 2 Overview, 10 Detailed
Description, 3.6 General Features, 2.1 Block Diagram, 4.3.7 Host Interface Specification, 4.5 RF Electrical Characteristics, 3.1 Dimensions, 3.2 Footprint, 3.4 Case Marking, and 7.1 Ordering Information Chapters added: 2.4 Peripheral Bus Interface, 4.3.4 Power Up Sequence, 4.3.5 Firmware-Related Timing, 29 Software Versions, and 5.4 Regulatory Information 1.2 09.06.2017 New document structure and layout Chapters removed: Data Sheet Status, Wireless Local Area Network Overview, Key Parts List, General Features, Software Versions 1.3 XX.XX.XXXX European Conformity (according to RED) information edited Firmware description added
1.3 Use of Symbols
Indicates important information for the proper use of the product. Non-observance can lead to errors. Attention Indicates important notes that, if not observed, can put the product’s functionality at risk. [chapter number] [chapter title] Cross reference Indicates cross references within the document. Example: Description of the symbols used in this document 1.3 Use of Symbols.
1.4 Related Documents
Please refer to the Panasonic website for related documents 7.2.2 Product Information.
PAN9320 Wi-Fi Module
2 Overview
Product Specification Rev. 1.3 Page 6 The PAN9320 is a 2.4 GHz 802.11 b/g/n embedded Wi-Fi module with integrated stack and API that minimizes firmware development and includes a full security suite. The module is specifically designed for highly integrated and cost-effective applications. The module includes a fully shielded case, integrated crystal oscillators, and a chip antenna. The module combines a high-performance CPU, high sensitivity wireless radio, baseband processor, medium access controller, encryption unit, boot ROM with patching capability, internal SRAM, and in-system programmable flash memory. The module’s integrated memory is available to the application for storing web content such as HTML pages or image data. Parallel support of access point and infrastructure mode allows easy setup of simultaneous Wi-Fi connections from the module to smart devices and home network routers. The pre-programmed Wi-Fi SoC firmware enables client (STA) and micro access point (µAP) applications. With the transparent mode, raw data can be sent from the UART to the air interface to smart devices, web servers, or PC applications. The PAN9320 supports Over-the-Air firmware updates. In order to make use of this feature, the customer needs to ensure that the appropriate preconditions are fulfilled and that a suitable environment is provided, particularly with regard to:
- Module configuration
- Utilization of the related module interface commands
- Server infrastructure and application Please refer to the Panasonic website for related documents 7.2.2 Product Information. Further information on the variants and versions 7.1 Ordering Information.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 7
2.1 Block Diagram
UART0 (Cmd) UART1 (Data) Status LEDs GPIOs MCU Ready Factory Reset QSPI (Flash) Vcc 3.3 V LPF PAN9320 Fully Embedded Wi-Fi Module IEEE 802.11 b/g/n Crystal
16 Mbit
UART0 (Cmd) UART1 (Data) Status LEDs GPIOs MCU Ready Factory Reset QSPI (Flash) Vcc 3.3 V WAKE UP1 PAN9310 Fully Embedded Wi-Fi Module IEEE 802.11 b/g/n
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 8
2.2 Pin Configuration
No Pin Name Pin Type Description
1 GND Ground Pin Connect to ground
2 GPIO441 Digital I/O Digital I/O #44
3 GPIO451 Digital I/O Digital I/O #45
4 USB AVDD 33 Power Do not connect, for internal purposes only
5 NC NC Do not connect
6 NC NC Do not connect
7 3.3 V Power 3.0 V-3.6 V power supply connection (typical 3.3 V) 8 3.3 V Power 3.0 V-3.6 V power supply connection (typical 3.3 V)
9 UART1 CTS Digital In CTSn for UART1 (using hardware flow control)
10 UART1 RTS Digital Out RTSn for UART1 (using hardware flow control)
11 UART1 TXD Digital Out TXD for UART1
12 UART1 RXD Digital In RXD for UART1
13 QSPI CS22 Digital Out Chip select external flash (connect for usage of external QSPI flash
memory)
14 GND Ground Pin Connect to ground
1 All GPIOs are initially set to output with low level
2 Only connect, if using an external QSPI flash memory; otherwise do not connect
2 3 4 5 6 7 8 9 10 11 12 13 14 35 34 33 32 31 30 29 28 27 26 25 24 23 GND THERMO GND THERMO GND THERMO GND THERMO
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 9 No Pin Name Pin Type Description
15 GND Ground Pin Connect to ground
16 NC/RF NC/Analog IO PAN9320: NC
PAN9310: RF in/out over 50 Ω bottom pad
17 GND Ground Pin Connect to ground
18 GND Ground Pin Connect to ground
19 GND Ground Pin Connect to ground
20 GND Ground Pin Connect to ground
21 GND Ground Pin Connect to ground
22 GND Ground Pin Connect to ground
23 GND Ground Pin Connect to ground
24 GND Ground Pin Connect to ground
25 GND Ground Pin Connect to ground
26 W STAT LED Digital Out Connect to LED wireless (Wi-Fi) status, active low
27 UART0 TXD/DUAL STAT Digital Out TXD for UART0/UART1 state (transparent data or command)
28 UART0 RXD/DUAL SW Digital In RXD for UART0/UART1 toggle switch for the control of the state
29 GPIO41 Digital I/O Digital I/O #4
30 GPIO51 Digital I/O Digital I/O #5
31 GPIO61 Digital I/O Digital I/O #6
32 GPIO71 Digital I/O Digital I/O #7
33 STAT LED1 Digital Out Connect to LED MCU status (heartbeat), active low
34 STAT LED2 Digital Out Connect to LED IP connectivity (allocated IP), active low
35 STAT LED3 Digital Out Connect to LED Error (active during booting), active low
36 GND Ground Pin Connect to ground
37 RESETn Digital In Reset MCU, active low (also option for flashing in production
process)
38 WAKE UP0 Digital In Do not connect, for internal purposes only
39 BOOT Digital In Boot option, high level → boot from internal flash memory3
40 GPIO281 Digital I/O Digital I/O #28
41 MCU READY Digital Out Connect to LED MCU ready (booting ready), active high
42 FACTORY RESET Digital In Factory reset (valid after 10 seconds), active high
3 Connect the BOOT pin over a 100 Ohm resistor to VCC
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 10 No Pin Name Pin Type Description A3 NC NC Do not connect A4 NC NC Do not connect A5 NC NC Do not connect B1 NC NC Do not connect B2 BT FREQ Input Signal Information BT using channel which either overlaps Wi-Fi channel or not B3 BT GRANTN Output Signal Indicate permission to transmit, low BT can transmit B4 BT REQ Input Signal BT device request access to medium B5 BT STATE Input Signal Information BT_REQ priority (1- or 2-bit) and direction BT RX/TX C1 NC NC Do not connect C2 NC NC Do not connect C3 WAKE UP14 Digital In Wake up signal for WLAN SoC (Host-to-SoC), active high4 C4 QSPI CLK2 Digital Out Clock for QSPI (connect for usage of external QSPI flash memory) C5 QSPI D32 Digital I/O Data3 for QSPI (connect for usage of external QSPI flash memory) D1 TDI Digital In TDI for JTAG (option for flashing in production process) D2 TRSTn Digital In TRSTn for JTAG (option for flashing in production process) D3 NC NC Do not connect D4 QSPI D02 Digital I/O Data0 for QSPI (connect for usage of external QSPI flash memory) D5 QSPI D12 Digital I/O Data1 for QSPI (connect for usage of external QSPI flash memory) E1 TDO Digital Out TDO for JTAG (option for flashing in production process) E2 TCK Digital Out TCK for JTAG (option for flashing in production process) E3 TMS Digital I/O TMS for JTAG (option for flashing in production process) E4 QSPI D22 Digital I/O Data2 for QSPI (connect for usage of external QSPI flash memory) E5 QSPI CS2 Digital Out Do not connect, for internal purposes only F1 W PDn Digital In Do not connect, for internal purposes only (pull-up resistor internally) F2 W RESETn Input Signal Do not connect, for internal purposes only (pull-up resistor internally) F3 GND Ground Pin Connect to ground F4 GND Ground Pin Connect to ground F5 GND Ground Pin Connect to ground GND THERMO Thermal Pin Connect to ground
4 Connect to HOST MCU (wake up after shut-off mode, active high), use 10 kOhm resistor to GND at pin
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 11 No Pin Name Pin Type Description GND THERMO Thermal Pin Connect to ground GND THERMO Thermal Pin Connect to ground GND THERMO Thermal Pin Connect to ground
2.3 Host Interfaces
- 2-wire data transfer (RX, TX)
- Programmable baud rate (300 bps to 1.5 Mbps)
- Data format (LSB first)
- Data bit: (5-8 bit)
- Parity bit: (0-4 bit)
- Stop bit: (1-2 bit) UART1 Interface
- 4-wire data transfer (RX, TX, RTS, CTS)
- Programmable baud rate (300 bps to 1.5 Mbps)
- Data format (LSB first)
- Data bit: (5-8 bit)
- Parity bit: (0-4 bit)
- Stop bit: (1-2 bit) Further information 4.3.7 Host Interface Specification.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 12
2.4 Peripheral Bus Interface
2.4.1 Embedded WLAN Radio (SoC)
Clocked Serial Unit (CSU) • 3-Wire, 4-Wire (3W4W) Interface
- 2-Wire Serial Interface (TWSI)
- 1-Wire Serial Interface General Purpose I/O (GPIO) Interface
- Defined GPIOs, I/O configured to either input or output
- GPIO “W STAT LED” with LED output functionality LED pulse stretching to observe short duration of status events Two software controlled blink rates to indicate events
2.4.2 Embedded MCU
JTAG Standard JTAG interface Quad Serial Peripheral Interface
- Integrated QSPI controller (master) with synchronous serial peripheral for slave device connection
- Integrated QSPI slave device with allocated firmware range and Web content 16 Mbit/2 Mbyte (1 Mbyte is reserved for customer Web content) 256 byte per programmable page with configurable length 1 to 256 Uniform sector erase (4 kB) Uniform block erase (64 kB) Erase/Program suspend and resume Standard/Dual/Quad SPI Support Flash controller for fetching code or read-only data 200 Mbps max. serial data rate in quad mode with 50 MHz functional clock
- Chip Select (CS2) for parallel operation of module internal and external QSPI flash
- External QSPI slave device can be connected for customer Web content memory extension Macronix QSPI flash MX25L1633E supported Maximum 16Mbit/2MByte is supported by firmware Wake Up External signal for HOST-to-SoC wake-up after shut-off mode General-Purpose I/O (GPIO) interface
- Defined GPIOs, I/O configured to either input or output (on/off)
- GPIOs with LED status functionality (Ready, Heartbeat, IP-Connectivity, and Error) Further information 4.3.8 Peripheral Interface Specification.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 13
2.5 WLAN Features
IEEE 802.11/ Standards
- 802.11 data rates 1 and 2 Mbps (DSSS)
- 802.11b data rates 5.5 and 11 Mbps (CCK)
- 802.11g data rates 6, 9, 12, 18, 24, 36, 48, and 54 Mbps (OFDM)
- 802.11b/g performance enhancements
- 802.11n-compliant with maximum data rates up to 72 Mbps (20 MHz channel) and 150 Mbps (40 MHz channel)
- 802.11d international roaming 5
- 802.11i enhanced security (WEP, WPA, WPA2)
- 802.11k radio resource measurement 5
- 802.11r fast hand-off for AP roaming 5
- 802.11w protected management frames 5
- Support clients (stations) implementing IEEE Power Save mode WLAN MAC • Ad-Hoc 5 and Infrastructure modes
- RTS/CTS for operation und DCF
- Hardware filtering of 32 multicast addresses and duplicate frame detection for up to 32 unicast addresses
- WLAN SoC with TX and RX FIFO for maximum throughput
- Open System and Shared Key Authentication services
- A-MPDU RX (de-aggregation) and TX (aggregation)
- 20/40 MHz channel coexistence
- Reduced Inter-Frame Spacing (RIFS) bursting
- Management Information Base (MIB) counter
- Radio resource measurement counters
- Block acknowledgement with 802.11n extensions
- Transmit beam former support
- Transmit rate adaptation
- Transmit power control
- Long and short preamble generation on a frame-by-frame basis for 802.11b frames
- Marvell® Mobile Hotspot technology (MMH)
5 Hardware-supported, not implemented in the pre-installed firmware stack
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 14 Type Features WLAN Baseband • 802.11n 1x1 SISO (WLAN SoC with SISO RF radio)
- Backward compatibility with legacy 802.11b/g technology
- PHY data rates up to 150 Mbps (802.11n - MCS7)
- 20 MHz bandwidth/channel, 40 MHz bandwidth/channel, upper/lower
20 MHz bandwidth in 40 MHz channel, and 20 MHz duplicate legacy
bandwidth in 40 MHz channel mode operation
- Modulation and Coding Scheme MCS 0 ~ 7 and MCS 32 (duplicate
6 Mbps)
- Radio resource measurement
- Optional 802.11n SISO features: 20/40 MHz coexistence 1-stream Space-Time-Block-Coding (STBC) reception Short Guard Interval RIFS on receive path Beamformer function and hardware acceleration Greenfield TX/RX WLAN Radio • 20 and 40 MHz channel bandwidth
- Embedded WLAN Radio SoC with the following features: Direct conversion radio (no SAW filter) 2.4 GHz TX/RX switch, Power Amplifier (PA) and Low Noise Amplifier (LNA) path Gain selectable LNAs with optimized noise figure and power consumption Power Amplifiers with power control Closed loop power control (0.5 dB step increments) Optimized TX gain distribution for linearity and noise performance Fine channel step with AFC (adaptive frequency control) WLAN Encryption • Embedded WLAN Radio SoC with the following features: WEP 64-bit and 128-bit encryption with hardware TKIP processing (WPA) AES-CCMP hardware implementation as part of 802.11i security standard (WPA2) Enhanced AES engine performance AES-Cipher-Based Message Authentication Code (CMAC) as part of the 802.11w security standard
PAN9320 Wi-Fi Module
3 Detailed Description
Product Specification Rev. 1.3 Page 15 13,50 2,66
3.1 Dimensions
All dimensions are in millimeters. No. Item Dimension Tolerance Remark 1 Width 13.50 ± 0.30 2 Length 29.00 ± 0.30 3 Height 2.66 ± 0.20 With case
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 16
3.2 Footprint
The outer dimensions have a tolerance of 0.3 mm.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 17
3.3 Packaging
The product is a mass production status product and will be delivered in the package described below.
3.3.1 Tape Dimensions
3.3.2 Packing in Tape
Empty spaces in the component packed area shall be less than two per reel and those spaces shall not be consecutive. The top cover tape shall not be found on reel holes and it shall not stick out from the reel.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 18
3.3.3 Component Direction
3.3.4 Reel Dimension
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 19
3.3.5 Package Label
(1T) (1P) (2P) (9D) (Q) (HW/SW) Lot code Customer order number, if applicable Order number Date code Quantity Hardware/Software version
3.3.6 Total Package
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 20
3.4 Case Marking
Brand name PAN9320/PAN9310 Hardware/Software version Engineering Sample (optional) Model Name/ENW number Lot code Serial number WLAN MAC address FCC ID IC Canada Marking for Pin 1 2D barcode, for internal usage only PAN9320 HW/SW ES M/N: ENW49A01A3EF YYWWDLL 12345678 0013430B801E FCC ID: T7V-93208 IC: 216Q-9320
PAN9320 Wi-Fi Module
4 Specification
Product Specification Rev. 1.3 Page 21 All specifications are over temperature and process, unless indicated otherwise.
4.1 Default Test Conditions
Temperature: 25 ± 10 °C Humidity: 40 to 85 % RH Supply Voltage: 3.3 V
4.2 Absolute Maximum Ratings
The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. Max. Units TSTOR Storage temperature -40 +85 °C VESD ESD robustness All pads, according to human body model (HBM), JEDEC STD 22, method A114 1 000 V According to charged device model (CDM), JEDEC STD 22, method C101 500 V PRF RF input level +20 dBm VDDMAX Maximum voltage Maximum power supply voltage from any pin with respect to VSS (GND) -0.3 3.6 V VDIG Voltage on any digital pins GPIOs, RESETn, UART, QSPI, Coex I/F -0.3 VDDMAX V
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 22
4.3 Recommended Operating Conditions
The maximum ratings may not be exceeded under any circumstances, not even momentarily or individually, as permanent damage to the module may result. Symbol Parameter Condition Min. Typ. Max. Units TA Ambient operating temperature range Extended grade -30 +70 °C VDD 3V3 Supply voltage6 Voltage on pins 7, 8 (3.3 V) I/O supply voltage internally connected to VDD/VCC 3.0 3.3 3.6 V
4.3.1 Digital Pin Characteristics
Symbol Parameter Condition Min. Typ. Max. Units VIH High level input voltage7 3.3 V operation (VIO = VDD) 0.7 VDD VDD + 0.3 V VIL Low level input voltage7 3.3 V operation (VIO = VDD) -0.3 0.3 VDD V IPS @ 0.5 VDD Pull-up/down strength VDigital Pin = 0.5 x VDD 10 50 µA IOH @ VDD-0.4 V High level output current7
3.3 V operation (VIO = VDD) 4 8 mA
IOL @ 0.4 V Low level output current7 6 The supply current must be limited to max. 1A 7 The capacitive load should not be larger than 50 pF for all I/Os when using the default driver strength settings. Large capacitance loads generally increase the overall current consumption.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 23
4.3.2 Current Consumption
The current consumption depends on the user scenario and on the setup and timing in the power modes. Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated. Symbol Parameter Condition Min. Typ. Max. Units ITX Active Transmit8 PTX = +18 dBm for 802.11b @ 11 Mbps 430 mA PTX = +15 dBm for 802.11g @ 54 Mbps 370 mA PTX = +13 dBm for 802.11n (20 MHz) @ 65 Mbps 350 mA IRX Active Receive9 802.11b @ 11 Mbps 150 mA 802.11g @ 54 Mbps 155 mA 802.11n @ 65 Mbps 160 mA IRXIdle Receive Idle10 Passive receive state, ready to receive packets, but no active decoding 145 mA IShut-off Shut-off MCU and Radio in shut-off mode 27 mA
4.3.3 Internal Operating Frequencies
Symbol Parameter Condition Min. Typ. Max. Units fSYSCLK1 CPU/System/ Encryption clock speed Refers to clock speed of WLAN SoC
128 MHz
Refers to clock speed of MCU 200 MHz fREFCLK1 WLAN SoC Crystal fundamental frequency Frequency tolerance < ±10 ppm over operating temperature and process Frequency tolerance < ±10 ppm over operating temperature and process
8 Peak values for specified output power level and data rate with UDP traffic between the AP and Device
(STA). 9 Peak values for specified data rate with UDP traffic between the AP and Device (STA). 10 The device is powered on and is ready to receive packets, but it is not actively decoding.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 24
4.3.4 Power Up Sequence
When the power is turned on, set reset signal to low (RESETn = low). After the VDD is stable, release the reset (RESETn = high).
4.3.5 Firmware-Related Timing
Symbol Parameter Min. Typ. Max. Units T MCU READY Time period from Power up or Reset until MCU READY pin is active 4 5 sec T WAKE UP Time period needed to set pin active to wake-up from shut-off mode (afterwards firmware is booting) 100 ms T FACTORY RESET Time period needed to set pin active to release factory reset (afterwards firmware is booting) 8 10 sec T INFRA ASSO Time period in Infrastructure mode from WLAN association request until association with selected Access-Point’s SSID 4 sec T DE-ASSO SCAN Time period between de-association from AP until next scan is released 60 sec T IP DHCP Time period from IP DHCP request until IP assignment 90 sec
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 25
4.3.6 Coexistence Interface Specification
The Coexistence Interface pins are powered from the VIO voltage supply internally connected to VDD = 3.3 V. DC specification 4.3.1 Digital Pin Characteristics. Marvell® 3/4-Wire Timing Data Symbol Parameter Min. Typ. Max. Units T1 Priority[0] info is valid in BT_STATE on and after T1 from BT_REQ rise. 0 1 100 µs T2 TxRx Info is valid in BT_STATE on and after T2. The BT_STATE must hold until there is any change of direction in the next slots. 2 19 100 µs T3 Time from TxRx Info valid to BCA grant decision 2 40 594 µs T4 BT_GRANTn needs to be valid T4 time before the upcoming slot. BT_GRANTn indicates Tx grant, and may also indicate Rx grant. Once a slot is granted, the subsequent slots are also granted unless there is a change in direction from Rx to Tx. Rx to Tx change always re- arbitrates. 2 80 594 µs T5 TxRx Info for the next slot is valid on and after T5 to the start of the next slot. If direction remains the same for the next slot, then BT_STATE must not change during the current slot. If the direction changes for the next slot, the BT_STATE must change only after the last bit of Bluetooth data is transferred; otherwise the transfer may be disrupted. 5 40 600 µs T6 The BT_REQ signal de-asserts T6 time after the last bit of Bluetooth data is transferred. 0 15 25 µs T7 Time from BT_REQ rise to first Bluetooth slot boundary. Bluetooth slot boundary is marked by first bit of Bluetooth data. 8 150 600 µs T8 Optional Priority[1] information is valid in BT_STAT on and after T8. This time the parameter only exists if BCA is configured for 2-bit priority on the same BT_STATE pin. Otherwise, T2 would start after T1. 2 10 100 µs Ttx Slot time (fixed for Bluetooth) 625 µs Trx Slot time (fixed for Bluetooth) 625 µs
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 26 WL_ACTIVE 2/3/4-Wire Timing Data Symbol Parameter Min. Typ. Max. Units T1 If WLAN can be stopped, WL_ACTIVE will de- assert prior to Bluetooth slot start (T1 < T2). If the Bluetooth device samples WL_ACTIVE before starting priority transfer, WL_ACTIVE needs to de-assert earlier than the sampling time. 0 499 µs T2 Time from BT_PRIORITY rise to start of Bluetooth activity. 20 50 499 µs T3 Time from end of Bluetooth activity to BT_PRIORITY fall. 0 0 499 µs T4 Slot time (fixed for Bluetooth) 625 µs
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 27
4.3.7 Host Interface Specification
4.3.7.1 UART0 Command Interface
Module Pin No Signal Name Function Description
27 UART0 TXD
28 UART0 RXD Receive data input
Item Range Default Comment Baudrate 300 ~ 1 500 000 115 200 Baud Data bits 5 ~ 8 (LSB first) 8 LSB first Parity bits 0 ~ 4 0 Stop bit 1/1.5/2 1 Supported Baud Rates Baud 300 600 1 200 2 400 4 800 9 600 14 400 19 200 28 800 38 400 56 000 57 600 115 200 128 000 256 000 520 000 780 000 1 500 000 UART0 Timing Diagram
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 28
4.3.7.2 UART1 Transparent Data Interface
Module Pin No Signal Name Function Description
9 UART1 CTS
10 UART1 RTS Request to send
11 UART1 TXD Transmit data output
12 UART1 RXD Receive data input
Item Range Default Comment Baudrate 300 ~ 1 500 000 115 200 Baud Data bits 5 ~ 8 (LSB first) 8 LSB first Parity bits 0 ~ 4 0 Stop bit 1/1.5/2 1 Supported Baud Rates Baud 300 600 1 200 2 400 4 800 9 600 14 400 19 200 28 800 38 400 56 000 57 600 115 200 128 000 256 000 520 000 780 000 1 500 000 UART1 Timing Diagram
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 29
4.3.7.3 UART1 Dual Interface
9 UART1 CTS OUT
10 UART1 RTS IN Request to send
11 UART1 TXD OUT Transmit data output
12 UART1 RXD IN Receive data input
27 DUAL STAT OUT
(transparent or command)
28 DUAL SW IN UART1 toggle switch
Specification of protocol and supported baud rates 4.3.7.2 UART1 Transparent Data Interface. The usage of the UART1 dual interface needs to be configured in the Customer Config of the firmware. After booting, the MCU READY pin changes from low level to high level. As start condition, the DUAL SW input pin needs to be pre-set from the HOST by changing from high level to low level. The DUAL STAT output pin signals high level as transparent state. In this case, the HOST is able to transmit or receive transparent data. To change from transparent to command state, the DUAL SW input pin needs to be toggled (low - high - low level change) from the HOST: 1. The change of state is initiated by changing the DUAL SW input pin from low to high level (set toggle switch). 2. After the DUAL STAT pin has changed the state from high level to low level, the Command state is active and the DUAL SW input pin can be reset from high level to low level (reset toggle). 3. The HOST is now able to send commands. After the commands have been sent, it is recommended to change back to transparent state by toggling the DUAL SW input pin again.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 30 Bus and Control Timing Diagram
4.3.8 Peripheral Interface Specification
The Peripheral Interface pins are powered from the VIO voltage supply internally connected to VDD = 3.3 V. DC specification 4.3.1 Digital Pin Characteristics. Configurable GPIOs GPIO function State GPIO Pin Name GPIO4 GPIO5 GPIO6 GPIO7 GPIO 28 GPIO 44 GPIO 45 Input IN - YES YES YES YES YES YES YES Output OUT ON YES YES YES YES YES YES YES OFF YES YES YES YES YES YES YES Default by firmware OFF OUT OUT OUT OUT OUT OUT OUT The functions of the configurable GPIOs are set by the firmware Default Config, but they can be reconfigured by using the host command interface (UART).
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 31 Firmware-Defined GPIOs GPIO Pin Name GPIO Definition GPIO Level Firmware State Input Out- put Default Active Boot Firmware Application Active Firmware Function STAT LED1 NO YES - LOW OFF OFF: Shut-off BLINK (1sec): Firmware active MCU status (heartbeat) STAT LED2 NO YES - LOW OFF OFF: no IP assigned ON: IP assigned IP-Connectivity in Infrastructure mode STAT LED3 NO YES - LOW ON OFF: no error ON: error appeared MCU firmware error W STAT LED NO YES - LOW OFF OFF: no AP connection BLINK (0.3 s): Scanning for AP BLINK (1.2 s): WLAN Error ON: Associated with AP WLAN connectivity in Infrastructure mode MCU READY NO YES - HIGH OFF OFF: Shut-off ON: Firmware ready Firmware application is ready FACTORY RESET YES NO LOW11 HIGH inactive Set active for min. 10 seconds Restore firmware default WAKE UP1 YES NO LOW11 HIGH inactive Set active for min. 100 ms Wake up after shut- off BOOT YES NO HIGH12 HIGH active inactive after booting Radio firmware to be loaded from internal flash memory The functions of the firmware-defined GPIOs are fixed and cannot be changed.
11 Set default level by using resistor with 10 kOhm to GND
12 Set default level with resistor 100 Ohm to Vcc
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 32
4.4 Quad Serial Peripheral Interface (QSPI)
List of Supported Flash Memories Part Name Manufacturer Memory Type SPI Mode SPI Clock Memory Size Page Size MX25L1633E Macronix QSPI 1/2/4 I/O 104/85 MHz 16 Mbit 256 byte Firmware-Supported QSPI Characteristics Symbol Parameter Min. Typ. Max. Units t cyc QSPI clock cycle time 20 ns t W Clock high and low time t cyc/2-6.67 ns t SU (RX) Data input setup time 5.5 ns t h (RX) Data input hold time 0 ns t out (TX) Data output delay time 3.2 ns QSPI Timing Diagram
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 33 QSPI Command Set (Used by Firmware) Command Description 1st byte 2nd byte 3rd byte 4th byte 5th byte Action WREN Write enable 06 (hex) sets the (WEL) write enable latch bit WRDI Write disable 04 (hex) resets the (WEL) write enable latch bit RDID Read identifica- tion 9F (hex) outputs JEDEC ID: 1-byte Manufacturer ID & 2-byte Device ID RDSR Read status register 05 (hex) reads out the values of the status register WRSR Write status register 01 (hex) Values writes new values of the status register READ Read data 03 (hex) AD1 A23-A16 AD2 A15-A8 AD3 A7-A0 n bytes read out until CS# goes high FAST READ Fast read data 0B (hex) AD1 AD2 AD3 Dummy n bytes read out until CS# goes high 2READ 2 I/O read BB (hex) ADD(2) ADD(2) & Dummy(2) n bytes read out by 2 x I/O until CS# goes high 4READ 4 I/O read EB (hex) ADD(4) & Dummy(4) Dummy(4) n bytes read out by 4 x I/O until CS# goes high PP Page program 02 (hex) AD1 AD2 AD3 programs the selected page 4PP Quad page program 38 (hex) AD1 quad input to program the selected page Sector Erase 4 kB sector erase 20 (hex) AD1 AD2 AD3 erases the selected sector Block Erase 64 kB block erase D8 (hex) AD1 AD2 AD3 erases the selected block Chip Erase 2 MB full chip erase 60 or C7 (hex) erases whole chip
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 34
4.5 RF Electrical Characteristics
4.5.1 WLAN Radio Specification
Parameter Operation Mode Specification Standard Conformance IEEE 802.11/IEEE 802.11b IEEE 802.11g IEEE 802.11n Modulation IEEE 802.11b DSSS/CCK IEEE 802.11g OFDM IEEE 802.11n OFDM @ MCS0~7 and MCS32 (duplicate Physical layer data rates IEEE 802.11 1, 2 Mbps @ DSSS IEEE 802.11b 5.5, 11 Mbps @ DSSS / CCK Supported data rates IEEE 802.11g 6, 9, 12, 18, 24, 36, 48, 54 Mbps IEEE 802.11n MCS0~7 HT20 LGI 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps
72.2 Mbps
HT40 LGI 13.5, 27, 40.5, 54, 81, 108, 121.5,
135 Mbps
SGI 15, 30, 45, 60, 90, 120, 135, 150 Mbps Supported bandwidth IEEE 802.11n 20, 40 MHz (BW) Supported channel mode operation IEEE 802.11n 20 MHz BW/channel, 40 MHz BW/channel, upper/lower 20 MHz BW @ 40 MHz channel, 20 MHz duplicate legacy BW @ 40 MHz channel Supported Guard Interval IEEE 802.11n 400 ns (SGI), 800 ns (LGI) Supported channel 2.4 GHz13 IEEE 802.11g North America (US) 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11 France (FR) 10, 11, 12, 13 Japan MMK (JP) 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13 IEEE 802.11n North America (US) 1-5, 2-6, 3-7, 4-8, 5-9, 6-10, 7-11 Canada (CA) Europe (EU) France (FR) Japan MMK (JP) - 13 In order to comply with the relevant regulatory requirements, please refer to the model’s supported channels 7.1 Ordering Information.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 35
4.5.2 WLAN RF Characteristics
4.5.2.1 RF Characteristics for IEEE 802.11b Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated. 50 Ohm terminal load connected to the RF connector. Parameter Condition Min. Typ. Max. Units RF frequency range 2 400 2 483.5 MHz Carrier frequency tolerance -25 +25 ppm Transmit output power +18 +20 dBm Spectrum mask fC ± 11 MHz -30 dBr fC ± 22 MHz -50 dBr Power-on/Power-down ramp 2 µs RF Carrier suppression -15 dB Error Vector Magnitude (EVM) Peak 35 % Minimum Receive Sensitivity 1 Mbps (DSSS) FER ≤ 8 % -98 -86 dBm
2 Mbps (DSSS) FER ≤ 8 % -95 -83 dBm
5.5 Mbps (CCK) FER ≤ 8 % -91 -79 dBm
11 Mbps (CCK) FER ≤ 8 % -88 -76 dBm
Maximum Input Level FER ≤ 8 % -10 dBm Adjacent Channel Rejection FER ≤ 8 % 35 dB
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 36 4.5.2.2 RF Characteristics for IEEE 802.11g Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated. 50 Ohm terminal load connected to the RF connector. Parameter Condition Min. Typ. Max. Units RF frequency range 2 400 2 483.5 MHz Carrier frequency tolerance -25 +25 ppm Transmit output power
6 Mbps ~ 36 Mbps +16 +18 dBm
48 Mbps ~ 54 Mbps +15 +17 dBm
fC ± 11 MHz -20 dBr fC ± 20 MHz -28 dBr fC ± 30 MHz -40 dBr Transmitter center frequency leakage -15 dB Transmitter Spectral Flatness -2 +2 dB Constellation Error (EVM) BPSK, CR 1/2 (6 Mbps) -5 dB BPSK, CR 3/4 (9 Mbps) -8 dB QPSK, CR 1/2 (12 Mbps) -10 dB QPSK, CR 3/4 (18 Mbps) -13 dB 16-QAM, CR 1/2 (24 Mbps) -16 dB 16-QAM, CR 3/4 (36 Mbps) -19 dB 64-QAM, CR 2/3 (48 Mbps) -22 dB 64-QAM, CR 3/4 (54 Mbps) -25 dB Minimum Receive Sensitivity BPSK, CR 1/2 (6 Mbps) PER ≤ 10 % -91 -82 dBm BPSK, CR 3/4 (9 Mbps) PER ≤ 10 % -90 -81 dBm QPSK, CR 1/2 (12 Mbps) PER ≤ 10 % -89 -79 dBm QPSK, CR 3/4 (18 Mbps) PER ≤ 10 % -87 -77 dBm 16-QAM, CR 1/2 (24 Mbps) PER ≤ 10 % -84 -74 dBm 16-QAM, CR 3/4 (36 Mbps) PER ≤ 10 % -80 -70 dBm 64-QAM, CR 2/3 (48 Mbps) PER ≤ 10 % -76 -66 dBm 64-QAM, CR 3/4 (54 Mbps) PER ≤ 10 % -75 -65 dBm Maximum Input Level PER ≤ 10 % -20 dBm Adjacent channel rejection BPSK, CR 1/2 (6 Mbps) PER ≤ 10 % 16 dB 64-QAM, CR 3/4 (54 Mbps) PER ≤ 10 % -1 dB
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 37 4.5.2.3 RF Characteristics for IEEE 802.11n (BW 20 MHz) Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated. 50 Ohm terminal load connected to the RF connector. Parameter Condition Min. Typ. Max. Units RF frequency range 2 400 2 483.5 MHz Carrier frequency tolerance -25 +25 ppm Transmit output power MCS0 ~ MCS2 +15 +17 dBm MCS3 ~ MCS4 +14 +16 dBm MCS5 ~ MCS7 +13 +15 dBm Spectrum mask fC ± 11 MHz -20 dBr fC ± 20 MHz -28 dBr fC ± 30 MHz -45 dBr Transmitter center frequency leakage -15 dB Transmitter Spectral Flatness -2 +2 dB Constellation Error (EVM) BPSK, CR 1/2 (MCS0) -5 dB QPSK, CR 1/2 (MCS1) -10 dB QPSK, CR 3/4 (MCS2) -13 dB 16-QAM, CR 1/2 (MCS3) -16 dB 16-QAM, CR 3/4 (MCS4) -19 dB 64-QAM, CR 2/3 (MCS5) -22 dB 64-QAM, CR 3/4 (MCS6) -25 dB 64-QAM, CR 5/6 (MCS7) -27 dB Minimum Receive Sensitivity14
6.5 Mbps (MCS0) PER ≤ 10 % -91 -82 dBm
13 Mbps (MCS1) PER ≤ 10 % -88 -79 dBm
19.5 Mbps (MCS2) PER ≤ 10 % -86 -77 dBm
26 Mbps (MCS3) PER ≤ 10 % -83 -74 dBm
39 Mbps (MCS4) PER ≤ 10 % -79 -70 dBm
52 Mbps (MCS5) PER ≤ 10 % -75 -66 dBm
58.5 Mbps (MCS6) PER ≤ 10 % -74 -65 dBm
65 Mbps (MCS7) PER ≤ 10 % -73 -64 dBm
Maximum Input Level PER ≤ 10 % -20 dBm Adjacent channel rejection15 65 Mbps (MCS7) PER ≤ 10 % -2 dB 14 The Minimum Sensitivity levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI, and BCC. 15 The Adjacent Channel Rejection levels apply only to non-STBC modes, MCS 0~7, 800 ns LGI, and BCC.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 38 4.5.2.4 RF Characteristics for IEEE 802.11n (BW 40 MHz) Assume VDD = 3.3 V, Tamb = 25 °C, if nothing else stated. 50 Ohm terminal load connected to the RF connector. Parameter Condition Min. Typ. Max. Units RF frequency range 2 400 2 483.5 MHz Carrier frequency tolerance -25 +25 ppm Transmit output power MCS0 ~ MCS2 +13 +15 dBm MCS3 ~ MCS4 +12 +14 dBm MCS5 ~ MCS7 +11 +13 dBm Spectrum mask fC ± 21 MHz -20 dBr fC ± 40 MHz -28 dBr fC ± 60 MHz -45 dBr Transmitter center frequency leakage -15 dB Transmitter Spectral Flatness -2 +2 dB Constellation Error (EVM) BPSK, CR 1/2 (MCS0) -5 dB QPSK, CR 1/2 (MCS1) -10 dB QPSK, CR 3/4 (MCS2) -13 dB 16-QAM, CR 1/2 (MCS3) -16 dB 16-QAM, CR 3/4 (MCS4) -19 dB 64-QAM, CR 2/3 (MCS5) -22 dB 64-QAM, CR 3/4 (MCS6) -25 dB 64-QAM, CR 5/6 (MCS7) -27 dB Minimum Receive Sensitivity14
13.5 Mbps (MCS0) PER ≤ 10 % -88 -79 dBm
27 Mbps (MCS1) PER ≤ 10 % -85 -76 dBm
40.5 Mbps (MCS2) PER ≤ 10 % -83 -74 dBm
54 Mbps (MCS3) PER ≤ 10 % -80 -71 dBm
81 Mbps (MCS4) PER ≤ 10 % -76 -67 dBm
108 Mbps (MCS5) PER ≤ 10 % -72 -63 dBm
121.5 Mbps (MCS6) PER ≤ 10 % -71 -62 dBm
135 Mbps (MCS7) PER ≤ 10 % -70 -61 dBm
Maximum Input Level PER ≤ 10 % -20 dBm Adjacent channel rejection15 135 Mbps (MCS7) PER ≤ 10 % -2 dB
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 39
4.6 Reliability Tests
The measurement should be done after the test device has been exposed to room temperature and humidity for one hour. No. Item Limit Condition
1 Vibration test Electrical parameter should be in
- Freq.: 10~50 Hz; Amplitude: 1.5 mm; 20 min./cycle, 1 h each of XYZ axis
- Freq.: 30~100 Hz, 6 G; 20 min./cycle, 1 h each of XYZ axis
2 Shock test See above Dropped onto hard wood from a height of
3 Heat cycle test See above -40 °C for 30 min. and +85 °C for 30 min.; each temperature 300 cycles
4 Moisture test See above +60 °C, 90 % RH, 300 h
5 Low temperature
See above -40 °C, 300 h 6 High temp. test See above +85 °C, 300 h
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 40
4.7 Recommended Soldering Profile
Reflow permissible cycle: 2 Opposite side reflow is prohibited due to module weight More than 75 percent of the soldering area shall be coated by solder The soldering profiles should be adhered to in order to prevent electrical or mechanical damage Soldering profile assumes lead-free soldering
PAN9320 Wi-Fi Module
5 Cautions
Product Specification Rev. 1.3 Page 41 Failure to follow the guidelines set forth in this document may result in degrading of the product’s functions and damage to the product.
5.1 Design Notes
- Follow the conditions written in this specification, especially the control signals of this module. 2. The supply voltage must be free of AC ripple voltage (for example from a battery or a low noise regulator output). For noisy supply voltages, provide a decoupling circuit (for example a ferrite in series connection and a bypass capacitor to ground of at least 47 µF directly at the module). 3. This product should not be mechanically stressed when installed. 4. Keep this product away from heat. Heat is the major cause of decreasing the life of these products. 5. Avoid assembly and use of the target equipment in conditions where the product’s temperature may exceed the maximum tolerance. 6. The supply voltage should not be exceedingly high or reversed. It should not carry noise and/or spikes. 7. Keep this product away from other high frequency circuits. 8. Refer to the recommended pattern when designing a board.
5.2 Installation Notes
- Reflow soldering is possible twice based on the conditions set forth in 4.7 Recommended Soldering Profile. Set up the temperature at the soldering portion of this product according to this reflow profile. 2. Carefully position the products so that their heat will not burn into printed circuit boards or affect the other components that are susceptible to heat. 3. Carefully locate these products so that their temperatures will not increase due to the effects of heat generated by neighboring components. 4. If a vinyl-covered wire comes into contact with the products, then the cover will melt and generate toxic gas, damaging the insulation. Never allow contact between the cover and these products to occur. 5. This product should not be mechanically stressed or vibrated when reflowed. 6. To repair the board by hand soldering, follow the conditions set forth in this chapter. 7. Do not wash this product. 8. Pressing on parts of the metal cover or fastening objects to the metal will cause damage to the unit.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 42
5.3 Usage Condition Notes
- Take measures to protect the unit against static electricity. If pulses or other transient loads (a large load applied in a short time) are applied to the products, check and evaluate their operation befor assembly on the final products. 2. Do not use dropped products. 3. Do not touch, damage or soil the pins. 4. Follow the recommended condition ratings about the power supply applied to this product. 5. Electrode peeling strength: Do not add pressure of more than 4.9 N when soldered on PCB. 6. Pressing on parts of the metal cover or fastening objects to the metal cover will cause damage. 7. These products are intended for general purpose and standard use in general electr onic equipment, such as home appliances, office equipment, information, and communication equipment.
5.4 Storage Notes
- The module should not be stressed mechanically during storage. 2. Do not store these products in the following conditions or the performance characteristics of the product, such as RF performance will be adversely affected: – Storage in salty air or in an environment with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NOX, – Storage in direct sunlight, – Storage in an environment where the temperature may be outside the range of 5 °C to 35 °C, or where the humidity may be outside the 45 to 85 percent range, – Storage of the products for more than one year after the date of delivery storage period: Please check the adhesive strength of the embossed tape and soldering after six months of storage. 3. Keep this product away from water, poisonous gas, and corrosive gas. 4. This product should not be stressed or shocked when transported. 5. Follow the specification when stacking packed crates (max. 10).
5.5 Safety Cautions
These specifications are intended to preserve the quality assurance of products and individual components. Before use, check and evaluate the operation when mounted on your products. Abide by these specifications without deviation when using the products. These products may short-circuit. If electrical shocks, smoke, fire, and/or accidents involving human life are anticipated when a short circuit occurs, provide the following failsafe functions as a minimum:
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 43 1. Ensure the safety of the whole system by installing a protection circuit and a protection device. 2. Ensure the safety of the whole system by installing a redundant circuit or another system to prevent a single fault causing an unsafe status.
5.6 Other Cautions
- Do not use the products for other purposes than those listed. 2. Be sure to provide an appropriate fail-safe function on your product to prevent any additional damage that may be caused by the abnormal function or the failure of the product. 3. This product has been manufactured without any ozone chemical controlled under the Montreal Protocol. 4. These products are not intended for uses other than under the special conditions shown below. Before using these products under such special conditions, carefully check their performance and reliability under the said special conditions to determine whether or not they can be used in such a manner: – In liquid, such as water, salt water, oil, alkali, or organic solvent, or in places where liquid may splash, – In direct sunlight, outdoors, or in a dusty environment, – In an environment where condensation occurs, – In an environment with a high concentration of harmful gas (e. g. salty air, HCl, Cl2, SO2, H2S, NH3, and NOX). 5. If an abnormal voltage is applied due to a problem occurring in other components or circuits, replace these products with new products because they may not be able to provide normal performance even if their electronic characteristics and appearances appear satisfactory. 6. When you have any question or uncertainty, contact Panasonic.
5.7 Life Support Policy
This Panasonic Industrial Devices Europe GmbH product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Panasonic customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Panasonic Industrial Devices Europe GmbH for any damages resulting.
PAN9320 Wi-Fi Module
6 Regulatory and Certification Information
Product Specification Rev. 1.3 Page 44
6.1 Federal Communications Commission (FCC) for US
6.1.1 FCC Notice
The PAN9320, including the ceramic antenna (ENW49A01A3EF), and the PAN9310 SMD type (ENW49A01C3EF), and including the antennas, which are listed in 6.1.5 Approved Antenna List, complies with Part 15 of the FCC Rules. The device meets the requirements for modular transmitter approval as detailed in FCC public Notice DA00-1407. The transmitter operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. The FCC identifier for ENW49A01x3EF(16) is FCC ID: T7V-9320.
6.1.2 Caution
The FCC requires the user to be notified that any changes or modifications made to this device that are not expressly approved by Panasonic Industrial Devices Europe GmbH may void the user's authority to operate the equipment. This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:
- Reorient or relocate the receiving antenna,
- Increase the separation between the equipment and receiver,
- Connect the equipment into an outlet on a circuit different from that to which the receiver is connected,
- Consult the dealer or an experienced radio/TV technician for help. 16 x = „A“ for PAN9320 and x = „C“ for PAN9310 (e.g. ENW49A01A3EF x = “A”)
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 45
6.1.3 Label Requirements
The OEM must ensure that FCC labelling requirements are met. This includes a clearly visible label (laser marking) on the outside of the OEM enclosure specifying the appropriate Panasonic FCC identifier for this product as well as the FCC Notice above. The FCC identifier is FCC ID: T7V-9320 for model ENW49A01x3EF16. This FCC identifier is valid for the PAN9320. The end product must in any case be labelled on the exterior with: “Contains FCC ID: T7V-9320”.
6.1.4 Antenna Warning
This antenna warning refers to the test device with the model number ENW49A01C3EF (PAN9310 with SMD pad) Chapter 7.1 Ordering Information The device is tested with a standard SMA connector and with the antenna listed below. When integrated into the OEM’s product, these fixed antennas require installation preventing end users from replacing them with non-approved antennas. Any antenna not in the following table must be tested to comply with FCC Section 15.203 for unique antenna connectors and with Section 15.247 for emissions. The FCC identifier for the device with the antenna listed in 6.1.5 Approved Antenna List is the same (FCC ID: T7V-9320).
6.1.5 Approved Antenna List
Item Part Number Manufacturer Frequency Band Type Gain (dBi) 1 ANT2012LL13R2400A Yageo 2.4 GHz Chip antenna +0.8 Note: We are able to qualify your antenna and will add it to this list when the certification process is completed.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 46
6.1.6 RF Exposure
To comply with FCC RF Exposure requirements, the OEM must ensure that only antennas from the Approved Antenna List are installed 6.1.5 Approved Antenna List. The preceding statement must be included as a CAUTION statement in manuals for products operating with the approved antennas in the previous table to alert users on FCC RF Exposure compliance. Any notification to the end user of installation or removal instructions about the integrated radio module is not allowed. The radiated output power of the PAN9320 with a mounted ceramic chip antenna (FCC ID: T7V-9320 for model ENW49A01A3EF) are fulfilled for mobile configuration. The installation of the module is restricted to mobile host devices. Nevertheless, the PAN9320 shall be used in such a manner that the potential for human contact during normal operation is minimized. End users may not be provided with the module installation instructions. OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure compliance.
6.2 Innovation, Science, and Economic Development (ISED) for
PAN9320 and versions are licensed to meet the regulatory requirements of ISED. License for M/N: ENW49A01x3EF16: IC: 216Q-9320 License for M/N: ENW49A02x3EF16: IC: 216Q-9320 Manufacturers of mobile, fixed, or portable devices incorporating this module are advised to clarify any regulatory questions and ensure compliance for SAR and/or RF exposure limits. Users can obtain Canadian information on RF exposure and compliance from www.ic.gc.ca. This device has been designed to operate with the antennas listed in 6.1.5 Approved Antenna List, having a maximum gain of +0.8 dBi. Antennas not included in this list or having a gain greater than +0.8 dBi are strictly prohibited for use with this device. The required antenna impedance is 50 Ohm. The antenna used for this transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. French PAN9320 (et ses versions) est garanti conforme aux dispositions règlementaires d’ Innovation, Sciences et Développement économique (ISDE) Canada. Licence pour M/N: ENW49A01x3EF16: IC: 216Q-9320 Licence pour M/N: ENW49A02x3EF16: IC: 216Q-9320 Il est recommandé aux fabricants d’appareils fixes, mobiles ou portables de consulter la réglementation en vigueur et de vérifier la conformité de leurs produits relativement aux limites d’exposition aux rayonnements radiofréquence ainsi qu’au débit d’absorption spécifique maximum autorisé.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 47 Des informations pour les utilisateurs sur la réglementation Canadienne concernant l’exposition aux rayonnements RF sont disponibles sur le site www.ic.gc.ca. Ce produit a été développé pour fonctionner spécifiquement avec les antennes listées dans le tableau 6.1.5 Approved Antenna List, présentant un gain maximum de 0.8 dBi. Des antennes autres que celles listées ici, ou présentant un gain supérieur a 0.8 dBi ne doivent en aucune circonstance être utilises en combinaison avec ce produit. L’impédance des antennes compatibles est 50 Ohm. L’antenne utilisée avec ce produit ne doit ni être située à proximité d’une autre antenne ou d’un autre émetteur, ni être utilisée conjointement avec une autr e antenne ou un autre émetteur.
6.2.1 IC Notice
The device PAN9320 and versions ( 7.1 Ordering Information), including the antennas ( 6.1.5 Approved Antenna List), comply with Canada RSS-GEN Rules. The device meets the requirements for modular transmitter approval as detailed in RSS-Gen. Operation is subject to the following two conditions: 1. This device may not cause harmful interference, and 2. This device must accept any interference received, including interference that may cause undesired operation. French Le présent appareil PAN9320 ( 7.1 Ordering Information), les antennes y compris ( 6.1.5 Approved Antenna List), est conforme aux CNR-Gen d'ISDE applicables aux appareils radio exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: 1. l'appareil ne doit pas produire de brouillage, et 2. l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 48
6.2.2 Labeling Requirements
The OEM must ensure that IC labelling requirements are met. This includes a clearly visible label on the outside of the OEM enclosure specifying the appropriate Panasonic IC identifier for this product as well as the IC Notice above. The IC identifiers are: IC: 216Q-9320 (for M/N: ENW49A01x3EF (16)) IC: 216Q-9320 (for M/N: ENW49A02x3EF (16)) These IC identifiers are valid for all PAN9320 modules 7.1 Ordering Information. In any case, the end product must be labelled on the exterior with: “Contains IC: 216Q-9320” French Obligations d’étiquetage Les fabricants d’équipements d’origine (FEO) – en anglais Original Equipment Manufacturer (OEM) – doivent s’assurer que les obligations d’étiquetage IC du produit final sont remplies. Ces obligations incluent une étiquette clairement visible à l’extérieur de l’emballage externe, comportant l’identifiant IC du module Panasonic inclus, ainsi que la notification ci-dessus. L’ identifiant IC est: IC: 216Q-9320 (pour M/N: ENW49A01x3EF (16)) IC: 216Q-9320 (pour M/N: ENW49A02x3EF (16)) Cet identifiant est valide pour tous les modules PAN9320 7.1 Ordering Information. Dans tous les cas les produits finaux doivent indiquer sur leur emballage externe la mention suivante: “Contient IC: 216Q-9320”
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 49
6.2.3 European Conformity According to RED (2014/53/EU)
All modules described in this product specification comply with the standards according to the following LVD (2014/35/EU), EMC-D (2014/30/EU) together with RED (2014/53/EU) articles: 3.1a Safety/Health: EN60950-1:2006+A11:2009+A1:2010+A12:2011+AC:2011+A2:2013 EN62311:2008 3.1b EMC: EN 301 489-1 V2.1.1:2017-02 EN 301 489-17 V3.1.1:2017-02 3.2 Radio: EN 300 328 V2.1.1:2016-11 As a result of the conformity assessment procedure described in 2014/53/EU Directive, the end customer equipment should be labelled as follows: The end customer has to assure that the device has a distance of more than 20 cm from the human body under all circumstances. The end customer equipment must meet the actual Safety/Health requirements according to RED. PAN9320 and its model versions in the specified reference design ca n be used in all countries of the European Economic Area (Member States of the EU, European Free Trade Association States[Iceland, Liechtenstein, Norway]), Monaco, San Marino, Andorra, and Turkey.
6.3 RoHS and REACH Declaration
The latest declaration of environmental compatibility (Restriction of Hazardous Substances, RoHS and Registration, Evaluation, Authorisation and Restriction of Chemicals, REACH) for supplied products can be found on the Panasonic website in the “Downloads” section of the respective product 7.2.2 Product Information.
PAN9320 Wi-Fi Module
7 Appendix
Product Specification Rev. 1.3 Page 50
7.1 Ordering Information
The PAN9310/PAN9320 is delivered with a pre-installed firmware 7.1.2 Firmware.
7.1.1 Variants and Versions
Order Number Brand Name Description MOQ17 ENW49A01A3EF PAN9320 Fully embedded stand-alone Wif-Fi module IEEE 802.11 b/g/n with a ceramic chip-antenna Firmware version: V1.9.0.1 Regulatory notice: FCC/IC18 for US and for Canada Supported channel: Channel 1 ~ 11, 2412 ~ 2462 MHz 500 ENW49A01C3EF PAN931019 Fully embedded stand-alone Wif-Fi module IEEE 802.11 b/g/n with an RF bottom pad Firmware version: V1.9.0.1 Regulatory notice: FCC/IC18 for US and for Canada Supported channel: Channel 1 ~ 11, 2412 ~ 2462 MHz 500 ENW49A02A3EF PAN9320 Fully embedded stand-alone Wif-Fi module IEEE 802.11 b/g/n with a ceramic chip-antenna Firmware version: V1.9.0.1 Regulatory notice: ETSI20 for EU and other Supported channel: Channel 1 ~ 13, 2412 ~ 2472 MHz 500 ENW49A02C3EF PAN931019 Fully embedded stand-alone Wif-Fi module IEEE 802.11 b/g/n with an RF bottom pad Firmware version: V1.9.0.1 Regulatory notice: ETSI20 for EU and other Supported channel: Channel 1 ~ 13, 2412 ~ 2472 MHz 500 17 Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 500 pieces, fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution channels.
18 The model with the Regulatory Domain FCC/IC (M/N: ENW49A01A3EF) is only intended to be used in the
countries of US and Canada because only the channels 1 ~ 11 (2412 ~ 2462 MHz) are supported in the 2.4 GHz ISM band. It is not possible to change the pre-stored Region Code in order to change the Regulatory Domain. Thus the module labeling contains the FCC Grant ID. 19 The models with the brand name PAN9310 do not have the chip antenna on module. The Grant IDs marked on the module labelling are referenced and only valid if the customer applies an antenna from the Approved Antenna List ( 6.1.5 Approved Antenna List) including the reference design described in the PAN9310 manual for OEM Antenna Instructions according to KDB996369 question 11 ( 7.2.2 Product Information). In this case, the customer can refer to the pre-qualified module’s modular approval which needs to be finally approved by the certification body of the regulatory authority.
20 The model with Regulatory Domain ETSI (M/N: ENW49A02A3EF) are mainly intended to be used in
European countries because the channels 1 ~ 13 (2412 ~ 2472 MHz) are supported. The Region Code is pre-configured (using Default Config Content in Flash memory) to Regulatory Domain ETSI and thus the module labeling does not contain the FCC ID. At the end the customer is able to change applied Region Code by his own Customer Config Content to be stored during customer OEMs product production in the flash memory. It means the FCC Regulatory Domain can be configured as well, but the customer has to certify the end product by itself.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 51 Order Number Brand Name Description MOQ17 ENW49A01A5EF PAN9320 Fully embedded stand-alone Wif-Fi module IEEE 802.11 b/g/n with a ceramic chip-antenna Firmware version: V1.9.6.4 Regulatory notice: FCC/IC18 for US and for Canada Supported channel: Channel 1 ~ 11, 2412 ~ 2462 MHz 500 ENW49A01C5EF PAN931019 Fully embedded stand-alone Wif-Fi module IEEE 802.11 b/g/n with an RF bottom pad Firmware version: V1.9.6.4 Regulatory notice: FCC/IC18 for US and for Canada Supported channel: Channel 1 ~ 11, 2412 ~ 2462 MHz 500 ENW49A02A5EF PAN9320 Fully embedded stand-alone Wif-Fi module IEEE 802.11 b/g/n with a ceramic chip-antenna Firmware version: V1.9.6.4 Regulatory notice: ETSI20 for EU and other Supported channel: Channel 1 ~ 13, 2412 ~ 2472 MHz 500 ENW49A02C5EF PAN931019 Fully embedded stand-alone Wif-Fi module IEEE 802.11 b/g/n with an RF bottom pad Firmware version: V1.9.6.4 Regulatory notice: ETSI20 for EU and other Supported channel: Channel 1 ~ 13, 2412 ~ 2472 MHz 500
7.1.2 Firmware
Firmware Version Key Features 1.9.0.1 • Simultaneous AP and station
- Netcat TCP data tunnel
- AJAX web server
- Software update over-the-air 1.9.6.4 • Simultaneous AP and station
- Netcat TCP data tunnel
- AJAX web server
- Software update over-the-air In addition to V1.9.0.1:
- Webcat – WebSocket client/secure WebSocket client TLS1.2
- UDP Protocol support
- Access Point IP Address configurable
- Web server - automatic redirect/HTTP redirect For further information please refer to our product documentation 7.2.2 Product Information.
PAN9320 Wi-Fi Module Product Specification Rev. 1.3 Page 52
7.2 Contact Details
7.2.1 Contact Us
Please contact your local Panasonic Sales office for details on additional product options and services: For Panasonic Sales assistance in the EU, visit https://eu.industrial.panasonic.com/about-us/contact-us Email: wireless@eu.panasonic.com For Panasonic Sales assistance in North America, visit the Panasonic Sales & Support Tool to find assistance near you at https://na.industrial.panasonic.com/distributors Please visit the Panasonic Wireless Technical Forum to submit a question at https://forum.na.industrial.panasonic.com
7.2.2 Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our products and related documents: For complete Panasonic product details in the EU, visit http://pideu.panasonic.de/products/wireless-modules.html For complete Panasonic product details in North America, visit http://www.panasonic.com/rfmodules